CN104022045B - A kind of flatten the device of index hole on lead frame - Google Patents

A kind of flatten the device of index hole on lead frame Download PDF

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Publication number
CN104022045B
CN104022045B CN201410278045.5A CN201410278045A CN104022045B CN 104022045 B CN104022045 B CN 104022045B CN 201410278045 A CN201410278045 A CN 201410278045A CN 104022045 B CN104022045 B CN 104022045B
Authority
CN
China
Prior art keywords
groove
plummer
plate
fin
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410278045.5A
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Chinese (zh)
Other versions
CN104022045A (en
Inventor
李宗华
何伟
陈太兵
王利华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Advanced Power Semiconductor Co Ltd
Original Assignee
Chengdu Advanced Power Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Advanced Power Semiconductor Co Ltd filed Critical Chengdu Advanced Power Semiconductor Co Ltd
Priority to CN201410278045.5A priority Critical patent/CN104022045B/en
Publication of CN104022045A publication Critical patent/CN104022045A/en
Application granted granted Critical
Publication of CN104022045B publication Critical patent/CN104022045B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Abstract

The invention discloses and a kind of flatten the device of index hole on lead frame, it includes bogey and pressure head, plummer (1) is upper and is provided with groove I(3 along the length direction of plummer (1)), the top of plummer (1) and be positioned at groove I(3) both sides be provided with groove II(4), each L plate (2) is arranged at the top of plummer (1) and the vertical plate of each L plate (2) each parallel to groove II(4) inwall arrange, fin (6) is arranged on the top of rectangular block (5) and is parallel to the long limit setting of rectangular block (5), fin (6) is arranged upward, the two ends of pressing plate (7) are respectively arranged with briquetting (8), two briquettings (8) are separately positioned between the vertical plate of two adjacent L plates (2) and pressing plate (7) is pressed on fin (6).The invention has the beneficial effects as follows: compact conformation, alleviate workman labor intensity, facilitate operative, improve production efficiency.

Description

A kind of flatten the device of index hole on lead frame
Technical field
The technical field of the pressing of the index hole that the present invention relates on lead frame on reinforcement, a kind of flattens the device of index hole on lead frame.
Background technology
Lead frame of triode is the basic element of character of semiconductor element.Lead frame of triode such as T0-92(industry universal model), lead frame generally comprises Ji Dao, left little solder joint, right little solder joint, internal pin, pin connect the parts compositions such as muscle.The lead frame of triode being used for using or sell on market typically contains the lead frame sheet of multiple lead frame, the reinforcement of concave shape it is provided with between lead frame sheet, multiple index hole it is both provided with on each reinforcement and along the length direction of reinforcement, but, the surrounding of the index hole of the part lead frame processed through leading portion is jagged, therefore, this lead frame cannot pass through Trim Molding machine, thus the phenomenon got stuck occurs, this lead frame have to be taken out by workman, with a less column, the burr around index hole is flattened again, but index hole is compared with little and quantity is many, this adds the labor intensity of workman beyond doubt, and reduce the production efficiency of lead frame sheet, it is difficult to meet the demand in market, have a strong impact on the economic benefit of enterprise, therefore, do not promote the use of.
Summary of the invention
It is an object of the invention to overcome the shortcoming of prior art, it is provided that a kind of compact conformation, alleviate workman labor intensity, facilitate operative, improve production efficiency flatten the device of index hole on lead frame.
nullThe purpose of the present invention is achieved through the following technical solutions: a kind of flatten the device of index hole on lead frame,It includes bogey and pressure head,Described bogey is by plummer、Spacing head and L plate composition,The rectangular shape of plummer,Groove I it is provided with on plummer and along the length direction of plummer,The top of plummer and be positioned at the both sides of groove I and be provided with groove II,Two groove II are symmetrical arranged and the both sides of two groove II are provided with L plate,Each L plate is arranged at the inwall setting each parallel to groove II of the top of plummer and the vertical plate of each L plate,Described spacing head is made up of rectangular block and fin,Fin is arranged on the top of rectangular block and is parallel to the long limit setting of rectangular block,The two ends of rectangular block are individually positioned in two groove II,Fin is arranged upward,Described pressure head is made up of pressing plate and briquetting,The two ends of pressing plate are respectively arranged with briquetting,Two briquettings are separately positioned between the vertical plate of two adjacent L plates and pressing plate is pressed on fin.
The top of described plummer and be positioned at the both sides of two groove II and be provided with multiple screwed hole, the horizontal plate of described L plate is provided with multiple through hole, and L plate sequentially passes through through hole by screw and screwed hole is fixedly mounted on plummer.
The degree of depth of described groove I is more than the thickness of lead frame.
The width of described groove I is more than groove II.
The rectangular shape of described briquetting.
Described rectangular block and the width of briquetting are all equal with groove II.
The invention have the advantages that and on the plummer of (1) present invention and along the length direction of plummer, be provided with groove I, groove I serves the effect of guiding, so that rectangular frame slides in groove I, facilitate workman by the bottom cunning of the reinforcement with jagged index hole on fin, facilitate the operation of workman.(2) two ends of the pressing plate of the present invention are respectively arranged with briquetting, the two ends of rectangular block are individually positioned in two groove II, fin is arranged upward, when this device uses, only need first to be taken out from bogey by pressure head, again by the bottom cunning of the reinforcement with jagged index hole on fin, then two briquettings are separately positioned between the vertical plate of two adjacent L plates, and pressing plate is pressed in the top of this reinforcement, the top of pressing plate is finally beaten with hammer, thus disposably index hole jagged for bands all on this reinforcement is flattened, the most not only it is greatly saved the labor intensity of workman, and greatly improve the production efficiency of lead frame.
Accompanying drawing explanation
Fig. 1 is the bogey assembling structural representation with pressure head of the present invention;
Fig. 2 is the A-A sectional view of Fig. 1;
Fig. 3 is the top view of plummer of the present invention;
Fig. 4 is the B-B sectional view of Fig. 3;
Fig. 5 is the structural representation of the spacing head of the present invention;
Fig. 6 is the sectional view of Fig. 5;
Fig. 7 is the structural representation of the pressure head of the present invention;
Fig. 8 is the C-C sectional view of Fig. 7;
Fig. 9 is the I portion zoomed-in view of Fig. 2;
In figure, 1-plummer, 2-L plate, 3-groove I, 4-groove II, 5-rectangular block, 6-fin, 7-pressing plate, 8-briquetting, 9-screwed hole, 10-through hole.
Detailed description of the invention
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to the following stated:
As Figure 1-4, a kind of flatten the device of index hole on lead frame, it includes bogey and pressure head, described bogey is by plummer 1, spacing head and L plate 2 form, the rectangular shape of plummer 1, groove I3 it is provided with on plummer 1 and along the length direction of plummer 1, the degree of depth of groove I3 is more than the thickness of lead frame, the top of plummer 1 and be positioned at the both sides of groove I3 and be provided with groove II4, the width of groove I3 is more than groove II4, two groove II4 are symmetrical arranged and the both sides of two groove II4 are provided with L plate 2, each L plate 2 is arranged at the inwall setting each parallel to groove II4 of the top of plummer 1 and the vertical plate of each L plate 2.As shown in Figure 1, Figure 2, shown in Fig. 5 and Fig. 6, spacing head is made up of rectangular block 5 and fin 6, and fin 6 is arranged on the top of rectangular block 5 and is parallel to the long limit of rectangular block 5 and arranges, and the two ends of rectangular block 5 are individually positioned in two groove II4, and fin 6 is arranged upward.As shown in Figure 1, Figure 2, Figure 7 and Figure 8, pressure head is made up of pressing plate 7 and briquetting 8, the two ends of pressing plate 7 are respectively arranged with briquetting 8, the rectangular shape of briquetting 8, the width of rectangular block 5 and briquetting 8 is all equal with groove II4, and two briquettings 8 are separately positioned between the vertical plate of two adjacent L plates 2 and pressing plate 7 is pressed on fin 6.
As depicted in figs. 1 and 2, the top of plummer 1 and be positioned at the both sides of two groove II4 and be provided with multiple screwed hole 9, being provided with multiple through hole 10 on the horizontal plate of described L plate 2, L plate 2 sequentially passes through through hole 10 by screw and screwed hole 9 is fixedly mounted on plummer 1.
The work process of the present invention is as follows: first taken out from bogey by pressure head, subsequently lead frame is lain in groove I3, lead frame is the most slowly promoted to make the bottom of reinforcement of the jagged index hole of band move on on fin 6, then two briquettings are separately positioned between the vertical plate of two adjacent L plates 2, and pressing plate 7 is pressed in the top of this reinforcement, the top of pressing plate 7 is finally beaten with hammer, active force is delivered on this reinforcement by pressing plate 7, thus disposably beat pressing plate 7 and just index hole jagged for bands all on this reinforcement can be flattened, i.e. save the labor intensity of workman, improve again the production efficiency of lead frame.

