CN207994336U - A kind of high-power bar laser sintering fixture - Google Patents
A kind of high-power bar laser sintering fixture Download PDFInfo
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- CN207994336U CN207994336U CN201820371421.9U CN201820371421U CN207994336U CN 207994336 U CN207994336 U CN 207994336U CN 201820371421 U CN201820371421 U CN 201820371421U CN 207994336 U CN207994336 U CN 207994336U
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- sliding block
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- pedestal
- bar
- card slot
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Abstract
A kind of high-power bar laser sintering fixture, including：Pedestal, sliding block, card slot, briquetting, slider-actuated mechanism.When needing laser being sintered, under the microscope, by heat sink, the golden soldering piece for constituting chip of laser, bar item, golden soldering piece and heat sink it is sequentially placed in card slot, sliding block is driven to move down by slider-actuated mechanism later, until briquetting slowly heat sink on chip of laser and is in contact with it, spring, which provides downward elastic force, allows briquetting to be pressed on chip of laser, pressure uniformity, entire fixture is put into vacuum back-flow soldering equipment is sintered later.Avoid bar item and it is heat sink between generate cavity, each material is accurately positioned by card slot, ensures the consistency of bar junior unit structure.A piece bar of item of sintering carries out folded battle array encapsulation to that can filter out a required bar junior unit after each parameter testing, ensure that the consistency of folded battle array encapsulation, avoid wasting the fixture at junior unit every time.
Description
Technical field
The utility model is related to semiconductor laser manufacturing fields, and in particular to a kind of high-power bar laser sintering clip
Tool.
Background technology
With the gradual perfection of material epitaxy technology and individual laser package technology, high power laser diode device and
Array device is at home and abroad rapidly developed, and the Main way of present laser industry application extension is become, have it is small,
The advantages that efficient, at low cost, is therefore widely used in laser display, laser medicine, industrial processes, solid state laser and light
The technical fields such as fibre laser pumping.Output optical power, photoelectric conversion efficiency and reliability are weigh laser performance three
Major parameter, and the main factor for limiting three's development is heat, determines that the size of optical output power of laser, photoelectricity turn
Change the height and reliability of efficiency.In addition to the property of semiconductor laser itself, the package quality of laser is also to influence to dissipate
The key factor of heat, it is desirable that laser and it is heat sink between welding have securely, without cavity, thermal conductivity is good, antifatigue, low thermal resistance
The features such as.Therefore, it is the key that Application of High Power Semiconductor Laser skill semiconductor laser to be sintered to the method on heat sink
One of art.
The hard solder packing forms of current high-power bar of laser generally use the stacked battle array structure of more junior unit groups into
Row is integral sintered, as disclosed in Chinese patent literature CN201410010960《A kind of high power semi-conductor applied to long pulsewidth
Individual laser package structure》, bar item, weld tabs, it is heat sink stacked according to certain structure and sequence after once sinter bar item into and fold battle array,
Higher to the coherence request of various materials in such method, especially bar item can not screen, once there are the feelings of consistency difference
Condition can cause folded battle array that can not integrally use, and cause device yield low, waste material and artificial；In addition, such packaged type pair
The requirement for being sintered clamp precision is also higher, and some point tolerances may cause the sintering at some position bad, equally cause to waste.
Disclosed in Chinese patent literature CN206575014U《A kind of folded battle array of bonding type semiconductor laser》With
Disclosed in CN106785920A《A kind of semiconductor laser stacks of mechanical connection type》Junior unit in the folded battle array laser proposed
It can be fabricated separately, and the folded battle array after combination can be achieved to split, but the combination of junior unit includes a bar item, heat sink and insulation
Piece, triplicity need more complex fixture that could complete, and between connection using gluing by the way of, relative to solder weldering
There are many poor radiation of the mode connect, this mode, influence performance and the service life of folded battle array laser.
Invention content
The utility model provides a kind of improve and is sintered efficiency, ensures consistency to overcome the shortcomings of the above technology
High-power bar laser is sintered fixture.
Technical solution is used by the utility model overcomes its technical problem：
A kind of high-power bar laser sintering fixture, including：
Pedestal is provided with sliding slot from top to bottom；
Sliding block, back are provided with the positioning column to match with sliding slot, and sliding block is slidably connected by positioning column and sliding slot；
Card slot is set on pedestal, and the size of the card slot and the appearance and size of chip of laser match；
Briquetting, is installed on sliding block lower end and the upper end positioned at card slot, and the size of the briquetting is less than the size of card slot；
Slider-actuated mechanism is set on pedestal, for driving sliding block to be slided up and down along sliding slot；
Spring is provided between the sliding block and pedestal, spring generates sliding block downward elastic force.
Preferably, above-mentioned slider-actuated mechanism includes the through-hole being set on pedestal and is set on sliding block and and through-hole
The screw hole II of same axis, adjusting screw are combined on screw hole II after passing through through-hole.
In order to improve the guidance quality to telescopic spring, jack, the receptacle axis and sliding slot phase are provided on above-mentioned pedestal
Parallel, the tail end of spring is plugged in jack, and head end is connected with sliding block.
In order to operate facility, above-mentioned sliding slot is to be obliquely installed, and the angle between horizontal plane is 45 °.
Further include the screw hole I being set on pedestal for the ease of the positioning to spring force, the axis of the screw hole I with
The axis perpendicular of jack, positioning screw are combined in screw hole I, and tail end and the positioning screw of the spring are connected to a fixed.
The utility model has the beneficial effects that：When needing laser being sintered, under the microscope, laser will be constituted
Heat sink, the golden soldering piece of chip, bar item, golden soldering piece and it is heat sink be sequentially placed in card slot, pass through slider-actuated machine later
Structure driving sliding block moves down, until briquetting slowly heat sink on chip of laser and is in contact with it, spring provides downward bullet
Power allows briquetting to be pressed on chip of laser, and entire fixture is put into vacuum back-flow soldering equipment by pressure uniformity later
It is sintered.Avoid bar item and it is heat sink between generate cavity, each material is accurately positioned by card slot, ensures bar junior unit
The consistency of structure.A piece bar of item of sintering is small to that can filter out required bar item after each parameter testing at junior unit every time for the fixture
Unit carries out folded battle array encapsulation, ensure that the consistency of folded battle array encapsulation, avoids wasting.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the utility model；
Fig. 2 is the dimensional structure diagram of the pedestal of the utility model；
Fig. 3 is the dimensional structure diagram of the sliding block of the utility model；
In figure, 1. pedestal, 2. sliding block, 3. chip of laser, 4. spring, 5. adjusting screw, 6. positioning screw, 7. through-hole
8. 13. briquetting of sliding slot 9. jack, 10. card slot, 11. screw hole, I 12. positioning column, 14. screw hole II.
Specific implementation mode
Below in conjunction with the accompanying drawings 1, attached drawing 2, attached drawing 3 are described further the utility model.
A kind of high-power bar laser sintering fixture, including：Pedestal 1 is provided with sliding slot 8 from top to bottom；Sliding block 2,
Its back is provided with the positioning column 12 to match with sliding slot 8, and sliding block 2 is slidably connected by positioning column 12 and sliding slot 8；Card slot 10, if
It is placed on pedestal 1, the size of card slot 10 matches with the appearance and size of chip of laser 3；Briquetting 13, be installed on 2 lower end of sliding block and
Positioned at the upper end of card slot 10, the size of briquetting 13 is less than the size of card slot 10；Slider-actuated mechanism is set on pedestal 1, is used for
Driving sliding block 2 is slided up and down along sliding slot 8；Spring 4 is provided between sliding block 2 and pedestal 1, spring 4 generates sliding block 2 on downward bullet
Power.When needing laser being sintered, under the microscope, heat sink, golden soldering piece, bar item, the gold of chip of laser 3 will be constituted
Soldering piece and it is heat sink be sequentially placed in card slot 10, drive sliding block 2 to move down by slider-actuated mechanism later, until briquetting 13
It slowly heat sink on chip of laser 3 and is in contact with it, spring 4, which provides downward elastic force, allows briquetting 13 to be pressed in laser
On device chip 3, entire fixture is put into vacuum back-flow soldering equipment is sintered later by pressure uniformity.It avoids bar
Item and it is heat sink between generate cavity, each material is accurately positioned by card slot 10, ensures the consistency of bar junior unit structure.The folder
A piece bar of item of sintering carries out folded battle array encapsulation to tool at junior unit to that can filter out a required bar junior unit after each parameter testing every time,
The consistency that ensure that folded battle array encapsulation, avoids wasting.
Embodiment 1：
Slider-actuated mechanism can be following structure comprising the through-hole 7 that is set on pedestal 1 and be set to sliding block 2
It is upper and with the screw hole II 14 of 7 same axis of through-hole, adjusting screw 5 is combined on screw hole II 14 after passing through through-hole 7.When rotation adjusts spiral shell
When following closely 5, driving sliding block 2 is slided up and down with respect to pedestal 1, and adjustment structure is simple, operation facility.
Embodiment 2：
Preferably, jack 9 is provided on pedestal 1,9 axis of jack is parallel with sliding slot 8, and the tail end of spring 4 is plugged in slotting
In hole 9, head end is connected with sliding block 2.Since spring 4 is improved to bullet along the axial stretching of jack 9 in jack 9
The positioning of spring 4, it is ensured that the elastic force that spring 4 is applied on sliding block 2 is consistent along the direction of motion of sliding slot 8 with it, to meet
The sliding of sliding block 2 smoothly requires.
Embodiment 3：
Preferably, sliding slot 8 is to be obliquely installed, and the angle between horizontal plane is 45 °.Sliding slot 8 is obliquely installed, to
The just opposite operator of the operating surface of entire fixture is realized, to improve the comfort level of operation.
Embodiment 4：
Further, further include the screw hole I 11 being set on pedestal 1, the axis of screw hole I 11 and the axis phase of jack 9
Vertically, positioning screw 6 is combined in screw hole I 11, and tail end and the positioning screw 6 of spring 4 are connected to a fixed.Pass through the spiral shell of screw-in
Hole I 11 is realized and is precisely controlled to 4 reduction length of spring, to realize the accurate adjustment to 4 elastic force of spring.
Claims (5)
1. a kind of high-power bar laser is sintered fixture, which is characterized in that including：
Pedestal（1）, it is provided with sliding slot from top to bottom（8）；
Sliding block（2）, back is provided with and sliding slot（8）The positioning column of matching（12）, sliding block（2）Pass through positioning column（12）With sliding slot
（8）It is slidably connected；
Card slot（10）, it is set to pedestal（1）On, the card slot（10）Size and chip of laser（3）Appearance and size match；
Briquetting（13）, it is installed on sliding block（2）Lower end and be located at card slot（10）Upper end, the briquetting（13）Size be less than card slot
（10）Size；
Slider-actuated mechanism is set to pedestal（1）On, for driving sliding block（2）Along sliding slot（8）It slides up and down；
The sliding block（2）With pedestal（1）Between be provided with spring（4）, spring（4）To sliding block（2）Generate downward elastic force.
2. high-power bar laser according to claim 1 is sintered fixture, it is characterised in that：The slider-actuated mechanism
Including being set to pedestal（1）On through-hole（7）And it is set to sliding block（2）Upper and and through-hole（7）The screw hole II of same axis（14）,
Adjusting screw（5）Across through-hole（7）After be combined on screw hole II（14）.
3. high-power bar laser according to claim 1 is sintered fixture, it is characterised in that：The pedestal（1）On set
It is equipped with jack（9）, the jack（9）Axis and sliding slot（8）It is parallel, spring（4）Tail end be plugged in jack（9）In, head
End and sliding block（2）It is connected.
4. high-power bar laser according to claim 1 or 2 or 3 is sintered fixture, it is characterised in that：The sliding slot
（8）To be obliquely installed, the angle between horizontal plane is 45 °.
5. high-power bar laser according to claim 3 is sintered fixture, it is characterised in that：Further include being set to pedestal
（1）On screw hole I（11）, the screw hole I（11）Axis and jack（9）Axis perpendicular, positioning screw（6）It is combined on spiral shell
Hole I（11）In, the spring（4）Tail end and positioning screw（6）It is connected to a fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820371421.9U CN207994336U (en) | 2018-03-19 | 2018-03-19 | A kind of high-power bar laser sintering fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820371421.9U CN207994336U (en) | 2018-03-19 | 2018-03-19 | A kind of high-power bar laser sintering fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207994336U true CN207994336U (en) | 2018-10-19 |
Family
ID=63827306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820371421.9U Active CN207994336U (en) | 2018-03-19 | 2018-03-19 | A kind of high-power bar laser sintering fixture |
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| Country | Link |
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| CN (1) | CN207994336U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN114406460A (en) * | 2022-01-07 | 2022-04-29 | 苏州尤诗光电科技有限公司 | Laser bar packaging structure, welding fixture and method |
-
2018
- 2018-03-19 CN CN201820371421.9U patent/CN207994336U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN114406460A (en) * | 2022-01-07 | 2022-04-29 | 苏州尤诗光电科技有限公司 | Laser bar packaging structure, welding fixture and method |
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