CN205159288U - Clamp plate smelting tool - Google Patents
Clamp plate smelting tool Download PDFInfo
- Publication number
- CN205159288U CN205159288U CN201520892284.XU CN201520892284U CN205159288U CN 205159288 U CN205159288 U CN 205159288U CN 201520892284 U CN201520892284 U CN 201520892284U CN 205159288 U CN205159288 U CN 205159288U
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- CN
- China
- Prior art keywords
- storage tank
- chip
- smelting tool
- main board
- pressing plate
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- Expired - Fee Related
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Abstract
The embodiment of the utility model discloses clamp plate smelting tool, this clamp plate smelting tool include main part board, the first containing Groove, second storage tank and shell fragment. The embodiment of the utility model provides a clamp plate smelting tool replaces through using the shell fragment to pass the first containing Groove elasticity wait to encapsulate the copper sheet on the chip to the copper sheet of realization on to the chip is semiconductor package fixed of full wafer structure, even when the lead frame has light micro deformation, also can be fine with lead frame supporting seat laminating down, thereby fix and wait to encapsulate the chip, make things convenient for the welding of wire.
Description
Technical field
The utility model embodiment relates to semiconductor die package bonding wire craft, particularly relates to a kind of pressing plate smelting tool.
Background technology
Semiconductor device needs wire rod to weld with product in encapsulation process, and general mode is put on hot plate by chip to be packaged together with lead frame, re-use pressing plate smelting tool treat packaged chip pressure clamping fixed after carry out bonding wire.
The pressing plate smelting tool of prior art, as shown in Figure 1, Fig. 1 is the structural representation of the pressing plate smelting tool of existing semiconductor die package bonding wire craft.This pressing plate smelting tool 1 comprises main board 10, first storage tank 11, press strip 12 and receive chips mouth 13, first storage tank 11 in hollow out form, and press strip 12 is disposed in the first storage tank 11, to be separated out shape, equirotal receive chips mouth 13.When for row bonding wire operation, first the pressing plate smelting tool and hot plate that go to upper and lower setting are fixed on welding machine platform, and the chip of wish bonding wire and the lead frame be welded in below it are positioned on hot plate, promote the below of hot plate to pressing plate smelting tool, pressing plate smelting tool is utilized to press sandwich sheet, chip is sandwiched on receive chips mouth 13 by pressure, pressing plate smelting tool is compressed on the lead frame of chip surrounding by press strip 12 and the first storage tank 11, realization fixing chip, then utilizes bonding wire board and capillary of arranging in pairs or groups carries out bonding wire operation.Wherein, the shape of semiconductor chip and size are consistent with receive chips mouth.
Above-mentioned pressing plate smelting tool more than 1 copper sheet be applied on chip is in the semiconductor packages of multi-disc absolute construction, and be the semiconductor packages of monolithic structure for the copper sheet on chip, because there is the connecting rod for connecting between copper sheet, so the press strip 12 of this pressing plate smelting tool 1 and the first storage tank 11 cannot be pressed on the lead frame of chip surrounding through connecting rod, thus this pressing plate smelting tool 1 can not realize the copper sheet treated on packaged chip is the fixing of the semiconductor packages of monolithic structure.Meanwhile, after having welded chip and copper sheet, lead frame has slight deformation, utilizes vacuum suction of the prior art that lead frame and the supporting seat below it can not be made to fit, thus when causing weldering metal wire, cannot operation.
Utility model content
The utility model embodiment provides a kind of pressing plate smelting tool, fixing with what realize the semiconductor packages that the copper sheet on chip is monolithic structure, even if when lead frame has a slight deformation, also can fit by the supporting seat well and under lead frame, thus fixing product to be packaged, facilitate the welding of wire.
The utility model embodiment provides a kind of pressing plate smelting tool, and this pressing plate smelting tool comprises main board and the first storage tank, and described first storage tank is through to be opened on described main board, and wherein, described pressing plate smelting tool also comprises:
Second storage tank, described second storage tank is opened in the back side of described main board, and for accommodating chip to be packaged, the copper sheet on described chip to be packaged exposes from described first storage tank;
Shell fragment, one end of described shell fragment is fixedly installed on the front of main board, and the other end of described shell fragment stretches in the first storage tank, for supporting the copper sheet on described chip to be packaged through the first storage tank elasticity, with fixing chip to be packaged.
Further, described pressing plate smelting tool also comprises:
Guide vane end stop, described guide vane end stop is arranged on the back side of described main board, is positioned at least one end of described first storage tank, retains setpoint distance for making between the lead frame of described main board and beneath chips to be packaged.
Further, described shell fragment comprises:
Stiff end, described stiff end is fixed by bolt and main board;
Elastic comb, the first end of described elastic comb is connected with stiff end, and the second end stretches in the first storage tank, for being compressed on the copper sheet of chip to be packaged in the first storage tank.
Further, described elastic comb is L-type, and the minor face of L-type is the second end.
Further, deep gouge is offered in described main board front, and the stiff end of shell fragment embeds in described deep gouge, is fixedly connected with described main board.
Further, described shell fragment is arranged on the one or both sides of the first storage tank.
Further, described shell fragment and the first storage tank are that chip fixes group, and described main board is provided with chip described in one or more groups and fixes group.
The utility model supports copper sheet on described chip to be packaged by using shell fragment through the first storage tank elasticity, thus realization is the fixing of the semiconductor packages of monolithic structure to the copper sheet on chip, even if when lead frame has a slight deformation, the elastic force of shell fragment also can make lead frame and the supporting seat below it well fit, thus fixing chip to be packaged, facilitate the welding of wire.Meanwhile, set up the second storage tank, for accommodating chip to be packaged, prevent pressing plate smelting tool from crushing or weighing chip to be packaged wounded.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pressing plate smelting tool of existing semiconductor die package bonding wire craft;
Fig. 2 is the structural representation of the pressing plate smelting tool that the utility model embodiment provides;
Fig. 3 is the profile of the pressing plate smelting tool that the utility model embodiment provides.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.Be understandable that, specific embodiment described herein only for explaining the utility model, but not to restriction of the present utility model.It also should be noted that, for convenience of description, illustrate only the part relevant to the utility model in accompanying drawing but not entire infrastructure.
Fig. 2 is the structural representation of the pressing plate smelting tool that the utility model embodiment provides, the present embodiment is applicable in the encapsulation process of semiconductor device treats the fixing of packaged chip, and this pressing plate smelting tool comprises: main board 1, first storage tank 2, second storage tank 3 and shell fragment 4.
Wherein, the first storage tank 2 is through is opened on described main board 1; Second storage tank 3 is opened in the back side of main board 1, and for accommodating chip to be packaged, the copper sheet on chip to be packaged exposes from the first storage tank 2; One end of shell fragment 4 is fixedly installed on the front of main board 1, and the other end of shell fragment 4 stretches in the first storage tank 2, for supporting the copper sheet on described chip to be packaged through the first storage tank 2 elasticity, with fixing chip to be packaged.The size of the first storage tank 2 and the second storage tank 3 can be determined according to the size of chip to be packaged.
During for chips welding wire to be packaged, described chip to be packaged together with the copper sheet be welded in above it, from pushed to the second storage tank 3 below pressing plate.Copper sheet on this chip to be packaged and chip partly or entirely exposes from the first storage tank 2, and shell fragment 4 is pressed in described copper sheet by the first storage tank 2 above pressing plate, and the pressure of shell fragment 4 is applied on chip by copper sheet, for fixing chip to be packaged.Then bonding wire board is utilized and capillary of arranging in pairs or groups carries out bonding wire operation.
The utility model supports copper sheet on described chip to be packaged by using shell fragment through the first storage tank elasticity, thus realization is the fixing of the semiconductor packages of monolithic structure to the copper sheet on chip, even if when lead frame has a slight deformation, the elastic force of shell fragment also can make lead frame and the supporting seat below it well fit, thus fixing chip to be packaged, facilitate the welding of wire.Meanwhile, set up the second storage tank, for accommodating chip to be packaged, prevent pressing plate smelting tool from crushing or weighing chip to be packaged wounded.
In order to prevent, shell fragment 4 elastic force is excessive causes the chip under copper sheet to weigh wounded or crush, described pressing plate smelting tool can also comprise: guide vane end stop 5, described guide vane end stop 5 is arranged on the back side of described main board 1, being positioned at least one end of described first storage tank 2, retaining setpoint distance for making between described main board 1 and the lead frame of beneath chips to be packaged.Wherein, this setpoint distance is the thickness of guide vane end stop 5, and the thickness of guide vane end stop 5 can be determined according to the thickness of product to be packaged, and guide vane end stop 5 can arrange polylith, preferably, respectively arranges one piece of guide vane end stop 5 at the first storage tank 2 two ends.
