CN204130584U - A kind of COB light source of specular removal Vernonia parishii Hook. F. angle - Google Patents
A kind of COB light source of specular removal Vernonia parishii Hook. F. angle Download PDFInfo
- Publication number
- CN204130584U CN204130584U CN201420509857.1U CN201420509857U CN204130584U CN 204130584 U CN204130584 U CN 204130584U CN 201420509857 U CN201420509857 U CN 201420509857U CN 204130584 U CN204130584 U CN 204130584U
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- Prior art keywords
- angle
- groove
- metal substrate
- pad
- light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The utility model discloses a kind of COB light source of specular removal Vernonia parishii Hook. F. angle, it comprises LED support, LED support is provided with electrode, LED support comprises metal substrate, and the middle part of metal substrate is provided with groove, and groove surfaces is coated with highlighted silver layer, there is groove hypotenuse at an angle at the edge of groove, be provided with LED chip in groove, metal substrate upper groove side is provided with metal pad, and LED chip is connected with pad by bonding wire; Pad is by circuit and Electrode connection; Middle part on metal substrate is provided with LED chip, bonding wire, the phosphor gel that pad is coated, and on metal substrate, the periphery of phosphor gel is provided with injected plastics material layer; The inner side edge that injected plastics material layer connects with phosphor gel is hypotenuse at an angle.The rising angle that the utility model arranges the inclined expansion at injected plastics material edge light decreases the reflection of light simultaneously, thus improves light efficiency; There is the advantage that good heat dissipation, cost are low and easy to use.
Description
[technical field]
The utility model relates to a kind of COB light source of specular removal Vernonia parishii Hook. F. angle.
[background technology]
LED and light-emitting diode, as a kind of novel green light source product, be acknowledged as 21 century lighting source most with prospects.Particularly along with the lifting of technical merit, reach 303lm/W for the power type white light LED laboratory light efficiency thrown light on, the closely theoretical boundary of white LED light source.But the light efficiency of domestic market main product still only 130lm/W, differs comparatively large with the laboratory level of world advanced person, tool has greatly improved space.Meanwhile, in the lighting demands such as room lighting, require light illumination evenly and there is larger irradiated area, and the spotlight effect of Conventional LED light sources is strong, needs to adopt complicated secondary optical design, has had a strong impact on quality of lighting and has improve production cost.
At present, the packing forms of LED is various, and adopts COBLED to be the LED general illumination industry mainstream technology scheme that domestic and international industrial circle is tending towards admitting for high-power LED encapsulation.COB encapsulation is as a kind of integration packaging mode without the need to chip set, without the need to Reflow Soldering, without the need to paster, and operation and material reduce nearly 1/3rd, have greatly saved cost; The chip adopted directly is attached to the die bond process advan of the mirror metal substrate of high reflecting rate in the lifting of overall bright dipping light efficiency more simultaneously.But the packaged type that COB substrate adopts at present is unfavorable for the derivation of side direction light, and overall bright dipping light efficiency is low, and rising angle is little, cost is high and use inconvenient.
[utility model content]
The purpose of this utility model is to overcome the deficiencies in the prior art part, a kind of good heat dissipation is provided, the COB light source at the specular removal Vernonia parishii Hook. F. angle that cost is low and easy to use, and solve the low problem of the light efficiency that adopts at present the white light LEDs of COB encapsulation to cause less due to its side direction bright dipping, realize the beneficial effect expanding the LED light source angle of divergence, the secondary optical design of light source can be simplified simultaneously while improving product light efficiency, improve the integral inverted light effect of COB light source.
The purpose of this utility model is achieved in that
A kind of COB light source of specular removal Vernonia parishii Hook. F. angle, it is characterized in that it comprises LED support, described LED support is provided with electrode, described LED support comprises metal substrate, and the middle part of described metal substrate is provided with groove, and groove surfaces is coated with highlighted silver layer, there is groove hypotenuse at an angle at the edge of described groove, be provided with LED chip in described groove, described metal substrate upper groove side is provided with metal pad, and described LED chip is connected with pad by bonding wire; Described pad is by circuit and Electrode connection; Middle part on described metal substrate is provided with LED chip, bonding wire, the phosphor gel that pad is coated, and on described metal substrate, the periphery of phosphor gel is provided with injected plastics material layer; The inner side edge that described injected plastics material layer connects with phosphor gel is hypotenuse at an angle.
The COB light source at a kind of specular removal Vernonia parishii Hook. F. angle as above, is characterized in that described pad is arranged on above injected plastics material layer.
The COB light source at a kind of specular removal Vernonia parishii Hook. F. angle as above, it is characterized in that described groove is circular or square, the degree of depth of described groove is 0.5 ~ 4mm, and the angle of inclination of described groove hypotenuse is 30 ~ 60 °.
The COB light source at a kind of specular removal Vernonia parishii Hook. F. angle as above, is characterized in that the width of described pad is 0.5 ~ 2mm.
The COB light source at a kind of specular removal Vernonia parishii Hook. F. angle as above, is characterized in that the angle of inclination of the hypotenuse that described injected plastics material layer connects with phosphor gel is more than or equal to the angle of inclination of groove hypotenuse.
The COB light source at a kind of specular removal Vernonia parishii Hook. F. angle as above, is characterized in that the angle of inclination of the hypotenuse that described injected plastics material layer connects with phosphor gel is 30 ~ 60 °
The utility model adopts LED chip die bond in the groove of metal substrate, groove is had be equal to the reflecting effect of reflector, is conducive to reflecting light and chip side to the derivation of light, improves luminous efficiency of source; The rising angle synchronously arranging the inclined expansion at injected plastics material edge light decreases the reflection of light simultaneously, thus improves light efficiency; Metallic substrate surfaces adopts ripe highlighted silver coating technique, substantially increases integral inverted light effect; Adopt the COB packaged type of LED, there is the advantage that good heat dissipation, cost are low and easy to use.
[accompanying drawing explanation]
Fig. 1 is vertical view of the present utility model;
Fig. 2 is generalized section of the present utility model.
[embodiment]
As shown in Figure 1, 2, a kind of COB light source of specular removal Vernonia parishii Hook. F. angle, it comprises LED support 1, described LED support 1 is provided with electrode 8, and described LED support 1 comprises metal substrate 4, and the middle part of described metal substrate 4 is provided with groove 9, there is groove hypotenuse 10 at an angle at the edge of described groove 9, be provided with LED chip 2 in described groove 9, described metal substrate 4 upper groove 9 side is provided with metal pad 6, and described LED chip 2 is connected with pad 6 by bonding wire 7; Described pad 6 is connected with electrode 8 by circuit; Middle part on described metal substrate 4 is provided with LED chip 2, bonding wire 7, the phosphor gel 3 that pad 6 is coated, and on described metal substrate 4, the periphery of phosphor gel 3 is provided with injected plastics material layer 5; The inner side edge that described injected plastics material layer 5 connects with phosphor gel 3 is hypotenuse at an angle.
Pad 6 is arranged on above injected plastics material layer 5, and makes pad 6 coated by phosphor gel 3.
Groove 9 can be circular or square, and the depth H of groove is 0.5 ~ 4mm, and the tilt angle ranges of groove hypotenuse is 30 ~ 60 °, and being provided with of groove hypotenuse is beneficial to the derivation of chip side to light.The groove 9 of metal substrate 4 carries out the highlighted silver layer process of plated surface, metal surface silver plating process is ripe and effective silver layer reflectivity is high.
Pad 6 width range is 0.5 ~ 2mm, and the area that the pad of compact design decreases platform increases luminous zone area.The inner side edge that described injected plastics material layer (5) connects with phosphor gel (3) is hypotenuse at an angle, and the inclination angle of hypotenuse is more than or equal to the angle of inclination of groove hypotenuse, and making the inclination angle of hypotenuse between 30 ~ 60 °, larger exterior angle is conducive to improving the light source angle of divergence and improving bright dipping.
LED chip 2 directly die bond in metal substrate 4, because the large directly die bond of the large heat of LED power is easy to distributing of heat in substrate.
The utility model adopts the certain lopsided groove of band, the effusion that can improve LED side light improves the light emission rate of LED, highlighted silver coating has high reflecting rate, improves the overall bright dipping of light source, and the inclined side design of substrate and injected plastics material improves the rising angle of light source.
Claims (6)
1. the COB light source at a specular removal Vernonia parishii Hook. F. angle, it is characterized in that it comprises LED support (1), described LED support (1) is provided with electrode (8), described LED support (1) comprises metal substrate (4), the middle part of described metal substrate (4) is provided with groove (9), groove (9) surface is coated with highlighted silver layer, there is groove hypotenuse (10) at an angle at the edge of described groove (9), LED chip (2) is provided with in described groove (9), described metal substrate (4) upper groove (9) side is provided with metal pad (6), described LED chip (2) is connected with pad (6) by bonding wire (7), described pad (6) is connected with electrode (8) by circuit, middle part on described metal substrate (4) is provided with LED chip (2), bonding wire (7), the phosphor gel (3) that pad (6) is coated, the periphery of the upper phosphor gel (3) of described metal substrate (4) is provided with injected plastics material layer (5), the inner side edge that described injected plastics material layer (5) connects with phosphor gel (3) is hypotenuse at an angle.
2. the COB light source at a kind of specular removal Vernonia parishii Hook. F. angle according to claim 1, is characterized in that described pad (6) is arranged on above injected plastics material layer (5).
3. the COB light source at a kind of specular removal Vernonia parishii Hook. F. angle according to claim 1, it is characterized in that described groove (9) is for circular or square, the degree of depth (H) of described groove (9) is 0.5 ~ 4mm, and the angle of inclination of described groove hypotenuse (10) is 30 ~ 60 °.
4. the COB light source at a kind of specular removal Vernonia parishii Hook. F. angle according to claim 1, is characterized in that the width of described pad (6) is 0.5 ~ 2mm.
5. the COB light source at a kind of specular removal Vernonia parishii Hook. F. angle according to claim 1, is characterized in that the angle of inclination of the hypotenuse that described injected plastics material layer (5) connects with phosphor gel (3) is more than or equal to the angle of inclination of groove hypotenuse.
6. the COB light source at a kind of specular removal Vernonia parishii Hook. F. angle according to claim 5, is characterized in that the angle of inclination of the hypotenuse that described injected plastics material layer (5) connects with phosphor gel (3) is 30 ~ 60 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420509857.1U CN204130584U (en) | 2014-09-04 | 2014-09-04 | A kind of COB light source of specular removal Vernonia parishii Hook. F. angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420509857.1U CN204130584U (en) | 2014-09-04 | 2014-09-04 | A kind of COB light source of specular removal Vernonia parishii Hook. F. angle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204130584U true CN204130584U (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420509857.1U Active CN204130584U (en) | 2014-09-04 | 2014-09-04 | A kind of COB light source of specular removal Vernonia parishii Hook. F. angle |
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| Country | Link |
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| CN (1) | CN204130584U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN105826310A (en) * | 2016-03-17 | 2016-08-03 | 广东华辉煌光电科技有限公司 | High-power LED multichip light source module |
| CN109065696A (en) * | 2018-10-29 | 2018-12-21 | 博罗县正润光电有限公司 | A kind of LED New-support |
-
2014
- 2014-09-04 CN CN201420509857.1U patent/CN204130584U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655327A (en) * | 2016-03-16 | 2016-06-08 | 广东华辉煌光电科技有限公司 | Structure substrate of COB light source modules with flip LED chips |
| CN105826310A (en) * | 2016-03-17 | 2016-08-03 | 广东华辉煌光电科技有限公司 | High-power LED multichip light source module |
| CN109065696A (en) * | 2018-10-29 | 2018-12-21 | 博罗县正润光电有限公司 | A kind of LED New-support |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 528400 Tongyi Industrial Park, Guzhen Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Guangsheng Semiconductor Technology Co., Ltd. Address before: 528400 Qifang Industrial Zone, Tongyi Industrial Zone, Guzhen, Zhongshan City, Guangdong Province Patentee before: Zhongshan City Guangsheng Semiconductor Science & Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |