CN108183389B - Laser diode and laser diode packaging method - Google Patents
Laser diode and laser diode packaging method Download PDFInfo
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- CN108183389B CN108183389B CN201810090134.5A CN201810090134A CN108183389B CN 108183389 B CN108183389 B CN 108183389B CN 201810090134 A CN201810090134 A CN 201810090134A CN 108183389 B CN108183389 B CN 108183389B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The embodiment of the invention provides a laser diode and a laser diode packaging method, and relates to the technical field of semiconductors. The laser diode comprises a base, a laser chip and a shell, wherein one side of the base is connected with one side of the shell, one side of the base and the shell form a storage space, and the laser chip is positioned in the storage space. The laser diode provided by the embodiment of the invention has the advantages of small volume and strong heat dissipation capacity; the laser diode packaging method provided by the embodiment of the invention has the advantage of simple processing technology.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a laser diode and a laser diode packaging method.
Background
With the increasing development and maturity of semiconductor technology, laser Diode (LD) has been greatly improved in power, conversion efficiency, wavelength expansion, and operation lifetime. The method has the characteristics of high quantum efficiency, high reliability, long service life, easy correspondence between the emission wavelength and the absorption peak of the laser medium, good quality of the laser output beam and the like. The light-emitting diode has the advantages of high efficiency, high beam quality, long service life, full solidification, compact structure, portability and the like, and is attracting more and more attention.
For the laser diode, it is necessary to package the same so that the laser diode can achieve high wall plug efficiency, improve stability and save use cost for users. Currently, for packaging of laser diodes, TO packages and C-mount packages are commonly used.
The TO packaging structure is suitable for most of semiconductor laser application occasions, but the C-mount packaging with complex manufacturing process has the advantages of high reliability, high stability, high precision machining, high heat conductivity and the like, and is not provided with a protection window and is not easy TO center.
How to solve the above problems is an important point of attention of those skilled in the art.
Disclosure of Invention
Accordingly, the present invention is directed to a laser diode to solve the problems of complicated manufacturing process and difficult centering of the laser diode in the prior art.
Another object of the present invention is to provide a method for packaging a laser diode, so as to solve the disadvantages of complicated manufacturing process and difficult centering of the laser diode in the prior art.
In order to achieve the above object, the technical scheme adopted by the embodiment of the invention is as follows:
in one aspect, an embodiment of the present invention provides a laser diode, where the laser diode includes a base, a laser chip, and a housing, where one side of the base is connected to one side of the housing, one side of the base and the housing form a storage space, and the laser chip is located in the storage space.
Further, the laser diode further comprises a lens, two ends of the lens are respectively arranged on the base and the shell, one side of the base, the shell and the lens form a storage space, and light rays emitted by the laser chip are transmitted and broadcast along the lens.
Further, the base comprises a first stop block, the shell comprises a second stop block, and two sides of the lens are respectively arranged on the first stop block and the second stop block.
Further, the lens is connected with the first stop block and the second stop block in a mode of gold-tin eutectic or glue bonding or glass paste sintering.
Further, the base is a cube-shaped base, and the shell is an L-shaped shell.
Further, the laser chip is mounted at a center position of one face of the base close to the housing.
Further, the shell is an aluminum nitride ceramic shell or a metal shell.
On the other hand, the embodiment of the invention also provides a laser diode packaging method, which comprises the following steps:
mounting a laser chip on a base;
the shell is arranged on the base, so that a storage space is formed by one side of the base and the shell, and the laser chip is positioned in the storage space.
Further, the chassis is arranged in a connection plate shape to form a chassis board, and after the step of mounting the housing to the chassis, the laser diode packaging method further includes:
cutting the base plate to form a laser diode semi-finished product by each base, the shell and the laser chip;
a lens is arranged on each laser diode semi-finished product to form a plurality of laser diodes, wherein one side of the base, the shell and the lens form a storage space, and light rays emitted by the laser chip are transmitted out along the lens
Further, the base includes a first stopper, the housing includes a second stopper, and the step of mounting a lens to each of the laser diode blanks to form a plurality of laser diodes includes:
and installing two sides of the lens on the first stop block and the second stop block respectively.
And connecting the lens with the first stop block and the second stop block by using a gold-tin eutectic or glue bonding or glass paste sintering mode.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a laser diode and a laser diode packaging method, wherein the laser diode comprises a base, a laser chip and a shell, and because the base and the shell are not integrally formed in the embodiment, the laser chip can be more easily fixed at a preset position when the laser chip is installed, and then the base and the shell are connected. Meanwhile, the shell is provided with the object placing space, the laser chip is positioned in the object placing space, and the size of the object placing space can be determined according to the size of the laser chip, so that the size of the shell is smaller, and the size of the laser diode provided by the invention is smaller. And the heat that laser chip produced when the during operation can transmit to the base to dispel the heat by the base, make the heat-sinking capability stronger.
The laser diode packaging method is that a laser chip is arranged on a base, and then a shell is arranged on the base, so that the laser chip is positioned in a storage space of the shell. The laser diode packaging method provided by the invention has the advantages of simple process and rapid packaging.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic structural diagram of a laser diode according to an embodiment of the present invention.
Fig. 2 shows a schematic structural diagram of a base provided by an embodiment of the present invention.
Fig. 3 shows a schematic structural diagram of a housing according to an embodiment of the present invention.
Fig. 4 is a schematic flow chart of a laser diode packaging method according to an embodiment of the present invention.
Fig. 5 shows a schematic structural diagram of a base plate according to an embodiment of the present invention.
Icon: 100-laser diode; 110-a base; 111-a first stop; 120-a housing; 121-a second stop; 130-a laser chip; 140-lens; 150-placing space; 200-base plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present invention, it should also be noted that, unless explicitly specified and defined otherwise, the terms "connected", "connected" and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
First embodiment
Referring to fig. 1, an embodiment of the present invention provides a laser diode 100, where the laser diode 100 includes a base 110, a laser chip 130, a housing 120, and a lens 140, the base 110 is connected to the housing 120, the laser chip 130 is mounted on the base 110, a storage space 150 is disposed on a surface of the housing 120 opposite to the base 110, the laser chip 130 is located in the storage space 150, and the lens 140 is connected to the base 110 and the housing 120 respectively.
Specifically, in the present embodiment, the base 110 and the housing 120 are not integrally formed, but are processed separately, so that the laser chip 130 can be accurately mounted at a predetermined position when the laser chip 130 is mounted on the base 110, and the packaging effect is better.
In the present embodiment, the base 110 is provided in a cube shape, and since the laser diode 100 can be in an optimal operation state when the laser chip 130 is located at the center of the side of the base 110 near the housing 120, the laser chip 130 of the present embodiment is mounted at the center of the side of the base 110 near the housing 120, and is easier to handle when the center is fixed.
In order to enhance the heat dissipation capability of the laser chip 130 during operation, in the present embodiment, the housing 120 and the base 110 are both made of aluminum nitride ceramics or metal materials. Since the laser chip 130 is directly mounted on the base 110, the base 110 can be used as a substrate of the laser chip 130, and heat emitted by the laser chip 130 during operation can be directly transferred to the base 110, and then the base 110 dissipates heat, thereby enhancing the heat dissipation capacity of the laser diode 100.
Meanwhile, in the present embodiment, the manner of mounting the laser chip 130 on the base 110 can adopt a conventional common forward support die bonding process, which is convenient, fast and efficient. Before the laser chip 130 is mounted, the surface of the base 110 is pre-set with a circuit by means of plating or structure splitting and linking, and then the laser chip 130 is subjected to die bonding operation, so that the method is convenient and quick, and the processing technology is simple.
In the present embodiment, in order to form the storage space 150 between the base 110 and the housing 120, the laser chip 130 is disposed in the storage space 150, and the housing 120 is an L-shaped housing 120. Of course, in other embodiments, the housing 120 may be provided in other shapes, and the present embodiment is not limited in any way.
It should be noted that, in the present embodiment, since the size of the plant placement space 150 between the base 110 and the base 110 is only required to be able to place the laser chip 130, in the present embodiment, the volume of the housing can be made small, so that compared with the existing laser diode 100, the laser diode 100 provided in the present embodiment has smaller volume, more convenient processing and higher packaging efficiency.
It should be noted that, the base 110 and the L-shaped housing 120 need to be tightly connected, and in this embodiment, the base 110 and the L-shaped housing 120 are bonded by using au-sn eutectic or high-temperature-resistant high-viscosity glue. Meanwhile, the housing 120 provided in this embodiment is also made of aluminum nitride ceramic or metal.
