CN208385366U - A kind of LED packaging and die bonding structure - Google Patents
A kind of LED packaging and die bonding structure Download PDFInfo
- Publication number
- CN208385366U CN208385366U CN201821080013.4U CN201821080013U CN208385366U CN 208385366 U CN208385366 U CN 208385366U CN 201821080013 U CN201821080013 U CN 201821080013U CN 208385366 U CN208385366 U CN 208385366U
- Authority
- CN
- China
- Prior art keywords
- fixed
- plate
- push
- limit
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of LED packaging and die bonding structures, including station, push-rod electric machine, telescopic rod, sliding block, limit spring and LED wafer, it is opened up at the top of the station fluted, pedestal is placed in the groove, it is located at groove two sides at the top of the station and symmetrically offers limiting slot, limited block is fixed in the limiting slot, mounting rack is fixed at the top of the station, the mounting rack top inner wall is fixed with push-rod electric machine, this LED packaging and die bonding structure, fixed plate movement is pushed by push-rod electric machine, so that fixed plate drives limit plate movement, so that limit plate and limited block cooperate, two end motions of the limit plate to separate pedestal, release limit of the limit plate to LED wafer, LED wafer is slipped at the top of pedestal, push plate moves downward under the elastic force effect of adjustable spring, to LED crystalline substance Piece forms a thrust, so that LED wafer is fixed, structure is simple, and it is convenient to operate, and saves the time, improves working efficiency.
Description
Technical field
The utility model relates to LED die bond technical field, specially a kind of LED packaging and die bonding structure.
Background technique
For light emitting diode, encapsulation technology is indispensable, LED wafer manufacturer offer on Client application
Have functional LED wafer, and encapsulating manufacturer then is by these chips commercialization to client.Manufacturer is encapsulated by chip commodity
Change, needs to test by LED wafer, is cut into crystal grain, classification, die bond, routing, encapsulation and LED bulb classification.Wherein, existing
LED die bond technique be mainly first on the pedestal of LED support or in the base point of LED wafer crystal-bonding adhesive, then by LED crystalline substance
Piece is mounted in fixing seat, is fixed on LED wafer on the pedestal of LED support.Existing LED packaging and die bonding structure passes through
Mechanical adjustment, structure is complicated, inconvenient, is easy to appear mistake, meanwhile, synchronism is extremely difficult between all parts, for this purpose,
It is proposed that a kind of LED packaging and die bonding structure.
Utility model content
The purpose of this utility model is to provide a kind of LED packaging and die bonding structures, to solve to propose in above-mentioned background technique
The problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of LED packaging and die bonding structure, including behaviour
Make platform, push-rod electric machine, telescopic rod, sliding block, limit spring and LED wafer, opens up fluted, the groove at the top of the station
It is inside placed with pedestal, is located at groove two sides at the top of the station and symmetrically offers limiting slot, fixed in the limiting slot limited
Position block, the station top are fixed with mounting rack, and the mounting rack top inner wall is fixed with push-rod electric machine, the push-rod electric machine
Output shaft end be fixed with fixed plate, the fixed plate bottom symmetrical offers sliding slot, slidably connects cunning in the sliding slot
Block is provided with limit spring in the sliding slot, and the both ends of the limit spring are fixedly connected with sliding block and fixed plate respectively, described
Slider bottom is fixed with limit plate, and the limit plate bottom end offers fixing groove, is arranged in fixing groove at the top of the pedestal, institute
It states limited block and limit plate cooperates, the limit plate side offers placing groove, and the fixed plate bottom symmetrical is provided with
Adjustable spring, is provided with push plate below the fixed plate, the both ends of the push plate be slidably connected at respectively two it is symmetrically arranged
In placing groove, the both ends of the adjustable spring are fixedly connected with push plate and fixed plate respectively, and the push plate bottom is placed with LED crystalline substance
Piece, and LED wafer cooperates with two symmetrically arranged limit plates, the operation console side is fixed with control panel, described
Control panel is electrically connected push-rod electric machine.
Preferably, the fixed plate bottom symmetrical is fixed with telescopic rod, and the telescopic rod bottom end is fixedly connected with push plate, and
Adjustable spring is set on the outside of telescopic rod.
Preferably, longitudinal screenshot of the push plate is in isosceles trapezoid, and push plate is a kind of rubber slab.
Preferably, the height of the fixing groove is greater than the height of pedestal.
Preferably, longitudinal screenshot of the limited block is triangular in shape.
Compared with prior art, the utility model has the beneficial effects that
1, the utility model pushes fixed plate movement by push-rod electric machine, so that fixed plate drives limit plate movement, so that
Limit plate and limited block cooperate, and limit plate releases limit of the limit plate to LED wafer to two end motions far from pedestal,
LED wafer is slipped at the top of pedestal, and push plate moves downward under the elastic force effect of adjustable spring, is formed one to LED wafer and is pushed away
Power, so that LED wafer is fixed, structure is simple, and it is convenient to operate, and saves the time, improves working efficiency.