Concrete, described shell fragment 4 can comprise: stiff end, and described stiff end is fixed by bolt and main board 1; Elastic comb, the first end of described elastic comb is connected with stiff end, and the second end stretches in the first storage tank 2, for being compressed on the copper sheet of chip to be packaged in the first storage tank 2.Wherein, the quantity of elastic comb can be determined according to the quantity of chip to be packaged, shell fragment 4 is the sheet metals with certain thickness and length, the power be compressed on the copper sheet of chip to be packaged in the first storage tank 2 is that the deformation of shell fragment 4 produces, can by changing the thickness of shell fragment 4 and length adjust pressure, make pressure can not the excessive and chip that causes weighing wounded or crush under copper sheet.Therefore, the application of this shell fragment 4 had both solved the chip fixation problem that copper sheet is the semiconductor packages of monolithic structure, protected again chip and was not weighed wounded or crush.
Further, described elastic comb is L-type, and the minor face of L-type is the second end of described elastic comb.
Preferably, deep gouge is offered in described main board 1 front, and the stiff end of shell fragment 4 embeds in described deep gouge, is fixedly connected with described main board 1.
According to the needs of chip to be packaged, described shell fragment 4 can be arranged on the one or both sides of the first storage tank 2.Such as, in order to increase work efficiency, shell fragment 4 can be set respectively in the both sides at the first storage tank 2, make it possible to fix two rows chip to be packaged simultaneously, thus bonding wire operation can be carried out to fixing two rows chip to be packaged simultaneously.
Optionally, described shell fragment 4 and the first storage tank 1 fix group for chip, described main board 1 can be provided with chip described in one or more groups and fix group.Such as, the arrangements of chips on product to be packaged is 4 row, 5 row, then can arrange 4 core assembly sheets and fix group on pressing plate, wherein the elastic comb of shell fragment 4 can be set to 5, can realize treating encapsulating products so simultaneously all fixing, and then improve packaging efficiency.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and protection range of the present utility model can not be departed from.Therefore, although be described in further detail the utility model by above embodiment, but the utility model is not limited only to above embodiment, when not departing from the utility model design, can also comprise other Equivalent embodiments more, and scope of the present utility model is determined by appended right.
Claims (7)
1. a pressing plate smelting tool, comprises main board and the first storage tank, and described first storage tank is through to be opened on described main board, it is characterized in that, described pressing plate smelting tool also comprises:
Second storage tank, described second storage tank is opened in the back side of described main board, and for accommodating chip to be packaged, the copper sheet on described chip to be packaged exposes from described first storage tank;
Shell fragment, one end of described shell fragment is fixedly installed on the front of main board, and the other end of described shell fragment stretches in the first storage tank, for supporting the copper sheet on described chip to be packaged through the first storage tank elasticity, with fixing chip to be packaged.
2. pressing plate smelting tool according to claim 1, is characterized in that, also comprise:
Guide vane end stop, described guide vane end stop is arranged on the back side of described main board, is positioned at least one end of described first storage tank, retains setpoint distance for making between the lead frame of described main board and beneath chips to be packaged.
3. pressing plate smelting tool according to claim 1, it is characterized in that, described shell fragment comprises:
Stiff end, described stiff end is fixed by bolt and main board;
Elastic comb, the first end of described elastic comb is connected with stiff end, and the second end stretches in the first storage tank, for being compressed on the copper sheet of chip to be packaged in the first storage tank.
4. pressing plate smelting tool according to claim 3, is characterized in that, described elastic comb is L-type, and the minor face of L-type is the second end.
5. pressing plate smelting tool according to claim 3, is characterized in that, deep gouge is offered in described main board front, and the stiff end of shell fragment embeds in described deep gouge, is fixedly connected with described main board.
6. pressing plate smelting tool according to claim 1, it is characterized in that, described shell fragment is arranged on the one or both sides of the first storage tank.
7. pressing plate smelting tool according to claim 1, is characterized in that, described shell fragment and the first storage tank are that chip fixes group, and described main board is provided with chip described in one or more groups and fixes group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520892284.XU CN205159288U (en) | 2015-11-09 | 2015-11-09 | Clamp plate smelting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520892284.XU CN205159288U (en) | 2015-11-09 | 2015-11-09 | Clamp plate smelting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159288U true CN205159288U (en) | 2016-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520892284.XU Expired - Fee Related CN205159288U (en) | 2015-11-09 | 2015-11-09 | Clamp plate smelting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205159288U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
-
2015
- 2015-11-09 CN CN201520892284.XU patent/CN205159288U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878309A (en) * | 2017-05-11 | 2018-11-23 | 无锡华润安盛科技有限公司 | It is bonded pressing plate and bonding jig |
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20171109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |