CN207584398U - A kind of COB packaged light sources - Google Patents
A kind of COB packaged light sources Download PDFInfo
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- CN207584398U CN207584398U CN201721548903.9U CN201721548903U CN207584398U CN 207584398 U CN207584398 U CN 207584398U CN 201721548903 U CN201721548903 U CN 201721548903U CN 207584398 U CN207584398 U CN 207584398U
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Abstract
The utility model provides a kind of COB packaged light sources, including substrate, box dam and insulating layer, the chip fixed area and circuit for fixed chip are provided on the substrate, the circuit is arranged on around the chip fixed area, the chip is fixed on the chip fixed area, is connected in series between chip, and the anode buttock line being together in series and the cathode buttock line being together in series are connect with the circuit, the box dam is covered on the circuit, setting fluorescent glue inside the box dam.COB packaged light sources provided by the utility model, gold thread is not easy to break, improves the service life and stability of the LED light of encapsulation.
Description
Technical field
The utility model is related to a kind of COB packaged light sources, belong to LED technology field.
Background technology
All it was the encapsulating structure used as the COB packaged light sources of 100W in the past in COB packaged light sources, therefore
It is distant between the chip in encapsulating structure, connection adjacent chips when producing the high-power COB packaged light sources within 50W
Conducting wire draws long, and in use, conducting wire easily is caused to break by the extruding of the extraneous stress such as glue, influences LED
Service life and stability, even more cause the high-powered LED lamp within 50W can not normal use.
In addition, under normal circumstances, COB substrates are a kind of multilayered structures, and during COB manufacture crafts, longer gold thread
The reliability of COB packaged light sources can be reduced, because COB packaged light sources product is in use, due to expanding with heat and contract with cold for colloid,
It is easier to break gold thread.
Utility model content
Based on above deficiency, the utility model one side technical problems to be solved are to provide a kind of COB packaged light sources, gold
Line is not easy to break, improves the service life and stability of the LED light of encapsulation.
In order to solve the above technical problems, the utility model employs following technical scheme：
A kind of COB packaged light sources including substrate, box dam and insulating layer, are provided on the substrate for fixed chip
Chip fixed area and circuit, the circuit are arranged on around the chip fixed area, and the chip is fixed on the chip and fixes
Area is connected in series between chip, and the anode buttock line being together in series and the cathode buttock line being together in series are connect with the circuit, institute
It states box dam to be covered on the circuit, setting fluorescent glue inside the box dam.
It is provided with to fix the anode welding section of anode buttock line, weld for fixing the cathode of cathode buttock line on the substrate
Area is met, the anode buttock line being together in series is fixed on anode welding section, and the cathode buttock line being together in series is fixed on cathode welding section, institute
It states and is connected between anode welding section, cathode welding section and circuit by gold thread.
The circuit is inclined-plane close to chip fixed area side, and the anode buttock line being together in series is fixed on circuit close to chip
On the inclined-plane of anode side, the cathode buttock line being together in series is fixed on circuit on the inclined-plane of chip cathode side.
It is fixed in the chip fixed area and is conductively connected block, the anode buttock line being together in series and the cathode being together in series
Buttock line, which is fixed on, to be conductively connected on block, and the block that is conductively connected is electrically connected with the circuit.
The block that is conductively connected is fixed on chip fixed area by crystal-bonding adhesive.
The block that is conductively connected is connect with the circuit by elargol.
Insulating layer is set around the circuit；And/or；Insulating layer is set between the circuit and the substrate.
The chip is divided into several column distributions on the chip fixed area, is connected in series between each column chip.
Using above technical scheme, the utility model achieves following technique effect：
(1) COB packaged light sources provided by the utility model, chip are connected by gold thread, and circuit is arranged on chip fixed area
Around, the buttock line of series connection is connect with circuit, compact-sized, it is not easy to be caused to break, be improved the service life of the LED light of encapsulation
And stability.
(2) anode welding section is set between anode buttock line and circuit, then by gold thread by anode buttock line and anode welding section
And anode welding section is connect with circuit；Cathode welding section is set between cathode buttock line and circuit, then by gold thread by cathode tail
Line is connect with cathode welding section and cathode welding section with circuit；The length of gold thread is reduced, reduces the probability of broken string；
(3) circuit is set as inclined-plane close to the side of chip fixed area, then anode buttock line and cathode buttock line are fixed on tiltedly
On face, reduce the height that buttock line is connected to circuit；Reduce the probability of broken string；
(4) buttock line and circuit are connected by being conductively connected block, avoids being easily broken off using gold thread.
Description of the drawings
Fig. 1 is the vertical view of the first embodiment of the utility model COB packaged light sources；
Fig. 2 is sectional view at A-A shown in Fig. 1；
Fig. 3 is the vertical view of second of embodiment of the utility model COB packaged light sources；
Fig. 4 is sectional view at B-B shown in Fig. 3；
Fig. 5 is the vertical view of the third embodiment of the utility model COB packaged light sources；
Fig. 6 is sectional view at C-C shown in Fig. 5.
Specific embodiment
Embodiment 1
As depicted in figs. 1 and 2, COB packaged light sources provided by the utility model, including substrate 1, box dam 2 and insulating layer 3,
It is provided on the substrate 1 for the chip fixed area of fixed chip 5 and circuit 4, the circuit 4 is arranged on the chip and fixes
Around area, the chip 5 is fixed on the chip fixed area, is connected in series between chip 5, the anode buttock line that is together in series and
The cathode buttock line being together in series is connect with the circuit 4, and box dam 2 is covered on the circuit 4,2 inside setting fluorescent glue of box dam
6。
Specifically, substrate 1 is aluminum substrate 1, insulating layer 3 is set on substrate 1, circuit 4 is set on the insulating layer 3.In electricity
Insulating layer 3 is also provided with around road 4, prevents the excessively exposure of circuit 4 in air.It is provided with to fix anode tail on substrate 1
The anode welding section 11 of line, the cathode welding section for fixing cathode buttock line 12.In anode wire welding area 11,12 and of cathode wire welding area
Also insulating layer 3 is covered between the gap of circuit 4.Chip 5 is divided into several column distributions on chip fixed area, between each column chip 5
It is connected in series with.The anode buttock line being together in series is fixed on anode welding section 11, and the cathode buttock line being together in series is fixed on cathode weldering
Area 12 is met, is welded between anode welding section 11 and circuit 4 and by gold thread and connected respectively between cathode welding section 12 and circuit 4
It connects, plays the role of that circuit is connected, gold thread can set more, improve the reliability of entire device.
It can arrange chip 5 using this structure more close, greatly shorten gold thread wire length so that wire length has more
More operability, can effectively avoid gold thread length it is excessive caused by bonding wire poor reliability the problem of, so as to reduce production
Cost, the reliability for improving COB packaged light sources.
Embodiment 2
The present embodiment is differed only in embodiment 1, the anode buttock line being together in series and the cathode tail being together in series
Line is different from the structure that circuit 4 connects.In the present embodiment, circuit 4 is inclined-plane 41 close to chip fixed area side, is together in series
Anode buttock line is fixed on circuit 4 on the inclined-plane 41 of 5 anode side of chip, and the cathode buttock line being together in series is fixed on circuit 4
On the inclined-plane 41 of 5 cathode side of chip.
Embodiment 3
The present embodiment is differed only in embodiment 1, the anode buttock line being together in series and the cathode tail being together in series
Line is different from 4 connection structure of circuit.In the present embodiment, chip fixed area, which is fixed with, is conductively connected block 7, in the present embodiment,
Block 7 is conductively connected as aluminium block, block 7 is conductively connected and chip fixed area is fixed on by crystal-bonding adhesive.The anode buttock line being together in series with
And the cathode buttock line being together in series is fixed on and is conductively connected on block, is conductively connected block and is electrically connected with the circuit 4 by elargol.
The utility model additionally provides a kind of packaging method of COB packaged light sources, COB packaged light sources such as Fig. 1 obtained
Shown, shown method mainly includes the following steps that：
(1) chip fixed area is set on substrate 1, insulating layer 3 is set around chip fixed area；
(2) layers of copper is set on the insulating layer 3, is etched into circuit 4；
(3) LED chip 5 is set to the chip fixed area, each chip 5 is connected in series by gold thread,
The anode buttock line being together in series and the cathode buttock line being together in series are connect with the circuit 4；It specifically includes：
(31) setting anode buttock line wire welding area 11, the weldering of cathode buttock line on the insulating layer close to the edge of chip fixed area
Line area 12；
(32) LED chip 5 is set to the chip fixed area, each chip 5 is linked together by gold thread, it will just
Pole buttock line is fixed on anode buttock line welding section 11, and cathode buttock line is fixed on cathode buttock line welding section 12；
(33) anode buttock line welding section 11 and circuit 4 and cathode buttock line wire welding area 12 and circuit 4 are connected respectively with gold thread
It connects；
(4) dispensing forms box dam 2 above circuit 4；
(5) setting fluorescent glue 6 encapsulates in box dam 2.
Using above-mentioned production method, solve the problems, such as that COB packaged light sources easily break dead lamp, improve the LED of encapsulation
The service life and stability of lamp.
Finally it should be noted that：It these are only the preferred embodiment of the utility model, be not limited to this practicality
It is novel, although the utility model is described in detail with reference to embodiment, for those skilled in the art, according to
So it can modify to the technical solution recorded in foregoing embodiments or which part technical characteristic is equally replaced
It changes, but within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all include
It is within the protection scope of the utility model.
Claims (8)
1. a kind of COB packaged light sources, it is characterised in that：Including substrate, box dam and insulating layer, it is provided on the substrate for solid
Determine the chip fixed area and circuit of chip, the circuit is arranged on around the chip fixed area, and the chip is fixed on described
Chip fixed area is connected in series between chip, the anode buttock line being together in series and the cathode buttock line being together in series and the electricity
Road connects, and the box dam is covered on the circuit, setting fluorescent glue inside the box dam.
2. COB packaged light sources according to claim 1, it is characterised in that：It is provided with to fix anode on the substrate
The anode welding section of buttock line, the cathode welding section for fixing cathode buttock line, the anode buttock line being together in series are fixed on anode weldering
Area is met, the cathode buttock line being together in series is fixed on cathode welding section, leads between the anode welding section, cathode welding section and circuit
Cross gold thread connection.
3. COB packaged light sources according to claim 1, it is characterised in that：The circuit is close to chip fixed area side
Inclined-plane, the anode buttock line being together in series are fixed on circuit on the inclined-plane of chip anode side, the cathode buttock line being together in series
Circuit is fixed on the inclined-plane of chip cathode side.
4. COB packaged light sources according to claim 1, it is characterised in that：Conductive connect is fixed in the chip fixed area
Block is connect, the anode buttock line being together in series and the cathode buttock line being together in series are fixed on and are conductively connected on block, described to be conductively connected
Block is electrically connected with the circuit.
5. COB packaged light sources according to claim 4, it is characterised in that：The block that is conductively connected is fixed by crystal-bonding adhesive
In chip fixed area.
6. COB packaged light sources according to claim 4, it is characterised in that：The block that is conductively connected passes through with the circuit
Elargol connects.
7. COB packaged light sources according to claim 1, it is characterised in that：Insulating layer is set around the circuit；With/
Or；Insulating layer is set between the circuit and the substrate.
8. COB packaged light sources according to claim 1, it is characterised in that：The chip divides on the chip fixed area
Into several column distributions, it is connected in series between each column chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721548903.9U CN207584398U (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721548903.9U CN207584398U (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207584398U true CN207584398U (en) | 2018-07-06 |
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ID=62732204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721548903.9U Active CN207584398U (en) | 2017-11-17 | 2017-11-17 | A kind of COB packaged light sources |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207584398U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107842719A (en) * | 2017-11-17 | 2018-03-27 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources and preparation method thereof |
-
2017
- 2017-11-17 CN CN201721548903.9U patent/CN207584398U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107842719A (en) * | 2017-11-17 | 2018-03-27 | 广东晶科电子股份有限公司 | A kind of COB packaged light sources and preparation method thereof |
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