CN103617437B - Card groove milling sealed in unit - Google Patents
Card groove milling sealed in unit Download PDFInfo
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- CN103617437B CN103617437B CN201310586719.3A CN201310586719A CN103617437B CN 103617437 B CN103617437 B CN 103617437B CN 201310586719 A CN201310586719 A CN 201310586719A CN 103617437 B CN103617437 B CN 103617437B
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Abstract
The invention discloses a kind of card groove milling sealed in unit, comprise board and master controller, board be provided with for transfer card connecting gear and be positioned at the slotting attachment of side of travelling belt of connecting gear, slotting attachment comprises the multiple groove milling mechanisms be arranged side by side along travelling belt, master controller is electrically connected with each groove milling mechanism respectively, control each groove milling mechanism and respectively milling is carried out to the diverse location of the card on travelling belt, to mill out chip groove.Card groove milling sealed in unit of the present invention, both can realize groove milling during manufacture order core card, can realize again groove milling when producing multicore card; Groove milling when no matter being manufacture order core card, or groove milling during production multicore card, multiple groove milling mechanism can divide the work jointly to complete, and groove milling efficiency significantly promotes.
Description
Technical field
The present invention relates to card production equipment, particularly a kind of card groove milling sealed in unit.
Background technology
At present, in order to the use of conservation, reduce the raw materials for production cost of phonecard, phonecard on the market starts to adopt a card multicore (such as, one card twin-core, a card four-core) card, also claim multicore card, namely multicore card inlays multiple SIM card on one greatly card, the SIM card of the same quantity of such production significantly can reduce the quantity of required large card, reduces the raw materials cost producing large card.The flow process of production SIM card: first mill out for putting the chip groove of chip on SIM card sheet on large card, then puts into chip groove and encapsulates by chip.But, traditional groove milling sealed in unit only has a groove milling mechanism usually, one time groove milling flow process can only mill out a chip groove, on the same card sheet during the multiple chip groove of milling, card is needed to carry out repeatedly groove milling flow process, the production procedure of producing a card is too complicated, and the production cycle is long, causes production efficiency low; And because whole chip groove is all completed separately by a milling cutter, a milling chip groove cycle oversize, treat that the time that the card of groove milling needs to wait for is oversize, cause production efficiency to reduce further.
Summary of the invention
Of the present invention provide a kind of can the compatible card slotting attachment to the groove milling of single core card and the groove milling of multicore card, and the groove milling efficiency of card can be improved.
The present invention proposes a kind of card groove milling sealed in unit, comprise board and master controller, described board be provided with for transfer card connecting gear and be positioned at the slotting attachment of side of travelling belt of described connecting gear, described slotting attachment comprises the multiple groove milling mechanisms be arranged side by side along described travelling belt, described master controller is electrically connected with each groove milling mechanism respectively, control each groove milling mechanism and respectively milling is carried out to the diverse location of the card on described travelling belt, to mill out chip groove.
Preferably, the corresponding described each described groove milling mechanism of described board is provided with the fixture group for gripping the card on described travelling belt below described travelling belt.
Preferably, described board is also provided with for carrying chip to the Handling device in the chip groove of described card.
Preferably, described Handling device comprises the linear module of XY and multiple lifting assembly be connected on the linear module of described XY, and described lifting assembly is connected with chip and picks and places part, lifting assembly described at least one is connected with the linear module of described XY by rotary cylinder, described master controller is module linear in described XY respectively, lifting assembly, chip picks and places part and rotary cylinder electrical connection, described in the linear module task driven of XY described in described main controller controls, lifting assembly moves to assigned address, described controller controls described lifting assembly work and drives described chip to pick and place part vertically to rise or vertically decline, described controller controls described chip and picks and places part and capture described chip or unclasp described chip, described controller controls lifting assembly described in described rotary cylinder task driven and rotates to drive the chip of this lifting assembly bottom to pick and place part rotation.
Preferably, the direction of transfer described board is also provided with along travelling belt is positioned at the packaging system in described slotting attachment downstream, described packaging system comprises: for the spot welding group described chip and described chip groove are welded and fixed, for strengthening the hot weld group of the weld strength of described chip and described chip groove, and the group of colding pressing for cooling the chip after hot weld; Described master controller is respectively with described spot welding group, hot weld group with cold pressing to organize and be electrically connected.
