CN107842719A - A kind of COB packaged light sources and preparation method thereof - Google Patents
A kind of COB packaged light sources and preparation method thereof Download PDFInfo
- Publication number
- CN107842719A CN107842719A CN201711144567.6A CN201711144567A CN107842719A CN 107842719 A CN107842719 A CN 107842719A CN 201711144567 A CN201711144567 A CN 201711144567A CN 107842719 A CN107842719 A CN 107842719A
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit
- buttock line
- series
- negative pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a kind of COB packaged light sources and preparation method, the COB packaged light sources include substrate, box dam and insulating barrier, the chip fixed area and circuit for fixed chip are provided with the substrate, the circuit is arranged on around the chip fixed area, the chip is fixed on the chip fixed area, it is connected in series between chip, the positive pole buttock line being together in series and the negative pole buttock line being together in series are connected with the circuit, the box dam is covered on the circuit, and fluorescent glue is set inside the box dam.COB packaged light sources provided by the invention, gold thread is not easy to break, improves the service life and stability of the LED of encapsulation.
Description
Technical field
The present invention relates to a kind of COB packaged light sources and preparation method thereof, belong to LED technology field.
Background technology
All it was to use the encapsulating structure as 100W COB packaged light sources in the past in COB packaged light sources, therefore
It is distant between the chip in encapsulating structure, connection adjacent chips when producing the high-power COB packaged light sources within 50W
Wire draws long, and in use, wire easily is caused to break by the extruding of the extraneous stress such as glue, influences LED
Service life and stability, even more cause the high-powered LED lamp within 50W can not normal use.
In addition, generally, COB substrates are a kind of sandwich constructions, and during COB manufacture crafts, longer gold thread
The reliability of COB packaged light sources can be reduced, because COB packaged light sources product is in use, due to expanding with heat and contract with cold for colloid,
It is easier to break gold thread.
The content of the invention
Deficiency, one aspect of the present invention technical problems to be solved are to provide a kind of COB packaged light sources based on more than, and gold thread is not
Easy fracture, improve the service life and stability of the LED of encapsulation.
In order to solve the above technical problems, present invention employs following technical scheme：
A kind of COB packaged light sources, including substrate, box dam and insulating barrier, it is provided with for fixed chip on the substrate
Chip fixed area and circuit, the circuit are arranged on around the chip fixed area, and the chip is fixed on the chip and fixed
Area, it is connected in series between chip, the positive pole buttock line being together in series and the negative pole buttock line being together in series are connected with the circuit, institute
State box dam to be covered on the circuit, fluorescent glue is set inside the box dam.
Be provided with the substrate for fix positive pole buttock line positive pole weld zone, for fix negative pole buttock line negative pole weld
Area is met, the positive pole buttock line being together in series is fixed on positive pole weld zone, and the negative pole buttock line being together in series is fixed on negative pole weld zone, institute
State and connected between positive pole weld zone, negative pole weld zone and circuit by gold thread.
The circuit is inclined-plane close to chip fixed area side, and the positive pole buttock line being together in series is fixed on circuit close to chip
On the inclined-plane of positive pole side, the negative pole buttock line being together in series is fixed on circuit on the inclined-plane of chip negative pole side.
It is fixed with the chip fixed area and is conductively connected block, the positive pole buttock line being together in series and the negative pole being together in series
Buttock line, which is fixed on, to be conductively connected on block, and the block that is conductively connected electrically connects with the circuit.
The block that is conductively connected is fixed on chip fixed area by crystal-bonding adhesive.
The block that is conductively connected is connected with the circuit by elargol.
Insulating barrier is set around the circuit；And/or；Insulating barrier is set between the circuit and the substrate.
The chip is divided into some column distributions on the chip fixed area, is connected in series between each column chip.
Using above technical scheme, the present invention achieves following technique effect：
(1) COB packaged light sources provided by the invention, chip are connected by gold thread, and circuit is arranged on around chip fixed area,
The buttock line of series connection is connected with circuit, compact-sized, it is not easy to is caused to break, is improved the service life of the LED of encapsulation and steady
It is qualitative.
(2) positive pole weld zone is set between positive pole buttock line and circuit, then by gold thread by positive pole buttock line and positive pole weld zone
And positive pole weld zone is connected with circuit；Negative pole weld zone is set between negative pole buttock line and circuit, then by gold thread by negative pole tail
Line is connected with negative pole weld zone and negative pole weld zone with circuit；The length of gold thread is reduced, reduces the probability of broken string；
(3) circuit is arranged to inclined-plane close to the side of chip fixed area, then positive pole buttock line and negative pole buttock line are fixed on tiltedly
On face, reduce the height that buttock line is connected to circuit；Reduce the probability of broken string；
(4) buttock line and circuit are connected by being conductively connected block, avoids being easily broken off using gold thread.
Another aspect of the present invention technical problems to be solved are to provide a kind of preparation method of COB packaged light sources, using this
The COB packaged light sources that kind method makes, gold thread is not easy to break, improves the service life and stability of the LED of encapsulation.
In order to solve the above technical problems, present invention employs following technical scheme：
A kind of preparation method of COB packaged light sources, comprises the following steps：
(1) chip fixed area is set on substrate, insulating barrier is set around chip fixed area；
(2) layers of copper is set on the insulating layer, is etched into circuit；
(3) LED chip is arranged at the chip fixed area, each chip-in series linked together by gold thread, will
The positive pole buttock line being together in series and the negative pole buttock line being together in series are connected with the circuit respectively；
(4) dispensing forms box dam above circuit layer；
(5) setting fluorescent glue encapsulation in glue dam is being enclosed.
The step (3) comprises the following steps：
(31) positive pole buttock line wire welding area, negative pole buttock line bonding wire are set on the insulating barrier close to the edge of chip fixed area
Area；
(32) LED chip is arranged at the chip fixed area, each chip linked together by gold thread, by positive pole
Buttock line is fixed on positive pole buttock line weld zone, and negative pole buttock line is fixed on into negative pole buttock line weld zone；
(33) positive pole buttock line weld zone and circuit and negative pole buttock line wire welding area and circuit are connected respectively with gold thread.
Using above technical scheme, the present invention achieves following technique effect：
The preparation method of COB packaged light sources provided by the invention, solve COB packaged light sources and easily break the asking of dead lamp
Topic, improve the service life and stability of the LED of encapsulation.
Brief description of the drawings
Fig. 1 is the top view of the first embodiment of COB packaged light sources of the present invention；
Fig. 2 is sectional view at A-A shown in Fig. 1；
Fig. 3 is the top view of second of embodiment of COB packaged light sources of the present invention；
Fig. 4 is sectional view at B-B shown in Fig. 3；
Fig. 5 is the top view of the third embodiment of COB packaged light sources of the present invention；
Fig. 6 is sectional view at C-C shown in Fig. 5.
Embodiment
Embodiment 1
As depicted in figs. 1 and 2, COB packaged light sources provided by the invention, including substrate 1, box dam 2 and insulating barrier 3, it is described
The chip fixed area and circuit 4 for fixed chip 5 are provided with substrate 1, the circuit 4 is arranged on the chip fixed area week
Enclose, the chip 5 is fixed on the chip fixed area, is connected in series between chip 5, the positive pole buttock line being together in series and series connection
The negative pole buttock line to get up is connected with the circuit 4, and box dam 2 is covered on the circuit 4, and the inside of box dam 2 sets fluorescent glue 6.
Specifically, substrate 1 is aluminium base 1, insulating barrier 3 is set on substrate 1, circuit 4 is set on the insulating layer 3.In electricity
Insulating barrier 3 is also provided with around road 4, prevents the too exposure of circuit 4 in atmosphere.It is provided with substrate 1 for fixing positive pole tail
The positive pole weld zone 11 of line, the negative pole weld zone for fixing negative pole buttock line 12.In positive pole wire welding area 11, the and of negative pole wire welding area 12
Also insulating barrier 3 is covered between the gap of circuit 4.Chip 5 is divided into some column distributions on chip fixed area, between each column chip 5
It is connected in series.The positive pole buttock line being together in series is fixed on positive pole weld zone 11, and the negative pole buttock line being together in series is fixed on negative pole weldering
Area 12 is met, is welded between positive pole weld zone 11 and circuit 4 and by gold thread and connected respectively between negative pole weld zone 12 and circuit 4
Connect, play a part of turning on circuit, gold thread can be set more, improve the reliability of whole device.
It can arrange chip 5 using this structure more close, greatly shorten gold thread wire length so that wire length has more
More operability, caused by can effectively avoiding gold thread length excessive the problem of bonding wire poor reliability, so as to reduce production
Cost, the reliability for improving COB packaged light sources.
Embodiment 2
The present embodiment differs only in embodiment 1, the positive pole buttock line being together in series and the negative pole tail being together in series
Line is different from the structure that circuit 4 connects.In the present embodiment, circuit 4 is inclined-plane 41 close to chip fixed area side, is together in series
Positive pole buttock line is fixed on circuit 4 on the inclined-plane 41 of the positive pole side of chip 5, and the negative pole buttock line being together in series is fixed on circuit 4
On the inclined-plane 41 of the negative pole side of chip 5.
Embodiment 3
The present embodiment differs only in embodiment 1, the positive pole buttock line being together in series and the negative pole tail being together in series
Line is different from the attachment structure of circuit 4.In the present embodiment, chip fixed area, which is fixed with, is conductively connected block 7, in the present embodiment,
It is aluminium block to be conductively connected block 7, is conductively connected block 7 and is fixed on chip fixed area by crystal-bonding adhesive.The positive pole buttock line being together in series with
And the negative pole buttock line being together in series is fixed on and is conductively connected on block, it is conductively connected block and is electrically connected with the circuit 4 by elargol.
Present invention also offers a kind of preparation method of COB packaged light sources, its obtained COB packaged light source as shown in figure 1,
Shown method mainly includes the following steps that：
(1) chip fixed area is set on substrate 1, insulating barrier 3 is set around chip fixed area；
(2) layers of copper is set on the insulating layer 3, is etched into circuit 4；
(3) LED chip 5 is arranged at the chip fixed area, each chip 5 is connected in series by gold thread,
The positive pole buttock line being together in series and the negative pole buttock line being together in series are connected with the circuit 4；Specifically include：
(31) positive pole buttock line wire welding area 11, the weldering of negative pole buttock line are set on the insulating barrier close to the edge of chip fixed area
Line area 12；
(32) LED chip 5 is arranged at the chip fixed area, each chip 5 linked together by gold thread, will just
Pole buttock line is fixed on positive pole buttock line weld zone 11, and negative pole buttock line is fixed on into negative pole buttock line weld zone 12；
(33) positive pole buttock line weld zone 11 and circuit 4 and negative pole buttock line wire welding area 12 and circuit 4 are connected respectively with gold thread
Connect；
(4) dispensing forms box dam 2 above circuit 4；
(5) fluorescent glue 6 is set to encapsulate in box dam 2.
Using above-mentioned preparation method, solve the problems, such as that COB packaged light sources easily break dead lamp, improve the LED of encapsulation
The service life and stability of lamp.
Finally it should be noted that：The preferred embodiments of the present invention are these are only, are not intended to limit the invention, although
The present invention is described in detail with reference to embodiment, for those skilled in the art, it still can be to foregoing
Technical scheme described in each embodiment is modified, or to which part technical characteristic carry out equivalent substitution, but it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements made etc., the protection of the present invention should be included in
Within the scope of.
Claims (10)
- A kind of 1. COB packaged light sources, it is characterised in that：Including substrate, box dam and insulating barrier, it is provided with the substrate for solid Determine the chip fixed area and circuit of chip, the circuit is arranged on around the chip fixed area, and the chip is fixed on described Chip fixed area, it is connected in series between chip, the positive pole buttock line being together in series and the negative pole buttock line being together in series and the electricity Road is connected, and the box dam is covered on the circuit, and fluorescent glue is set inside the box dam.
- 2. COB packaged light sources according to claim 1, it is characterised in that：It is provided with the substrate for fixing positive pole The positive pole weld zone of buttock line, the negative pole weld zone for fixing negative pole buttock line, the positive pole buttock line being together in series are fixed on positive pole weldering Area is met, the negative pole buttock line being together in series is fixed on negative pole weld zone, leads between the positive pole weld zone, negative pole weld zone and circuit Cross gold thread connection.
- 3. COB packaged light sources according to claim 1, it is characterised in that：The circuit is close to chip fixed area side Inclined-plane, the positive pole buttock line being together in series are fixed on circuit on the inclined-plane of chip positive pole side, the negative pole buttock line being together in series Circuit is fixed on the inclined-plane of chip negative pole side.
- 4. COB packaged light sources according to claim 1, it is characterised in that：Conductive connect is fixed with the chip fixed area Block is connect, the positive pole buttock line being together in series and the negative pole buttock line being together in series are fixed on and be conductively connected on block, described to be conductively connected Block electrically connects with the circuit.
- 5. COB packaged light sources according to claim 4, it is characterised in that：The block that is conductively connected is fixed by crystal-bonding adhesive In chip fixed area.
- 6. COB packaged light sources according to claim 4, it is characterised in that：The block that is conductively connected passes through with the circuit Elargol connects.
- 7. COB packaged light sources according to claim 1, it is characterised in that：Insulating barrier is set around the circuit；With/ Or；Insulating barrier is set between the circuit and the substrate.
- 8. COB packaged light sources according to claim 1, it is characterised in that：The chip divides on the chip fixed area Into some column distributions, it is connected in series between each column chip.
- A kind of 9. preparation method of COB packaged light sources, it is characterised in that：Comprise the following steps：(1) chip fixed area is set on substrate, insulating barrier is set around chip fixed area；(2) layers of copper is set on the insulating layer, is etched into circuit；(3) LED chip is arranged at the chip fixed area, each chip-in series is linked together by gold thread, will be connected The positive pole buttock line to get up and the negative pole buttock line being together in series are connected with the circuit respectively；(4) dispensing forms box dam above circuit layer；(5) setting fluorescent glue encapsulation in glue dam is being enclosed.
- 10. the preparation method of COB packaged light sources according to claim 9, it is characterised in that：The step (3) include with Lower step：(31) positive pole buttock line wire welding area, negative pole buttock line wire welding area are set on the insulating barrier close to the edge of chip fixed area；(32) LED chip is arranged at the chip fixed area, each chip linked together by gold thread, by positive pole buttock line Positive pole buttock line weld zone is fixed on, negative pole buttock line is fixed on negative pole buttock line weld zone；(33) positive pole buttock line weld zone and circuit and negative pole buttock line wire welding area and circuit are connected respectively with gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711144567.6A CN107842719A (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711144567.6A CN107842719A (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107842719A true CN107842719A (en) | 2018-03-27 |
Family
ID=61679048
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711144567.6A Pending CN107842719A (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107842719A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344726A (en) * | 2023-03-28 | 2023-06-27 | 安徽中益新材料科技股份有限公司 | Long-life road lighting lamp capable of improving visual distance of eyes and production process thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201779499U (en) * | 2010-08-11 | 2011-03-30 | 兴通工业股份有限公司 | Luminous module |
| CN202452143U (en) * | 2011-09-30 | 2012-09-26 | 深圳市格天光电有限公司 | 15-string and eight-parallel-branch light emitting diode (LED) chip integrated surface light source |
| CN205480223U (en) * | 2015-12-31 | 2016-08-17 | 深圳市恒达光电子科技有限公司 | High stable pottery COB encapsulation LED lamp |
| CN107039411A (en) * | 2017-05-09 | 2017-08-11 | 易美芯光（北京）科技有限公司 | The white light LEDs COB encapsulated using CSP chips and blue LED flip chip structure and preparation method |
| CN207584398U (en) * | 2017-11-17 | 2018-07-06 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources |
-
2017
- 2017-11-17 CN CN201711144567.6A patent/CN107842719A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201779499U (en) * | 2010-08-11 | 2011-03-30 | 兴通工业股份有限公司 | Luminous module |
| CN202452143U (en) * | 2011-09-30 | 2012-09-26 | 深圳市格天光电有限公司 | 15-string and eight-parallel-branch light emitting diode (LED) chip integrated surface light source |
| CN205480223U (en) * | 2015-12-31 | 2016-08-17 | 深圳市恒达光电子科技有限公司 | High stable pottery COB encapsulation LED lamp |
| CN107039411A (en) * | 2017-05-09 | 2017-08-11 | 易美芯光（北京）科技有限公司 | The white light LEDs COB encapsulated using CSP chips and blue LED flip chip structure and preparation method |
| CN207584398U (en) * | 2017-11-17 | 2018-07-06 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116344726A (en) * | 2023-03-28 | 2023-06-27 | 安徽中益新材料科技股份有限公司 | Long-life road lighting lamp capable of improving visual distance of eyes and production process thereof |
| CN116344726B (en) * | 2023-03-28 | 2024-01-19 | 安徽中益新材料科技股份有限公司 | Long-life road lighting lamp capable of improving visual distance of eyes and production process thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101035335B1 (en) | Light Emitting Diode Package | |
| CN102691921A (en) | Light-emitting diode light bar and method for manufacturing same | |
| US20160276318A1 (en) | Package of LED Chip and Manufacturing Method Thereof | |
| US20130214310A1 (en) | Semiconductor package and fabrication method thereof | |
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| WO2021027415A1 (en) | Led backlight module and display device | |
| CN207584398U (en) | A kind of COB packaged light sources | |
| CN107842719A (en) | A kind of COB packaged light sources and preparation method thereof | |
| CN112242473A (en) | LED filament light source, manufacturing method thereof and lamp | |
| CN101814574A (en) | Light emitting diode base plate heat radiation structure and manufacture method thereof | |
| US20080042157A1 (en) | Surface mount light emitting diode package | |
| JP4250171B2 (en) | Ceramic package for light emitting device | |
| CN103606545B (en) | LED flexible board light source module and manufacturing method thereof | |
| CN106871078A (en) | A kind of integrated substrates of surface-adhered type RGB LED and its manufacture method | |
| CN202268386U (en) | LED (Light Emitting Diode) packaging structure | |
| CN206340574U (en) | A kind of QFN surface-adhered types RGB LED package supports | |
| WO2016058370A1 (en) | Method for designing moisture-proof structure of led smd holder | |
| CN102544342B (en) | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof | |
| CN206163520U (en) | LED packaging bracket and LED luminous body | |
| CN103280510A (en) | LED (light-emitting diode) packaging structure and packaging method thereof | |
| CN219435896U (en) | LED bulb lighting chip structure | |
| CN216719946U (en) | Double-layer wiring front-mounted LED lamp | |
| CN212571030U (en) | Novel middle-high power LED support with small size and capable of fixing RGB three crystals | |
| CN217655878U (en) | LED lamp bead and LED lamp strip | |
| CN215342578U (en) | COB packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 511458 33 Nansha District City Road South, Nansha District, Guangzhou, Guangdong Applicant after: GUANGDONG APT ELECTRONICS LTD. Address before: 511458 No. 33, South Ring Road, Nansha District, Guangzhou, Guangdong. Applicant before: GUANGDONG APT ELECTRONICS LTD. |