CN104684272A - Multi-splicing PCB (printed circuit board) patch clamp and production process thereof - Google Patents
Multi-splicing PCB (printed circuit board) patch clamp and production process thereof Download PDFInfo
- Publication number
- CN104684272A CN104684272A CN201410664742.4A CN201410664742A CN104684272A CN 104684272 A CN104684272 A CN 104684272A CN 201410664742 A CN201410664742 A CN 201410664742A CN 104684272 A CN104684272 A CN 104684272A
- Authority
- CN
- China
- Prior art keywords
- pcb
- supporting plate
- reference column
- base
- general
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surgical Instruments (AREA)
- Automatic Assembly (AREA)
- Jigs For Machine Tools (AREA)
- Connection Of Plates (AREA)
Abstract
The invention provides a multi-splicing PCB (printed circuit board) patch clamp, which is used for combining a plurality of PCBs onto one clamp for patch production. The clamp comprises a universal support plate and a base, wherein the shapes and the dimensions of the universal support plate are matched with those of the base, the universal support plate is arranged on the base, the front and back sides of the universal support plate are respectively provided with at least one front side position avoiding region and at least one reverse side position avoiding region with different sizes, a plurality of support plate positioning posts and a plurality of groups of PCB positioning posts corresponding to the plurality of PCBs are fixedly arranged on the base, a plurality of support plate positioning holes matched with the support plate positioning posts are formed in the universal support plate, the plurality of groups of PCB positioning posts respectively correspond to the PCB positioning holes formed in the plurality of PCBs, and the plurality of groups of PCB positioning posts pass through the universal support plate to be matched with the corresponding PCB positioning holes. According to a production process, the clamp is introduced for production. The multi-splicing PCB patch clamp and the production process of the multi-splicing PCB patch clamp provided by the invention have the advantages that the production cost can be reduced, and the precision can be improved.
Description
Technical field
The present invention relates to a kind of PCB(Printed Circuit Board, printed circuit board) paster fixture and production technology thereof, especially relate to and be a kind ofly applicable to the few many spelling PCB paster fixtures of PCB number of elements and production technology thereof.
Background technology
SMT(Surface Mount Technology, surface mounting technology) the actual production capacity of ultrahigh speed paster line have at least 100,000 elements/hour, and the number of elements of some PCB is considerably less, such as 1 PCB spelled, its number of elements only has 300, and chip mounter only needs just complete for 10 seconds, and the processing steps such as printing will become the bottleneck of restriction speed of production, the speed advantage of chip mounter cannot play, and can not meet the production capacity of chip mounter far away.The corresponding each type of plate clamp of piecing together of prior art needs a set of special supporting plate more, if stopped production or design for change, scrapping of a whole set of fixture will be caused, cause cost waste, and the reference column on the supporting plate of prior art is generally manually installed, positioning precision cannot be ensured.
Summary of the invention
The technical problem that the present invention solves provides a kind of many spelling PCB paster fixtures and the production technology thereof that can either reduce costs and can improve positioning precision.
The technical scheme that the present invention solves the problems of the technologies described above is, a kind of many spelling PCB paster fixtures are provided, paster production is carried out for multiple PCB being combined to a sub-folder tool, comprise general supporting plate and base that geomery matches, general supporting plate is placed on base, these positive and negative both sides of general supporting plate offer the Bi Wei district, at least one front varied in size respectively, at least one reverse side Bi Wei district, this base is fixedly installed multiple supporting plate reference column, and many groups PCB reference column of corresponding multiple PCB, this general supporting plate is provided with the multiple supporting plate location holes matched with the plurality of supporting plate reference column, described many group PCB reference columns are corresponding with the PCB location hole be positioned on described multiple PCB respectively, this many group PCB reference column matches with corresponding PCB location hole through after general supporting plate.
Preferably, this Bi Wei district, at least one front, at least one reverse side Bi Wei district, in the spacing side by side setting respectively of the positive and negative both sides of general supporting plate, often form supporting traverse between adjacent Bi Wei district, two fronts or adjacent two reverse side Bi Wei districts.
Preferably, the degree of depth in Bi Wei district, this front, reverse side Bi Wei district is identical, and total depth is identical with general plate thickness.
Preferably, the quantity of the plurality of supporting plate reference column is three, and wherein two two ends being separately positioned on base one side, another supporting plate reference column is arranged on another relative side, the setting corresponding with supporting plate reference column of supporting plate location hole.
Preferably, this location hole being arranged on another relative side is a thin-and-long location hole, and the width of this thin-and-long location hole is identical with two supporting plate location hole diameters, and length is larger than corresponding reference column diameter.
Preferably, at least one supporting traverse arranges through circular hole.
Preferably, these base both sides are provided with the relief area caved inward.
Preferably, this at least one supporting plate reference column and many group PCB reference columns and base interference fit.