Preferably, the spot welding head of described spot welding group has multiple somes tips, the chip groove one_to_one corresponding of each tip and a described card; The hot weld head of described hot weld group has multiple hot weld mouth, the chip groove one_to_one corresponding of each hot weld mouth and a described card; Described head of colding pressing of colding pressing group has multiple mouth of colding pressing, the chip groove one_to_one corresponding of each cold pressing mouth and a described card.
Preferably, also comprise and to be located at immediately below described hot weld head and to be positioned at the flat glue assembly of the below of described card, described flat glue assembly comprises base, on described base, the position of corresponding described hot weld mouth is provided with holding tank, the first circular block is provided with in described holding tank, described first circular block has stacked the second circular block, the end face of described first circular block is spherical concave surface, the bottom surface of described second circular block is the spherical convex surface with described first circular block bottom surface adaptation, and the bottom surface of described second circular block is parallel with described card bottom surface.
Preferably, described board is also provided with: walk to expect passage for carries chips band material, walk to expect for driving described in described chip belt material edge the stepping mechanism that passage advances, and for punching out the punching mechanism that chip carries out for Handling device carrying from chip belt material; Described stepping mechanism is positioned at the upstream of described punching mechanism along the step direction of described chip belt material, and described stepping mechanism and described punching mechanism are electrically connected with described master controller.
Preferably, described stepping mechanism comprises: for clamping the live splint assembly that described chip belt material advances to drive described chip belt material, for gripping the geometrical clamp assembly of described chip belt material, walk to expect for driving described in described live splint assembly edge the stepping cylinder that passage reciprocates, the drive plate that first end connects the piston rod of described stepping cylinder, the second end connects described live splint assembly, and connect the relative and spaced retaining bolt assembly in one end of described drive plate with described stepping cylinder;
The piston rod of the vertical described stepping cylinder of described drive plate, the second end of described drive plate is adjustable length stretching structure; Described retaining bolt assembly comprises fixed head that is parallel with described drive plate and that be fixed on described board, and is located at the multiple retaining bolts on described fixed head, and the spacing at a distance of described live splint assembly retaining bolt far away and described drive plate is less;
Described master controller is connected with described stepping cylinder, live splint assembly and geometrical clamp electrical component respectively; Live splint assembly described in described main controller controls, closes to clamp described chip belt material or open to unclamp described chip belt material; Geometrical clamp assembly described in described main controller controls, closes to clamp described chip belt material or open to unclamp described chip belt material.
Preferably, described punching mechanism comprises the die-cut cylinder be electrically connected with described master controller and the die cutting die be located at above described die-cut cylinder; Described die cutting die is provided with the punching module of multiple different size, and described punching module comprises multiple chip punching; Describedly walk to expect that passage is multiple, respectively walk to expect that passage be arranged in parallel, described in walk to expect that passage is between described die-cut cylinder and described punching module, described in walk to expect that passage and described punching module one_to_one corresponding are arranged.
Card groove milling sealed in unit of the present invention, both can realize groove milling during manufacture order core card, can realize again groove milling when producing multicore card.When manufacture order core card, by main controller controls multiple groove milling mechanism common milling chip groove, namely control the part that each groove milling mechanism only needs the whole chip groove of milling, finally mill out a complete chip groove.Make the milling cycle of each groove milling mechanism significantly shorten like this, groove milling efficiency improves greatly.When producing multicore card, multiple groove milling mechanism is respectively by the diverse location milling of main controller controls to card.In a word, groove milling when no matter being manufacture order core card, or groove milling during production multicore card, multiple groove milling mechanism can divide the work jointly to complete, and groove milling efficiency significantly promotes.
Accompanying drawing explanation
Fig. 1 is the structural representation of card groove milling sealed in unit in first embodiment of the invention;
Fig. 2 is the vertical view of card groove milling sealed in unit in first embodiment of the invention;
Fig. 3 is the assembly structure schematic diagram of slotting attachment and fixture group in first embodiment of the invention;
Fig. 4 is the structural representation of Handling device in second embodiment of the invention;
Fig. 5 is the structural representation of the spot welding group of packaging system in third embodiment of the invention;
Fig. 6 is the structural representation of the hot weld group of packaging system in third embodiment of the invention;
Fig. 7 is the structural representation of the group of colding pressing of packaging system in third embodiment of the invention;
Fig. 8 is the structural representation of flat glue assembly in fourth embodiment of the invention;
Fig. 9 is the partial structurtes schematic diagram of card groove milling sealed in unit in fifth embodiment of the invention;
Figure 10 is the structural representation of stepping mechanism in fifth embodiment of the invention;
Figure 11 is the structural representation of punching mechanism in sixth embodiment of the invention;
Figure 12 is the rigging position graph of a relation of punching mechanism and carrying mechanism in sixth embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Fig. 1 is the structural representation of card groove milling sealed in unit in first embodiment of the invention, Fig. 2 is the vertical view of card groove milling sealed in unit in first embodiment of the invention, Fig. 3 is the assembly structure schematic diagram of slotting attachment and fixture group in first embodiment of the invention, Fig. 4 is the structural representation of Handling device in second embodiment of the invention, Fig. 5 is the structural representation that the present invention the 3rd executes the spot welding group of packaging system in example, Fig. 6 is the structural representation of the hot weld group of packaging system in third embodiment of the invention, Fig. 7 is the structural representation of the group of colding pressing of packaging system in third embodiment of the invention, Fig. 8 is the structural representation of flat glue assembly in fourth embodiment of the invention, Fig. 9 is the partial structurtes schematic diagram of card groove milling sealed in unit in fifth embodiment of the invention, Figure 10 is the structural representation of stepping mechanism in fifth embodiment of the invention, Figure 11 is the structural representation of punching mechanism in sixth embodiment of the invention, Figure 12 is the rigging position graph of a relation of punching mechanism and carrying mechanism in sixth embodiment of the invention.
With reference to Fig. 1-Fig. 3, the card groove milling sealed in unit that this embodiment proposes, comprise board 10 and master controller 20, board 10 be provided with for transfer card connecting gear and be positioned at the slotting attachment 40 of side of travelling belt 30 of connecting gear, slotting attachment 40 comprises the multiple groove milling mechanisms 41 be arranged side by side along travelling belt 30, master controller 20 is electrically connected with each groove milling mechanism 41 respectively, control each groove milling mechanism 41 and respectively milling is carried out to the diverse location of the card on travelling belt 30, to mill out chip groove.The present embodiment is for Liang Ge groove milling mechanism 41 below, sets forth the present embodiment; Certain groove milling mechanism 41 can also be 3,4 or more.
The card groove milling sealed in unit of the present embodiment can control realization manufacture order core card by master controller 20 time groove milling (milling chip groove) and groove milling (the multiple chip groove of milling) when producing multicore card.Be implemented as:
When manufacture order core card, master controller 20 control Liang Ge groove milling mechanism 41 common milling chip groove, namely control a part for a groove milling mechanism 41 milling chip groove, control the remainder of another groove milling mechanism 41 this chip groove of milling, finally mill out a complete chip groove.Certainly, when groove milling mechanism 41 is more, the milling division of labor of each groove milling mechanism 41 can be thinner, and the milling cycle of each groove milling mechanism 41 can be shorter.The complete chip groove time of a milling complete chip groove (the milling cycle be) is milled out by a groove milling mechanism 41 compared to traditional card groove milling sealed in unit.The card groove milling sealed in unit of the present embodiment, the milling cycle of each groove milling mechanism 41 significantly shortens, and the groove milling efficiency of card groove milling sealed in unit improves greatly.
When producing multicore card, master controller 20 control Liang Ge groove milling mechanism 41 is respectively to the groove milling of the diverse location of card, and each groove milling mechanism 41 controls by master controller 20 is independent.Such as, during card groove milling sealed in unit milling twin-core card, need mill out two chip grooves, then a groove milling mechanism 41 mills out a chip groove, and another groove milling mechanism 41 mills out another chip groove; Again such as, during card groove milling sealed in unit production four-core card, four chip grooves need be milled out, then can a groove milling mechanism 41 milling two chip grooves, another two the chip grooves of another groove milling mechanism 41 milling.Certainly, when groove milling mechanism 41 has more, the milling workload of each groove milling mechanism 41 is just less, and groove milling efficiency is just higher.
Further, with reference to Fig. 1-Fig. 3, during in order to make each groove milling mechanism 41 pairs of card groove milling, be not easy card is shifted and causes shape or the dimensional discrepancy of chip groove, in the present embodiment, below travelling belt 30, be provided with the fixture group 100 for gripping the card on travelling belt 30 in the corresponding each groove milling mechanism 41 of board 10, to be fixedly clamped card by fixture group 100, the chip groove that groove milling mechanism 41 is milled out is more accurate.The fixture group 100 of the present embodiment can for carry out spacing limiting plate to the both sides of card, or the parts that card can be gripped for the electromagnet etc. being clamped in card both sides.
Further, Fig. 1, Fig. 2 and Fig. 4, board 10 is also provided with for carrying chip to the Handling device 50 in the chip groove of card, and is positioned at the packaging system 60 in slotting attachment 40 downstream along the direction of transfer of travelling belt 30; Chip is transported in the chip groove of card by Handling device 50, for packaging system 60 by chip package on card.
Handling device 50 comprises the linear module of XY 51 and multiple lifting assembly 52 be connected on the linear module 51 of described XY, described lifting assembly 52 is connected with chip and picks and places part 53, lifting assembly 52 described at least one is connected with the linear module 51 of described XY by rotary cylinder 54; Master controller 20 respectively module 51 linear in XY, lifting assembly 52, chip picks and places part 53 and rotary cylinder 54 is electrically connected, master controller 20 control XY linear module 51 task driven lifting assembly 52 moves to assigned address, controller controls lifting assembly 52 work and drives chip pick and place the vertical rising of part 53 or vertically decline, controller control chip picks and places part 53 grab chips or unclasps chip, and controller control rotary cylinder 54 task driven lifting assembly 52 rotates to drive the chip on this lifting assembly 52 to pick and place part 53 and rotates.The Handling device 50 of the present embodiment comprises multiple lifting assembly 52, and each lifting assembly 52 is connected with a chip and picks and places part 53, therefore disposablely carries multiple chip, and the card groove milling sealed in unit of the present embodiment just in time can be coordinated to produce multicore card; During card groove milling sealed in unit manufacture order core card, Handling device 50 disposable need carry a chip.The adjustable chip of rotary cylinder 54 picks and places part 53 and rotates, and according to different card Production requirement, some situations may need to adjust the pin direction of chip, therefore makes chip pick and place the pin direction of part 53 rotatable chip adjusted chip arranging rotary cylinder 54.In the present embodiment, the linear module of XY 51 adopts the orthogonal electric cylinder 511 of driving direction and servo motor 512, and servo motor 512 is arranged on electric cylinder 511, and lifting assembly 52 is connected on servo motor.The linear module 51 of certain XY also can adopt other Linear transmission parts.Due to the restriction of bulk, in this enforcement, lifting assembly 52 adopts the pen cylinder vertically arranged, and certain lifting assembly 52 can also adopt servomotor or other Linear transmission parts; The chip of the present embodiment picks and places part 53 and adopts sucker, certainly also can adopt the parts such as mechanical arm.
With reference to Fig. 1, Fig. 2 and Fig. 5-Fig. 7, packaging system 60 comprises: for the spot welding group 61 chip and chip groove are welded and fixed, for strengthening the hot weld group 62 of the weld strength of chip and chip groove, and the group 63 of colding pressing for cooling the chip after hot weld; Master controller 20 is electrically connected with spot welding group 61, hot weld group 62 and group 63 of colding pressing respectively.The spot welding head 612 of spot welding group 61 has multiple somes tips 6121 (being two some tips 6121 in Fig. 5), the chip groove one_to_one corresponding of each tip 6121 and a card; The hot weld of hot weld group 62 6212 has multiple hot weld mouth 62121 (being two hot weld mouths 62121 in Fig. 6), the chip groove one_to_one corresponding of each hot weld mouth 62121 and a card; Colding pressing of group of colding pressing 63 632 has multiple mouth 6321 (being two mouths 6321 of colding pressing in Fig. 7) of colding pressing, the chip groove one_to_one corresponding of each cold pressing mouth 6321 and a card.
In the present embodiment, spot welding group 61 comprises one or more spot welding device, and (in the present embodiment, spot welding device is one, i.e. spot welding device just composition spot welding group 61), the spot welding head 612 of spot welding device is arranged in spot welding main body 611, spot welding main body 611 is connected on the driving stem 6131 (driving stem 6131 is arranged straight up) of the first cylinder 613 that is vertically arranged, declined by driving stem 6131 drive point soldering tip 612 and contact to carry out spot welding with card, and drive point soldering tip 612 rises when completing spot welding.
