CN104241495A - LED capable of emitting light from both faces and manufacturing process thereof - Google Patents
LED capable of emitting light from both faces and manufacturing process thereof Download PDFInfo
- Publication number
- CN104241495A CN104241495A CN201310241297.6A CN201310241297A CN104241495A CN 104241495 A CN104241495 A CN 104241495A CN 201310241297 A CN201310241297 A CN 201310241297A CN 104241495 A CN104241495 A CN 104241495A
- Authority
- CN
- China
- Prior art keywords
- led
- lower casing
- shell body
- manufacturing process
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention provides an LED capable of emitting light from both faces. The LED comprises a shell. The shell is divided into an upper shell body and a lower shell body which are yellow transparent glass. Multiple LED chips are arranged in the shell and connected through wires. The LED chips are connected with the positive electrode and the negative electrode of a power source through conductive copper foil. The LED is simple in structure and reasonable in layout, the production process of the LED is simpler than that of an LED of the same type. Compared with a traditional packaged LED, single-face light emitting efficiency and double-face light emitting efficiency are doubled, cost is reduced, and precious production time is saved; meanwhile, fluorescent powder or silica gel is not used in the production process, so that production cost is saved. Vacuumizing motion is conducted, so that the upper shell body and the lower shell body are combined tightly, the transmitting speed of heat in a vacuum environment is increased, and heat is conducted and dissipated through the upper shell body and the lower shell body. Meanwhile, the produced product can emit light by 360 degrees without a dead angle and the illumination luminous flux effect of the LED is one time or more than that of LED products of the same type.
Description
Technical field
The present invention relates to LED technology field, be specifically related to a kind of can comprehensively luminous LED and manufacturing process thereof.
Background technology
LED is as solid-state cold light source, because of its energy-saving and environmental protection, life-span length etc. advantage, become the main product of contemporary lighting field, but, in the production of most of LED product, need to use the auxiliary materials such as a large amount of fluorescent material and silica gel, on the one hand, significantly increase the cost of product like this, the manufacturing process of the product simultaneously added, is unfavorable for large-scale industrial production.
Summary of the invention
For the deficiencies in the prior art, the object of this invention is to provide a kind of rational in infrastructure, easy to use a kind of can the LED of luminescence and manufacturing process thereof comprehensively, it solve these above-mentioned problems.
The technical solution adopted in the present invention is as follows: a kind of can be comprehensively luminous LED, comprise shell, described shell is divided into upper casing and lower casing, described upper casing and lower casing are yellow transparent glass, some LED chips are provided with in described shell, connected by wire between described LED chip, described LED chip connects the both positive and negative polarity of power supply by copper-foil conducting electricity.
A manufacturing process of LED that can be comprehensively luminous,
Comprise the steps:
1) upper casing and lower casing is configured;
2) LED chip is put into the middle part of lower casing, use transparent heat conduction colloid to fix, one end that chip is fixed originally must Shall be transparent substrate, then copper-foil conducting electricity is put into the both sides of lower casing;
3) LED chip wire is interconnected, and connects copper-foil conducting electricity with wire;
4) vacuumizing after forming both positive and negative polarity series connection makes it tightr;
5) upper casing is docked with lower casing encapsulate, then vacuumize.
Preferably, described wire is gold thread.
Preferably, the light of described LED chip can be shone out by upper casing and lower casing simultaneously.
Beneficial effect of the present invention comprises:
Structure of the present invention is simple, rationally distributed, production process of the present invention is simpler than LED production process of the same type, contrast with conventional package LED, one side is luminous to be doubled with 2 luminous luminous efficiencies, and reduce costs and saved the valuable production time, do not use fluorescent material or silica gel in process of production simultaneously, save production cost.
The action simultaneously carrying out vacuumizing makes lower casing more tight, and heat in a vacuum transmission speed can be accelerated and come heat conduction and heat radiation through upper lower casing.
Meanwhile, the product that the present invention produces can realize 360 degree and irradiate without dead angle, exceedes similar LED product luminous flux effect more than one times.
Accompanying drawing explanation
Fig. 1 is that the present invention is a kind of can the overall structure schematic diagram of comprehensively luminous LED and manufacturing process thereof;
Fig. 2 is that the present invention is a kind of can the side structure schematic diagram of comprehensively luminous LED and manufacturing process thereof.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
A kind of can be comprehensively luminous LED, as shown in Figure 1, 2, comprise shell, described shell is divided into upper casing and lower casing, described upper casing and lower casing are yellow transparent glass, be provided with some LED chips in described shell, connected between described LED chip by wire, described LED chip connects the both positive and negative polarity of power supply by copper-foil conducting electricity.
A manufacturing process of LED that can be comprehensively luminous,
Comprise the steps:
1) upper casing and lower casing is configured;
2) LED chip is put into the middle part of lower casing, use transparent heat conduction colloid to fix, one end that chip is fixed originally must Min be transparent substrate, then copper-foil conducting electricity is put into the both sides of lower casing;
3) LED chip wire is interconnected, and connects copper-foil conducting electricity with wire;
4) vacuumizing after forming both positive and negative polarity series connection makes it tightr;
5) upper casing is docked with lower casing encapsulate, then vacuumize.
Described wire is gold thread.
The light of described LED chip can be shone out by upper casing and lower casing simultaneously.
Structure of the present invention is simple, rationally distributed, production process of the present invention is simpler than LED production process of the same type, contrast with conventional package LED, one side is luminous to be doubled with 2 luminous luminous efficiencies, and reduce costs and saved the valuable production time, do not use fluorescent material or silica gel in process of production simultaneously, save production cost.
The action simultaneously carrying out vacuumizing makes lower casing more tight, and heat in a vacuum transmission speed can be accelerated and come heat conduction and heat radiation through upper lower casing.
Meanwhile, the product that the present invention produces can realize 360 degree and irradiate without dead angle, exceedes similar LED product luminous flux effect more than one times.
Above-mentioned execution mode is the preferred embodiments of the present invention; be not for limiting enforcement of the present invention and interest field; all equivalences made according to the content described in the present patent application scope of patent protection change and modify, and all should be included in the present patent application the scope of the claims.
Claims (4)
1. a LED that can be comprehensively luminous, it is characterized in that, comprise shell, described shell is divided into upper casing and lower casing, described upper casing and lower casing are yellow transparent glass, be provided with some LED chips in described shell, connected between described LED chip by wire, described LED chip connects the both positive and negative polarity of power supply by copper-foil conducting electricity.
2. a manufacturing process of LED that can be comprehensively luminous, is characterized in that,
Comprise the steps:
1) upper casing and lower casing is configured;
2) LED chip is put into the middle part of lower casing, use transparent heat conduction colloid to fix, one end that chip is fixed originally must be transparent substrate, then copper-foil conducting electricity is put into the both sides of lower casing;
3) LED chip wire is interconnected, and connects copper-foil conducting electricity with wire;
4) vacuumizing after forming both positive and negative polarity series connection makes it tightr;
5) upper casing is docked with lower casing encapsulate, then vacuumize.
3. according to claim 1 and 2 a kind of can comprehensively luminous LED and manufacturing process thereof, it is characterized in that, described wire is gold thread.
4. according to claim 1 a kind of can comprehensively luminous LED and manufacturing process thereof, it is characterized in that, the light of described LED chip can be shone out by upper casing and lower casing simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310241297.6A CN104241495A (en) | 2013-06-17 | 2013-06-17 | LED capable of emitting light from both faces and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310241297.6A CN104241495A (en) | 2013-06-17 | 2013-06-17 | LED capable of emitting light from both faces and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104241495A true CN104241495A (en) | 2014-12-24 |
Family
ID=52229217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310241297.6A Pending CN104241495A (en) | 2013-06-17 | 2013-06-17 | LED capable of emitting light from both faces and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104241495A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617087A (en) * | 2015-02-06 | 2015-05-13 | 滕州天一光电科技有限公司 | 360 degree illumination LED (light emitting diode) without fluorescent powder or silica gel and manufacture technology thereof |
| WO2021062630A1 (en) * | 2019-09-30 | 2021-04-08 | 京东方科技集团股份有限公司 | Backplate and glass-based circuit board |
-
2013
- 2013-06-17 CN CN201310241297.6A patent/CN104241495A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617087A (en) * | 2015-02-06 | 2015-05-13 | 滕州天一光电科技有限公司 | 360 degree illumination LED (light emitting diode) without fluorescent powder or silica gel and manufacture technology thereof |
| WO2021062630A1 (en) * | 2019-09-30 | 2021-04-08 | 京东方科技集团股份有限公司 | Backplate and glass-based circuit board |
| US11469359B2 (en) | 2019-09-30 | 2022-10-11 | Beijing Boe Display Technology Co., Ltd. | Backplane and glass-based circuit board |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141224 |
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| WD01 | Invention patent application deemed withdrawn after publication |