CN201779499U - Lighting module - Google Patents

Abstract

The utility model relates to a light-emitting module, which comprises a circuit layer, an insulating layer, a heat-conducting substrate, a plurality of light-emitting diode chips and at least one euphotic layer; the circuit layer is provided with at least one through hole which penetrates through the upper part and the lower part, and a circuit is arranged in the circuit layer; the insulating layer is combined on one side surface of the circuit layer, and a plurality of through holes which penetrate through the upper part and the lower part are arranged corresponding to each through hole; the heat conducting substrate is made of good heat conducting materials and is combined on one side surface of the insulating layer, which is different from the circuit layer, and a plurality of lugs are integrally formed on the heat conducting substrate and respectively protrude into the through holes from the through holes; the plurality of light emitting diode chips are respectively arranged on one side surface of the plurality of bumps exposed in the through holes and are respectively electrically connected with the circuits in the circuit layer; the transparent layer fills the through hole and can uniformly project the light of the plurality of LED chips to the outside. The light emitting module of the present invention has the function of rapidly guiding out the heat generated by the light emitting diode chip to ensure the efficiency and the service life of the light emitting diode chip.

Description

Lighting module

technical field

The utility model relates to the technical field of a light-emitting module (module) that utilizes a light-emitting diode chip to generate bright light, in particular to a device that can quickly export the heat generated by the light-emitting diode chip to ensure the performance and use of the light-emitting diode chip. long-life light-emitting modules.

Background technique

Generally, a light-emitting module using a light-emitting diode chip (light-emitting diode chip) as a light source will relatively generate high-temperature heat while the light-emitting diode generates photoelectric effect. However, conventional light-emitting modules are mainly formed by directly electrically connecting a plurality of light-emitting diode chips on a circuit board, and then attaching the circuit board to a heat sink. Therefore, the high-temperature heat generated by the light-emitting diode chip can only be conducted from the bottom of itself to the radiator through the circuit board in sequence. However, the heat conduction efficiency of the circuit board is very poor, so the overall heat dissipation efficiency is extremely poor and the heat dissipation speed is extremely slow. Therefore, when the conventional light-emitting module is used for a long time, the temperature is likely to be too high, which seriously affects the lighting performance, and then causes the effect of light failure or rapid aging, and greatly reduces the service life.

At present, there is also a light-emitting module, the structure of which is shown in Taiwan Patent No. M339772, but its heat conduction efficiency is also poor, so the overall heat dissipation efficiency is still not good, and its lighting effect is also poor.

It can be seen that the above-mentioned existing light-emitting modules obviously still have inconveniences and defects in structure and use, and need to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. urgent problem to be solved. Therefore, how to create a light-emitting module with a new structure is one of the current important research and development topics, and it has also become a goal that the industry needs to improve.

Utility model content

The main purpose of the utility model is to overcome the defects of the existing light-emitting modules and provide a light-emitting module with a new structure. The technical problem to be solved is to quickly export the heat generated by the light-emitting diode chip to ensure that the light-emitting diode chip performance and service life. Very practical.

The purpose of this utility model and its technical solution are to adopt the following technical solutions to achieve. The light-emitting module proposed according to the utility model includes a circuit layer, an insulating layer, a heat-conducting substrate, a plurality of light-emitting diode chips and at least one light-transmitting layer. Wherein, the circuit layer has at least one through hole through the top and bottom, and a circuit is provided in the circuit layer. The insulating layer is combined with one side of the circuit layer, and corresponding to each through hole, there are a plurality of through holes penetrating up and down. The heat-conducting substrate is made of good heat-conducting material, and is bonded to a side of the insulating layer different from the circuit layer. A plurality of bumps are integrally formed on the heat-conducting substrate, respectively protruding from the plurality of through holes to the through hole. middle. The plurality of light emitting diode chips are respectively arranged on one side surface of the plurality of bumps exposed in the through hole, and are respectively electrically connected with the circuit in the circuit layer. The light-transmitting layer fills the through hole on the circuit layer so that the light of the light-emitting diode chip can be evenly projected to the outside.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures. Preferably, the light-emitting module described in the present invention may further include a heat sink combined with a side of the heat conduction substrate different from the insulating layer, and the heat sink has a plurality of heat dissipation fins on a side different from the heat conduction substrate. Wherein, the radiator can be integrated with the heat conduction substrate, or can be detachably combined with the heat conduction substrate.

Preferably, in the light-emitting module described in the present utility model, the circuit has a plurality of conductive blocks exposed on the two opposite sides of the circuit layer, which can be used to feed positive and negative currents to control the plurality of light-emitting diodes The body chip glows brightly.

With the above technical solution, the light emitting module of the present invention has at least the following advantages and beneficial effects:

(1) Using multiple bumps can quickly conduct the heat of the light-emitting diode chip on it to the large-area heat-conducting substrate on the other side of the insulating layer, thereby achieving the purpose of rapidly dissipating heat from the light-emitting diode chip, To ensure that the performance and service life of the light emitting diode chip are improved.

(2) The heat dissipation efficiency of the light-emitting module is further improved by using a plurality of heat dissipation fins.

To sum up, the utility model can effectively improve the efficiency and service life of the LED chip. The utility model has remarkable progress in technology, and has obvious positive effects, and is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

Fig. 1 is a perspective view of the first embodiment of the present utility model.

Fig. 2 is a top view of the first embodiment of the present utility model.

FIG. 3 is a schematic cross-sectional view along line A-A of FIG. 2 .

FIG. 4 is a schematic cross-sectional view along line B-B of FIG. 2 .

Fig. 5 is the second embodiment of the present utility model.

Fig. 6 is the third embodiment of the present utility model.

Fig. 7 is the fourth embodiment of the present utility model.

Circuit layer 1 Via 10

Conductive block 11 first fixing hole 12

Tank 13 Insulation 2

Perforation 20 Second fixing hole 21

Thermally conductive substrate 3 bump 30

Groove 31 The third fixing hole 32

Light-emitting diode chip 4 Light-transmitting layer 5

Lens 6 Radiator 7

Radiating fins 70 screw holes 71

Fixing bolt 8

Detailed ways

In order to further explain the technical means and effects of the utility model to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and efficacy of the light-emitting module proposed according to the utility model will be described below in conjunction with the accompanying drawings and preferred embodiments. , as detailed below.

Please refer to Fig. 1-Fig. 4, which are the first embodiment of the light-emitting module described in the present utility model. It is pointed out that the light-emitting module includes a circuit layer 1 , an insulating layer 2 , a heat-conducting substrate 3 , a plurality of light-emitting diode chips 4 and at least one light-transmitting layer 5 . in:

The circuit layer 1 has at least one through hole 10 through the top and bottom, and has a circuit (not shown in the figure) in the circuit layer 1, and the circuit has a plurality of conductive blocks 11 exposed on two sides of the circuit layer 1. Positive and negative currents can be passed through relatively short sides.

The insulating layer 2 is bonded to the bottom surface of the circuit layer 1 , and the insulating layer 2 has a plurality of through holes 20 corresponding to each through hole 10 penetrating through the upper and lower sides. In the present utility model, the insulating layer 2 is a board.

The thermally conductive substrate 3 is made of a good thermally conductive material and is bonded to the bottom surface of the insulating layer 2 . A plurality of bumps 30 are integrally formed on the top surface of the thermally conductive substrate 3 , protruding from the plurality of through holes 20 to the through hole 10 respectively. middle. The top surface of each protrusion 30 is flush with the top surface of the insulating layer 2 and has a groove 31 , and the groove wall of the groove 31 forms an outwardly expanding slope. In the present invention, the thermally conductive substrate 3 can be a copper substrate or an aluminum substrate.

The plurality of LED chips 4 are respectively disposed in the grooves 31 of the plurality of bumps 30 , and are respectively electrically connected to the circuits in the circuit layer 1 . The plurality of LED chips 4 can be controlled to emit bright light by passing positive and negative currents through the plurality of conductive blocks 11 .

The at least one light-transmitting layer 5 fills up the through holes 10 on the circuit layer 1 one by one, and allows the light of the plurality of LED chips 4 to be evenly projected to the outside. In the present invention, fluorescent powder can be uniformly distributed in the light-transmitting layer 5 for more uniform transmission of light.

As can be seen in FIG. 4 , the hole wall of the through hole 10 forms at least one oblique refraction surface for refracting the light from the plurality of LED chips 4 to the outside of the transparent layer 5 .

Since the utility model can quickly conduct the heat generated by the plurality of light emitting diode chips 4 to the large-area heat-conducting substrate 3 on the bottom surface of the insulating layer 2 through the plurality of bumps 30, it is possible to use the plurality of light emitting diodes The heat of the chips 4 is quickly dissipated to ensure the efficiency of improving the efficiency and service life of the plurality of LED chips 4 .

Please refer to Fig. 5, which is the second embodiment of the present utility model, its structure is roughly the same as that of the first embodiment, the difference is that the second embodiment further includes a lens 6 covering the top surface of the circuit layer 1, Moreover, the outer surface of the lens 6 is in a convex arc shape for collecting the light from the plurality of LED chips 4 , so that the projected light is brighter.

Please refer to FIG. 6 , which is a third embodiment of the present invention, its structure is substantially the same as that of the second embodiment, the difference is that the third embodiment further includes a radiator 7 and a plurality of fixing bolts 8 . The heat sink 7 is combined with the plurality of fixing bolts 8 on the bottom surface of the heat conduction substrate 3 , and the bottom of the heat sink 7 has a plurality of heat dissipation fins 70 , the heat dissipation efficiency of the light emitting module can be further improved by the heat sink 7 . Wherein, the circuit layer 1 has a plurality of first fixing holes 12, the insulating layer 2 has a second fixing hole 21 corresponding to each of the first fixing holes 12, and the heat conducting substrate 3 has a corresponding to each second fixing hole 21. A third fixing hole 32 , the heat sink 7 has a screw hole 71 corresponding to each third fixing hole 32 . Each of the fixing bolts 8 can pass through the corresponding first fixing hole 12 , the second fixing hole 21 , and the third fixing hole 32 to be screwed into the screw hole 71 of the radiator 7 . The upper end of each first fixing hole 12 has a receiving groove 13 for receiving the head of the fixing bolt 8 .

Please refer to FIG. 7 , which is a fourth embodiment of the present invention, its structure is substantially the same as that of the third embodiment, the difference is that the heat conducting substrate 3 of the fourth embodiment is integrated with the heat sink 7 .

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments without departing from the technical solution of the present utility model. Content, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (10)

1. A light-emitting module, characterized in that it comprises: A circuit layer having at least one through hole through the top and bottom, and a circuit in the circuit layer; An insulating layer, combined on one side of the circuit layer, has a plurality of through holes through the upper and lower sides corresponding to each through hole; A thermally conductive substrate made of good thermally conductive material is combined on the side of the insulating layer different from the circuit layer, and a plurality of bumps are integrally formed on the thermally conductive substrate, respectively protruding from the plurality of through holes into the through hole ; A plurality of light emitting diode chips are respectively arranged on one side of the plurality of bumps exposed in the through hole, and are respectively electrically connected to the circuit in the circuit layer; and At least one light-transmitting layer for projecting light from the plurality of light-emitting diode chips out of the outer light-transmitting layer fills up the through holes on the circuit layer one by one. 2 . The light emitting module as claimed in claim 1 , wherein each bump has a groove on one side exposed in the through hole, and the light emitting diode chip is disposed in the groove. 3 . 3. The light-emitting module according to claim 2, wherein the groove wall of the groove forms an outwardly expanding slope. 4 . The light emitting module according to claim 3 , wherein phosphor powder uniformly distributed in the light-transmitting layer for uniform transmission of light. 5 . The light emitting module according to claim 3 , wherein the wall of the through hole forms at least one oblique refraction surface that refracts the light from the plurality of LED chips to the outside of the transparent layer. 5 . 6 . The light-emitting module according to claim 3 , further comprising a lens, which is combined on a side of the circuit layer different from the insulating layer, and the outer surface of the lens is convex. 7. The light-emitting module according to any one of claims 1 to 6, further comprising a heat sink, which is combined on the side of the heat-conducting substrate different from the insulating layer, and the heat sink is different from the side of the heat-conducting substrate One side has multiple cooling fins. 8. The lighting module according to claim 7, further comprising a plurality of fixing bolts, wherein the circuit layer has a plurality of first fixing holes, and the insulating layer has a second fixing hole corresponding to each first fixing hole holes, the heat conduction substrate has a third fixing hole corresponding to each second fixing hole, the heat sink has a screw hole corresponding to each third fixing hole, and each fixing bolt can pass through the corresponding first, The second and third fixing holes are screwed to the screw holes of the radiator. 9. The light-emitting module according to claim 7, wherein the heat-conducting substrate and the heat sink are integrated. 10. The light-emitting module according to any one of claims 1-6, wherein the circuit has a plurality of conductive blocks for passing in positive and negative currents to control the plurality of light-emitting diode chips to emit bright light. The circuit layer is near two opposite sides.

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