Hot weld group 62 has multiple hot weld device 621 (the present embodiment is for 3 hot weld devices 621), and each hot weld device 621 has a hot weld 6212, repeats repeatedly hot weld, to realize better hot weld effect by multiple hot weld device 621 pairs of cards.Hot weld main body 6211 correspondence of each hot weld device 621 is connected to the drive end (drive end is the lower end of the second cylinder 6214) of the second cylinder 6214 that is vertically arranged, hot weld device 621 is provided with and clip 6213, and the width of the distance between two jig arm of clip 6213 and card is adaptive; Drive hot weld device to decline by the second cylinder 6214 and carry out hot weld to contact card, when hot weld, card is fixed by the both sides that clip 6213 is stuck in card, avoids card to offset.
Group of colding pressing 63 comprises one or more cold compression device, and (group of colding pressing in the present embodiment 63 is one, namely cold compression device just forms group 63 of colding pressing), the main body 631 of colding pressing of cold compression device is connected to the drive end (drive end is the lower end of the 3rd cylinder 633) of the 3rd cylinder 633 that is vertically arranged, to cold pressing 632 bottoms being connected to main body 631 of colding pressing, by the 3rd cylinder 633 drive cold pressing 632 rising and decline, when colding pressing, cold pressing and 632 to decline, make its mouth 6321 contact chip of colding pressing, chip is cooled; Colded pressing, the 3rd cylinder 633 drives 632 rising of colding pressing.
In order to the encapsulation coordinating the present embodiment card groove milling sealed in unit to produce multicore card realizes, in the present embodiment, the spot welding head 612 that spot welding group 61 adopts some tip 6121 quantity corresponding with the chip groove quantity on a card, hot weld that hot weld group 62 adopts hot weld mouth 62121 quantity corresponding with the chip groove quantity on a card 6212, group of colding pressing 63 adopt equally mouth 6321 quantity of colding pressing corresponding with the chip groove quantity on a card cold pressing 632.Certainly, the change of the chip groove quantity of card is produced according to card groove milling sealed in unit, correspondence is replaced by corresponding spot welding head 612, hot weld 6212 and colds pressing 632, i.e. spot welding group 61 is equipped with the different spot welding head 612 of multiple tip 6121 quantity, hot weld group 62 is equipped with the different hot weld of multiple hot weld mouth 62121 quantity 6212 and group 63 of colding pressing is equipped with multiple mouth 6321 quantity of colding pressing different colds pressing 632.Certain hot weld group 62 and group 63 of colding pressing all can adopt multiple, namely by multiple hot weld group 62 divided the work the same card sheet all chips hot weld and divided the work the cooling of all chips of the same card sheet by multiple group 63 of colding pressing.
Further, with reference to Fig. 1, Fig. 2, Fig. 6 and Fig. 8, in order to make the hot weld better effects if of hot weld group 62 pairs of chips, avoid coming unglued, the present embodiment is provided with flat glue assembly 90 immediately below hot weld 6212, flat glue assembly 90 is positioned at the below of card place plane, for the lower surface colloid equating by the card in thermal welding process.Concrete, flat glue assembly 90 comprises base 91, on base 91, the position of corresponding hot weld mouth 62121 is provided with holding tank 911, the first circular block 92 is provided with in holding tank 911, first circular block 92 stacks the second circular block 93, the end face of the first circular block 92 is spherical concave surface, and the bottom surface of the second circular block 93 is the spherical convex surface with the first circular block 92 bottom surface adaptation, and the bottom surface of the second circular block 93 is parallel with card bottom surface.When card carries out hot weld, each second circular block 93 correspondence is positioned at immediately below a chip groove of this card, and the lower surface of the end face of the second circular block 93 contact card, the second circular block 93 top surface area is greater than the area of chip groove.Due to the second circular block 93 for by the end face (spherical concave surface) of its bottom surface (spherical convex surface) and the first circular block 92 suitable and overlay on the first circular block 92, therefore, when the glue out-of-flatness of card bottom surface, the top surface inclination of the second circular block 93, the bottom surface of card returns to level to the second circular block 93 end face effect second circular block 93 end face, thus the glue of card bottom surface is driven plain.
