CN201937979U - Circuit board wave soldering tool - Google Patents
Circuit board wave soldering tool Download PDFInfo
- Publication number
- CN201937979U CN201937979U CN2011200414935U CN201120041493U CN201937979U CN 201937979 U CN201937979 U CN 201937979U CN 2011200414935 U CN2011200414935 U CN 2011200414935U CN 201120041493 U CN201120041493 U CN 201120041493U CN 201937979 U CN201937979 U CN 201937979U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- wiring board
- groove
- base plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 238000009434 installation Methods 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 14
- 238000003723 Smelting Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract 2
- 230000037431 insertion Effects 0.000 abstract 2
- 238000003466 welding Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 1
Images
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a circuit board wave soldering tool. A through hole and a groove are formed on a base plate, in addition, a circuit board fixing clamp is arranged on the upper surface, the position of the through hole corresponds to an installation position of an insertion installation device, a lead pin can be exposed from the back side of the base plate, the position of the groove corresponds to a position of a surface pasting device, and the depth of the groove is the same as the thickness of the surface pasting device. The tool uses the groove formed on the base plate for containing soldered surface pasting devices, the lead pin of the device can be exposed from the back side of the base plate through the through hole, and the circuit board is clamped on the upper surface of the base plate through the fixing clamp, so the surface pasting device can not fall in the wave soldering process, and meanwhile, the soldering work of the insertion installation device of the circuit board can be completed by using the existing wave soldering equipment.
Description
Technical field
The utility model relates to electronic equipment and makes the field, relates in particular to a kind of wiring board wave-soldering smelting tool.
Background technology
Make the field at electronic equipment,, aim at the wave-soldering of handling ventilating hole element and developing and still be full of vitality, and be the key component of all kinds of production lines although Surface Mount Component, occurred.In the production process of reality, inevitably to run into the simultaneous situation of Surface Mount Component, and placing components, especially the welding method of two kinds of components and parts has nothing in common with each other in the automated production process, how to realize that automation is to need the problem of solution conscientiously in the electronic circuit board production process.
The utility model content
The purpose of this utility model is to provide a kind of wiring board wave-soldering smelting tool, can utilize existing Wave soldering apparatus to realize the welding job of plate altogether of Surface Mount Component, and placing components.
For achieving the above object, the utility model is achieved through the following technical solutions:
A kind of wiring board wave-soldering smelting tool, on substrate, offer through hole and groove, and the wiring board geometrical clamp is installed at upper surface, described lead to the hole site is corresponding to the placing components installation position, its pin is exposed behind from substrate, described groove location is corresponding to position, Surface Mount Component, place, and its degree of depth is identical with the thickness of Surface Mount Component.
Further, table also is provided with holder on described substrate, is used for the plug-in mounting of long tube pin components and parts.
Wiring board wave-soldering smelting tool described in the utility model, utilize the groove on the substrate to place the good Surface Mount Component, of welding, by means of through hole device pin is exposed behind from substrate, geometrical clamp is held on upper surface of base plate with wiring board, makes in wave-soldering process element pasted on surface can not come off and can finish the welding job of wiring board placing components simultaneously again by means of existing Wave soldering apparatus.
Description of drawings
According to embodiment and accompanying drawing the utility model is described in further detail below.
Fig. 1 is the wiring board wave-soldering described in the utility model smelting structure schematic diagram of signing an undertaking;
Fig. 2 is the utility model application principle schematic diagram.
Among the figure:
1, substrate; 2, through hole; 3, groove; 4, holder; 5, geometrical clamp sliding seat; 6, bolt; 7, spring; 8, placing components; 9, Surface Mount Component; 10, long tube pin components and parts; 11, wiring board.
Embodiment
Shown in Fig. 1 to 2, provided the structure and the application principle figure thereof of wiring board wave-soldering smelting tool described in the utility model.
As shown in the figure, this wiring board wave-soldering smelting tool offers through hole 2 and groove 3 on substrate 1, and the wiring board geometrical clamp is installed at upper surface, this geometrical clamp is made up of geometrical clamp sliding seat 5, bolt 6 and spring 7, geometrical clamp sliding seat 5 can move up and down along bolt 6, and the elastic force of dependence spring 7 forms the clamping to wiring board 11; The size of the visual wiring board of quantity that geometrical clamp is provided with suitably is provided with, to form the firm grip to wiring board 11.
Through hole 2 positions can make its pin expose from substrate 1 behind corresponding to the installation position of placing components 8 grades, and described groove 3 positions are corresponding to positions, place such as Surface Mount Component,s 9, and its degree of depth is identical with the thickness of Surface Mount Component.
Table also is provided with holder 4 on described substrate 1, the plug-in mounting that is used for long tube pin components and parts 10, the height of this holder 4 or carry out prefabricatedly according to the degree of depth that pin inserts and can become suitable shape dress according to the configuration design of device, makes things convenient for the placement and the plug-in mounting of long tube pin components and parts 10.
During use, wiring board 11 is combined with smelting tool described in the utility model as shown in Figure 2, utilize the groove on the substrate to place the good Surface Mount Component, of welding, by means of through hole device pin is exposed behind from substrate, geometrical clamp is held on upper surface of base plate with wiring board, makes in wave-soldering process element pasted on surface can not come off and can finish the welding job of wiring board placing components simultaneously again by means of existing Wave soldering apparatus.
Claims (2)
1. wiring board wave-soldering smelting tool, it is characterized in that, on substrate (1), offer through hole (2) and groove (3), and the wiring board geometrical clamp is installed at upper surface, described through hole (2) position is corresponding to the placing components installation position, its pin is exposed behind from substrate (1), and described groove (3) position is corresponding to position, Surface Mount Component, place, and its degree of depth is identical with the thickness of Surface Mount Component.
2. a kind of wiring board wave-soldering smelting tool according to claim 1 is characterized in that table also is provided with holder (4) on described substrate (1), is used for the plug-in mounting of long tube pin components and parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200414935U CN201937979U (en) | 2011-02-18 | 2011-02-18 | Circuit board wave soldering tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200414935U CN201937979U (en) | 2011-02-18 | 2011-02-18 | Circuit board wave soldering tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201937979U true CN201937979U (en) | 2011-08-17 |
Family
ID=44449480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200414935U Expired - Lifetime CN201937979U (en) | 2011-02-18 | 2011-02-18 | Circuit board wave soldering tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201937979U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103269566A (en) * | 2013-05-24 | 2013-08-28 | 天津市松正电动汽车技术股份有限公司 | Wave-soldering jig with element locating function |
| CN113814507A (en) * | 2021-10-15 | 2021-12-21 | 西安微电子技术研究所 | Automatic tin coating tool for axial insertion of components after taping and use method |
-
2011
- 2011-02-18 CN CN2011200414935U patent/CN201937979U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103269566A (en) * | 2013-05-24 | 2013-08-28 | 天津市松正电动汽车技术股份有限公司 | Wave-soldering jig with element locating function |
| CN113814507A (en) * | 2021-10-15 | 2021-12-21 | 西安微电子技术研究所 | Automatic tin coating tool for axial insertion of components after taping and use method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN DONGZHI TECHNOLOGY CO., LTD. Free format text: FORMER NAME: SHENZHEN DONGZHI EQUIPMENT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518055 Nanshan District, Shenzhen, Zhongshan Road, dawn Industrial Zone, building three, building five, building Patentee after: Shenzhen Dong Zhi Science and Technology Ltd. Address before: 518055 Nanshan District, Shenzhen, Zhongshan Road, dawn Industrial Zone, building three, building five, building Patentee before: Shenzhen Torch Equipment Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518055 Nanshan District, Shenzhen, Zhongshan Road, dawn Industrial Zone, building three, building five, building Patentee after: Shenzhen Technology Co., Ltd. Address before: 518055 Nanshan District, Shenzhen, Zhongshan Road, dawn Industrial Zone, building three, building five, building Patentee before: Shenzhen Dong Zhi Science and Technology Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110817 |