CN208400847U - A kind of high-power encapsulation lamp bead of octal - Google Patents
A kind of high-power encapsulation lamp bead of octal Download PDFInfo
- Publication number
- CN208400847U CN208400847U CN201821243610.4U CN201821243610U CN208400847U CN 208400847 U CN208400847 U CN 208400847U CN 201821243610 U CN201821243610 U CN 201821243610U CN 208400847 U CN208400847 U CN 208400847U
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- octal
- lamp bead
- pin
- bowl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a kind of high-power encapsulation lamp bead of octal, comprising: four chips, four pairs of pins on the bracket are respectively set in bracket；Four pairs of pins include positive pin and negative pin, each chip corresponds to a pair of pins and is connected by conducting wire and is formed into a loop, the bowl that the bracket includes: bottom plate, is arranged on one face of bottom plate, radiating block in bowl is set, four chips are fixed on the radiating block, and the radiating block is embedded on the bottom plate and extends to the bottom surface of bottom plate.The utility model is by being arranged multiple chips in a bowl, to meet the needs of to multiple color；It secures the wafer on radiating block, can effectively enhance heat dissipation effect, to meet powerful demand.
Description
Technical field
The utility model relates to LED technology field more particularly to a kind of high-power encapsulation lamp beads of octal.
Background technique
With the progress of science and technology, LED light is also more towards small size, high-power, multiple color development, to meet big function
The demand of rate, more colors is generally assembled using multiple colors all LED light, but volume can be brought to become larger, and weak heat-dissipating etc. is asked
Topic.
Therefore, the prior art is defective, needs to improve.
Utility model content
Technical problem to be solved by the utility model is: provide a kind of high-power encapsulation lamp bead of octal, can meet it is small in size,
Various colors, high-power, good heat dissipation demand.
The technical solution of the utility model is as follows: providing a kind of high-power encapsulation lamp bead of octal, comprising: bracket is set respectively
Set four chips, four pairs of pins on the bracket；Four pairs of pins include positive pin and negative pin, each chip
Corresponding a pair of pins is simultaneously by conducting wire connection forming circuit, and the bracket includes: bottom plate, the bowl that is arranged on a face of bottom plate
Cup, is arranged in the radiating block in bowl, four chips are fixed on the radiating block, and the radiating block is embedded in the bottom
On plate and extend to the bottom surface of bottom plate.Different colors can be used in four chips, and four chips are separately connected a pair of pins,
So that each chip can be controlled separately, meets the needs of a variety of pairs of multiple colors.Four wafer packages in the same bracket,
Meet under the needs of multiple color, volume can be effectively reduced.Four chips are fixed on radiating block, radiating block passes through shown bottom
Plate can reinforce heat dissipation effect, and power can be done greatly, meet powerful demand.
Further, the positive pin and negative pin are C font metal strip, the positive pin and C font of C font
Negative pin block bottom plate, one end stretches in bowl, and one end stretches to the bottom surface of bottom plate, makes the high-power encapsulation lamp bead of octal
Paster technique can be used, quite convenient for automated production, down-stream enterprise is facilitated to produce.
Further, the positive pin and negative pin are metal block, and the anode pin and negative pin are inlayed
On bottom plate, one end of the anode pin and negative pin is stretched in bowl, and one end stretches to the bottom surface of bottom plate, makes eight
Paster technique can be used in the high-power encapsulation lamp bead of foot, quite convenient for automated production, down-stream enterprise is facilitated to produce.
Further, the negative pin side of the bottom plate is provided with cathode mark.
Further, the cathode is identified as oblique angle or fillet.
Further, four chips are yellow chip, in blue dies, red chip, white chip, green chip
One kind or at least two combination.
Further, the radiating block is copper billet, and radiating block can be directly welded on cooling fin, convenient for heat dissipation.
Further, encapsulated layer is provided between the chip and bowl.
Further, the bottom plate and bowl are integrated.
Further, four chips are single electrode chip or bipolar electrode chip.
Using the above scheme, the utility model provides a kind of high-power encapsulation lamp bead of octal, by setting in a bowl
Multiple chips are set, to meet the needs of to multiple color；It secures the wafer on radiating block, can effectively enhance heat dissipation effect, with
Meet powerful demand；The back side that positive pin and negative pin are all extended to bracket makes the high-power encapsulation lamp bead of octal
Paster technique can be used, down-stream enterprise is facilitated to produce.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the top view of Fig. 1；
Fig. 3 is the rearview of Fig. 1.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Fig. 1-Fig. 3 is please referred to, the utility model provides a kind of high-power encapsulation lamp bead of octal, comprising: bracket is respectively set
Four chips, 20, four pairs of pins 30 on the bracket；Four pairs of pins 30 include positive pin and negative pin, each
The corresponding a pair of pins 30 of chip 20 is simultaneously formed into a loop by the connection of conducting wire 40, and the bracket includes: bottom plate 11, is arranged in bottom plate 11
A face on bowl 12, the radiating block 13 in bowl 12 is set, and four chips 20 are fixed on the radiating block 13
On, the radiating block 13 is embedded on the bottom plate 11 and extends to the bottom surface of bottom plate 11.Four chips 20 can be used different
Color, and four chips 20 are separately connected a pair of pins 30, so that each chip 20 can be controlled separately, meet a variety of to a variety of
The demand of color.Four chips 20 are encapsulated in the same bracket, in the case where meeting the needs of multiple color, can effectively reduce body
Product.Four chips 20 are fixed on radiating block 13, radiating block 13 passes through shown bottom plate 11, can reinforce heat dissipation effect, power is just
It can do greatly, meet powerful demand.
In the present embodiment, the positive pin and negative pin are C font metal strip, the positive pin and C of C font
The negative pin of font blocks bottom plate 11, and one end stretches in bowl 12, and one end stretches to the bottom surface of bottom plate 11, makes the big function of octal
Paster technique can be used in rate encapsulation lamp bead, quite convenient for automated production, down-stream enterprise is facilitated to produce.
In the present embodiment, the negative pin side of the bottom plate 11 is provided with cathode mark 14.The cathode 14 identifies
For oblique angle.
In the present embodiment, four chips 20 are blue dies, red chip, white chip, green four kinds of chip
Combination.
In the present embodiment, the radiating block 13 is copper billet, and radiating block 13 can be directly welded on cooling fin, convenient for dissipating
Heat.Encapsulated layer is provided between the chip 20 and bowl 12.The bottom plate 11 and bowl 12 are integrated.
In the present embodiment, four chips are bipolar electrode chip.
In conclusion the utility model provides a kind of high-power encapsulation lamp bead of octal, it is more by being arranged in a bowl
A chip, to meet the needs of to multiple color；It secures the wafer on radiating block, can effectively enhance heat dissipation effect, to meet
Powerful demand；The back side that positive pin and negative pin are all extended to bracket adopt the high-power encapsulation lamp bead of octal can
With paster technique, down-stream enterprise is facilitated to produce.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1. a kind of high-power encapsulation lamp bead of octal characterized by comprising four on the bracket are respectively set in bracket
Chip, four pairs of pins；Four pairs of pins include positive pin and negative pin, each chip corresponds to a pair of pins and by leading
Line connection forming circuit, the bracket includes: bottom plate, the bowl that is arranged on a face of bottom plate, and dissipating in bowl is arranged in
Heat block, four chips are fixed on the radiating block, and the radiating block is embedded on the bottom plate and extends to bottom plate
Bottom surface.
2. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that the anode pin and cathode
Pin is C font metal strip, and the positive pin of C font and the negative pin of C font block bottom plate, and one end stretches to bowl
Interior, one end stretches to the bottom surface of bottom plate.
3. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that the anode pin and cathode
Pin is metal block, and the anode pin and negative pin are embedded on bottom plate, the anode pin and negative pin
One end stretches in bowl, and one end stretches to the bottom surface of bottom plate.
4. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that the negative pin of the bottom plate
Side is provided with cathode mark.
5. the high-power encapsulation lamp bead of a kind of octal according to claim 4, which is characterized in that the cathode is identified as oblique angle
Or fillet.
6. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that four chips are yellow
One of chip, blue dies, red chip, white chip, green chip or at least two combination.
7. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that the radiating block is copper billet.
8. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that between the chip and bowl
It is provided with encapsulated layer.
9. the high-power encapsulation lamp bead of a kind of octal according to claim 1, which is characterized in that the bottom plate and bowl are one
Body.
10. the high-power encapsulation lamp bead of a kind of octal according to claim 9, which is characterized in that four chips are single
Electrode wafer or bipolar electrode chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821243610.4U CN208400847U (en) | 2018-08-03 | 2018-08-03 | A kind of high-power encapsulation lamp bead of octal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821243610.4U CN208400847U (en) | 2018-08-03 | 2018-08-03 | A kind of high-power encapsulation lamp bead of octal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400847U true CN208400847U (en) | 2019-01-18 |
Family
ID=65129312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821243610.4U Active CN208400847U (en) | 2018-08-03 | 2018-08-03 | A kind of high-power encapsulation lamp bead of octal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208400847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190171A (en) * | 2019-04-27 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of ten footlights source of SMD-RGBWY polychrome |
-
2018
- 2018-08-03 CN CN201821243610.4U patent/CN208400847U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190171A (en) * | 2019-04-27 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of ten footlights source of SMD-RGBWY polychrome |
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