CN203055987U - LAMP light emitting diode of curve surface reflection cavity - Google Patents
LAMP light emitting diode of curve surface reflection cavity Download PDFInfo
- Publication number
- CN203055987U CN203055987U CN201320061706XU CN201320061706U CN203055987U CN 203055987 U CN203055987 U CN 203055987U CN 201320061706X U CN201320061706X U CN 201320061706XU CN 201320061706 U CN201320061706 U CN 201320061706U CN 203055987 U CN203055987 U CN 203055987U
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- China
- Prior art keywords
- emitting diode
- reflection cavity
- lamp light
- chip
- reflection
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a LAMP light emitting diode of a curve surface reflection cavity. The LAMP light emitting diode comprises a metal support, a chip, and two leads. The metal support comprises two spaced support frames, and one of the support frames is provided with a reflection cavity with an opening. The chip is disposed on a bottom of the reflection cavity. The chip is electrically connected with the two spaced support frames. Outer sealing adhesive wraps main bodies of the two spaced support frames and the chip. A vertical section of the outer sealing adhesive is in a shape of an arch. The two spaced support frames are respectively provided with a metal pin extending out of the outer sealing adhesive. A side wall of the reflection cavity is a concave curved surface. Through changing the side wall of the reflection cavity to the concave curved surface, on one hand, more light rays reflect out of the outer sealing adhesive, luminance of the LAMP light emitting diode is improved, and on the other hand, the concave curved surface has effect of condensation, and light rays reflected by the curve surface reflection cavity refract out of the curve surface reflection cavity, thereby improving axial brightness.
Description
Technical field
The utility model relates to field of semiconductor manufacture, relates in particular to the LAMP light-emitting diode in a kind of camber reflection chamber.
Background technology
Recent years, China LED (light-emitting diode, Light Emitting Diode) Packaging Industry, emerge like the mushrooms after rain, though the speed of development is amazing, with world-class level very big distance is arranged still, wherein topmost is exactly quality and the reliability of product.
Wherein, the LED metallic support is one of topmost former material of LED product, is to be responsible for conduction and thermal component in the LED product, and links to each other with the metal pins of chip, plays important effect.
The LED metallic support is broadly divided into LAMP metallic support (being direct insertion LED metallic support), SMD metallic support (being the adopting surface mounted LED metallic support), Piranha metallic support and high-power metallic support.When LED encapsulates, several LED metallic supports are linked together, behind the packing colloid with its disconnection.
See also Fig. 1 and Fig. 2, wherein, shown in Figure 1 is existing LAMP light-emitting diode structure schematic diagram with reflection cavity of plagiohedral sidewall and cross section ovalize; Shown in Figure 2 is existing LAMP light-emitting diode structure schematic diagram with the rounded reflection cavity of plagiohedral sidewall and cross section.By Fig. 1 and Fig. 2 as seen, existing LAMP LED is direct insertion LED, mainly comprise metallic support (LAMP metallic support), chip 2, outer sealing, lead-in wire 4 and metal pins 5, described metallic support comprises two bracing frames 1 separately, the sidewall 12 of reflection cavity illustrated in figures 1 and 2 is inclined-plane (plane inclined), and namely the angle between the bottom 11 of the sidewall 12 of described reflection cavity and described reflection cavity is acute angle.
The refractive index of outer sealing 3 is about 1.4-1.5, the refractive index of air is 1, and when sealing entered air outside light penetrates according to total reflection formula sinA=1/n, incidence angle greater than the light of 34 degree total reflection can take place, cause part light to be reflected back toward in the reflection cavity, thereby can't penetrate reflection cavity.Exactly because the light minute surface reflection that 12 pairs of chips 2 of the sidewall of reflection cavity send is so spotlight effect is relatively poor.
Therefore, in the face of market to the more and more higher trend of the requirement of product brightness under, and chip 2 brightness promote under the condition of limited, how as much as possible light to be reflected emission cavity, are the technical problems that those skilled in the art need to be resolved hurrily to improve its brightness.
The utility model content
The purpose of this utility model is to provide the LAMP light-emitting diode in a kind of camber reflection chamber, by the sidewall of reflection cavity is made into the curved surface of indent by the inclined-plane, can be so that more rays reflect outer sealing, and can improve axial brightness, thus improve the brightness of LAMP light-emitting diode.
To achieve the above object, the utility model adopts following technical scheme:
The LAMP light-emitting diode in a kind of camber reflection chamber, comprise metallic support, chip and two lead-in wires, described metallic support comprises two bracing frames separately, wherein bracing frame is provided with a reflection cavity with opening, described chip is arranged on the bottom of described reflection cavity, described chip electrically connects with described two bracing frames separately respectively by two lead-in wires, in described outer sealing is wrapped in the main body of described two bracing frames separately and chip, described two bracing frames separately have the metal pins that stretches out described outer sealing respectively, and the sidewall of described reflection cavity is the curved surface of indent.
