CN215731705U - High-reliability LED lamp filament structure - Google Patents
High-reliability LED lamp filament structure Download PDFInfo
- Publication number
- CN215731705U CN215731705U CN202123135391.2U CN202123135391U CN215731705U CN 215731705 U CN215731705 U CN 215731705U CN 202123135391 U CN202123135391 U CN 202123135391U CN 215731705 U CN215731705 U CN 215731705U
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- Prior art keywords
- metal terminal
- led chip
- height
- wire
- filament structure
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000007306 turnover Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor packaging, in particular to a high-reliability LED filament structure which comprises a substrate, an LED chip and a metal terminal, wherein the LED chip and the metal terminal are fixed on the substrate, a wiring platform is arranged between the LED chip and the metal terminal, the height of the metal terminal is higher than that of the wiring platform, the height of the wiring platform is higher than that of the LED chip, the LED chip is connected with a first wire, the other end of the first wire is connected to the wiring platform, the metal terminal is at least connected with a second wire, and the other end of the second wire is connected to the wiring platform and is connected with the first wire. The LED filament structure has the advantages of high reliability and long service life.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a high-reliability LED filament structure.
Background
In recent years, due to rapid development of the LED industry, LED lamps gradually replace conventional lighting lamps. Because the LED light has the characteristics of point light sources, directivity and the like, the LED lamp is difficult to completely replace the traditional incandescent lamp, and the full light distribution illumination is realized. An existing LED filament is formed by packaging a group of LED chips on a substrate, 360-degree full-angle light emitting can be achieved, and then a plurality of filaments are connected to form a light emitting effect similar to a tungsten filament lamp. The theoretical service life of the existing LED lamp is 10 ten thousand hours, and the LED filament structure mainly comprises a substrate, an LED chip, insulating glue, wires and packaging glue. Due to the difference of the thermal expansion coefficients of the two materials between the substrate and the metal terminal, the wire at the position is stressed maximally, is easy to fail, has poor reliability and influences the service life.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems and provides a high-reliability LED filament structure.
In order to achieve the purpose, the utility model provides a high-reliability LED filament structure which comprises a substrate, an LED chip and a metal terminal, wherein the LED chip and the metal terminal are fixed on the substrate, a wiring platform is arranged between the LED chip and the metal terminal, the height of the metal terminal is higher than that of the wiring platform, the height of the wiring platform is higher than that of the LED chip, the LED chip is connected with a first wire, the other end of the first wire is connected to the wiring platform, the metal terminal is connected with at least one second wire, and the other end of the second wire is connected to the wiring platform and is connected with the first wire.
According to one aspect of the utility model, the height of the upper surface of the taping platform is located at 1/2 of the difference in height of the metal terminals and the LED chip.
According to an aspect of the utility model, the second wire is provided with two.
According to one aspect of the present invention, the metal terminal is fixedly bonded to the substrate.
Usually, the metal terminal and the substrate are fixed by glue and metal wrap angle, and the height difference between the metal terminal and the substrate is more than 300 um. At present, the thickness of a conventional LED chip is 120um-150um, so that the height difference between a metal terminal and the LED chip is about 150um, and the height of a wire arc needs to be increased when a wire is lapped, so that a gold wire at the position is easy to lose efficacy. Preferably, the height of the upper surface of the taping platform is located at 1/2 of the difference in height of the metal terminals and the LED chip. So set up, through increasing the platform of taking a percentage, can effectively reduce the line arc height of acting as go-between to strengthen product reliability greatly.
Drawings
FIG. 1 schematically shows a diagram of a high reliability LED filament structure according to one embodiment of the present invention;
fig. 2 schematically shows a side view of a high reliability LED filament structure according to an embodiment of the present invention.
The reference numerals in the drawings represent the following meanings:
1. a substrate; 2. an LED chip; 3. a metal terminal; 4. a wiring platform; 5. a first wire rod; 6. a second wire.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the utility model, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
The present invention is described in detail below with reference to the drawings and the specific embodiments, which are not repeated herein, but the embodiments of the present invention are not limited to the following embodiments.
As shown in fig. 1, the utility model provides a high-reliability LED filament structure, which includes a substrate 1, and an LED chip 2 and a metal terminal 3 fixed on the substrate 1, wherein the metal terminal 3 is fixedly bonded to the substrate 1. LED chip 2 with be equipped with between the metal terminal 3 and take a business turn over line platform 4, the height of metal terminal 3 is higher than take a business turn over line platform 4's height, take a business turn over line platform 4's height is higher than LED chip 2's height, be connected with first wire rod 5 on the LED chip 2, the other end of first wire rod 5 is connected to take a business turn over line platform 4 is last, be connected with a second wire rod 6 on the metal terminal 3 at least, the other end of second wire rod 6 is connected to take a business turn over line platform 4 on with first wire rod 5 is connected.
Usually, the metal terminal 3 and the substrate 1 are fixed by glue and metal wrap angle, and the height difference between the metal terminal 3 and the substrate 1 is more than 300 um. At present, the thickness of the conventional LED chip 2 is 120um-150um, so that the height difference between the metal terminal 3 and the LED chip 2 is about 150um, and the wire arc height needs to be increased during wire lapping, so that a gold wire at the position is easy to lose efficacy. Preferably, the height of the upper surface of the bonding pad 4 is located at 1/2 of the height difference between the metal terminal 3 and the LED chip 2. According to the LED filament structure, the height of the wire arc stay wire can be effectively reduced by adding the wiring platform 4, so that the reliability of a product is greatly enhanced.
According to one embodiment of the utility model, two second wires 6 are provided. This can improve the stability of connection of the LED chip 2 to the metal terminals 3. In addition, at least two wires from the wiring platform 4 to the metal terminal 3 adopt different wire welding modes, so that the stress at the metal terminal can be effectively buffered, and the reliability is greatly improved.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, and it is apparent to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides a high reliability LED filament structure, its characterized in that includes base plate (1) and fixes LED chip (2) and metal terminal (3) on base plate (1), LED chip (2) with be equipped with between metal terminal (3) and take line platform (4), the height of metal terminal (3) is higher than take the height of line platform (4), take the height of line platform (4) to be higher than the height of LED chip (2), be connected with first wire rod (5) on LED chip (2), the other end of first wire rod (5) is connected to on taking line platform (4), be connected with one second wire rod (6) on metal terminal (3) at least, the other end of second wire rod (6) is connected to take on line platform (4) with first wire rod (5) are connected.
2. The high reliability LED filament structure according to claim 1, wherein the height of the upper surface of the tap platform (4) is located at 1/2 of the height difference between the metal terminal (3) and the LED chip (2).
3. The high reliability LED filament structure according to claim 2, wherein the second wire (6) is provided in two.
4. The high-reliability LED filament structure according to claim 1, wherein the metal terminal (3) is fixedly connected with the substrate (1) in an adhesion manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123135391.2U CN215731705U (en) | 2021-12-15 | 2021-12-15 | High-reliability LED lamp filament structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123135391.2U CN215731705U (en) | 2021-12-15 | 2021-12-15 | High-reliability LED lamp filament structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215731705U true CN215731705U (en) | 2022-02-01 |
Family
ID=80028243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123135391.2U Active CN215731705U (en) | 2021-12-15 | 2021-12-15 | High-reliability LED lamp filament structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215731705U (en) |
-
2021
- 2021-12-15 CN CN202123135391.2U patent/CN215731705U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20231211 Granted publication date: 20220201 |
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| PP01 | Preservation of patent right |