2, the utility model drives fixed plate to move upwards, so that the limit of limited block and limit plate by push-rod electric machine
It releases, the elastic force of limit spring pushes slide block movement, since the elastic force of limit spring is greater than the elastic force of adjustable spring, so that limit
Plate forms a thrust to push plate when moving, so that push plate moves upwards state when being restored to static, it is convenient to operate, and increases
The stability of device, saves the time, so that the movement of limit plate and push plate reaches synchronism.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram.
In figure: 1, station；2, limiting slot；3, limited block；4, groove；5, fixed plate；6, sliding slot；7, mounting rack；8, it stretches
Contracting spring；9, push-rod electric machine；10, telescopic rod；11, sliding block；12, limit spring；13, control panel；14, limit plate；15, it pushes away
Plate；16, LED wafer；17, placing groove；18, pedestal；19, fixing groove.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to Fig. 1, the utility model provides a kind of technical solution: a kind of LED packaging and die bonding structure, including station 1,
Push-rod electric machine 9, telescopic rod 10, sliding block 11, limit spring 12 and LED wafer 16 open up fluted 4 at the top of the station 1, institute
It states and is placed with pedestal 18 in groove 4,4 two sides of groove are located at the top of the station 1 and symmetrically offer limiting slot 2, the limit
Limited block 3 is fixed in slot 2, by limited block 3, so that limit plate 14 preferably slides in limiting slot 2, the station 1
Top is fixed with mounting rack 7, and 7 top inner wall of mounting rack is fixed with push-rod electric machine 9, by mounting rack 7, so that push-rod electric machine
9 obtain a supporting point, and the output shaft end of the push-rod electric machine 9 is fixed with fixed plate 5, and 5 bottom symmetrical of fixed plate is opened
Equipped with sliding slot 6, sliding block 11 is slidably connected in the sliding slot 6, and limit spring 12, the limit bullet are provided in the sliding slot 6
The both ends of spring 12 are fixedly connected with sliding block 11 and fixed plate 5 respectively, by limit spring 12, so that sliding block 11 is pushed, thus
So that sliding block 11 is slidably connected in sliding slot 6,11 bottom of sliding block is fixed with limit plate 14, and 14 bottom end of limit plate opens up
There is fixing groove 19, is arranged in fixing groove 19 at the top of the pedestal 18, is arranged by pedestal 18 in fixing groove 19, so that limited block
3 and limit plate 14 cooperate, 14 side of limit plate offers placing groove 17, and 5 bottom symmetrical of fixed plate is provided with
Adjustable spring 8, is provided with push plate 15 below the fixed plate 5, the both ends of the push plate 15 be slidably connected at respectively two it is symmetrical
In the placing groove 17 of setting, the both ends of the adjustable spring 8 are fixedly connected with push plate 15 and fixed plate 5 respectively, the push plate 15
Bottom is placed with LED wafer 16, and two symmetrically arranged limit plates 14 clamp LED wafer 16, are pushed away by adjustable spring 8
Plate 15 slides in placing groove 17, so that push plate 15 pushes colloid fixed at the top of LED wafer 16 and pedestal 18 to interact
To fixation, 1 side of station is fixed with control panel 13, and the control panel 13 is electrically connected push-rod electric machine 9, due to limit
The elastic force of position spring 12 is greater than the elastic force of adjustable spring 8, when push-rod electric machine 9 drives fixed plate 5 to move, so that limit plate 14 drives
Push plate 15 moves upwards, and is restored to static state.
5 bottom symmetrical of fixed plate is fixed with telescopic rod 10, and 10 bottom end of telescopic rod is fixedly connected with push plate 15, and
Adjustable spring 8 is set in 10 outside of telescopic rod, by the up and down adjustment of telescopic rod 10, deforms after preventing adjustable spring 8 from being compressed.
Longitudinal screenshot of the push plate 15 is in isosceles trapezoid, and push plate 15 is a kind of rubber slab, passes through the rubber of isosceles trapezoid
Offset plate, anti-thrust plate 15 damage LED wafer 16.
The height of the fixing groove 19 is greater than the height of pedestal 18, and the height of pedestal 18 is greater than by the height of fixing groove 19
Degree preferably cooperates with pedestal 18 convenient for fixing groove 19.
Longitudinal screenshot of the limited block 3 is triangular in shape, by the limited block 3 of triangle, so that limited block 3 and limit plate
Limit is formed between 14.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of LED packaging and die bonding structure, including station (1), push-rod electric machine (9), telescopic rod (10), sliding block (11), limit
Spring (12) and LED wafer (16), it is characterised in that: opened up fluted (4) at the top of the station (1), in the groove (4)
It is placed with pedestal (18), groove (4) two sides is located at the top of the station (1) and symmetrically offer limiting slot (2), the limiting slot
(2) it is fixed with limited block (3), is fixed with mounting rack (7) at the top of the station (1), mounting rack (7) top inner wall is solid in
Surely have push-rod electric machine (9), the output shaft end of the push-rod electric machine (9) is fixed with fixed plate (5), fixed plate (5) bottom
It symmetrically offers sliding slot (6), is slidably connected sliding block (11) in the sliding slot (6), be provided with limit spring in the sliding slot (6)
(12), the both ends of the limit spring (12) are fixedly connected with sliding block (11) and fixed plate (5) respectively, sliding block (11) bottom
It is fixed with limit plate (14), limit plate (14) bottom end offers fixing groove (19), and setting is solid at the top of the pedestal (18)
Determine in slot (19), the limited block (3) and limit plate (14) cooperate, and limit plate (14) side offers placing groove
(17), fixed plate (5) bottom symmetrical is provided with adjustable spring (8), is provided with push plate (15) below the fixed plate (5),
The both ends of the push plate (15) are slidably connected at respectively in two symmetrically arranged placing grooves (17), the adjustable spring (8)
Both ends are fixedly connected with push plate (15) and fixed plate (5) respectively, and push plate (15) bottom is placed with LED wafer (16), and LED
Chip (16) cooperates with two symmetrically arranged limit plates (14), and station (1) side is fixed with control panel
(13), the control panel (13) is electrically connected push-rod electric machine (9).
2. a kind of LED packaging and die bonding structure according to claim 1, it is characterised in that: fixed plate (5) bottom symmetrical
Be fixed with telescopic rod (10), telescopic rod (10) bottom end is fixedly connected with push plate (15), and adjustable spring (8) be set in it is flexible
On the outside of bar (10).
3. a kind of LED packaging and die bonding structure according to claim 1, it is characterised in that: the longitudinal direction of the push plate (15) is cut
Figure is in isosceles trapezoid, and push plate (15) is a kind of rubber slab.
4. a kind of LED packaging and die bonding structure according to claim 1, it is characterised in that: the height of the fixing groove (19)
Greater than the height of pedestal (18).
5. a kind of LED packaging and die bonding structure according to claim 1, it is characterised in that: the longitudinal direction of the limited block (3) is cut
Scheme triangular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080013.4U CN208385366U (en) | 2018-07-09 | 2018-07-09 | A kind of LED packaging and die bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821080013.4U CN208385366U (en) | 2018-07-09 | 2018-07-09 | A kind of LED packaging and die bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208385366U true CN208385366U (en) | 2019-01-15 |
Family
ID=64963307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821080013.4U Active CN208385366U (en) | 2018-07-09 | 2018-07-09 | A kind of LED packaging and die bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208385366U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770529A (en) * | 2020-12-17 | 2021-05-07 | 吕贤虾 | Automatic hot melting device of double-shaft chip packaging |
| CN113573494A (en) * | 2021-06-23 | 2021-10-29 | 苏州斯尔特微电子有限公司 | LED full-automatic die bonder and die bonding method thereof |
-
2018
- 2018-07-09 CN CN201821080013.4U patent/CN208385366U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770529A (en) * | 2020-12-17 | 2021-05-07 | 吕贤虾 | Automatic hot melting device of double-shaft chip packaging |
| CN112770529B (en) * | 2020-12-17 | 2022-05-20 | 福建省郑能量电路科技有限公司 | Automatic hot melting device of double-shaft chip package |
| CN113573494A (en) * | 2021-06-23 | 2021-10-29 | 苏州斯尔特微电子有限公司 | LED full-automatic die bonder and die bonding method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208385366U (en) | A kind of LED packaging and die bonding structure | |
| CN218447858U (en) | Device convenient to blue membrane and chip separation | |
| CN201066510Y (en) | Electronic label half-automatic sealing machine | |
| CN208434189U (en) | A kind of pressing device of PCB circuit board | |
| CN105557367B (en) | Flowerpot retaining device | |
| CN212321053U (en) | Fixing device for detecting LED lamp shade | |
| CN211014349U (en) | Test device for integrated circuit | |
| CN115980401B (en) | Automatic testing device based on down-pressure SOP test seat | |
| CN218727793U (en) | Module test fixture | |
| CN204549473U (en) | Automatic clamping device | |
| CN207994336U (en) | A kind of high-power bar laser sintering fixture | |
| CN217181007U (en) | Detachable ceramic block type wafer test probe card | |
| CN205490047U (en) | Voice coil motor base equipment tool | |
| CN106180270A (en) | A kind of intelligent measure apparatus for shaping | |
| CN208812482U (en) | A kind of hanging compact vertical injection molding machine robot device | |
| CN106211744A (en) | A kind of LED shading foam assembles fixture | |
| CN208028039U (en) | A kind of bonding fixture | |
| CN210071871U (en) | Single-station Panel automatic alignment clamp | |
| CN209466177U (en) | A kind of robot device for plug of choosing automatically | |
| CN208005707U (en) | Automatic recording machine grab chips structure | |
| CN216511350U (en) | Integrated circuit test process pickup apparatus | |
| CN209471939U (en) | A kind of stamp-mounting-paper diode gumming mechanism | |
| CN207665420U (en) | A kind of chip mounter lens loader | |
| CN218110494U (en) | Chip inspection is with preventing pressing from both sides damage formula clamp and get device | |
| CN221048352U (en) | Processing platform for electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523000 Patentee after: Dongguan Zhongzhi Technology Co.,Ltd. Address before: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523000 Patentee before: DONGGUAN SINOWIN OPTO-ELECTRONIC Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |