CN108183389A - A kind of laser diode and laser diode package method - Google Patents
A kind of laser diode and laser diode package method Download PDFInfo
- Publication number
- CN108183389A CN108183389A CN201810090134.5A CN201810090134A CN108183389A CN 108183389 A CN108183389 A CN 108183389A CN 201810090134 A CN201810090134 A CN 201810090134A CN 108183389 A CN108183389 A CN 108183389A
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- pedestal
- housing
- laser diode
- laser
- block
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The embodiment of the present invention proposes a kind of laser diode and laser diode package method, is related to technical field of semiconductors.The laser diode includes pedestal, laser chip and housing, and the side of the pedestal is connect with the side of the housing, and the side of the pedestal forms material-putting space with the housing, and the laser chip is located in the material-putting space.Laser diode provided in an embodiment of the present invention has the advantages of small, heat-sinking capability is strong；Laser diode package method provided in an embodiment of the present invention has the advantages that processing technology is simple.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of laser diode and laser diode package
Method.
Background technology
It is growing and ripe with semiconductor technology, laser diode (Laser Diode, abbreviation LD) power,
Transfer efficiency, wavelength spread and service life etc. have been greatly improved.Due to quantum efficiency height, reliability
The features such as height, service life are long, launch wavelength is easily corresponding with laser medium absorption peak, laser output beam is high-quality.Have
High efficiency, high light beam quality, long-life, all solidstate, compact-sized and light etc. advantages, so increasingly being closed by people
Note.
For laser diode, need to carry out necessary encapsulation to it, so that laser diode can obtain high-wall and insert efficiency,
It improves stability and saves the use cost of user.At present, for the encapsulation of laser diode, generally using TO encapsulation with
C-mount is encapsulated.
TO encapsulating structures are suitable for most of semiconductor laser use occasions, but the complex C- of its manufacture craft
Mount encapsulation has many advantages, such as high reliability, high stability, high-accuracy mechanical processing, high heat conductance, but does not have protecting window,
It is not easy to center simultaneously.
How to solve the above problems, be the emphasis of those skilled in the art's concern.
Invention content
In view of this, the purpose of the present invention is to provide a kind of laser diode, to solve two pole of laser in the prior art
Pipe complex manufacturing technology, the shortcomings that being not easy to center.
Another object of the present invention is to provide a kind of laser diode package method, to solve laser two in the prior art
Pole pipe complex manufacturing technology, the shortcomings that being not easy to center.
To achieve these goals, technical solution used in the embodiment of the present invention is as follows：
On the one hand, an embodiment of the present invention provides a kind of laser diode, the laser diode includes pedestal, laser core
Piece and housing, the side of the pedestal are connect with the side of the housing, and the side of the pedestal is put with housing formation
Object space, the laser chip are located in the material-putting space.
Further, the laser diode further includes lens, and the both ends of the lens are placed in the pedestal, institute respectively
State housing, the side of the pedestal, the housing and the lens forming material-putting space, and the light of laser chip transmitting
Line is propagated out along the lens.
Further, the pedestal includes the first block, and the housing includes the second block, and the both sides of the lens are distinguished
It is installed on first block and second block.
Further, the lens Sn/Au eutectic or glue bonding or glass cream sintering by way of with the first gear
Block, second block connection.
Further, the pedestal is cube shaped pedestal, and the housing is L-type housing.
Further, the laser chip is installed on the center of the one side close to the housing of the pedestal.
Further, the housing is aluminium nitride ceramics housing or metal shell.
On the other hand, the embodiment of the present invention additionally provides a kind of laser diode package method, the laser diode envelope
Dress method includes：
Laser chip is installed on pedestal；
Housing is installed on the pedestal, so that the side of the pedestal forms material-putting space with the housing, it is described to swash
Optical chip is located in the material-putting space.
Further, the pedestal is arranged into connecting plate form to form base board, and housing is installed on the bottom described
After the step of seat, the laser diode package method further includes：
The base board is cut so that each pedestal, the housing and the laser chip formed it is sharp
Optical diode semi-finished product；
One lens are installed on each laser diode semi-finished product, to form multiple laser diodes, wherein, it is described
The side of pedestal, the housing and the lens forming material-putting space, and the light of laser chip transmitting is along described
Mirror propagates out
Further, the pedestal includes the first block, and the housing includes the second block, described to be installed on lens often
A laser diode semi-finished product, to form multiple laser diodes the step of, include:
The both sides of the lens are respectively arranged in first block and second block.
Using Sn/Au eutectic or glue bonding or the mode of glass cream sintering by the lens and first block, described
Second block connects.
Compared with the prior art, the invention has the advantages that：
The present invention provides a kind of laser diode and laser diode package method, the laser diode include pedestal,
Laser chip and housing, by this present embodiment, pedestal is not integrally formed with housing, so when installing laser chip,
It can be easier laser chip being fixed on preset position, then again be attached pedestal and housing.Simultaneously as housing
Material-putting space is provided with, laser chip is located in material-putting space, depending on the size of material-putting space can be with the size of laser chip,
So volume smaller of housing so that the volume smaller of laser diode provided by the invention.Also, laser chip is at work
The heat of generation can be transferred on pedestal, and is radiated by pedestal so that heat-sinking capability is stronger.
The laser diode package method is that laser chip is installed on pedestal, and housing then is installed on the pedestal,
So as to which laser chip be made to be located in the material-putting space of housing.Laser diode package method provided by the invention has simple for process
And encapsulate the advantages of rapid.
For the above objects, features and advantages of the present invention is enable to be clearer and more comprehensible, preferred embodiment cited below particularly, and coordinate
Appended attached drawing, is described in detail below.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows the structure diagram of laser diode provided in an embodiment of the present invention.
Fig. 2 shows the structure diagrams of pedestal provided in an embodiment of the present invention.
Fig. 3 shows the structure diagram of housing provided in an embodiment of the present invention.
Fig. 4 has gone out the flow diagram of laser diode package method provided in an embodiment of the present invention.
Fig. 5 has gone out the structure diagram of base board provided in an embodiment of the present invention.
Icon：100- laser diodes；110- pedestals；The first blocks of 111-；120- housings；The second blocks of 121-；130-
Laser chip；140- lens；150- material-putting spaces；200- base boards.
Specific embodiment
Purpose, technical scheme and advantage to make the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In attached drawing, the technical solution in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
Part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be configured to arrange and design with a variety of different.
Below in conjunction with attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be configured to arrange and design with a variety of different herein.Cause
This, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit claimed invention below
Range, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Go out all other embodiments obtained under the premise of creative work, shall fall within the protection scope of the present invention.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.Meanwhile the present invention's
In description, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " connected ", " connection " should be interpreted broadly,
For example, it may be it is fixedly connected or is detachably connected or is integrally connected；Can be mechanical connection or electricity
Connection；It can be directly connected, can also be indirectly connected by intermediary, can be the connection inside two elements.For
For those of ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.It ties below
Attached drawing is closed, is elaborated to some embodiments of the present invention.In the absence of conflict, following embodiment and embodiment
In feature can be combined with each other.
First embodiment
Referring to Fig. 1, an embodiment of the present invention provides a kind of laser diode 100, which includes pedestal
110th, laser chip 130, housing 120 and lens 140, pedestal 110 are connect with housing 120, and laser chip 130 is installed on pedestal
110, housing 120 is provided with material-putting space 150 on one side with what pedestal 110 was oppositely arranged, and laser chip 130 is located at material-putting space
In 150, lens 140 are connect respectively with pedestal 110, housing 120.
Specifically, in the present embodiment, pedestal 110 is not integrally formed with housing 120, but is processed respectively, institute
When laser chip 130 is installed on pedestal 110, laser chip 130 can be accurately installed on to presetting position,
Packaging effect is more preferable.
In the present embodiment, pedestal 110 is set as cube shaped, since laser chip 130 is in the close shell of pedestal 110
During the center of the one side of body 120, laser diode 100 is at best working condition, so the present embodiment swashs
Optical chip 130 is installed on the center of the one side of the close housing 120 of pedestal 110, and is more prone in fixed center
Operation.
Also, in order to enhance the heat-sinking capability of laser chip 130 at work, in the present embodiment, housing 120 and pedestal
110 are made using aluminium nitride ceramics or metal material.Since laser chip 130 is directly mounted on pedestal 110, so
Pedestal 110 can be as the substrate of laser chip 130, and the heat that laser chip 130 gives out when working can be transferred directly to bottom
In seat 110, then radiated by pedestal 110, enhance the heat-sinking capability of the laser diode 100.
Meanwhile in the present embodiment, by laser chip 130 be installed on pedestal 110 mode can use it is traditional common
Positive stent die bond technique, it is convenient and efficient efficient.Also, before laser chip 130 is installed, the surface of pedestal 110 passes through
Coating processing or structure split the means such as link, and circuit presets are good, then carry out die bond operation, side to laser chip 130 again
Just it is quick, and processing technology is simple.
Also, in the present embodiment, in order to make to form material-putting space 150 between pedestal 110 and housing 120, so as to make to swash
Optical chip 130 is placed in the material-putting space 150, and housing 120 is L-type housing 120.Of course, it is some other be embodiment
In, housing 120 may be set to be other shapes, and the present embodiment does not do this any restriction.
It should be noted that in the present embodiment, due to can with the plant material-putting space 150 between pedestal 110
Size only need that laser chip 130 can be placed, so in the present embodiment, the volume of shell can be made very small, institute
With compared to existing laser diode 100, the volume smaller of laser diode 100 provided in this embodiment, while process more
Add conveniently, packaging efficiency higher.
It should also be noted that, need closely to connect between pedestal 110 and L-type housing 120, in the present embodiment, pedestal 110
It is Nian Jie using Sn/Au eutectic or high temperature resistant high-viscosity glue between L-type housing 120.Meanwhile housing 120 provided in this embodiment
Also it is made using aluminium nitride ceramics or metal material.
In order to realize that the light propagation for sending out laser chip 130 goes out, and will not be by the external world when laser chip 130 works
The interference of environment influences the service life of laser chip 130, so the laser diode 100 of the present embodiment includes lens
140。
The both ends of lens 140 are placed in pedestal 110, housing 120, side, housing 120 and the lens of pedestal 110 respectively
140 form material-putting space 150, and the light that laser chip 130 emits is propagated out along lens 140, so as to play lens 140
The effect of optical window.
Specifically, Fig. 2 and Fig. 3 are please referred to, in the present embodiment, for the ease of fixed lens 140, pedestal 110 includes the
One block 111, housing 120 include the second block 121, and the both sides of lens 140 are respectively arranged in the first block 111 and the second block
121.Also, pedestal 110 Sn/Au eutectic or glue bonding or glass cream sintering by way of with the first block 111, second gear
Block 121 connects so that the connection between lens 140 and pedestal 110 and housing 120 is more secured.
Second embodiment
Referring to Fig. 4, an embodiment of the present invention provides a kind of 100 packaging method of laser diode, the laser diode 100
Packaging method includes：
Step S101 precuts base board 200.
In the present embodiment, due to being packaged using mechanical equipment to laser diode 100, so in order to accelerate to seal
Efficiency is filled, referring to Fig. 5, example is packaged using base board 200, base board 200 can form multiple by way of cutting
Pedestal 110.Due in practical applications, in order to the appearance for when cutting being not in the unequal situation of cutting, in this implementation
In example, before laser chip 130 is installed on pedestal 110, can also it be precut.
Laser chip 130 is installed on base board 200 by step S102.
In the present embodiment, since base board 200 includes multiple pedestals 110 arranged using connecting plate form, pedestal
110 after precut, and laser chip 130 can be installed on base board 200 by mechanical equipment, and each pedestal 110 is pacified
Fill a laser chip 130.
This implementation carries out die bond operation (i.e. by laser chip using the mode that tin eutectic mode or heat curing type glue are bonded
130 are installed on base board 200) after, also bonding wire operation is carried out to it, so that the laser diode 100 being capable of normal use.
Housing 120 is installed on pedestal 110 by step S103.
After laser chip 130 is installed, housing 120 need to be installed on pedestal 110, so that the side of pedestal 110 and shell
Body 120 forms material-putting space 150, and laser chip 130 is located in material-putting space 150.In the present embodiment, housing 120 is L-shaped,
The connection of pedestal 110 and shell is realized by the mode that Sn/Au eutectic mode or heat curing type glue are bonded.
Step S104 cuts base board 200.
After housing 120 is installed, base board 200 need to be cut, so as to each pedestal 110, housing 120 and swash
Optical chip 130 forms 100 semi-finished product of laser diode.It should be noted that in the present embodiment, since pre-cut has been carried out
It cuts, it is described to cut at this time more convenient and be less prone to mistake.
One lens 140 are installed on each 100 semi-finished product of laser diode by step S105.
After 100 semi-finished product of laser diode are obtained, also need a lens 140 being installed on the laser diode 100 half
Finished product, to form multiple laser diodes 100, wherein, side, housing 120 and the lens 140 of pedestal 110 form glove sky
Between 150, and laser chip 130 emit light propagated out along lens 140.
Specifically, step S105 includes：
The both sides of lens 140 are respectively arranged in the first block 111 and the second block 121 by sub-step S1051.
In the present embodiment, pedestal 110 is provided with the first block 111, and housing 120 is provided with the second block 121, lens
140 both sides can be respectively arranged in the first block 111 and the second block 121, and the first block 111 and the second block more than 121 are thoroughly
Mirror 140 plays the role of support and limiting.
Sub-step S1052, using Sn/Au eutectic or glue bonding or the mode of glass cream sintering by lens 140 and first gear
Block 111, the second block 121 connect.
After the both sides of lens 140 can be respectively arranged on the first block 111 and the second block 121, in order to realize
Fixation between lens 140 and pedestal 110, housing 120 is also needed through Sn/Au eutectic, glue bonding or glass cream sintering processing
Realize the fixation between lens 140 and pedestal 110, housing 120.
In conclusion the present invention provides a kind of laser diode and laser diode package method, the laser diode
Including pedestal, laser chip and housing, by this present embodiment, pedestal is not integrally formed with housing, so swashing in installation
During optical chip, it can be easier laser chip being fixed on preset position, then again be attached pedestal and housing.Together
When, since housing is provided with material-putting space, laser chip is located in material-putting space, and the size of material-putting space can be with laser chip
Size depending on, so the volume smaller of housing so that the volume smaller of laser diode provided by the invention.Also, laser
The heat that chip generates at work can be transferred on pedestal, and is radiated by pedestal so that heat-sinking capability is stronger.
It should be noted that herein, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Cover non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only include those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or set
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in the process, method, article or apparatus that includes the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should be noted that：Similar label and letter exists
Similar terms are represented in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and is explained.
Claims (10)
1. a kind of laser diode, which is characterized in that the laser diode includes pedestal, laser chip and housing, described
The side of pedestal is connect with the side of the housing, and the side of the pedestal forms material-putting space, the laser with the housing
Chip is located in the material-putting space.
2. laser diode as described in claim 1, which is characterized in that the laser diode further includes lens, described
The both ends of mirror are placed in the pedestal, the housing respectively, and the side of the pedestal, the housing and the lens forming are put
Object space, and the light of laser chip transmitting is propagated out along the lens.
3. laser diode as claimed in claim 2, which is characterized in that the pedestal includes the first block, the housing packet
The second block is included, the both sides of the lens are respectively arranged in first block and second block.
4. laser diode as claimed in claim 3, which is characterized in that the lens by Sn/Au eutectic or glue bonding or
The mode of glass cream sintering is connect with first block, second block.
5. laser diode as described in claim 1, which is characterized in that the pedestal be cube shaped pedestal, the housing
For L-type housing.
6. laser diode as described in claim 1, which is characterized in that the laser chip is installed on the close of the pedestal
The center of the one side of the housing.
7. laser diode as described in claim 1, which is characterized in that the housing is aluminium nitride ceramics housing or metal-back
Body.
A kind of 8. laser diode package method, which is characterized in that the laser diode package method includes：
Laser chip is installed on pedestal；
Housing is installed on the pedestal, so that the side of the pedestal forms material-putting space, the laser core with the housing
Piece is located in the material-putting space.
9. laser diode package method as claimed in claim 8, which is characterized in that the pedestal into connecting plate form arrange with
Base board is formed, after described the step of housing is installed on the pedestal, the laser diode package method further includes：
The base board is cut, so that each pedestal, the housing and the laser chip form laser two
Pole pipe semi-finished product；
One lens are installed on each laser diode semi-finished product, to form multiple laser diodes, wherein, the pedestal
Side, the housing and the lens forming material-putting space, and the laser chip transmitting light passed along the lens
It broadcasts.
10. laser diode package method as claimed in claim 9, which is characterized in that the pedestal includes the first block, institute
It states housing and includes the second block, it is described that a lens are installed on each laser diode semi-finished product, to form multiple laser
The step of diode, includes:
The both sides of the lens are respectively arranged in first block and second block；
Using Sn/Au eutectic or glue bonding or the mode of glass cream sintering by the lens and first block, described second
Block connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810090134.5A CN108183389B (en) | 2018-01-30 | 2018-01-30 | Laser diode and laser diode packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810090134.5A CN108183389B (en) | 2018-01-30 | 2018-01-30 | Laser diode and laser diode packaging method |
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| CN108183389A true CN108183389A (en) | 2018-06-19 |
| CN108183389B CN108183389B (en) | 2023-09-29 |
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| CN201810090134.5A Active CN108183389B (en) | 2018-01-30 | 2018-01-30 | Laser diode and laser diode packaging method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224294A (en) * | 2019-06-28 | 2019-09-10 | 深圳市易飞扬通信技术有限公司 | The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly |
| CN111934193A (en) * | 2020-10-14 | 2020-11-13 | 山东元旭光电股份有限公司 | LD chip inorganic packaging structure and preparation method thereof |
| WO2021135848A1 (en) * | 2019-12-31 | 2021-07-08 | 深圳市中光工业技术研究院 | Laser |
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