In order to realize the light transmission and emission of the laser chip 130, and not to be interfered by the external environment when the laser chip 130 works, the service life of the laser chip 130 is affected, so the laser diode 100 of the present embodiment includes a lens 140.
The two ends of the lens 140 are respectively disposed on the base 110 and the housing 120, one side of the base 110, the housing 120 and the lens 140 form a storage space 150, and the light emitted by the laser chip 130 is transmitted along the lens 140, so that the lens 140 functions as a light window.
In detail, referring to fig. 2 and 3, in the present embodiment, in order to facilitate fixing the lens 140, the base 110 includes a first block 111, the housing 120 includes a second block 121, and two sides of the lens 140 are respectively mounted on the first block 111 and the second block 121. And, the base 110 is connected with the first stop block 111 and the second stop block 121 by means of gold-tin eutectic or glue bonding or glass paste sintering, so that the connection between the lens 140 and the base 110 and the shell 120 is firmer.
Second embodiment
Referring to fig. 4, an embodiment of the present invention provides a method for packaging a laser diode 100, where the method for packaging the laser diode 100 includes:
in step S101, the base plate 200 is precut.
In this embodiment, since the mechanical devices are used to package the laser diode 100, in order to increase the packaging efficiency, referring to fig. 5, the base board 200 is used to package, and the base board 200 can form a plurality of bases 110 by cutting. Since in practical application, in order that cutting unevenness does not occur until cutting, in the present embodiment, pre-cutting is performed before the laser chip 130 is mounted on the base 110.
In step S102, the laser chip 130 is mounted on the base board 200.
In the present embodiment, since the base plate 200 includes a plurality of bases 110 arranged in a link shape, the mechanical device mounts the laser chips 130 on the base plate 200 after the bases 110 are precut, and one laser chip 130 is mounted on each base 110.
After the die bonding operation (i.e., the laser chip 130 is mounted on the base board 200) is performed by a tin eutectic method or a thermosetting glue bonding method, a wire bonding operation is performed on the die bonding operation, so that the laser diode 100 can be used normally.
Step S103, the housing 120 is mounted on the base 110.
After the laser chip 130 is mounted, the housing 120 is mounted on the base 110, so that a storage space 150 is formed between one side of the base 110 and the housing 120, and the laser chip 130 is located in the storage space 150. In this embodiment, the housing 120 is L-shaped, and the connection between the base 110 and the housing is achieved by a gold-tin eutectic method or a thermosetting glue bonding method.
Step S104, the base plate 200 is cut.
After the housing 120 is installed, the base board 200 is cut so that each of the base 110, the housing 120, and the laser chip 130 forms a semi-finished product of the laser diode 100. It should be noted that, in this embodiment, since the precut is already performed, the precut is more convenient and less prone to errors.
In step S105, a lens 140 is mounted on each laser diode 100 semi-finished product.
After the semi-finished product of the laser diode 100 is obtained, a lens 140 is further installed on the semi-finished product of the laser diode 100 to form a plurality of laser diodes 100, wherein one side of the base 110, the housing 120 and the lens 140 form a storage space 150, and the light emitted by the laser chip 130 is transmitted along the lens 140.
Specifically, step S105 includes:
in substep S1051, both sides of the lens 140 are respectively mounted on the first stop 111 and the second stop 121.
In the present embodiment, the base 110 is provided with a first stop 111, the housing 120 is provided with a second stop 121, two sides of the lens 140 can be respectively mounted on the first stop 111 and the second stop 121, and the first stop 111 and the second stop 121 have supporting and limiting functions on the lens 140.
Substep S1052, the lens 140 is connected to the first stop 111 and the second stop 121 by means of gold-tin eutectic or glue bonding or glass paste sintering.
After the two sides of the lens 140 can be respectively mounted on the first stop block 111 and the second stop block 121, in order to fix the lens 140 with the base 110 and the housing 120, the lens 140 needs to be fixed with the base 110 and the housing 120 by gold-tin eutectic, glue bonding or glass paste sintering.
In summary, the present invention provides a laser diode and a method for packaging the laser diode, the laser diode includes a base, a laser chip and a housing, and in this embodiment, the base and the housing are not integrally formed, so that the laser chip can be more easily fixed at a predetermined position when the laser chip is mounted, and then the base and the housing are connected. Meanwhile, the shell is provided with the object placing space, the laser chip is positioned in the object placing space, and the size of the object placing space can be determined according to the size of the laser chip, so that the size of the shell is smaller, and the size of the laser diode provided by the invention is smaller. And the heat that laser chip produced when the during operation can transmit to the base to dispel the heat by the base, make the heat-sinking capability stronger.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Claims (6)
1. The laser diode is characterized by comprising a base, a laser chip and a shell, wherein one side of the base is connected with one side of the shell, a storage space is formed by one side of the base and the shell, and the laser chip is positioned in the storage space;
the laser diode also comprises a lens, wherein two ends of the lens are respectively arranged on the base and the shell, one side of the base, the shell and the lens form a storage space, and light rays emitted by the laser chip are transmitted and broadcast along the lens; the base is a cube-shaped base, and the shell is an L-shaped shell;
the base comprises a first stop block, the shell comprises a second stop block, and two sides of the lens are respectively arranged on the first stop block and the second stop block.
2. The laser diode of claim 1, wherein the lens is connected to the first stop and the second stop by means of gold-tin eutectic or glue bonding or glass paste sintering.
3. The laser diode of claim 1, wherein the laser chip is mounted to a center of a face of the base adjacent the housing.
4. The laser diode of claim 1, wherein the housing is an aluminum nitride ceramic housing or a metal housing.
5. A laser diode packaging method, characterized in that the laser diode packaging method comprises:
mounting a laser chip on a base;
the method comprises the steps that a shell is arranged on a base, so that a storage space is formed by one side of the base and the shell, and a laser chip is located in the storage space;
the chassis is arranged in a connected plate shape to form a chassis board, and after the step of mounting the housing to the chassis, the laser diode packaging method further includes:
cutting the base plate to form a laser diode semi-finished product by each base, the shell and the laser chip;
and installing a lens on each laser diode semi-finished product to form a plurality of laser diodes, wherein one side of the base, the shell and the lens form a storage space, and light rays emitted by the laser chips are transmitted and broadcast along the lens.
6. The method of claim 5, wherein the base includes a first stop and the housing includes a second stop, and wherein the step of mounting a lens to each of the laser diode blanks to form a plurality of laser diodes includes:
installing two sides of the lens on the first stop block and the second stop block respectively;
and connecting the lens with the first stop block and the second stop block by using a gold-tin eutectic or glue bonding or glass paste sintering mode.
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| CN201810090134.5A CN108183389B (en) | 2018-01-30 | 2018-01-30 | Laser diode and laser diode packaging method |
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| CN201810090134.5A CN108183389B (en) | 2018-01-30 | 2018-01-30 | Laser diode and laser diode packaging method |
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| CN108183389B true CN108183389B (en) | 2023-09-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110224294A (en) * | 2019-06-28 | 2019-09-10 | 深圳市易飞扬通信技术有限公司 | The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly |
| CN113131332A (en) * | 2019-12-31 | 2021-07-16 | 深圳市中光工业技术研究院 | Laser device |
| CN111934193B (en) * | 2020-10-14 | 2021-01-05 | 山东元旭光电股份有限公司 | LD chip inorganic packaging structure and preparation method thereof |
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| CN102074638A (en) * | 2009-11-25 | 2011-05-25 | 亿光电子工业股份有限公司 | Light-emitting diode package and manufacturing method thereof |
| CN102324424A (en) * | 2011-09-22 | 2012-01-18 | 华南师范大学 | White-light LED (Light Emitting Diode) packaged by fluorescent transparent ceramic lens |
| CN105261929A (en) * | 2015-07-17 | 2016-01-20 | 武汉欧普兰光电技术股份有限公司 | Transistor outline (TO)-CAN packaged semiconductor laser and fabrication method thereof |
| CN205004615U (en) * | 2015-10-22 | 2016-01-27 | 西安精英光电技术有限公司 | Subminiature laser module based on encapsulation of laser diode wafer |
| CN207743558U (en) * | 2018-01-30 | 2018-08-17 | 广东省半导体产业技术研究院 | A kind of laser diode |
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