Further, with reference to Fig. 1, Fig. 2, Fig. 9 and Figure 10, board 10 is also provided with: walk to expect passage L for carries chips band material P, for driving chip belt material P along walking to expect the stepping mechanism 70 that passage L advances, and for punching out the punching mechanism 80 that chip carries out for Handling device 50 carrying from chip belt material P; Stepping mechanism 70 is positioned at the upstream of punching mechanism 80 along the step direction of chip belt material P, and stepping mechanism 70 and punching mechanism 80 are electrically connected with master controller 20.In card groove milling sealed in unit operation work, operation order between punching mechanism 80, stepping mechanism 70 and Handling device 50 is: punching mechanism 80 is often after a die-cut chip, stepping mechanism 70 just drives chip belt material P stepping certain distance and the chip of Handling device 50 picks and places part 53 captures the chip punched out, then punching mechanism 80 die-cut chip again, so circulates.
Concrete, stepping mechanism 70 comprises: for clamping the live splint assembly 71 that chip belt material P advances to drive chip belt material P; For gripping the geometrical clamp assembly 75 of chip belt material P; For driving live splint assembly 71 along the stepping cylinder 72 walking to expect that passage L reciprocates, first end connects the piston rod of stepping cylinder 72, the drive plate 74 of the second end connection live splint assembly 71, and stepping cylinder 72 drives drive plate 74 to move live splint assembly 71 is moved by piston rod 721; And connecting the relative and spaced retaining bolt assembly 73 in one end of drive plate 74 with stepping cylinder 72, the driving distance of retaining bolt assembly 73 pairs of stepping cylinders 72 carries out restriction location.
The piston rod 721 of the vertical stepping cylinder 72 of drive plate 74, the second end 741 of drive plate 74 is adjustable length stretching structure, and namely the second end 741 of drive plate 74 is extending in their length direction changes with shortening with the length changing drive plate 74.Retaining bolt assembly 73 comprises fixed head 732 that is parallel with drive plate 74 and that be fixed on board 10, and the multiple retaining bolts 731 be located on fixed head 732, the spacing of each retaining bolt 731 retaining bolt that apart live splint assembly 71 is far away and drive plate 74 is less, i.e. spacing not identical to drive plate 74 of each retaining bolt, what that is to say stepping cylinder 72 is spacing not identical.
The present embodiment, drive plate 74 makes the retaining bolt 731 of diverse location spacing to it according to the tensile elongation difference of its second end, and then the size of the moveable ultimate range in+A direction, edge of adjustment drive plate 74.Concrete, because the retaining bolt 731 far away at a distance of live splint assembly 71 is less with the spacing of drive plate 74, so, second end 741 tensile elongation of drive plate 74 is longer, then nearer apart from drive plate 74 to the retaining bolt 731 that reply drive plate 74 is spacing, drive plate 74 is less along the moveable ultimate range in+A direction, and now the step distance of chip belt material P is less, namely now for chip belt material P die-cut of corresponding reduced size chip; Otherwise, the tensile elongation of the second end 741 of drive plate 74 is shorter, then spacing retaining bolt 731 carries out to drive plate 74 far away apart from drive plate 74, drive plate 74 is larger along the moveable ultimate range in+A direction, now the step distance of chip belt material P is larger, namely now for chip belt material P die-cut of corresponding large-size chip.
Master controller 20 is electrically connected with stepping cylinder 72, live splint assembly 71 and geometrical clamp assembly 75 respectively; Master controller 20 controls live splint assembly 71, closes to clamp chip belt material P or open to unclamp chip belt material P; Master controller 20 controls geometrical clamp assembly 75, closes to clamp chip belt material P or open to unclamp chip belt material P.
Master controller 20 controls live splint assembly 71 and cuts out clamping chip belt material P, control geometrical clamp assembly 75 to open simultaneously, then master controller 20 control step cylinder 72 task driven live splint assembly 71 moves along+A direction, and namely live splint assembly 71 drives chip belt material P to move along+A direction together; When stepping cylinder 72 drive live splint assembly 71 advance certain distance (i.e. the step distance of chip belt material P) time, the driver part of stepping cylinder 72 is spacing by one of them retaining bolt of retaining bolt assembly 73, and stepping cylinder 72 can not continue to drive live splint assembly 71 mobile to this driving direction (+A direction); Now, master controller 20 controls live splint assembly 71 and opens to unclamp chip belt material P, control geometrical clamp assembly 75 simultaneously and close the chip belt material P that is fixedly clamped, prevent chip belt material P malfunction, then stepping cylinder 72 drives live splint assembly 71 along walking to expect that live splint assembly 71 is retracted initial position by passage L retrogressing (moving along-A direction).After the interval time of presetting (now punching mechanism 80 is die-cut be easy to act as before carry out die-cut chip), master controller 20 control step mechanism 70 repeats above-mentioned action.
Further, with reference to Fig. 1, Fig. 2, Figure 11 and Figure 12, punching mechanism 80 comprises the die-cut cylinder 81 be electrically connected with master controller 20 and the die cutting die 82 be located at above die-cut cylinder 81; Die cutting die 82 is provided with the punching module 821 (the present embodiment is for two punching modules 821) of multiple different size; Walk to expect that passage L is multiple, respectively walk to expect that passage L be arranged in parallel, walk to expect that passage L is between die-cut cylinder 81 and punching module 821, walk to expect that passage L and punching module 821 one_to_one corresponding are arranged.
In the present embodiment, die cutting die 82 has multiple punching module 821 (namely the size of each punching module 821 is different) being respectively used to die-cut different size chip, can compatible sizes chip die-cut.When card groove milling sealed in unit produces the card of different size, because die cutting die 82 is provided with the punching module 821 of sizes, that the chip belt material P of chip corresponding for produced card is put into punching module 821 correspondence of correspondingly-sized walks to expect passage L, realize the die-cut of chip needed for card to encapsulate for produced card, without the need to changing die cutting die 82, eliminate the trouble changing die cutting die 82, save the time, improve production efficiency.
Further, punching module 821 comprises multiple chip punching 8211 (the present embodiment has two chip punchings 8211 for each punching module 821), die-cutly so once just can punch out multiple chip, the die-cut frequency of die cutting die 82 can be reduced and ensure to punch out the supply rate of chip simultaneously, and the production of multicore card can also be suitable for.
The foregoing is only the preferred embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize instructions of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a card groove milling sealed in unit, comprise board and master controller, described board be provided with for transfer card connecting gear and be positioned at the slotting attachment of side of travelling belt of described connecting gear, it is characterized in that, described slotting attachment comprises the multiple groove milling mechanisms be arranged side by side along described travelling belt, described master controller is electrically connected with each groove milling mechanism respectively, controls each groove milling mechanism and carries out milling to the diverse location of the card on described travelling belt respectively, to mill out chip groove; Described board is also provided with for carrying chip to the Handling device in the chip groove of described card; Described board is also provided with: walk to expect passage for carries chips band material, for drive described chip belt material along described in walk to expect the stepping mechanism that passage advances, and for punching out the punching mechanism that chip carries out for Handling device carrying from chip belt material; Described stepping mechanism is positioned at the upstream of described punching mechanism along the step direction of described chip belt material, and described stepping mechanism and described punching mechanism are electrically connected with described master controller;
Described stepping mechanism comprises: for clamping the live splint assembly that described chip belt material advances to drive described chip belt material, for gripping the geometrical clamp assembly of described chip belt material, walk to expect for driving described in described live splint assembly edge the stepping cylinder that passage reciprocates, the drive plate that first end connects the piston rod of described stepping cylinder, the second end connects described live splint assembly, and connect the relative and spaced retaining bolt assembly in one end of described drive plate with described stepping cylinder;
The piston rod of the vertical described stepping cylinder of described drive plate, the second end of described drive plate is adjustable length stretching structure; Described retaining bolt assembly comprises fixed head that is parallel with described drive plate and that be fixed on described board, and is located at the multiple retaining bolts on described fixed head, and the spacing at a distance of described live splint assembly retaining bolt far away and described drive plate is less;
Described master controller is connected with described stepping cylinder, live splint assembly and geometrical clamp electrical component respectively; Live splint assembly described in described main controller controls, closes to clamp described chip belt material or open to unclamp described chip belt material; Geometrical clamp assembly described in described main controller controls, closes to clamp described chip belt material or open to unclamp described chip belt material;
Described punching mechanism comprises the die-cut cylinder be electrically connected with described master controller and the die cutting die be located at above described die-cut cylinder; Described die cutting die is provided with the punching module of multiple different size, and described punching module comprises multiple chip punching; Describedly walk to expect that passage is multiple, respectively walk to expect that passage be arranged in parallel, described in walk to expect that passage is between described die-cut cylinder and described punching module, described in walk to expect that passage and described punching module one_to_one corresponding are arranged;
The corresponding described each described groove milling mechanism of described board is provided with the electromagnet for being clamped in described card both sides below described travelling belt.
