CN110224294A - The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly - Google Patents
The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly Download PDFInfo
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- CN110224294A CN110224294A CN201910578152.2A CN201910578152A CN110224294A CN 110224294 A CN110224294 A CN 110224294A CN 201910578152 A CN201910578152 A CN 201910578152A CN 110224294 A CN110224294 A CN 110224294A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Semiconductor Lasers (AREA)
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Abstract
The present invention relates to a kind of non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assemblies, the laser assembly includes: that chip of laser, laser thermal sediment, lens, tube socket, isolator, adjusting ring and adapter, the above method include: the upper surface that chip of laser is welded on to laser thermal sediment；The lower surface of laser thermal sediment is welded on to the optical path face of tube socket；Lens are welded on to the optical path face of tube socket；Isolator is welded on to the isolator putting hole of tube socket；The one end for adjusting ring is welded on to one end opposite with optical path face of tube socket；One end of adapter is welded on to the other end for adjusting ring.Laser assembly provided by the invention by using welding technique, avoid using traditional glue " moisture absorption " brings aging under conditions of non-hermetically sealed encapsulation the problem of, in " high temperature and humidity " reliability, failure risk be will be greatly reduced.
Description
Technical field
The present invention relates to laser equipment fields, non-hermetically sealed packaging method and non-gas more particularly to a kind of laser assembly
Close laser assembly.
Background technique
With the commercialization of the new technologies such as cloud computing, big data, data center's flow and bandwidth exponentially grade increase.This will be light
One huge opportunity of Module manufacturers.Optical module has some differences with conventional telecommunications transmission market in the application of data center,
Data center needs the iteration cycle of optical module short, cheap, therefore has expedited the emergence of the non-hermetically sealed encapsulation of optical device.Due to light group
The cost of part accounts for 60% or more of optical mode block cost, and the space of optical chip cost declining is smaller and smaller in addition, it is most possible reduce at
This is packaging cost.While guaranteeing optical module performance and reliability, push encapsulation technology from more expensive hermetic seal
Pick-up to low cost it is non-hermetically sealed be encapsulated into it is necessary.
The main points of non-hermetically sealed encapsulation include the non-airtight of optical device itself, the optimization of optical assembly design, encapsulating material with
And improvement of technique etc..Wherein challenged the most with non-hermetically sealedization of optical device especially laser.This is because if laser
Part realizes non-hermetically sealedization, then expensive level Hermetic Package there is no need to.
Non-hermetically sealed packaged laser component includes following several features: chip is exposed in air；Spun gold is exposed in air
In；Gluing optical path is exposed in air.
With the continuous improvement that chip of laser designs, the semiconductor laser chip supply of substantially industry shipment Top5
Quotient, has grasped the chip of laser technology for being able to satisfy non-hermetically sealed encapsulation, industry comparative maturity.The non-hermetically sealed encapsulation of spun gold
Risk is little, it is only necessary to do dust-proof processing to spun gold during product design, the manufacturing, prevent the dirt of external conductive particles
Dye, is able to satisfy relatively high reliability requirement substantially.
The optical path of laser assembly encapsulates, the adhesion process that the overwhelming majority uses.In the application of non-hermetically sealed encapsulation, optical path
Various components (laser COC (Chip On Carrier, carrier chip), LD (laser disc, laser disc) focus saturating
Mirror, isolator etc.) exposure in air, can ageing failure for a long time for glue.The mechanism of failure is mainly the vapor in air,
With the epoxy resin interaction in glue, epoxy resin absorbs the vapor in air, leads to volume expansion, generates one and answer
Power, we term it " absorbing moisture stress ".Absorbing moisture stress long duration of action can be such that glue and the bonding plane of optical path generates on glue
Aging loosens, and leads to optical path positioning, coupling efficiency decline.Under serious situation, optical module can directly fall off from optical path.
Different glue, water absorption rate is different, and the ability of moisture-proof thermal environment is stronger.But glue all at present, in non-gas
Under conditions of sealing dress, " moisture absorption " bring aging all not can avoid.