Claims (1)

  1. null1. one kind flattens the device of index hole on lead frame,It is characterized in that: it includes bogey and pressure head,Described bogey is by plummer (1)、Spacing head and L plate (2) composition,Plummer (1) rectangular shape,Plummer (1) is upper and is provided with groove I(3 along the length direction of plummer (1)),The top of plummer (1) and be positioned at groove I(3) both sides be provided with groove II(4),Two groove II(4) be symmetrical arranged and two groove II(4) both sides be provided with L plate (2),Each L plate (2) is arranged at the top of plummer (1) and the vertical plate of each L plate (2) each parallel to groove II(4) inwall arrange,Described spacing head is made up of rectangular block (5) and fin (6),Fin (6) is arranged on the top of rectangular block (5) and is parallel to the long limit setting of rectangular block (5),The two ends of rectangular block (5) are individually positioned in two groove II(4) in,Fin (6) is arranged upward,Described pressure head is made up of pressing plate (7) and briquetting (8),Described briquetting (8) rectangular shape,The two ends of pressing plate (7) are respectively arranged with briquetting (8),Two briquettings (8) are separately positioned between the vertical plate of two adjacent L plates (2) and pressing plate (7) is pressed on fin (6),The top of described plummer (1) and be positioned at two groove II(4) both sides be provided with multiple screwed hole (9),It is provided with multiple through hole (10) on the horizontal plate of described L plate (2),L plate (2) sequentially passes through through hole (10) by screw and screwed hole (9) is fixedly mounted on plummer (1),Described groove I(3) the degree of depth more than the thickness of lead frame,Described groove I(3) width more than groove II(4),Described rectangular block (5) and the width of briquetting (8) all with groove II(4) equal.
CN201410278045.5A 2014-06-20 2014-06-20 A kind of flatten the device of index hole on lead frame Expired - Fee Related CN104022045B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410278045.5A CN104022045B (en) 2014-06-20 2014-06-20 A kind of flatten the device of index hole on lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410278045.5A CN104022045B (en) 2014-06-20 2014-06-20 A kind of flatten the device of index hole on lead frame

Publications (2)

Publication Number Publication Date
CN104022045A CN104022045A (en) 2014-09-03
CN104022045B true CN104022045B (en) 2016-08-17

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CN201410278045.5A Expired - Fee Related CN104022045B (en) 2014-06-20 2014-06-20 A kind of flatten the device of index hole on lead frame

Country Status (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155901A (en) * 1991-12-30 1992-10-20 Fierkens Richard H J Integrated circuit lead frame positioner apparatus and method
US5193733A (en) * 1991-05-14 1993-03-16 Goldstar Electron Co., Ltd. Clamping device for inner leads of lead frame
CN202816883U (en) * 2012-08-31 2013-03-20 杰群电子科技(东莞)有限公司 Pressure plate for packaging semiconductor chips
CN203910764U (en) * 2014-06-20 2014-10-29 成都先进功率半导体股份有限公司 Device for pressing index holes on lead wire frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5193733A (en) * 1991-05-14 1993-03-16 Goldstar Electron Co., Ltd. Clamping device for inner leads of lead frame
US5155901A (en) * 1991-12-30 1992-10-20 Fierkens Richard H J Integrated circuit lead frame positioner apparatus and method
CN202816883U (en) * 2012-08-31 2013-03-20 杰群电子科技(东莞)有限公司 Pressure plate for packaging semiconductor chips
CN203910764U (en) * 2014-06-20 2014-10-29 成都先进功率半导体股份有限公司 Device for pressing index holes on lead wire frame

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Granted publication date: 20160817

Termination date: 20170620