2. card groove milling sealed in unit according to claim 1, it is characterized in that, described Handling device comprises the linear module of XY and multiple lifting assembly be connected on the linear module of described XY, described lifting assembly is connected with chip and picks and places part, lifting assembly described at least one is connected with the linear module of described XY by rotary cylinder, described master controller is module linear in described XY respectively, lifting assembly, chip picks and places part and rotary cylinder electrical connection, described in the linear module task driven of XY described in described main controller controls, lifting assembly moves to assigned address, described controller controls described lifting assembly work and drives described chip to pick and place part vertically to rise or vertically decline, described controller controls described chip and picks and places part and capture described chip or unclasp described chip, described controller controls lifting assembly described in described rotary cylinder task driven and rotates to drive the chip of this lifting assembly bottom to pick and place part rotation.
3. card groove milling sealed in unit according to claim 1, it is characterized in that, the direction of transfer described board is also provided with along travelling belt is positioned at the packaging system in described slotting attachment downstream, described packaging system comprises: for the spot welding group described chip and described chip groove are welded and fixed, for strengthening the hot weld group of the weld strength of described chip and described chip groove, and the group of colding pressing for cooling the chip after hot weld; Described master controller is respectively with described spot welding group, hot weld group with cold pressing to organize and be electrically connected.
4. card groove milling sealed in unit according to claim 3, is characterized in that, the spot welding head of described spot welding group has multiple somes tips, the chip groove one_to_one corresponding of each tip and a described card; The hot weld head of described hot weld group has multiple hot weld mouth, the chip groove one_to_one corresponding of each hot weld mouth and a described card; Described head of colding pressing of colding pressing group has multiple mouth of colding pressing, the chip groove one_to_one corresponding of each cold pressing mouth and a described card.
5. card groove milling sealed in unit according to claim 4, it is characterized in that, also comprise and to be located at immediately below described hot weld head and to be positioned at the flat glue assembly of the below of described card, described flat glue assembly comprises base, on described base, the position of corresponding described hot weld mouth is provided with holding tank, the first circular block is provided with in described holding tank, described first circular block has stacked the second circular block, the end face of described first circular block is spherical concave surface, the bottom surface of described second circular block is the spherical convex surface with described first circular block bottom surface adaptation, the bottom surface of described second circular block is parallel with described card bottom surface.
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| CN201310586719.3A CN103617437B (en) | 2013-11-20 | 2013-11-20 | Card groove milling sealed in unit |
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| CN103617437B true CN103617437B (en) | 2016-03-16 |
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| CN105642980B (en) * | 2016-02-02 | 2017-09-22 | 沈阳友联电子装备有限公司 | The whole groove milling method for magnifying material of IC-card and the slotting attachment for implementing this method |
| CN106466778A (en) * | 2016-08-30 | 2017-03-01 | 佛山市普拉迪数控科技有限公司 | A kind of shape extrusion center for processing weaving trick plate |
| CN106270687B (en) * | 2016-10-15 | 2018-05-01 | 广州明森科技股份有限公司 | A kind of smart card groove milling equipment |
| CN110899792B (en) * | 2019-11-28 | 2021-02-05 | 武汉嘉琦瑞发卡科技有限公司 | Positioning device of IC card slot milling machine |
| CN112743133A (en) * | 2021-01-21 | 2021-05-04 | 南京迪海智科精密机械有限公司 | IC card groove milling robot and IC card groove milling method |
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| CN101464961B (en) * | 2008-12-11 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | Method and equipment for producing SIM card |
| CN202291685U (en) * | 2011-09-15 | 2012-07-04 | 天津精诚机床股份有限公司 | Numerical control curve-tooth bevel gear milling machine with automatic loading and unloading device |
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Address after: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee after: Shenzhen Yuanmingjie Technology Co., Ltd. Address before: Four, building 518000, building A2, Nanchang second industrial zone, Xixiang street, Baoan District, Guangdong, Shenzhen, China (A) Patentee before: SHENZHEN YUANMINGJIE TECHNOLOGY CO., LTD. |