Summary of the invention
Based on this, it is necessary to all not can avoid under conditions of non-hermetically sealed encapsulation for above-mentioned glue all at present
The technical issues of " moisture absorption " bring aging, provides one kind and can be avoided glue " moisture absorption " under conditions of non-hermetically sealed encapsulation and brings
The non-hermetically sealed packaging method of the laser assembly of aging and non-hermetically sealed laser assembly.
A kind of non-hermetically sealed packaging method of laser assembly, the laser assembly include: chip of laser, laser heat
Heavy, lens, tube socket, isolator adjust ring and adapter, which comprises
The chip of laser is welded on to the upper surface of the laser thermal sediment；
The lower surface of the laser thermal sediment is welded on to the optical path face of the tube socket；
The lens are welded on to the optical path face of the tube socket；
The isolator is welded on to the isolator putting hole of the tube socket；
Described one end for adjusting ring is welded on to one end opposite with the optical path face of the tube socket；
One end of the adapter is welded on the other end for adjusting ring.
The upper surface that the chip of laser is welded on to the laser thermal sediment in one of the embodiments,
Including；The chip of laser eutectic is welded in the upper surface of the laser thermal sediment；
The lower surface by the laser thermal sediment is welded on the optical path face of the tube socket, comprising: by the laser
Heat sink lower surface eutectic is welded in the optical path face of the tube socket；
The optical path face that the lens are welded on to the tube socket, comprising: the lens eutectic is welded in the tube socket
Optical path face.
The upper table that the chip of laser eutectic is welded in the laser thermal sediment in one of the embodiments,
Face, comprising: the chip of laser Sn/Au eutectic is welded in the upper surface of the laser thermal sediment；
The optical path face that the lower surface eutectic of the laser thermal sediment is welded in the tube socket, comprising: by the laser
The lower surface Sn/Au eutectic that device is heat sink is welded in the optical path face of the tube socket；
The optical path face that the lens eutectic is welded in the tube socket, comprising: the lens Sn/Au eutectic is welded in institute
State the optical path face of tube socket.
In one of the embodiments, in the upper table that the chip of laser Sn/Au eutectic is welded in the laser thermal sediment
Before face, comprising:
The lower surface of the chip of laser is gold-plated；
The laser thermal sediment upper surface plate the first gilding, the gold-plated parameter of first gilding include:
The upper surface of the laser thermal sediment successively plate the titanium-tungsten face with a thickness of 50nm, the nickel face of 200nm, 500nm golden face；
The first gold medal tin solder layer, the golden tin solder of the first gold medal tin solder layer are plated in the upper surface of first gilding
Sn including 80% Au and 20%, the solder thickness are 6-7um, and fusing point is 280 DEG C.
The light of the tube socket is welded in the lower surface Sn/Au eutectic by the laser thermal sediment in one of the embodiments,
Before road surface, comprising:
The laser thermal sediment lower surface plate the second gilding, the gold-plated parameter of second gilding include:
The lower surface of the laser thermal sediment successively plate the titanium-tungsten face with a thickness of 50nm, the nickel face of 200nm, 500nm golden face；
The second gold medal tin solder layer, the golden tin solder of the second gold medal tin solder layer are plated in the lower surface of second gilding
Sn including 80% Au and 20%, the solder thickness are 6-7um, and fusing point is 280 DEG C；
The optical path face of the tube socket is successively plated to the layer gold of the nickel layer and 600nm with a thickness of 10 μm.
In one of the embodiments, before the lens Sn/Au eutectic is welded in the optical path face of the tube socket, comprising:
Gold plated Layer is plated in the lower surface of the lens, the gold-plated parameter of the Gold plated Layer includes: the following table in the lens
Successively plate the layer gold of the titanium layer with a thickness of 100nm, the platinum layer of 200nm, 500nm in face.
The isolator putting hole that the isolator is welded on to the tube socket in one of the embodiments, comprising:
By the isolator Laser Welding in the isolator putting hole of the tube socket, the solder joint of the Laser Welding is at positive triangle
Shape, the bonding power of the solder joint are 1.2kW, weld 6 solder joints, 6 solder joints are in the isolator putting hole
Surrounding is uniformly distributed, and the angle of the adjacent solder joint is 60 °.
It is described being welded on the tube socket with the optical path face by described one end for adjusting ring in one of the embodiments,
Opposite one end, comprising:
By one end Laser Welding for adjusting ring in one end opposite with the optical path face of the tube socket, the Laser Welding
It is welded using oblique 30 degree, for the solder joint of the Laser Welding at equilateral triangle, the bonding power of the solder joint is 1.2kW, welds 12
The solder joint.
Described one end by the adapter is welded on the other end for adjusting ring, packet in one of the embodiments,
It includes:
By one end Laser Welding of the adapter in the other end for adjusting ring, the Laser Welding is using oblique 30 degree welderings
It connects, for the solder joint of the Laser Welding at equilateral triangle, the bonding power of the solder joint is 1.2kW, welds 12 solder joints.
The upper surface that the chip of laser is welded on to the laser thermal sediment in one of the embodiments,
Including；By the chip of laser tin cream Reflow Soldering in the upper surface of the laser thermal sediment；
The lower surface by the laser thermal sediment is welded on the optical path face of the tube socket, comprising: by the laser
Heat sink lower surface tin cream Reflow Soldering is in the optical path face of the tube socket；
The optical path face that the lens are welded on to the tube socket, comprising: by the lens tin cream Reflow Soldering described
The optical path face of tube socket.
The material of the laser thermal sediment includes aluminium nitride in one of the embodiments,；The material of the tube socket includes
At least one of kovar alloy, stainless steel or copper-tungsten；The material of the lens include L-BAL35 glass, BK7 or
At least one of LAH84.
A kind of non-hermetically sealed laser assembly, including chip of laser, laser thermal sediment, lens, tube socket, isolator, adjusting
Ring and adapter, the chip of laser are the upper surfaces for being fixed by welding in the laser thermal sediment；The laser heat
Heavy lower surface is the optical path face for being fixed by welding in the tube socket；The lens are fixed by welding in the tube socket
Optical path face；The isolator is the isolator putting hole for being fixed by welding in the tube socket；Described one end for adjusting ring is logical
Cross the trailing flank one end opposite with optical path face for being weldingly fixed on the tube socket；One end of the adapter is by being welded and fixed
In the other end for adjusting ring.
The chip of laser is the upper table for being fixed by welding in the laser thermal sediment in one of the embodiments,
Face, the upper surface including being fixed on the laser thermal sediment by Sn/Au eutectic weldering or tin cream Reflow Soldering；
The lower surface of the laser thermal sediment is the optical path face for being fixed by welding in the tube socket, including total by golden tin
Crystalline substance weldering or tin cream Reflow Soldering are fixed on the optical path face of the tube socket；
The lens are the optical path faces for being fixed by welding in the tube socket, including are flowed back by Sn/Au eutectic weldering or tin cream
Solid welding is scheduled on the optical path face of the tube socket；
The isolator is the isolator putting hole for being fixed by welding in the tube socket, including is fixed on by Laser Welding
The isolator putting hole of the tube socket；
Described one end for adjusting ring is the trailing flank one end opposite with optical path face for being fixed by welding in the tube socket, is wrapped
Include the trailing flank that the tube socket is fixed on by Laser Welding one end opposite with optical path face；
One end of the adapter is to be fixed by welding in the other end for adjusting ring, including fix by Laser Welding
In the other end for adjusting ring.
The non-hermetically sealed packaging method of above-mentioned laser assembly and non-hermetically sealed laser assembly, by using the technique of welding,
The technique that the welding such as Sn/Au eutectic weldering, Laser Welding or tin cream Reflow Soldering specifically can be used is avoided using traditional glue in non-gas
The problem of " moisture absorption " brings aging under conditions of sealing dress, in " high temperature and humidity " reliability, failure risk be will be greatly reduced.
Detailed description of the invention
Fig. 1 is laser assembly schematic diagram provided in an embodiment of the present invention；
Fig. 2 is the first pass schematic diagram of the non-hermetically sealed packaging method of laser assembly provided in an embodiment of the present invention；
Fig. 3 is the side view of laser thermal sediment in laser assembly provided in an embodiment of the present invention；
Fig. 4 is the second procedure schematic diagram of the non-hermetically sealed packaging method of laser assembly provided in an embodiment of the present invention；
Fig. 5 is the schematic diagram of tube socket in laser assembly provided in an embodiment of the present invention；
Fig. 6 is the third flow diagram of the non-hermetically sealed packaging method of laser assembly provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram of lens in laser assembly provided in an embodiment of the present invention.
