CN103617437A - Card groove milling packaging device - Google Patents
Card groove milling packaging device Download PDFInfo
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- CN103617437A CN103617437A CN201310586719.3A CN201310586719A CN103617437A CN 103617437 A CN103617437 A CN 103617437A CN 201310586719 A CN201310586719 A CN 201310586719A CN 103617437 A CN103617437 A CN 103617437A
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Abstract
The invention discloses a card groove milling packaging device. The card groove milling packaging device comprises a machine platform and a master controller. The machine platform is provided with a conveying mechanism for conveying cards and a groove milling device which is located on one side of a conveying belt of the conveying mechanism. The groove milling device comprises a plurality of groove milling mechanisms which are arranged side by side along the conveying belt, and the master controller is respectively and electrically connected with the groove milling mechanisms and controls all groove milling mechanisms to mill the different positions of the cards on the conveying belt so as to mill out chip grooves. According to the card groove milling packaging device, groove milling can be achieved when single-core cards are produced, and groove milling can also be achieved when multi-core cards are produced. The multiple groove milling mechanisms can achieve groove filling in a work dividing mode regardless of the groove milling utilized when the single-core cards are produced or the groove milling utilized when the multi-core cards are produced, and the groove milling efficiency is greatly enhanced.
Description
Technical field
The present invention relates to card production equipment, particularly a kind of card groove milling sealed in unit.
Background technology
At present, use for conservation, reduce the raw materials for production cost of phonecard, phonecard on the market (for example starts to adopt a card multicore, one card twin-core, a card four-core) card, also claim multicore card, multicore card inlays multiple SIM card on a large card, the SIM card of producing so same quantity can significantly reduce the quantity of required large card, has reduced the raw materials cost of producing large card.The flow process of production SIM card: first mill out on large card on SIM card sheet for putting the chip groove of chip, then chip is put into chip groove and encapsulated.But, traditional groove milling sealed in unit only has Yi Ge groove milling mechanism conventionally, one time groove milling flow process can only mill out a chip groove, on the same card sheet during a plurality of chip groove of milling, card need to be carried out to repeatedly groove milling flow process, the production procedure of producing a card is too complicated, and the production cycle is long, causes production efficiency low; And because whole chip groove is all to be completed separately by a milling cutter, a chip groove of milling cycle oversize, treat that the time that the card of groove milling need to wait for is oversize, further cause production efficiency to reduce.
Summary of the invention
Of the present invention provide a kind of can the compatible card slotting attachment to the groove milling of single core card and the groove milling of multicore card, and can improve the groove milling efficiency of card.
The present invention proposes a kind of card groove milling sealed in unit, comprise board and master controller, described board is provided with for the connecting gear of transfer card and is positioned at the slotting attachment of a side of the travelling belt of described connecting gear, described slotting attachment comprises a plurality of groove milling mechanism being arranged side by side along described travelling belt, described master controller is electrically connected to each groove milling mechanism respectively, control each groove milling mechanism and respectively the diverse location of the card on described travelling belt is carried out to milling, to mill out chip groove.
Preferably, described in described board correspondence, groove milling mechanism is provided with for gripping the fixture group of the card on described travelling belt below described travelling belt described in each.
Preferably, on described board, be also provided with for carrying chip to the Handling device of the chip groove of described card.
Preferably, described Handling device comprises the linear module of XY and a plurality of lifting assembly being connected on the linear module of described XY, is connected with chip and picks and places part on described lifting assembly, and described at least one, lifting assembly is connected with the linear module of described XY by rotary cylinder, described master controller respectively with the linear module of described XY, lifting assembly, chip picks and places part and rotary cylinder is electrically connected to, described in described main controller controls, described in the linear module task driven of XY, lifting assembly moves to assigned address, described controller is controlled described lifting assembly work and is driven described chip to pick and place part vertically rising or vertically decline, described controller is controlled described chip and is picked and placeed part and capture described chip or unclasp described chip, described controller is controlled lifting assembly described in described rotary cylinder task driven and is rotated to drive the chip of this lifting assembly bottom to pick and place part rotation.
Preferably, on described board, be also provided with the packaging system that is positioned at described slotting attachment downstream along the direction of transfer of travelling belt, described packaging system comprises: for the spot welding group that described chip and described chip groove are welded and fixed, for strengthening the hot weld group of the weld strength of described chip and described chip groove, and carry out the cooling group of colding pressing for the chip to after hot weld; Described master controller is electrically connected to described spot welding group, hot weld group and the group of colding pressing respectively.
Preferably, the spot welding head of described spot welding group has a plurality of somes tips, and each tip is corresponding one by one with the chip groove of a described card; The hot weld head of described hot weld group has a plurality of hot weld mouths, and each hot weld mouth is corresponding one by one with the chip groove of a described card; The head of colding pressing of the described group of colding pressing has a plurality of mouths of colding pressing, and each mouth of colding pressing is corresponding one by one with the chip groove of a described card.
Preferably, also comprise the flat glue assembly of being located under described hot weld head and being positioned at the below of described card, described flat glue assembly comprises base, on described base, the position of corresponding described hot weld mouth is provided with holding tank, in described holding tank, be provided with the first circular block, on described the first circular block, stacked the second circular block, the end face of described the first circular block is spherical concave surface, the bottom surface of described the second circular block is and the spherical convex surface of described the first circular block bottom surface adaptation that the bottom surface of described the second circular block is parallel with described card bottom surface.
Preferably, on described board, be also provided with: for carries chips band material, walk to expect passage, for drive described chip belt material along described in walk to expect the stepping mechanism that passage advances, and for punching out from chip belt material the punching mechanism that chip is carried for Handling device; Described stepping mechanism is positioned at the upstream of described punching mechanism along the step direction of described chip belt material, described stepping mechanism and described punching mechanism are electrically connected to described master controller.
Preferably, described stepping mechanism comprises: for clamping the live splint assembly of described chip belt material to drive described chip belt material to advance, for gripping the geometrical clamp assembly of described chip belt material, for drive described live splint assembly along described in walk to expect that passage comes and goes mobile stepping cylinder, first end connects the piston rod of described stepping cylinder, the drive plate that the second end connects described live splint assembly, and connects the relative and spaced retaining bolt assembly in one end of described drive plate with described stepping cylinder;
The piston rod of the vertical described stepping cylinder of described drive plate, the second end of described drive plate is adjustable length stretching structure; Described retaining bolt assembly comprises parallel with described drive plate and is fixed on the fixed head on described board, and is located at a plurality of retaining bolts on described fixed head, less at a distance of the spacing of described live splint assembly retaining bolt far away and described drive plate;
Described master controller is connected with described stepping cylinder, live splint assembly and geometrical clamp electrical component respectively; Live splint assembly described in described main controller controls, closes to clamp described chip belt material or opens to unclamp described chip belt material; Geometrical clamp assembly described in described main controller controls, closes to clamp described chip belt material or opens to unclamp described chip belt material.
Preferably, described punching mechanism comprises the die-cut cylinder being electrically connected to described master controller and the die cutting die of being located at described die-cut cylinder top; Described die cutting die is provided with the punching module of a plurality of different sizes, and described punching module comprises a plurality of chip punchings; Describedly walk to expect that passage is a plurality of, respectively walk to expect channel parallel setting, described in walk to expect that passage is between described die-cut cylinder and described punching module, described in walk to expect passage and the corresponding setting one by one of described punching module.
Card groove milling sealed in unit of the present invention, the groove milling in the time of both can having realized manufacture order core card, can realize again the groove milling while producing multicore card.When manufacture order core card, by chip groove of the common milling of a plurality of groove milling of main controller controls mechanism, control the part that each groove milling mechanism only needs the whole chip groove of milling, finally mill out a complete chip groove.Make like this milling cycle of each groove milling mechanism significantly shorten, groove milling efficiency improves greatly.When producing multicore card, the diverse location milling to card by main controller controls respectively of a plurality of groove milling mechanism.In a word, groove milling while no matter being manufacture order core card, groove milling while still producing multicore card, a plurality of groove milling mechanism can divide the work jointly to complete, and groove milling efficiency significantly promotes.
Accompanying drawing explanation
Fig. 1 is the structural representation of card groove milling sealed in unit in first embodiment of the invention;
Fig. 2 is the vertical view of card groove milling sealed in unit in first embodiment of the invention;
Fig. 3 is the assembly structure schematic diagram of slotting attachment and fixture group in first embodiment of the invention;
Fig. 4 is the structural representation of Handling device in second embodiment of the invention;
Fig. 5 is the structural representation of the spot welding group of packaging system in third embodiment of the invention;
Fig. 6 is the structural representation of the hot weld group of packaging system in third embodiment of the invention;
Fig. 7 is the structural representation of the group of colding pressing of packaging system in third embodiment of the invention;
Fig. 8 is the structural representation of flat glue assembly in fourth embodiment of the invention;
Fig. 9 is the partial structurtes schematic diagram of card groove milling sealed in unit in fifth embodiment of the invention;
Figure 10 is the structural representation of stepping mechanism in fifth embodiment of the invention;
Figure 11 is the structural representation of punching mechanism in sixth embodiment of the invention;
Figure 12 is the rigging position graph of a relation of punching mechanism and carrying mechanism in sixth embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1 is the structural representation of card groove milling sealed in unit in first embodiment of the invention, Fig. 2 is the vertical view of card groove milling sealed in unit in first embodiment of the invention, Fig. 3 is the assembly structure schematic diagram of slotting attachment and fixture group in first embodiment of the invention, Fig. 4 is the structural representation of Handling device in second embodiment of the invention, Fig. 5 is the structural representation that the present invention the 3rd executes the spot welding group of packaging system in example, Fig. 6 is the structural representation of the hot weld group of packaging system in third embodiment of the invention, Fig. 7 is the structural representation of the group of colding pressing of packaging system in third embodiment of the invention, Fig. 8 is the structural representation of flat glue assembly in fourth embodiment of the invention, Fig. 9 is the partial structurtes schematic diagram of card groove milling sealed in unit in fifth embodiment of the invention, Figure 10 is the structural representation of stepping mechanism in fifth embodiment of the invention, Figure 11 is the structural representation of punching mechanism in sixth embodiment of the invention, Figure 12 is the rigging position graph of a relation of punching mechanism and carrying mechanism in sixth embodiment of the invention.
With reference to Fig. 1-Fig. 3, the card groove milling sealed in unit that this embodiment proposes, comprise board 10 and master controller 20, board 10 is provided with for the connecting gear of transfer card and is positioned at the slotting attachment 40 of a side of the travelling belt 30 of connecting gear, slotting attachment 40 comprises a plurality of groove milling mechanism 41 being arranged side by side along travelling belt 30, master controller 20 is electrically connected to each groove milling mechanism 41 respectively, control each groove milling mechanism 41 and respectively the diverse location of the card on travelling belt 30 is carried out to milling, to mill out chip groove.The mechanism of the present embodiment Yi Liangge groove milling below 41 is example, and the present embodiment is set forth; Certainly groove milling mechanism 41 can also be 3,4 or more.
Groove milling (a plurality of chip grooves of milling) when the groove milling when card groove milling sealed in unit of the present embodiment can be realized by the control of master controller 20 manufacture order core card (chip groove of a milling) and production multicore card.Specific implementation is:
When manufacture order core card, master controller 20 is controlled chip groove of Liang Ge groove milling mechanism's 41 common millings, control a part for Yi Ge groove milling mechanism 41 milling chip grooves, control the remainder of another groove milling mechanism this chip groove of 41 millings, finally mill out a complete chip groove.Certainly, when groove milling mechanism 41 is more, the milling of each groove milling mechanism 41 division of labor can be thinner, and the milling cycle of each groove milling mechanism 41 can be shorter.Compared to traditional card groove milling sealed in unit You Yige groove milling mechanism 41, mill out a complete chip groove (the milling cycle is the time of a complete chip groove of milling).The card groove milling sealed in unit of the present embodiment, the milling cycle of each groove milling mechanism 41 significantly shortens, and the groove milling efficiency of card groove milling sealed in unit improves greatly.
When producing multicore card, master controller 20 is controlled 41 groove millings to the diverse location of card respectively of Liang Ge groove milling mechanism, and each groove milling mechanism 41 controls by master controller 20 is independent.For example, during card groove milling sealed in unit milling twin-core card, need mill out two chip groove ，Ze Yige groove milling mechanisms 41 and mill out a chip groove, another groove milling mechanism 41 mills out another chip groove; Again for example, during card groove milling sealed in unit production four-core card, need mill out four chip grooves, can two chip grooves of Yi Ge groove milling mechanism 41 milling, another two the chip grooves of another groove milling mechanism 41 millings.Certainly ，Dang groove milling mechanism 41 has when more, and the milling workload of each groove milling mechanism 41 is just less, and groove milling efficiency is just higher.
Further, with reference to Fig. 1-Fig. 3, when making 41 pairs of card groove millings of each groove milling mechanism, the shape or the dimensional discrepancy that are not easy to make card displacement and cause chip groove, in the present embodiment, at board 10, corresponding each groove milling mechanism 41 are provided with for gripping the fixture group 100 of the card on travelling belt 30 below travelling belt 30, and by fixture group 100 card that is fixedly clamped, the chip groove that groove milling mechanism 41 is milled out is more accurate.The fixture group 100 of the present embodiment can be for spacing limiting plate is carried out in the both sides of card, or the parts that card can be gripped for being clamped in the electromagnet etc. of card both sides.
Further, Fig. 1, Fig. 2 and Fig. 4, be also provided with on board 10 for carrying chip to the Handling device 50 of the chip groove of card, and the packaging system 60 that is positioned at slotting attachment 40 downstreams along the direction of transfer of travelling belt 30; Handling device 50 is transported to chip in the chip groove of card, for packaging system 60 by chip package on card.
With reference to Fig. 1, Fig. 2 and Fig. 5-Fig. 7, packaging system 60 comprises: for the spot welding group 61 that chip and chip groove are welded and fixed, for strengthening the hot weld group 62 of the weld strength of chip and chip groove, and carry out the cooling group 63 of colding pressing for the chip to after hot weld; Master controller 20 is electrically connected to spot welding group 61, hot weld group 62 and the group 63 of colding pressing respectively.It is two some tips 6121 that the spot welding head 612 of spot welding group 61 has in a plurality of somes tip 6121(Fig. 5), each tip 6121 is corresponding one by one with the chip groove of a card; It is two hot weld mouths 62121 that the hot weld of hot weld group 62 6212 has in a plurality of hot weld mouth 62121(Fig. 6), each hot weld mouth 62121 is corresponding one by one with the chip groove of a card; The colding pressing 632 to have in a plurality of mouth 6321(Fig. 7 that cold pressing be two mouths 6321 of colding pressing of the group 63 of colding pressing), each mouth 6321 of colding pressing is corresponding one by one with the chip groove of a card.
In the present embodiment, spot welding group 61 comprises that (in the present embodiment, spot welding device is one to one or more spot welding devices, be that spot welding device just forms spot welding group 61), the spot welding head 612 of spot welding device is arranged in spot welding main body 611, the driving stem 6131(driving stem 6131 that spot welding main body 611 is connected to first cylinder 613 vertically arranging arranges straight up) on, by driving stem 6131 drive point soldering tips 612, decline and contact to carry out spot welding with card, and drive point soldering tip 612 rises when completing spot welding.
The group 63 of colding pressing comprises that (group 63 of colding pressing in the present embodiment is one to one or more cold compression devices, be that cold compression device just forms the group 63 of colding pressing), the main body 631 of colding pressing of cold compression device is connected to the drive end (drive end is the lower end of the 3rd cylinder 633) of the 3rd cylinder 633 vertically arranging, 632 bottoms that are connected to the main body 631 of colding pressing of colding pressing, by the 3rd cylinder 633, drive cold pressing 632 rising and decline, while colding pressing, cold pressing and 632 decline, make its mouth 6321 contact chips of colding pressing, to chip, carry out cooling; Colded pressing, the 3rd cylinder 633 drives 632 rising of colding pressing.
For the encapsulation that coordinates the present embodiment card groove milling sealed in unit to produce multicore card realizes, in the present embodiment, spot welding group 61 adopts the some tip 6121 quantity spot welding head 612 corresponding with chip groove quantity on a card, hot weld group 62 adopts the hot weld mouth 62121 quantity hot weld corresponding with chip groove quantity on a card 6212, the same employing of the group of colding pressing 63 cold pressing mouth 6321 quantity corresponding with chip groove quantity on a card cold pressing 632.Certainly, according to card groove milling sealed in unit, produce the change of the chip groove quantity of card, correspondence is replaced by corresponding spot welding head 612, hot weld 6212 and colds pressing 632, i.e. spot welding group 61 be equipped with multiple different spot welding head 612, the hot weld group 62 of tip 6121 quantity be equipped with hot weld that multiple hot weld mouth 62121 quantity are different 6212 and the group 63 of colding pressing be equipped with multiple mouth 6321 quantity of colding pressing different cold pressing 632.Certainly hot weld group 62 and the group 63 of colding pressing all can adopt a plurality of, by a plurality of hot weld groups 62 divide the work the same card sheet all chips hot weld and by a plurality of colding pressing, organize 63 all chips cooling of having divided the work the same card sheet.
Further, with reference to Fig. 1, Fig. 2, Fig. 6 and Fig. 8, in order to make the hot weld better effects if of 62 pairs of chips of hot weld group, avoid coming unglued, the present embodiment is provided with flat pin assembly 90 under hot weld 6212, flat pin assembly 90 is positioned at the below of card place plane, for by the lower surface colloid equating of the card of hot weld process.Concrete, flat pin assembly 90 comprises base 91, on base 91, the position of corresponding hot weld mouth 62121 is provided with holding tank 911, in holding tank 911, be provided with the first circular block 92, on the first circular block 92, stacked the second circular block 93, the end face of the first circular block 92 is spherical concave surface, and the bottom surface of the second circular block 93 is and the spherical convex surface of the first circular block 92 bottom surface adaptations that the bottom surface of the second circular block 93 is parallel with card bottom surface.When card carries out hot weld, each second circular block 93 correspondence be positioned at this card a chip groove under, and the lower surface of the end face of the second circular block 93 contact card, the second circular block 93 top surface area are greater than the area of chip groove.Because the second circular block 93 is suitable the overlaying on the first circular block 92 of end face (spherical concave surface) with the first circular block 92 by its bottom surface (spherical convex surface), therefore, when the glue out-of-flatness of card bottom surface, the top surface inclination of the second circular block 93, the bottom surface of card returns to level to second circular block 93 end face effect the second circular block 93 end faces, thereby the glue of card bottom surface is driven plain.
Further, with reference to Fig. 1, Fig. 2, Fig. 9 and Figure 10, on board 10, be also provided with: for carries chips band material P, walk to expect passage L, for driving chip belt material P along walking to expect the stepping mechanism 70 that passage L advances, and for punching out from chip belt material P the punching mechanism 80 that chip is carried for Handling device 50; Stepping mechanism 70 is positioned at the upstream of punching mechanism 80 along the step direction of chip belt material P, stepping mechanism 70 and punching mechanism 80 are electrically connected to master controller 20.In card groove milling sealed in unit operation work, operation between punching mechanism 80, stepping mechanism 70 and Handling device 50 is sequentially: after the every die-cut chip of punching mechanism 80, stepping mechanism 70 captures with regard to driving the chip of chip belt material P stepping certain distance and Handling device 50 to pick and place part 53 chip punching out, then punching mechanism 80 die-cut chip, so circulation again.
Concrete, stepping mechanism 70 comprises: for clamping the live splint assembly 71 of chip belt material P to drive chip belt material P to advance; For gripping the geometrical clamp assembly 75 of chip belt material P; For driving live splint assembly 71 along walking to expect that passage L comes and goes mobile stepping cylinder 72, first end connects the piston rod of stepping cylinder 72, the drive plate 74 that the second end connects live splint assembly 71, and stepping cylinder 72 drives drive plate 74 to move so that live splint assembly 71 moves by piston rod 721; And connecting relative and the spaced retaining bolt assembly 73 in one end of drive plates 74 with stepping cylinder 72, the driving of 73 pairs of stepping cylinders 72 of retaining bolt assembly is apart from limiting location.
The piston rod 721 of drive plate 74 vertical stepping cylinders 72, the second end 741 of drive plate 74 is adjustable length stretching structure, the second end 741 of drive plate 74 is extending on its length direction changes to change the length of drive plate 74 with shortening.Retaining bolt assembly 73 comprises parallel with drive plate 74 and is fixed on the fixed head 732 on board 10, and be located at a plurality of retaining bolts 731 on fixed head 732, each retaining bolt 731 is less at a distance of the spacing of live splint assembly 71 retaining bolt far away and drive plate 74, what be each retaining bolt to drive plate 74 is spacing not identical, that is to say spacing not identical to stepping cylinder 72.
The present embodiment, drive plate 74 makes the retaining bolt 731 of diverse location spacing to it according to the tensile elongation of its second end is different, and then regulates the size of the movably ultimate range along+A direction of drive plate 74.Concrete, due to less with the spacing of drive plate 74 at a distance of live splint assembly 71 retaining bolt 731 far away, so, the second end 741 tensile elongations of drive plate 74 are longer, nearer apart from drive plate 74 to the spacing retaining bolt 731 of reply drive plate 74, the movably ultimate range of drive plate 74 edge+A directions is just less, and now the step distance of chip belt material P is less, i.e. die-cut for the chip belt material P of corresponding reduced size chip now; Otherwise, the tensile elongation of the second end 741 of drive plate 74 is shorter, drive plate 74 is carried out to spacing retaining bolt 731 far away apart from drive plate 74, the movably ultimate range of drive plate 74 edge+A directions is just larger, now the step distance of chip belt material P is larger, i.e. die-cut for the chip belt material P of corresponding large-size chip now.
Further, with reference to Fig. 1, Fig. 2, Figure 11 and Figure 12, punching mechanism 80 comprises the die-cut cylinder 81 being electrically connected to master controller 20 and the die cutting die 82 of being located at die-cut cylinder 81 tops; It is example that punching module 821(the present embodiment that die cutting die 82 is provided with a plurality of different sizes be take two punching modules 821); Walk to expect that passage L is a plurality of, respectively walk to expect that passage L be arranged in parallel, walk to expect that passage L is between die-cut cylinder 81 and punching module 821, walk to expect passage L and punching module 821 corresponding setting one by one.
In the present embodiment, it is different that die cutting die 82 has size that a plurality of punching module 821(that are respectively used to die-cut different size chip are each punching module 821), can compatible sizes chip die-cut.When card groove milling sealed in unit is produced the card of different size, because die cutting die 82 is provided with the punching module 821 of sizes, the chip belt material P of chip corresponding to produced card is put into correspondingly-sized punching module 821 correspondences walk to expect passage L, realize the die-cut for produced card encapsulation of the required chip of card, without changing die cutting die 82, save the trouble of changing die cutting die 82, saved the time, improved production efficiency.
Further, punching module 821 comprises take each punching module 821 by a plurality of chip punching 8211(the present embodiment to have two chip punchings 8211 is example), die-cutly so once just can punch out a plurality of chips, can reduce the die-cut frequency of die cutting die 82 and guarantee to punch out the supply rate of chip simultaneously, and can also be suitable for the production of multicore card.
The foregoing is only the preferred embodiments of the present invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes instructions of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a card groove milling sealed in unit, comprise board and master controller, described board is provided with for the connecting gear of transfer card and is positioned at the slotting attachment of a side of the travelling belt of described connecting gear, it is characterized in that, described slotting attachment comprises a plurality of groove milling mechanism being arranged side by side along described travelling belt, described master controller is electrically connected to each groove milling mechanism respectively, controls each groove milling mechanism and respectively the diverse location of the card on described travelling belt is carried out to milling, to mill out chip groove.
2. card groove milling sealed in unit according to claim 1, is characterized in that, groove milling mechanism is provided with for gripping the fixture group of the card on described travelling belt below described travelling belt described in each described in described board correspondence.
3. card groove milling sealed in unit according to claim 1 and 2, is characterized in that, is also provided with for carrying chip to the Handling device of the chip groove of described card on described board.
4. card groove milling sealed in unit according to claim 3, it is characterized in that, described Handling device comprises the linear module of XY and a plurality of lifting assembly being connected on the linear module of described XY, on described lifting assembly, be connected with chip and pick and place part, described at least one, lifting assembly is connected with the linear module of described XY by rotary cylinder, described master controller respectively with the linear module of described XY, lifting assembly, chip picks and places part and rotary cylinder is electrically connected to, described in described main controller controls, described in the linear module task driven of XY, lifting assembly moves to assigned address, described controller is controlled described lifting assembly work and is driven described chip to pick and place part vertically rising or vertically decline, described controller is controlled described chip and is picked and placeed part and capture described chip or unclasp described chip, described controller is controlled lifting assembly described in described rotary cylinder task driven and is rotated to drive the chip of this lifting assembly bottom to pick and place part rotation.
5. card groove milling sealed in unit according to claim 3, it is characterized in that, on described board, be also provided with the packaging system that is positioned at described slotting attachment downstream along the direction of transfer of travelling belt, described packaging system comprises: for the spot welding group that described chip and described chip groove are welded and fixed, for strengthening the hot weld group of the weld strength of described chip and described chip groove, and carry out the cooling group of colding pressing for the chip to after hot weld; Described master controller is electrically connected to described spot welding group, hot weld group and the group of colding pressing respectively.
6. card groove milling sealed in unit according to claim 5, is characterized in that, the spot welding head of described spot welding group has a plurality of somes tips, and each tip is corresponding one by one with the chip groove of a described card; The hot weld head of described hot weld group has a plurality of hot weld mouths, and each hot weld mouth is corresponding one by one with the chip groove of a described card; The head of colding pressing of the described group of colding pressing has a plurality of mouths of colding pressing, and each mouth of colding pressing is corresponding one by one with the chip groove of a described card.
7. card groove milling sealed in unit according to claim 6, it is characterized in that, also comprise the flat glue assembly of being located under described hot weld head and being positioned at the below of described card, described flat glue assembly comprises base, on described base, the position of corresponding described hot weld mouth is provided with holding tank, in described holding tank, be provided with the first circular block, on described the first circular block, stacked the second circular block, the end face of described the first circular block is spherical concave surface, the bottom surface of described the second circular block is the spherical convex surface with described the first circular block bottom surface adaptation, the bottom surface of described the second circular block is parallel with described card bottom surface.
8. card groove milling sealed in unit according to claim 3, it is characterized in that, on described board, be also provided with: for carries chips band material, walk to expect passage, for drive described chip belt material along described in walk to expect the stepping mechanism that passage advances, and for punching out from chip belt material the punching mechanism that chip is carried for Handling device; Described stepping mechanism is positioned at the upstream of described punching mechanism along the step direction of described chip belt material, described stepping mechanism and described punching mechanism are electrically connected to described master controller.
9. card groove milling sealed in unit according to claim 8, it is characterized in that, described stepping mechanism comprises: for clamping the live splint assembly of described chip belt material to drive described chip belt material to advance, for gripping the geometrical clamp assembly of described chip belt material, for drive described live splint assembly along described in walk to expect that passage comes and goes mobile stepping cylinder, first end connects the piston rod of described stepping cylinder, the drive plate that the second end connects described live splint assembly, and connects the relative and spaced retaining bolt assembly in one end of described drive plate with described stepping cylinder;
The piston rod of the vertical described stepping cylinder of described drive plate, the second end of described drive plate is adjustable length stretching structure; Described retaining bolt assembly comprises parallel with described drive plate and is fixed on the fixed head on described board, and is located at a plurality of retaining bolts on described fixed head, less at a distance of the spacing of described live splint assembly retaining bolt far away and described drive plate;
Described master controller is connected with described stepping cylinder, live splint assembly and geometrical clamp electrical component respectively; Live splint assembly described in described main controller controls, closes to clamp described chip belt material or opens to unclamp described chip belt material; Geometrical clamp assembly described in described main controller controls, closes to clamp described chip belt material or opens to unclamp described chip belt material.
10. card groove milling sealed in unit according to claim 8, is characterized in that, described punching mechanism comprises the die-cut cylinder being electrically connected to described master controller and is located at the die cutting die of described die-cut cylinder top; Described die cutting die is provided with the punching module of a plurality of different sizes, and described punching module comprises a plurality of chip punchings; Describedly walk to expect that passage is a plurality of, respectively walk to expect channel parallel setting, described in walk to expect that passage is between described die-cut cylinder and described punching module, described in walk to expect passage and the corresponding setting one by one of described punching module.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105642980A (en) * | 2016-02-02 | 2016-06-08 | 沈阳友联电子装备有限公司 | Groove milling method of whole large material of IC cards and groove milling device implementing groove milling method |
| CN106270687A (en) * | 2016-10-15 | 2017-01-04 | 广州明森科技股份有限公司 | A kind of smart card groove milling equipment |
| CN106466778A (en) * | 2016-08-30 | 2017-03-01 | 佛山市普拉迪数控科技有限公司 | A kind of shape extrusion center for processing weaving trick plate |
| CN110899792A (en) * | 2019-11-28 | 2020-03-24 | 杭州大轶科技有限公司 | Positioning device of IC card slot milling machine |
| CN112743133A (en) * | 2021-01-21 | 2021-05-04 | 南京迪海智科精密机械有限公司 | IC card groove milling robot and IC card groove milling method |
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| CN202291685U (en) * | 2011-09-15 | 2012-07-04 | 天津精诚机床股份有限公司 | Numerical control curve-tooth bevel gear milling machine with automatic loading and unloading device |
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| CN101464961A (en) * | 2008-12-11 | 2009-06-24 | 东莞锐发智能卡科技有限公司 | Method and equipment for producing SIM card |
| CN202291685U (en) * | 2011-09-15 | 2012-07-04 | 天津精诚机床股份有限公司 | Numerical control curve-tooth bevel gear milling machine with automatic loading and unloading device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105642980A (en) * | 2016-02-02 | 2016-06-08 | 沈阳友联电子装备有限公司 | Groove milling method of whole large material of IC cards and groove milling device implementing groove milling method |
| CN106466778A (en) * | 2016-08-30 | 2017-03-01 | 佛山市普拉迪数控科技有限公司 | A kind of shape extrusion center for processing weaving trick plate |
| CN106270687A (en) * | 2016-10-15 | 2017-01-04 | 广州明森科技股份有限公司 | A kind of smart card groove milling equipment |
| CN106270687B (en) * | 2016-10-15 | 2018-05-01 | 广州明森科技股份有限公司 | A kind of smart card groove milling equipment |
| CN110899792A (en) * | 2019-11-28 | 2020-03-24 | 杭州大轶科技有限公司 | Positioning device of IC card slot milling machine |
| CN112743133A (en) * | 2021-01-21 | 2021-05-04 | 南京迪海智科精密机械有限公司 | IC card groove milling robot and IC card groove milling method |
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|---|---|
| CN103617437B (en) | 2016-03-16 |
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Address after: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee after: Shenzhen Yuanmingjie Technology Co., Ltd. Address before: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee before: SHENZHEN YUANMINGJIE TECHNOLOGY CO., LTD. |