Preferably, in the LAMP light-emitting diode in above-mentioned camber reflection chamber, described chip is arranged on the bottom of described reflection cavity by crystal-bonding adhesive.
Preferably, in the LAMP light-emitting diode in above-mentioned camber reflection chamber, the cross section of described reflection cavity is circular.
Preferably, in the LAMP light-emitting diode in above-mentioned camber reflection chamber, the cross section of described reflection cavity is oval.
Preferably, in the LAMP light-emitting diode in above-mentioned camber reflection chamber, the longitudinal section of described outer sealing is the arched door shape.
Preferably, in the LAMP light-emitting diode in above-mentioned camber reflection chamber, the cross section of described outer sealing is circle or ellipse or rectangle.
The LAMP light-emitting diode in the camber reflection chamber that the utility model provides, by the sidewall of reflection cavity is made into the curved surface of indent by the inclined-plane, the curved surface of indent has the optically focused effect, light can all upwards reflect after the reflection cavity reflection of curved surface, and then can improve axial brightness, thereby improve the brightness of LAMP light-emitting diode.The utility model is because therefore the brightness that can improve the LAMP light-emitting diode can extend following two advantages:
(1) can reduce brightness requirement to chip, select the chip of low-light level for use, can satisfy the demands, thereby reduce cost;
(2) under the situation that chip itself is constant, by reducing electric current, can satisfy the brightness demand, thereby reduce power consumption, energy-conserving and environment-protective.
Description of drawings
The LAMP light-emitting diode in camber reflection of the present utility model chamber is provided by following embodiment and accompanying drawing.
Fig. 1 is existing LAMP light-emitting diode structure schematic diagram with reflection cavity of plagiohedral sidewall and cross section ovalize;
Fig. 2 is existing LAMP light-emitting diode structure schematic diagram with the rounded reflection cavity of plagiohedral sidewall and cross section;
Fig. 3 is the LAMP light-emitting diode structure schematic diagram in the camber reflection chamber of the utility model embodiment one;
Fig. 4 is the plan structure schematic diagram of the reflection cavity that chip is housed of the utility model embodiment one;
Fig. 5 is the LAMP light-emitting diode structure schematic diagram in the camber reflection chamber of the utility model embodiment two;
Fig. 6 is the plan structure schematic diagram of the reflection cavity that chip is housed of the utility model embodiment two.
Among the figure, 1-bracing frame, 11-bottom, 12-sidewall, 2-chip, the outer sealing of 3-, 4-lead-in wire, 5-metal pins.
Embodiment
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize the beneficial effects of the utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For the purpose of this utility model, feature are become apparent, below in conjunction with accompanying drawing embodiment of the present utility model is further described.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Embodiment one
See also Fig. 3 and Fig. 4, wherein, shown in Figure 3 is the LAMP light-emitting diode structure schematic diagram in the camber reflection chamber of the utility model embodiment one, and shown in Figure 4 is the plan structure schematic diagram of the reflection cavity that chip is housed of the utility model embodiment one.
The LAMP light-emitting diode in the camber reflection chamber that present embodiment provides namely has the LAMP light-emitting diode of the reflection cavity of curved surface sidewall, comprise metallic support, chip 2 and two lead-in wires 4, described metallic support comprises two bracing frames 1 separately, wherein bracing frame 1 is provided with a reflection cavity with opening, described chip 2 is arranged on the bottom 11 of described reflection cavity, described chip 2 electrically connects with described two bracing frames 1 separately respectively by two lead-in wires 4, in described outer sealing 3 is wrapped in the main body of described two bracing frames 1 separately and chip 2, the longitudinal section of described outer sealing 3 is the arched door shape, described two bracing frames 1 separately have the metal pins 5 that stretches out described outer sealing 3 respectively, and the sidewall 12 of described reflection cavity is the curved surface of indent and can has reflex to the light that chip 2 sends.By making the sidewall 12 of reflection cavity the curved surface of indent into by the inclined-plane, the curved surface of indent has the optically focused effect, and light can all upwards reflect after the reflection cavity reflection of curved surface, can improve axial brightness, thereby improve the brightness of LAMP light-emitting diode.This product is compared with LAMP light-emitting diode illustrated in figures 1 and 2, light as much as possible can be reflected reflection cavity, calculates I according to theory and improves 30% brightness.
Preferably, in the LAMP light-emitting diode in the camber reflection chamber of present embodiment, described chip 2 is arranged on the bottom 11 of described reflection cavity by crystal-bonding adhesive (not shown).By being set, crystal-bonding adhesive chip 2 can be pasted on the bottom 11 of described reflection cavity securely.
Preferably, in the LAMP light-emitting diode in the camber reflection chamber of present embodiment, the cross section of described reflection cavity is oval, and namely described metallic support is oval cup-shaped, and the curvature of sidewall 12 can arrange as required.
Preferably, the cross section of described outer sealing 3 can be circle or ellipse or rectangle, and in the present embodiment, the cross section of described outer sealing 3 can be circular.
In addition, compare with the plagiohedral reflection cavity, camber reflection chamber difficulty in processing does not increase.During bracing frame 1 punching press with the sidewall design camber of drift, the reflection cavity sidewall that makes stamping forming bracing frame 1 is the curved surface of indent, bracing frame 1 is electroplated then, secondly through LAMP LED encapsulation flow processs such as solid crystalline substance, bonding wire, encapsulatings, is processed into finished product LAMP LED.In addition, when producing, bracing frame 1 can be designed to any curvature according to the size of the size that adopts chip 2 and bracing frame 1 itself.This patent is applicable to all LAMP light-emitting diode products.
Embodiment two
See also Fig. 5 and Fig. 6, wherein shown in Figure 5 is the LAMP light-emitting diode structure schematic diagram in the camber reflection chamber of the utility model embodiment two, and shown in Figure 6 is the plan structure schematic diagram of the reflection cavity that chip is housed of the utility model embodiment two of the utility model embodiment two.
By Fig. 5 and Fig. 6 as seen, present embodiment and implement one the main distinction and be:
The cross section of described reflection cavity is circular, and namely the sidewall 12 of described reflection cavity is spherical structure, and namely described metallic support is round aecidioid, and the curvature of sidewall 12 can arrange equally as required.
In sum, the LAMP light-emitting diode in the camber reflection chamber that the utility model provides, by the sidewall of reflection cavity is made into the curved surface of indent by the inclined-plane, the curved surface of indent has the optically focused effect, light can all upwards reflect after the reflection cavity reflection of curved surface, can improve axial brightness, thereby improve the brightness of LAMP light-emitting diode.Present embodiment takes out efficient by improving light, thereby improves the LAMP light-emitting diode luminance.This invention can be used in display screen, and illumination waits the LED association area.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (6)
1. the LAMP light-emitting diode in a camber reflection chamber, it is characterized in that, comprise metallic support, chip and two lead-in wires, described metallic support comprises two bracing frames separately, wherein bracing frame is provided with a reflection cavity with opening, described chip is arranged on the bottom of described reflection cavity, described chip electrically connects with described two bracing frames separately respectively by two lead-in wires, in outer sealing is wrapped in the main body of described two bracing frames separately and chip, described two bracing frames separately have the metal pins that stretches out described outer sealing respectively, and the sidewall of described reflection cavity is the curved surface of indent.
2. the LAMP light-emitting diode in camber reflection according to claim 1 chamber is characterized in that described chip is arranged on the bottom of described reflection cavity by crystal-bonding adhesive.
3. the LAMP light-emitting diode in camber reflection according to claim 1 chamber is characterized in that, the cross section of described reflection cavity is circular.
4. the LAMP light-emitting diode in camber reflection according to claim 1 chamber is characterized in that, the cross section of described reflection cavity is oval.
5. the LAMP light-emitting diode in camber reflection according to claim 1 chamber is characterized in that the longitudinal section of described outer sealing is the arched door shape.
6. according to the LAMP light-emitting diode in any described camber reflection chamber in the claim 1 ~ 5, it is characterized in that the cross section of described outer sealing is circle or ellipse or rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320061706XU CN203055987U (en) | 2013-01-30 | 2013-01-30 | LAMP light emitting diode of curve surface reflection cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320061706XU CN203055987U (en) | 2013-01-30 | 2013-01-30 | LAMP light emitting diode of curve surface reflection cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203055987U true CN203055987U (en) | 2013-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320061706XU Expired - Lifetime CN203055987U (en) | 2013-01-30 | 2013-01-30 | LAMP light emitting diode of curve surface reflection cavity |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078554A (en) * | 2014-05-15 | 2014-10-01 | 中山市川祺光电科技有限公司 | LED direct-plug-in lamp |
| CN107887481A (en) * | 2017-11-09 | 2018-04-06 | 江苏稳润光电科技有限公司 | The preparation method and white light LEDs product of a kind of consistent white light LEDs product of hot spot |
-
2013
- 2013-01-30 CN CN201320061706XU patent/CN203055987U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104078554A (en) * | 2014-05-15 | 2014-10-01 | 中山市川祺光电科技有限公司 | LED direct-plug-in lamp |
| CN107887481A (en) * | 2017-11-09 | 2018-04-06 | 江苏稳润光电科技有限公司 | The preparation method and white light LEDs product of a kind of consistent white light LEDs product of hot spot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |
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| CX01 | Expiry of patent term |