CN206432285U - Package structure for LED - Google Patents
Package structure for LED Download PDFInfo
- Publication number
- CN206432285U CN206432285U CN201621399852.3U CN201621399852U CN206432285U CN 206432285 U CN206432285 U CN 206432285U CN 201621399852 U CN201621399852 U CN 201621399852U CN 206432285 U CN206432285 U CN 206432285U
- Authority
- CN
- China
- Prior art keywords
- electrode
- wire
- straight line
- line section
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of package structure for LED, including a first electrode, second electrode, the light-emitting diode chip for backlight unit in first electrode, the first wire being electrically connected with respectively with first electrode and light-emitting diode chip for backlight unit, the second wire and packaging body being electrically connected with respectively with second electrode and light-emitting diode chip for backlight unit；Packaging body is by first electrode, second electrode, the first wire, the second wire, light emitting diode chip package；Second wire includes the middle straight line section that one end is electrically connected with the first straight line section of second electrode, the second straight line section of one end electric connection light-emitting diode chip for backlight unit and connection first straight line section and second straight line section.Package structure for LED of the present utility model is configured by the second wire to connection second electrode and light-emitting diode chip for backlight unit, make to be provided with least two obvious inflection points on the second wire, by bearing deformation on the second wire, pullling for direct butt welding point is avoided, the yields in manufacturing process is increased.
Description
Technical field
The utility model is related to a kind of semiconductor package, more particularly to a kind of encapsulating structure of light emitting diode.
Background technology
Compared to traditional light emitting source, light emitting diode (Light Emitting Diode, LED) has lightweight, body
The advantages of small, energy-conserving and environment-protective of product, high luminous efficiency, it extensively should more and more as a kind of new light emitting source
For indicating, showing, decorate, the field such as backlight, general lighting and urban landscape.
Existing package structure for LED generally includes first electrode, second electrode, the hair in first electrode
Luminous diode chip, the first wire being electrically connected with respectively with first electrode and light-emitting diode chip for backlight unit, respectively with second electrode
And the second wire and packaging body that light-emitting diode chip for backlight unit is electrically connected with；First wire and the second wire are arc line shaped knot
Structure.However, during actual fabrication, due to first electrode, second electrode, light-emitting diode chip for backlight unit respectively with the first wire and
Body encapsulation is packaged after the welding of second wire again, the carrying transmitting procedure after welding, before encapsulation easily produces vibrations, due to the
Two electrodes and first electrode are isolating construction, and the second wire of connecting luminous diode chip and second electrode is easy in vibrations
Middle pad is ripped, and causes open circuit, so that the light emitting diode after encapsulation is defective products.
Utility model content
Based on this, the utility model provides a kind of wire and welds good light-emitting diodes with electrode and light-emitting diode chip for backlight unit
Pipe encapsulating structure.
In order to realize the purpose of this utility model, the utility model uses following technical scheme：
A kind of package structure for LED, including a first electrode, second electrode, luminous two in first electrode
Pole pipe chip, the first wire being electrically connected with respectively with first electrode and light-emitting diode chip for backlight unit, respectively with second electrode and hair
The second wire and packaging body that luminous diode chip is electrically connected with；The packaging body by the first electrode, second electrode,
First wire, the second wire, light emitting diode chip package；Second wire includes one end and is electrically connected with the second electrode
First straight line section, one end be electrically connected with the second straight line section and connection first straight line section and the of the light-emitting diode chip for backlight unit
The middle straight line section of two straightways.
Package structure for LED of the present utility model passes through the to connection second electrode and light-emitting diode chip for backlight unit
Two wires are configured, and make to be provided with least two obvious inflection points on the second wire, so that the first electricity during vibrations
When pole and second electrode shift, by bearing deformation on the second wire, it is to avoid pullling for direct butt welding point, system is increased
Yields during work.
In one of the embodiments, the first straight line section and middle straight line section angle are 90~130 degree.
In one of the embodiments, the first straight line section and middle straight line section angle are 100~120 degree.
In one of the embodiments, the second straight line section and middle straight line section angulation are 70~90 degree.
In one of the embodiments, the second straight line section and middle straight line section angulation are 80~90 degree.
In one of the embodiments, first wire is set for arc line shaped.
In one of the embodiments, first wire and the second wire are plain conductor.
In one of the embodiments, fluorescent material is provided with the packaging body.
Brief description of the drawings
Fig. 1 is the structural representation before the package structure for LED encapsulation of a preferred embodiment of the present utility model；
Fig. 2 completes the schematic diagram after encapsulation for Fig. 1 package structure for LED.
Embodiment
For the ease of understanding the utility model, the utility model will be described more fully below.But, this practicality
It is new to realize in many different forms, however it is not limited to embodiment described herein.On the contrary, providing these implementations
The purpose of example is to make the understanding to disclosure of the present utility model more thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
Fig. 1 and Fig. 2 is referred to, is the package structure for LED 100 of the better embodiment of the utility model one, including
One first electrode 10, second electrode 20, the light-emitting diode chip for backlight unit 30 in first electrode 10, respectively with first electrode 10 and
The first wire 40 that light-emitting diode chip for backlight unit 30 is electrically connected with, electrically connect with second electrode 20 and light-emitting diode chip for backlight unit 30 respectively
The second wire 60 and packaging body 70 connect；The packaging body 70 is by the first electrode 10, second electrode 20, the first wire
40th, the second wire 60, light-emitting diode chip for backlight unit 30 are encapsulated.
The first electrode 10 is arranged at intervals with second electrode 20, and the light-emitting diode chip for backlight unit 30 is arranged on second electrode
On 20.In the present embodiment, the first electrode 10 is positive pole, and second electrode 20 is negative pole.The electricity of first electrode 10 and second
Pole 20 is electrically connected with by bottom surface with extraneous circuit board layers of copper.The dimensioned area of the first electrode 10 is than second electrode 20
Dimensioned area is big.
First wire 40 and the second wire 60 are plain conductor.First wire 40 is set for arc line shaped.Second wire
60, which include one end, is electrically connected with the first straight line section 61 of the second electrode 20, one end electric connection light-emitting diode chip for backlight unit
30 second straight line section 62 and the middle straight line section 63 of connection first straight line section 61 and second straight line section 62.First straight line section 61
It it is 90~130 degree with 63 angulation A of middle straight line section；It is preferred that first straight line section 61 and 63 angulation A of middle straight line section
For 100~120 degree；Second straight line section 62 is 70~90 degree with 63 angulation B of middle straight line section, it is preferred that second straight line section
62 be 80~90 degree with 63 angulation B of middle straight line section；Second wire 60 is arc wire.Second wire 60 and second
The junction of electrode 20 is one of pad Q.
When package structure for LED 100 of the present utility model makes, now by the first wire 40 respectively with first electrode
10 and light-emitting diode chip for backlight unit 30 weld and weld the second wire 60 with second electrode 20 and light-emitting diode chip for backlight unit 30 respectively
Connect；Complete after welding, the appearance in released state, operation process before packaging due to first electrode 10 and second electrode 20
During vibrations, small size displacement can be produced between first electrode 10 and second electrode 20, because the second wire 60 is set to first straight line
Section 61, second straight line section 62, middle straight line section 63 and angle each other are set, and form two inflection points, small producing
The second wire 60 can accordingly produce the deformation of similar quadrangle during width displacement, it is to avoid directly to the second wire 60 and second electrode
Tearing for 20 junction, is effectively protected the reliability of electric connection, so as to greatly increase good in manufacturing process
Product rate.The covering of body 70 is finally packaged, so as to complete the making of package structure for LED 100.
It is to be appreciated that in other embodiments, can add in the packaging body 70 of the package structure for LED 100
Enter fluorescent material.
Package structure for LED 100 of the present utility model passes through to connection second electrode 20 and light-emitting diode chip for backlight unit
30 the second wire 60 is configured, and makes to be provided with obvious inflection point on the second wire 60, so that first during vibrations
When electrode 10 and second electrode 20 shift, deformation is born by the second wire 60, it is to avoid pullling for direct butt welding point, from
And the reliable of electric connection is ensure that, increase the yields in manufacturing process.
Embodiment described above only expresses several embodiments of the present utility model, and it describes more specific and detailed,
But therefore it can not be interpreted as the limitation to the utility model the scope of the claims.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In protection domain of the present utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (8)
1. a kind of package structure for LED, it is characterised in that including a first electrode, second electrode, positioned at first electrode
On light-emitting diode chip for backlight unit, be electrically connected with respectively with first electrode and light-emitting diode chip for backlight unit the first wire, respectively with the
The second wire and packaging body that two electrodes and light-emitting diode chip for backlight unit are electrically connected with；The packaging body by the first electrode,
Second electrode, the first wire, the second wire, light emitting diode chip package；Second wire includes one end and is electrically connected with institute
State second straight line section and connection first that the first straight line section of second electrode, one end are electrically connected with the light-emitting diode chip for backlight unit
The middle straight line section of straightway and second straight line section.
2. package structure for LED according to claim 1, it is characterised in that：The first straight line section is straight with centre
Line segment angle is 90~130 degree.
3. package structure for LED according to claim 2, it is characterised in that：The first straight line section is straight with centre
Line segment angle is 100~120 degree.
4. package structure for LED according to claim 1, it is characterised in that：The second straight line section is straight with centre
Line segment angulation is 70~90 degree.
5. package structure for LED according to claim 4, it is characterised in that：The second straight line section is straight with centre
Line segment angulation is 80~90 degree.
6. package structure for LED according to claim 1, it is characterised in that：First wire sets for arc line shaped
Put.
7. package structure for LED according to claim 1, it is characterised in that：First wire and the second wire
For plain conductor.
8. package structure for LED according to claim 1, it is characterised in that：Fluorescence is provided with the packaging body
Powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621399852.3U CN206432285U (en) | 2016-12-19 | 2016-12-19 | Package structure for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621399852.3U CN206432285U (en) | 2016-12-19 | 2016-12-19 | Package structure for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206432285U true CN206432285U (en) | 2017-08-22 |
Family
ID=59587611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621399852.3U Expired - Fee Related CN206432285U (en) | 2016-12-19 | 2016-12-19 | Package structure for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206432285U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531866A (en) * | 2016-12-19 | 2017-03-22 | 东莞中之光电股份有限公司 | Light-emitting diode packaging structure |
-
2016
- 2016-12-19 CN CN201621399852.3U patent/CN206432285U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531866A (en) * | 2016-12-19 | 2017-03-22 | 东莞中之光电股份有限公司 | Light-emitting diode packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523808 Patentee after: Dongguan Zhongzhi Technology Co.,Ltd. Address before: No.3, Xincheng Avenue, Songshanhu, Dongguan, Guangdong 523808 Patentee before: DONGGUAN SINOWIN OPTO-ELECTRONIC Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170822 |