Specific embodiment
The embodiment of the present invention provides a kind of non-hermetically sealed packaging method of laser assembly, the non-gas suitable for laser assembly
Sealing dress, as shown in Figure 1, being laser assembly schematic diagram provided in an embodiment of the present invention, the laser assembly is specific can include:
Chip of laser 1, lens 3, tube socket 4, isolator 5, adjusts ring 6 and adapter 7 at laser thermal sediment 2.The light of the laser assembly
Road working principle are as follows: the diverging light that chip of laser 1 issues is converged by lens 3, and converged light passes through isolator 5, is entered
In the single mode optical fiber fibre core of adapter 7.Wherein, tube socket 4 is the main body for carrying laser assembly optical path.As shown in Fig. 2, being this hair
The first pass schematic diagram of the non-hermetically sealed packaging method for the laser assembly that bright embodiment provides, this method specifically may include following
Step:
Step S100: chip of laser 1 is welded on to the upper surface 201a of laser thermal sediment 2.As shown in figure 3, being this hair
Nitridation can be used in the side view of laser thermal sediment 2, the material of the laser thermal sediment 2 in the laser assembly that bright embodiment provides
Aluminium.
Further, 1 eutectic of chip of laser can be welded in the upper surface 201a of laser thermal sediment 2；It specifically can be by laser
1 Sn/Au eutectic of device chip is welded in the upper surface 201a of laser thermal sediment 2, and 1 Sn/Au eutectic of chip of laser is being welded in laser
Before heat sink 2 upper surface 201a, as shown in figure 4, being the non-hermetically sealed encapsulation side of laser assembly provided in an embodiment of the present invention
The second procedure schematic diagram of method, specifically can comprise the further steps of:
Step S102: in order to be powered on to chip of laser 1, the lower surface of chip of laser 1 is gold-plated, chip of laser 1
Specifically optional edge transmitting type DFB (Distributed Feedback Laser, distributed Feedback) laser.
Step S104: the first gilding 202a, the plating of the first gilding 202a are plated in the upper surface 201a of laser thermal sediment 2
Golden parameter include: the upper surface 201a of laser thermal sediment 2 successively plate the titanium-tungsten face with a thickness of 50nm, 200nm nickel face,
The golden face of 500nm.It the edge of first gilding 202a must not peeling and flash.Certainly, guaranteeing normal gold wire bonding and be total to
Under the premise of crystalline substance weldering, the gold-plated parameter of the first gilding 202a can be modified.
As shown in figure 3, the junction 204 of the first gilding 202a is used for the positive and negative anodes of connecting laser.
Step S106: the first gold medal tin solder layer 203a, the first gold medal tin solder layer are plated in the upper surface of the first gilding 202a
The golden tin solder of 203a includes the Sn of 80% Au and 20%, and solder thickness 6-7um, fusing point is 280 DEG C, the first gold medal tin solder
The edge of layer 203a must not peeling and flash.Certainly, it under the premise of guaranteeing normal gold wire bonding and eutectic welds, can modify
The parameter of golden tin solder.
Then, 1 Sn/Au eutectic of chip of laser is welded in the upper surface 201a of laser thermal sediment 2.The temperature of Sn/Au eutectic weldering
Degree specifically can be used 300 degrees Celsius, heat 15 seconds.
Certainly, chip of laser 1 is welded on to the upper surface 201a of laser thermal sediment 2, in addition to Sn/Au eutectic welds mode,
It can be by 1 tin cream Reflow Soldering of chip of laser in welding manners such as the upper surface 201a of laser thermal sediment 2.
Step S200: the lower surface 201b of laser thermal sediment 2 is welded on to the optical path face 401 of tube socket 4.As shown in figure 5, being
The schematic diagram of tube socket 4 in laser assembly provided in an embodiment of the present invention.
Further, the lower surface 201b eutectic of laser thermal sediment 2 can be welded in the optical path face 401 of tube socket 4；It can specifically incite somebody to action
The lower surface 201b Sn/Au eutectic of laser thermal sediment 2 is welded in the optical path face 401 of tube socket 4；By the lower surface of laser thermal sediment 2
201b Sn/Au eutectic is welded in front of the optical path face 401 of tube socket 4, as shown in fig. 6, being laser assembly provided in an embodiment of the present invention
Non-hermetically sealed packaging method third flow diagram, specifically can comprise the further steps of:
Step S202: the second gilding 202b, the plating of the second gilding 202b are plated in the lower surface 201b of laser thermal sediment 2
Golden parameter includes: successively to plate the nickel in titanium-tungsten face with a thickness of 50nm, 200nm in the 2 of laser thermal sediment lower surface 201b
Face, 500nm golden face.It the edge of second gilding 202b must not peeling and flash.Certainly, guarantee normal gold wire bonding and
Under the premise of eutectic welds, the gold-plated parameter of the second gilding 202b can be modified.
Step S204: the second gold medal tin solder layer 203b, the second gold medal tin solder layer are plated in the lower surface of the second gilding 202b
The golden tin solder of 203b includes the Sn of 80% Au and 20%, and solder thickness 6-7um, fusing point is 280 DEG C, the second gold medal tin solder
The edge of layer 203b must not peeling and flash.Certainly, it under the premise of guaranteeing normal gold wire bonding and eutectic welds, can modify
The parameter of golden tin solder.
Step S206: the optical path face 401 of tube socket 4 is successively plated to the layer gold of the nickel layer and 600nm with a thickness of 10 μm.Tube socket 4
Material specifically may include kovar (can cut down, section watt, kovar, also referred to as iron nickel cobalt) in alloy, stainless steel or copper-tungsten at least
It is a kind of.
Then, the lower surface 201b Sn/Au eutectic of laser thermal sediment 2 is welded in the optical path face 401 of tube socket 4.Sn/Au eutectic weldering
Temperature specifically can be used 300 degrees Celsius, heat 15 seconds.
Certainly, the lower surface 201b of laser thermal sediment 2 is welded on to the optical path face 401 of tube socket 4, in addition to Sn/Au eutectic weldering side
Formula, can also be by the lower surface 201b tin cream Reflow Soldering of laser thermal sediment 2 in the equal welding manners in the optical path face 401 of tube socket 4.
Step S300: lens 3 are welded on to the optical path face 401 of tube socket 4.As shown in fig. 7, being provided in an embodiment of the present invention
The schematic diagram of lens 3 in laser assembly, the material of the lens 3 specifically may include in L-BAL35 glass, BK7 or LAH84 extremely
Few one kind.
Further, 3 eutectic of lens can be welded in the optical path face 401 of tube socket 4；3 Sn/Au eutectic of lens can be specifically welded in
The optical path face 401 of tube socket 4；Before 3 Sn/Au eutectic of lens is welded in the optical path face 401 of tube socket 4, it specifically may also include following step
It is rapid:
Lens 3 lower surface plate Gold plated Layer 301, the gold-plated parameter of Gold plated Layer 301 include: the lower surface of lens 3 according to
The secondary layer gold plated with a thickness of the titanium layer of 100nm, the platinum layer of 200nm, 500nm.
Then, before 3 Sn/Au eutectic of lens being welded in the optical path face 401 of tube socket 4, golden tin solder include 80% Au and
20% Sn, fusing point are 280 DEG C, certainly, under the premise of guaranteeing normal gold wire bonding and eutectic welds, can modify golden soldering
The parameter of material.The temperature of Sn/Au eutectic weldering specifically can be used 300 degrees Celsius, heat 15 seconds.
Certainly, lens 3 are welded on to the optical path face 401 of tube socket 4, it, can also be by 3 tin of lens in addition to Sn/Au eutectic welds mode
Cream Reflow Soldering is in the equal welding manners in the optical path face 401 of tube socket 4.
Step S400: isolator 5 is welded on to the isolator putting hole 404 of tube socket 4.
Specifically, can be by 5 Laser Welding of isolator in the isolator putting hole 404 of tube socket 4, the solder joint of Laser Welding is at positive triangle
Shape, it is ensured that the stability of structure.The bonding power of solder joint can 1.2kW, weld 6 solder joints, 6 solder joints are in isolator putting hole
It is uniformly distributed around 404, the angle of adjacent welds is 60 °.Certainly, the number of welds of Laser Welding and power etc. are guaranteeing to cut
Under the premise of shear force and reliability, it can change.
Step S500: the one end for adjusting ring 6 is welded on to one end opposite with optical path face 401 (laser in Fig. 5 of tube socket 4
The face of weld 402).
Specifically, can be by one end Laser Welding of adjusting ring 6 in one end opposite with optical path face 401 of tube socket 4, Laser Welding is adopted
It is welded with oblique 30 degree, the solder joint of Laser Welding guarantees the stability of structure at equilateral triangle.The bonding power of solder joint is 1.2kW, weldering
12 solder joints are connect, 12 solder joints are uniformly distributed around the laser face of weld 402, and 30 ° of adjacent welds angle.
Particularly, the laser face of weld 402 is not gold-plated, prevents gilding from causing energy loss to the reflection of laser.
Step S600: one end of adapter 7 is welded on to the other end for adjusting ring 6.
Specifically, can be by one end Laser Welding of adapter 7 in the other end for adjusting ring 6, Laser Welding is welded using oblique 30 degree,
The solder joint of Laser Welding guarantees the stability of structure at equilateral triangle.The bonding power of solder joint is 1.2kW, welds 12 solder joints, 12
A solder joint is uniformly distributed around adjusting ring 6, and 30 ° of adjacent welds angle.
304# stainless steel, the kovar alloy with alloy tube socket 4 specifically can be used in the metal part for adjusting ring 6 and adapter 7
Matched coefficients of thermal expansion, promoted reliability.
The non-hermetically sealed packaging method of laser assembly provided in an embodiment of the present invention, laser assembly is by using welding
Technique, the technique that the welding such as Sn/Au eutectic weldering, Laser Welding or tin cream Reflow Soldering specifically can be used are avoided and are existed using traditional glue
The problem of " moisture absorption " brings aging under conditions of non-hermetically sealed encapsulation, in " high temperature and humidity " reliability, failure risk can drop significantly
It is low.
The embodiment of the present invention also provides a kind of non-hermetically sealed laser assembly, including chip of laser, laser thermal sediment, thoroughly
Mirror, isolator, adjusts ring and adapter at tube socket, and particularly, chip of laser is be fixed by welding in laser thermal sediment upper
Surface；The lower surface of laser thermal sediment is the optical path face for being fixed by welding in tube socket；Lens are to be fixed by welding in tube socket
Optical path face；Isolator is the isolator putting hole for being fixed by welding in tube socket；The one end for adjusting ring is by being welded and fixed
In one end that the trailing flank of tube socket is opposite with optical path face；One end of adapter is to be fixed by welding in the other end for adjusting ring.
Further, above-mentioned chip of laser is the upper surface for being fixed by welding in laser thermal sediment, specifically may include
The upper surface of laser thermal sediment is fixed on by modes such as Sn/Au eutectic weldering or tin cream Reflow Solderings.
The lower surface of above-mentioned laser thermal sediment is the optical path face for being fixed by welding in tube socket, specifically may include by golden tin
The modes such as eutectic weldering or tin cream Reflow Soldering are fixed on the optical path face of tube socket.
Said lens are to be fixed by welding in the optical path face of tube socket, specifically may include being returned by Sn/Au eutectic weldering or tin cream
The modes such as fluid welding are fixed on the optical path face of tube socket.
Above-mentioned isolator is the isolator putting hole for being fixed by welding in tube socket, specifically may include by the side such as Laser Welding
Formula is fixed on the isolator putting hole of tube socket.
One end of above-mentioned adjusting ring is the trailing flank one end opposite with optical path face for being fixed by welding in tube socket, specifically may be used
Trailing flank including being fixed on tube socket by modes such as Laser Weldings one end opposite with optical path face.
One end of above-mentioned adapter is to be fixed by welding in the other end for adjusting ring, specifically may include by Laser Welding etc.
Mode is fixed on the other end for adjusting ring.
Golden tin specifically can be used by using the technique of welding in non-hermetically sealed laser assembly provided in an embodiment of the present invention
The technique of the welding such as eutectic weldering, Laser Welding or tin cream Reflow Soldering is avoided using traditional glue under conditions of non-hermetically sealed encapsulation
The problem of " moisture absorption " brings aging, in " high temperature and humidity " reliability, failure risk be will be greatly reduced.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (13)
1. a kind of non-hermetically sealed packaging method of laser assembly, the laser assembly includes: chip of laser, laser heat
Heavy, lens, tube socket, isolator adjust ring and adapter, which is characterized in that the described method includes:
The chip of laser is welded on to the upper surface of the laser thermal sediment；
The lower surface of the laser thermal sediment is welded on to the optical path face of the tube socket；
The lens are welded on to the optical path face of the tube socket；
The isolator is welded on to the isolator putting hole of the tube socket；
Described one end for adjusting ring is welded on to one end opposite with the optical path face of the tube socket；
One end of the adapter is welded on the other end for adjusting ring.
2. the non-hermetically sealed packaging method of laser assembly according to claim 1, which is characterized in that described by the laser
Device chip is welded on the upper surface of the laser thermal sediment, including；The chip of laser eutectic is welded in the laser heat
Heavy upper surface；
The lower surface by the laser thermal sediment is welded on the optical path face of the tube socket, comprising: by the laser thermal sediment
Lower surface eutectic be welded in the optical path face of the tube socket；
The optical path face that the lens are welded on to the tube socket, comprising: the lens eutectic is welded in the light of the tube socket
Road surface.
3. the non-hermetically sealed packaging method of laser assembly according to claim 2, which is characterized in that described by the laser
Device chip eutectic is welded in the upper surface of the laser thermal sediment, comprising: is welded in the chip of laser Sn/Au eutectic described sharp
The upper surface that light device is heat sink；
The optical path face that the lower surface eutectic of the laser thermal sediment is welded in the tube socket, comprising: by the laser heat
Heavy lower surface Sn/Au eutectic is welded in the optical path face of the tube socket；
The optical path face that the lens eutectic is welded in the tube socket, comprising: the lens Sn/Au eutectic is welded in the pipe
The optical path face of seat.
4. the non-hermetically sealed packaging method of laser assembly according to claim 3, which is characterized in that by the laser
Chip Sn/Au eutectic is welded in front of the upper surface of the laser thermal sediment, comprising:
The lower surface of the chip of laser is gold-plated；
The first gilding is plated in the upper surface of the laser thermal sediment, the gold-plated parameter of first gilding includes: described
The upper surface of laser thermal sediment successively plate the titanium-tungsten face with a thickness of 50nm, the nickel face of 200nm, 500nm golden face；
The first gold medal tin solder layer is plated in the upper surface of first gilding, the golden tin solder of the first gold medal tin solder layer includes
The Sn of 80% Au and 20%, the solder thickness are 6-7um, and fusing point is 280 DEG C.
5. the non-hermetically sealed packaging method of laser assembly according to claim 4, which is characterized in that by the laser
Heat sink lower surface Sn/Au eutectic is welded in front of the optical path face of the tube socket, comprising:
The second gilding is plated in the lower surface of the laser thermal sediment, the gold-plated parameter of second gilding includes: described
The lower surface of laser thermal sediment successively plate the titanium-tungsten face with a thickness of 50nm, the nickel face of 200nm, 500nm golden face；
The second gold medal tin solder layer is plated in the lower surface of second gilding, the golden tin solder of the second gold medal tin solder layer includes
The Sn of 80% Au and 20%, the solder thickness are 6-7um, and fusing point is 280 DEG C；
The optical path face of the tube socket is successively plated to the layer gold of the nickel layer and 600nm with a thickness of 10 μm.
6. the non-hermetically sealed packaging method of laser assembly according to claim 5, which is characterized in that the lens are golden
Tin eutectic is welded in front of the optical path face of the tube socket, comprising:
The lens lower surface plate Gold plated Layer, the gold-plated parameter of the Gold plated Layer include: the lower surface of the lens according to
The secondary layer gold plated with a thickness of the titanium layer of 100nm, the platinum layer of 200nm, 500nm.
7. the non-hermetically sealed packaging method of laser assembly according to claim 1, which is characterized in that described by the isolation
Device is welded on the isolator putting hole of the tube socket, comprising:
By the isolator Laser Welding in the isolator putting hole of the tube socket, the solder joint of the Laser Welding is at equilateral triangle, institute
The bonding power for stating solder joint is 1.2kW, welds 6 solder joints, and 6 solder joints are equal around the isolator putting hole
Even distribution, the angle of the adjacent solder joint are 60 °.
8. the non-hermetically sealed packaging method of laser assembly according to claim 1, which is characterized in that described by the adjusting
One end of ring is welded on one end opposite with the optical path face of the tube socket, comprising:
By one end Laser Welding for adjusting ring in one end opposite with the optical path face of the tube socket, the Laser Welding is used
Oblique 30 degree of welding, for the solder joint of the Laser Welding at equilateral triangle, the bonding power of the solder joint is 1.2kW, is welded described in 12
Solder joint.
9. the non-hermetically sealed packaging method of laser assembly according to claim 1, which is characterized in that described by the adaptation
One end of device is welded on the other end for adjusting ring, comprising:
By one end Laser Welding of the adapter in the other end for adjusting ring, the Laser Welding is using oblique 30 degree welding, institute
The solder joint of Laser Welding is stated into equilateral triangle, the bonding power of the solder joint is 1.2kW, welds 12 solder joints.
10. the non-hermetically sealed packaging method of laser assembly according to claim 2, which is characterized in that described to swash described
Light device chip is welded on the upper surface of the laser thermal sediment, including；The chip of laser tin cream Reflow Soldering is swashed described
The upper surface that light device is heat sink；
The lower surface by the laser thermal sediment is welded on the optical path face of the tube socket, comprising: by the laser thermal sediment
Lower surface tin cream Reflow Soldering in the optical path face of the tube socket；
The optical path face that the lens are welded on to the tube socket, comprising: by the lens tin cream Reflow Soldering in the tube socket
Optical path face.
11. the non-hermetically sealed packaging method of laser assembly according to claim 6, which is characterized in that the laser heat
Heavy material includes aluminium nitride；The material of the tube socket includes at least one of kovar alloy, stainless steel or copper-tungsten；
The material of the lens includes at least one of L-BAL35 glass, BK7 or LAH84.
12. a kind of non-hermetically sealed laser assembly, including chip of laser, laser thermal sediment, lens, tube socket, isolator, adjusting ring
And adapter, which is characterized in that the chip of laser is the upper surface for being fixed by welding in the laser thermal sediment；It is described
The lower surface of laser thermal sediment is the optical path face for being fixed by welding in the tube socket；The lens are to be fixed by welding in institute
State the optical path face of tube socket；The isolator is the isolator putting hole for being fixed by welding in the tube socket；The adjusting ring
One end is the trailing flank one end opposite with optical path face for being fixed by welding in the tube socket；One end of the adapter is to pass through
It is weldingly fixed on the other end for adjusting ring.
13. non-hermetically sealed laser assembly according to claim 12, which is characterized in that the chip of laser is to pass through weldering
The upper surface for being fixed on the laser thermal sediment is connect, including the laser is fixed on by Sn/Au eutectic weldering or tin cream Reflow Soldering
Heat sink upper surface；
The lower surface of the laser thermal sediment is the optical path face for being fixed by welding in the tube socket, including is welded by Sn/Au eutectic
Or tin cream Reflow Soldering is fixed on the optical path face of the tube socket；
The lens are the optical path faces for being fixed by welding in the tube socket, including pass through Sn/Au eutectic weldering or tin cream reflux solid welding
It is scheduled on the optical path face of the tube socket；
The isolator is the isolator putting hole for being fixed by welding in the tube socket, including is fixed on by Laser Welding described
The isolator putting hole of tube socket；
Described one end for adjusting ring is the trailing flank one end opposite with optical path face for being fixed by welding in the tube socket, including is led to
Cross trailing flank one end opposite with optical path face that Laser Welding is fixed on the tube socket；
One end of the adapter is to be fixed by welding in the other end for adjusting ring, including be fixed on institute by Laser Welding
State the other end for adjusting ring.
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| CN201910578152.2A CN110224294A (en) | 2019-06-28 | 2019-06-28 | The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly |
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| CN201910578152.2A CN110224294A (en) | 2019-06-28 | 2019-06-28 | The non-hermetically sealed packaging method of laser assembly and non-hermetically sealed laser assembly |
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