CN201281241Y - Light source packaging structure - Google Patents
Light source packaging structure Download PDFInfo
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- CN201281241Y CN201281241Y CNU2008201231982U CN200820123198U CN201281241Y CN 201281241 Y CN201281241 Y CN 201281241Y CN U2008201231982 U CNU2008201231982 U CN U2008201231982U CN 200820123198 U CN200820123198 U CN 200820123198U CN 201281241 Y CN201281241 Y CN 201281241Y
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- illuminating source
- printed circuit
- circuit board
- photoresistance
- reflector
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- 238000004806 packaging method and process Methods 0.000 title claims description 82
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 9
- 238000004020 luminiscence type Methods 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000011514 reflex Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 235000014698 Brassica juncea var multisecta Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000251184 Rajiformes Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model relates to a light source encapsulating structure, which comprises: a printed circuit board; at least one luminescence light source electrically connected with the printed circuit board; at least one thermal light obstructing reflective body equipped with a concave structure and formed on the surface of the printed circuit board; a reflecting surface which is an internal surface of the concave thermal light obstructing reflective body; a luminescence light source arranged in the concave thermal light obstructing reflective body and having the advancing direction of axial light corresponding to an opening part of the thermal light obstructing reflective body; a light conductor that covers upper parts of the luminescence light source and the thermal light obstructing reflective body; and a transparent resin filled into a blank area between the light conductor and the printed circuit board. The utility model is favorable for improving the optical stability of the light source encapsulating structure, reducing the temperature rising function of optical radiation of non-axial ineffective light to the light source encapsulating structure itself, and improving the electro-optical conversion efficiency of the light source encapsulating structure.
Description
Technical field
The utility model relates to semiconductor technology, particularly relates to a kind of illuminating source packaging structure.
Background technology
The traditional lighting light fixture is selected thermal light source usually for use.Thermal light source because have that luminous efficiency is low, the life-span is short, power consumption height, pollution, shortcoming such as frangible, in energy high-pressure, cost more and more higher today, become the major issue that is related to national economy that countries in the world are shown great attention to and planned to solve as early as possible in a short time.And meet light emitting diode (the Light Emitting Diode of energy-conserving and environment-protective safety standard, hereinafter to be referred as LED) etc. solid state lighting new technology, clear superiority that new product showed, long as the life-span, volume is little, little power consumption, intellectuality (brightness, color tuning), safe, pollution-free etc., has attracted the market great amount of investment.Various small-sized, low side light fixtures (as lower lighting of power etc.) have begun to enter steadily conventional lamp market.But it is also not fully up to expectations in high-end light fixture (as higher lighting of power etc.) application facet, the problem of aspects such as the chip life-span that is in particular in the light source cooling technology and is associated, luminous efficiency waits to solve, these problems fail to break through technically, cause the high-end illuminating product of most of market in urgent need still to rest on the product introduction stage, can't satisfy industry and people's living needs fully.
The prior art led light source is normally installed many pieces of point-like and the good led light source of individual packages on a tellite.Fig. 1 is a prior art led light source structural representation.Every piece of led light source structure as shown in Figure 1, LED illuminating source 13 is connected with circuit conductor 12 on being laid in substrate 15 by bonding wire 11, the rays pass through lens 14 that LED illuminating source 13 sends derives, and is filled with transparent resin 16 between LED illuminating source 13 and lens 14.The radiation direction of launching from the point-like led light source has randomness.For the application scenarios such as solid light sources such as searchlights, contributive radiation direction is the light of substrate dorsad to throwing light on.The point-like led light source is towards the light of orientation substrate, and the side direction light of point-like led light source emission, and to the not contribution of the whole luminous illumination of led light source, these light are invalid light for the whole luminous illumination of led light source.As seen, the luminous efficiency of prior art led light source is lower.In addition, if invalid light is not in time handled, also can make the bulk temperature of led light source structure be tending towards higher; And, encapsulation bulk temperature high light source low for luminous efficiency, the life-span of light source can corresponding shortening, and the life-span of the drive circuit of this light source and stability can all can be subjected to corresponding harmful effect.
The utility model content
The purpose of this utility model provides a kind of illuminating source packaging structure, be used to improve the light source that non axial invalid light that illuminating source sends causes optical instability, and reduce the castering action that produces therefrom to illuminating source packaging structure self temperature.
For achieving the above object, the utility model provides a kind of illuminating source packaging structure, comprising:
Printed circuit board (PCB);
At least one illuminating source is electrically connected with described printed circuit board (PCB);
At least one has the hot photoresistance of concave structure every reflector, is formed at described printed circuit board surface; The described hot photoresistance of spill is a reflecting surface every the inner surface of reflector; Described hot photoresistance is provided with a described illuminating source in the spill of reflector, and described illuminating source axial ray direction of advance is corresponding to the uncovered part of described hot photoresistance every reflector;
Light conductor is located at described illuminating source and the hot photoresistance top every reflector;
Transparent resin is filled in the white space between described light conductor and the described printed circuit board (PCB).
On the basis of technique scheme, the printed circuit board (PCB) of the utility model illuminating source packaging structure also can comprise at least one electrode pads; Described hot photoresistance is a horizontal reflection face every the lower surface of reflector inner surface; Described illuminating source is arranged on the described horizontal reflection face, and is connected with described printed circuit board (PCB) by described electrode pads.Described hot photoresistance is every the spill degree of depth of the reflector height more than or equal to described illuminating source.Described hot photoresistance every the angle of the sideswipe face of reflector inner surface and described printed circuit board (PCB) greater than 90 °.Hot photoresistance can be plane, cancave cambered surface or convex globoidal every the sideswipe face of reflector inner surface.Described hot photoresistance can be with described printed circuit board (PCB) every reflector and is connected and prefabricated profiled glass-reflected body, plastic reflective body or chaff; Perhaps, described hot photoresistance is wholely set every reflector and described printed circuit board (PCB).
On the basis of technique scheme, described light conductor comprises that the described illuminating source of shaping sends the lens of light beam.Perhaps, described light conductor comprises that the described illuminating source of even diffusion sends the scattering layer of light beam.
On the basis of technique scheme, described printed circuit board (PCB) comprises tellite and the printed circuit that is formed on the described tellite; Described tellite comprises microcrystalline alumina ceramic substrate, high heat conduction metal-based circuit board or high heat-conduction electric insulation material substrate.Further, described illuminating source packaging structure also can comprise the thermoelectric cooling module that is connected with described printed circuit board (PCB) lower surface.
As shown from the above technical solution, the illuminating source packaging structure that provides of the utility model has following beneficial effect:
1, the utility model illuminating source packaging structure is by having the hot photoresistance of concave structure every reflector in the printed circuit board surface setting, in the spill of reflector, illuminating source is set at hot photoresistance, and the hot photoresistance of this spill is a reflecting surface every the inner surface of reflector, this makes that working as illuminating source sends non axial invalid light, hot photoresistance can reflex to these non axial invalid light outside the illuminating source packaging structure every reflector, help improving the optical stability of illuminating source packaging structure, and reduce the castering action of the optical radiation of non axial invalid light illuminating source packaging structure self temperature.
2, comprise a plurality of illuminating sources and a plurality ofly have the hot photoresistance of concave structure at the utility model illuminating source packaging structure every reflector, illuminating source and hot photoresistance are every the corresponding one by one setting of reflector, promptly in the spill of reflector, establish an illuminating source at each hot photoresistance, this makes hot photoresistance can stop effectively and reflect that every reflector parallel component light beam that illuminating source sends injects the light-emitting window of adjacent illuminating source correspondence, reduction is to the light interference effect of adjacent illuminating source to adjacent illuminating source, thereby effectively reduced non axial invalid light to the optical radiation between the adjacent illuminating source, helped improving the optical stability of illuminating source packaging structure.
3, pass through shape, curvature, the surface actively adjustment of surface reflectivity of hot photoresistance in the utility model illuminating source packaging structure every the sideswipe face of reflector inner surface, the non axial invalid light that illuminating source can be sent changes into the contributive effective sunlight of the whole luminous illumination of light source, thereby helps improving the electro-optical efficiency of illuminating source packaging structure.
4, the utility model illuminating source packaging structure can be selected high thermal conductivity material preparation tellite for use, or adopt active refrigeration mode, make the illuminating source packaging structure internal heat be delivered to outside the structure fast, thereby help reducing the operating temperature of illuminating source packaging structure, help improving the service life of illuminating source, improve the stability of driving power, prolong the service life of illuminating source, reduce light source production and use cost.
Description of drawings
Fig. 1 is a prior art led light source structural representation;
Fig. 2 is the utility model illuminating source packaging structure first example structure schematic diagram;
Fig. 3 is the utility model illuminating source packaging structure second example structure schematic diagram;
Fig. 4 is the illuminating source packaging structure schematic diagram of the utility model honeycomb arrangement;
Fig. 5 is the illuminating source packaging structure schematic diagram that the utility model square matrix is arranged;
Fig. 6 is the utility model illuminating source packaging structure operation principle schematic diagram;
Fig. 7 is the utility model illuminating source packaging structure the 3rd example structure schematic diagram;
Fig. 8 is the utility model illuminating source packaging structure the 4th example structure schematic diagram.
The specific embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Fig. 2 is the utility model illuminating source packaging structure first example structure schematic diagram.As shown in Figure 2, present embodiment comprises that printed circuit board (PCB) 21, illuminating source 22, hot photoresistance are every reflector 23, light conductor 24 and transparent resin 25.
Printed circuit board (PCB) 21 comprises tellite and printed circuit.
Hot photoresistance has concave structure every reflector 23, is formed at printed circuit board (PCB) 21 surfaces.Hot photoresistance is provided with an illuminating source 22 in the spill of reflector 23, and the axial ray direction of advance that illuminating source 22 sends is corresponding to the uncovered part of hot photoresistance every reflector 23.Hot photoresistance is a reflecting surface every the inner surface of reflector 23.Have the uncovered light-emitting window that can be used as illuminating source 22 of the hot photoresistance of concave structure every reflector 23, this uncovered concrete shape and big I design according to actual needs, are shaped as square or circle etc. as hot photoresistance every reflector 23 uncovered.
This hot photoresistance is the heat radiations that stop and reflect non axial light beam generation in illuminating source 22 outgoing beams every the effect of reflector 23, and the heat radiation that makes non axial light produce can not produce heat effect to illuminating source packaging structure.This non axial invalid light comprises the side direction light of illuminating source 22 outgoing and the light of close printed circuit board (PCB) 21 directions.
White space between light conductor 24 and printed circuit board (PCB) 21 is filled with transparent resin 25, and transparent resin 25 is used to protect illuminating source 22.Transparent resin 25 is filled in the zone between light conductor 24 lower surfaces and printed circuit board (PCB) 21, and be limited in simultaneously hot photoresistance every reflector 23 in the zone that illuminating source 22 forms, promptly all be filled with transparent resin 25 every illuminating source 22 edges and top that reflector 23 centers on by hot photoresistance.
The present embodiment illuminating source packaging structure, by illuminating source being laid in hot photoresistance in the spill of reflector, hot photoresistance is a reflecting surface every the inner surface of reflector, promptly this hot photoresistance is a reflecting surface every the reflector surface adjacent with illuminating source, this makes that working as illuminating source sends non axial invalid light, hot photoresistance can reflex to these non axial invalid light outside the illuminating source packaging structure every reflector, thereby help improving the optical stability of illuminating source packaging structure, and reduce the castering action of the optical radiation of non axial invalid light illuminating source packaging structure self temperature; Simultaneously, the utility model illuminating source packaging structure also helps non axial invalid light is changed into the contributive effective sunlight of the whole luminous illumination of light source, thereby helps improving the electro-optical efficiency of illuminating source packaging structure.
Fig. 3 is the utility model illuminating source packaging structure second example structure schematic diagram.Present embodiment shows and comprises a plurality of illuminating sources and a plurality of illuminating source packaging structure with hot photoresistance of concave structure every reflector on basis embodiment illustrated in fig. 2.As shown in Figure 3, in the present embodiment, each hot photoresistance is provided with an illuminating source 22 in reflector 23 spills, and the axial ray direction of advance that illuminating source 22 sends is corresponding to the uncovered part of hot photoresistance every reflector 23.
For ease of explanation present embodiment technical scheme, a hot photoresistance is provided with axial ray direction of advance that an illuminating source 22 and illuminating source 22 send corresponding to the structure of hot photoresistance every the uncovered part of reflector 23 in reflector 23 spills, is called an effective luminescence unit.A plurality of effective luminescence units are arranged with matrix, like this, have isolated mutually every reflector 23 by hot photoresistance between the adjacent illuminating source 22.Light conductor 24 is located at a plurality of illuminating sources 22 and a plurality of hot photoresistance every reflector 23 tops, and the white space between light conductor and printed circuit board (PCB) 21 is filled with transparent resin 25.
In the present embodiment, hot photoresistance with concave structure is reflecting surface every the inner surface of reflector 23, the instant heating photoresistance is reflecting surface every reflector 23 and illuminating source 22 each adjacent surface, concrete, hot photoresistance is a sideswipe face 231 every the side of reflector 23 inner surfaces, and hot photoresistance is the horizontal reflection face 232 adjacent with illuminating source 22 bottoms every the lower surface of reflector 23 inner surfaces.Printed circuit board (PCB) 21 includes the electrode pads 26 that is used to locate illuminating source 22.Illuminating source 22 is arranged on the horizontal reflection face 232, and is electrically connected with printed circuit board (PCB) 21 by electrode pads 26.
On the basis of present embodiment technical scheme, hot photoresistance designs according to actual needs every the uncovered concrete shape and the big I of reflector 23.Fig. 4 is the illuminating source packaging structure schematic diagram of the utility model honeycomb arrangement.As shown in Figure 4, hot photoresistance can be circle every the uncovered shape of reflector 23, illuminating source packaging structure has the circular uncovered hot photoresistance of concave structure to be arranged every reflector 23 and a plurality of effective luminescence unit matrix that illuminating source 22 is formed, thereby forms the illuminating source packaging structure that is honeycomb arrangement.Fig. 5 is the illuminating source packaging structure schematic diagram that the utility model square matrix is arranged.As shown in Figure 5, hot photoresistance can be square every the uncovered shape of reflector 23, have the square uncovered hot photoresistance of concave structure and arrange, be the illuminating source packaging structure that the square matrix is arranged thereby form every reflector 23 and a plurality of effective luminescence unit matrix that illuminating source 22 is formed.In addition, hot photoresistance designs according to actual needs every the uncovered big I of reflector 23.
In order to make heat rejection reflector 23 can effectively stop the light that to inject the light-emitting window position of adjacent illuminating source correspondence in the parallel component of illuminating source 22 outgoing beams, avoid illuminating source 22 parallel components that adjacent illuminating source 22 is produced the light interference effect, the spill degree of depth of heat rejection reflector 23 is more than or equal to the height of illuminating source 22.In order to make heat rejection reflector 23 can effectively stop and reflect side direction in illuminating source 22 outgoing beams and near the heat radiation of printed circuit board (PCB) 21 directions, make these radiation to the whole heat effect that produces of adjacent illuminating source 22 and illuminating source packaging structure, hot photoresistance every the angle of the sideswipe face 231 of reflector 23 inner surfaces and printed circuit board (PCB) 21 greater than 90 °.Further, hot photoresistance can be plane, cancave cambered surface or convex globoidal every the sideswipe face 231 of reflector 23.In the actual design of illuminating source packaging structure, by carrying out of the adjustment of hot photoresistance every sideswipe face 231 surface configurations, curvature, surface area and the surface reflectivity of reflector 23, the non axial invalid light of outgoing in the illuminating source 22 can be reflected outside the illuminating source packaging structure, thereby effectively reduce the illuminating source packaging structure bulk temperature, improve electro-optical efficiency; Also can be controlled simultaneously the output beam angle of divergence.
For heat radiation in the illuminating source outgoing beam and invalid light effectively are converted to the contributive effective sunlight of the whole illuminance of illuminating source packaging structure, thereby realize the high light photoelectric transformation efficiency and reduce this illuminating source packaging structure bulk temperature, increase the life-span and the long-time stability of light source and associated driver circuitry, the fully reflecting surface that the hot photoresistance of present embodiment all can be designed to light every adjacent each the sideswipe face 231 of reflector 23 and illuminating source 22 and horizontal reflection face 232.Sideswipe face 231 is not less than 90 ° with the angle of printed circuit board (PCB) 21.When hot photoresistance when the sideswipe face 231 of reflector 23 is cancave cambered surface, illuminating source 22 outgoing and incident or be generally 115 °～155 ° through the light angle that horizontal reflection face 232 reflexes to sideswipe face 231.Fig. 6 is the utility model illuminating source packaging structure operation principle schematic diagram.As shown in Figure 6, the utility model illuminating source packaging structure is in actual moving process, because hot photoresistance all has reflex every sideswipe face 231 and 232 pairs of incident raies of horizontal reflection face of reflector 23 contiguous illuminating sources 22, when the light that reaches different angles outgoing such as side downwards when illuminating source 22 incides sideswipe face 231 or horizontal reflection face 232, incident ray can be by sideswipe face 231 and/or 232 reflections of horizontal reflection face, and the light that reflects sees through transparent resin 25 and penetrates from lens 24.The actual use shows, each angle light that the utility model illuminating source packaging structure can fully use illuminating source 22 to send, based on sideswipe face 231 and the horizontal reflection face 232 of photoresistance, the invalid light of illuminating source 22 is reflected into the contributive effective sunlight of the whole illumination of illuminating source packaging structure every reflector 23.
Hot photoresistance is selected prefabricated profiled glass-reflected body, plastic reflective body or chaff etc. for use every reflector 23, when preparation present embodiment illuminating source packaging structure, these prefabricated profiled glass-reflected bodies, plastic reflective body or chaff and printed circuit board (PCB) 21 are connected as one.Perhaps, hot photoresistance also can adopt metal coating, brilliant material growth, surface deposition or electroplating technology etc. directly to be deposited on the tellite surface every reflector 23, forms as one with tellite.Hot photoresistance is every the sideswipe face 231 of reflector 23 and horizontal reflection face 232 all can be the metal coating minute surface or other have the surface of reflection function.
By above-mentioned analysis as seen, the utility model illuminating source packaging structure is in practical work process, the invalid light that reaches directions such as side in the illuminating source outgoing beam is downwards derived illuminating source packaging structure, therefore can avoid of the absorption of the utility model illuminating source packaging structure to the unwanted light radiation, thereby prevent that further the utility model light source from encapsulating the lifting of junction temperature, also can avoid the luminous power fluctuation that causes owing to the interference of light; Penetrate from lens when the axial ray of illuminating source top outgoing sees through the transparent resin packed layer, the utility model illuminating source packaging structure has possessed the illumination effect of general existing light source product; Further, the utility model illuminating source packaging structure also can be converted into the invalid light that reaches directions such as side in the illuminating source outgoing beam downwards to the contributive effective light radiation of illuminating source packaging structure integral illumination, therefore, help improving the electro-optical efficiency of the utility model illuminating source packaging structure, reduce the overall work temperature of illuminating source packaging structure, obviously improved the working life of illuminating source, than the bigger advantage that has of general conventional lighting sources product.
Fig. 7 is the utility model illuminating source packaging structure the 3rd example structure schematic diagram.As shown in Figure 7, present embodiment and difference embodiment illustrated in fig. 3 are that the present embodiment light conductor is specially scattering layer 242.Scattering layer 242 is located at the top of transparent resin 25 packed layers, is used for the light of even scattering illuminating source 22 from transparent resin 25 transmissions.On specific implementation, scattering layer 242 can be diffusion sheet, and perhaps coating has the scattering diluent coating etc. of printing opacity effect on transparent resin 25.
Present embodiment comprises tellite and printed circuit at printed circuit board (PCB) 21, and printed circuit is formed on the tellite.On the basis of technique scheme, in order to improve the heat conductivity of present embodiment illuminating source packaging structure, can select to have the material preparation tellite of high thermal conductivity, for example: tellite can comprise: microcrystalline alumina ceramic substrate, high heat conduction metal-based circuit board or high heat-conduction electric insulation material substrate etc.; Wherein, high heat conduction metal-based circuit board can comprise aluminium base or copper base etc.Has high thermal conductivity material preparation printed circuit board (PCB) 21 by selecting for use, make present embodiment illuminating source packaging structure internal heat to be delivered to outside the structure fast by tellite, thereby help reducing the operating temperature of illuminating source packaging structure, help improving the service life of illuminating source, improve the stability of driving power, prolong the service life of illuminating source, reduce light source production and use cost.
In addition, in order to improve the heat conductivity of present embodiment illuminating source packaging structure, on the basis of technique scheme, also can select for use the mode of active refrigeration to reduce the operating temperature of illuminating source packaging structure.
Fig. 8 is the utility model illuminating source packaging structure the 4th example structure schematic diagram.As shown in Figure 8, present embodiment connects thermoelectric cooling module (Thermo electric Cooler is called for short TEC) 27 at printed circuit board (PCB) 21 lower surfaces.Thermoelectric cooling module 27 can weld or thermal conductance is gluing connects mode and printed circuit board (PCB) 21 lower surfaces connect as one.After thermoelectric cooling module 27 was applied operating voltage, 27 of thermoelectric cooling modules can be taken away the heat of assembling on the printed circuit board (PCB) 21 rapidly, made that the operating temperature of illuminating source 22 remains on a comparatively desirable level on the printed circuit board (PCB) 21.
Present embodiment by active mode to illuminating source packaging structure refrigeration, its cooling effect is very obvious, be suitable for the illuminating source of any power level, particularly particularly evident for the cooling effect of high-power (as: the LED illuminating source that power is surpassed 0.5W is called the great power LED illuminating source).Present embodiment provides effective cooling scheme for illuminating source packaging structure, has obviously improved the reliability of light source, prolongs the service life of light source.
On the basis of technique scheme, light source attractive in appearance for convenient formation, that profile is abundant, the printed circuit board (PCB) of the utility model illuminating source packaging structure can be selected flexibility (flexible) printed circuit board (PCB) for use.Based on the abundant light fixture of profiles such as the flexible formation columnar light source of the illuminating source packaging structure of flexible printed circuit board, turriform light source, can the light-emitting 3 D angle be control effectively simultaneously, make things convenient for the user to select for use according to the needs of practical application scene.
It should be noted that at last: above embodiment only in order to the explanation the technical solution of the utility model, is not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that previous embodiment is put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of the utility model embodiment technical scheme.
Claims (10)
1, a kind of illuminating source packaging structure is characterized in that, comprising:
Printed circuit board (PCB);
At least one illuminating source is electrically connected with described printed circuit board (PCB);
At least one has the hot photoresistance of concave structure every reflector, is formed at described printed circuit board surface; The described hot photoresistance of spill is a reflecting surface every the inner surface of reflector; Described hot photoresistance is provided with a described illuminating source in the spill of reflector, and the axial ray direction of advance that described illuminating source sends is corresponding to the uncovered part of hot photoresistance every reflector;
Light conductor is located at described illuminating source and the hot photoresistance top every reflector;
Transparent resin is filled in the white space between described light conductor and the described printed circuit board (PCB).
2, illuminating source packaging structure according to claim 1 is characterized in that, described printed circuit board (PCB) comprises at least one electrode pads; Described hot photoresistance is a horizontal reflection face every the lower surface of reflector inner surface; Described illuminating source is arranged on the described horizontal reflection face, and is connected with described printed circuit board (PCB) by described electrode pads.
3, illuminating source packaging structure according to claim 1 is characterized in that, described hot photoresistance is every the spill degree of depth of the reflector height more than or equal to described illuminating source.
4, illuminating source packaging structure according to claim 1 is characterized in that, described hot photoresistance every the angle of the sideswipe face of reflector inner surface and described printed circuit board (PCB) greater than 90 °.
5, illuminating source packaging structure according to claim 1 is characterized in that, described hot photoresistance is plane, cancave cambered surface or convex globoidal every the sideswipe face of reflector inner surface.
6, illuminating source packaging structure according to claim 1 is characterized in that, described hot photoresistance is to be connected with described printed circuit board (PCB) and prefabricated profiled glass-reflected body, plastic reflective body or chaff every reflector; Perhaps, described hot photoresistance is wholely set every reflector and described printed circuit board (PCB).
7, illuminating source packaging structure according to claim 1 is characterized in that, described light conductor comprises that the described illuminating source of shaping sends the lens of light beam.
8, illuminating source packaging structure according to claim 1 is characterized in that, described light conductor comprises that the described illuminating source of even diffusion sends the scattering layer of light beam.
9, illuminating source packaging structure according to claim 1 is characterized in that, described printed circuit board (PCB) comprises tellite and the printed circuit that is formed on the described tellite; Described tellite comprises microcrystalline alumina ceramic substrate, high heat conduction metal-based circuit board or high heat-conduction electric insulation material substrate.
10, illuminating source packaging structure according to claim 1 is characterized in that, also comprises the thermoelectric cooling module that is connected with described printed circuit board (PCB) lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201231982U CN201281241Y (en) | 2008-10-28 | 2008-10-28 | Light source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201231982U CN201281241Y (en) | 2008-10-28 | 2008-10-28 | Light source packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN201281241Y true CN201281241Y (en) | 2009-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201231982U Expired - Fee Related CN201281241Y (en) | 2008-10-28 | 2008-10-28 | Light source packaging structure |
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| CN (1) | CN201281241Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047513A1 (en) * | 2009-10-19 | 2011-04-28 | 深圳帝光电子有限公司 | High brightness led lamp |
| CN106898684A (en) * | 2017-04-14 | 2017-06-27 | 桂林电子科技大学 | A kind of multi-chip and UVLED array supports of connecting |
-
2008
- 2008-10-28 CN CNU2008201231982U patent/CN201281241Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011047513A1 (en) * | 2009-10-19 | 2011-04-28 | 深圳帝光电子有限公司 | High brightness led lamp |
| CN106898684A (en) * | 2017-04-14 | 2017-06-27 | 桂林电子科技大学 | A kind of multi-chip and UVLED array supports of connecting |
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