The another technical scheme that the present invention solves the problems of the technologies described above is, provide a kind of many spelling PCB production technologies, it comprises the steps:
One sleeve clamp is provided, comprise general supporting plate and base that geomery matches, general supporting plate is placed on base, these positive and negative both sides of general supporting plate offer the Bi Wei district, at least one front varied in size respectively, at least one reverse side Bi Wei district, this base is fixedly installed multiple supporting plate reference column, and many groups PCB reference column of corresponding multiple PCB, this general supporting plate is provided with the multiple supporting plate location holes matched with the plurality of supporting plate reference column, described many group PCB reference columns are corresponding with the PCB location hole be positioned on described multiple PCB respectively, this many group PCB reference column matches with corresponding PCB location hole through after general supporting plate,
Assembled PCB, the mode matched according to PCB location hole and corresponding PCB reference column by multiple PCB is assembled on general supporting plate;
Brush tin cream, assembled good PCB brushes tin cream;
Paster, with chip mounter by component mounter on the PCB spelled;
Reflow Soldering.
Preferably, rubberizing around the Bi Wei district of general supporting plate before assembled PCB.
PCB paster fixture of spelling provided by the invention is used by the general supporting plate of increase by one and base engagement more, general supporting plate both sides are all provided with Bi Wei district, the PCB going for various different size carries out assembled use, and the element on PCB can be avoided to interference with general supporting plate, like this, the PCB that one sleeve clamp goes for plurality of specifications produces, even and can ensure PCB design change after, still can produce with original fixture, save production cost, in addition, because reference column has been separated from supporting plate, reference column can be mounted on base, need not all manual installation reference column on supporting plate at every turn, ensure that the consistency of location, thus improve positioning precision, advantageously paster and brush process of tin ground carry out later.The PCB of spelling production technology provided by the invention can reduce production cost guarantee production precision by introducing above-mentioned fixture more.
Accompanying drawing explanation
A kind of package assembly schematic diagram of spelling PCB paster fixture that Fig. 1 provides for one embodiment of the invention more;
Fig. 2 is the front view of the general supporting plate shown in Fig. 1;
Fig. 3 is the rearview of the general supporting plate shown in Fig. 1;
Fig. 4 is Fig. 3 cutaway view;
Fig. 5 is the partial enlargement structural representation at place shown in Fig. 4 label V;
Fig. 6 is the partial enlargement structural representation at place shown in Fig. 4 label VI;
Fig. 7 is the front view of base;
Fig. 8 is the upward view of base;
A kind of flow chart of spelling PCB production technology that Fig. 9 provides for further embodiment of this invention more.
Embodiment
By reference to the accompanying drawings the present invention is described in further detail below by embodiment.
Refer to Fig. 1, one embodiment of the invention provides a kind of many spelling PCB paster fixtures, paster production is carried out for multiple PCB 3 is combined to a sub-folder tool, comprise general supporting plate 1 that geomery matches and base (refers to Fig. 7 label 2, same below), general supporting plate 1 is placed on base 2, and the plurality of PCB 3 array is assembled on general supporting plate 1 side by side.
Refer to Fig. 2-Fig. 6, this general supporting plate 1 rectangular tabular substantially, its positive and negative both sides offer the reverse side Bi Wei district 15 of 11, four, Bi Wei district, four fronts varied in size respectively, Bi Wei district, this front 11 is identical with the opening degree of depth in reverse side Bi Wei district 15, be the half of general supporting plate 1 thickness, namely the region that front Bi Wei district 11 is overlapping with reverse side Bi Wei district 15 this general supporting plate 1 through, in the front of general supporting plate 1, interval arranged side by side is arranged in Bi Wei district, four fronts 11, and at the back side of general supporting plate 1, interval arranged side by side is arranged in four reverse side Bi Wei districts 15.The width in Bi Wei district, front 11 is less than the width in reverse side Bi Wei district 15.Supporting traverse 12 is formed between Bi Wei district, adjacent two fronts 11 or adjacent two reverse side Bi Wei districts, wherein middle is midfoot support crossbeam 17, being provided with the through circular hole of a row 16, passing for coordinating the reference column on base 2 (referring to Fig. 7 label 22).The end positions of this general supporting plate 1 one side is also provided with two through supporting plate location holes 13, the centre position of another side of this general supporting plate 1 is also provided with a thin-and-long location hole 14, the width of this thin-and-long location hole 14 is identical with the diameter of two supporting plate location holes 13, length is larger than corresponding supporting plate reference column (referring to Fig. 7 label 23) diameter, to ensure that general supporting plate 1 is placed in after on base 2, accurate location can be realized, avoided location.
Refer to Fig. 6-Fig. 7, this base 2 shape is consistent with the shape of general supporting plate 1, substantially rectangular tabular, and its both sides are provided with the relief area 24 caved inward, so that being separated and installing between general supporting plate 1 with base 2.Position corresponding with the supporting plate location hole 13 on general supporting plate 1 and thin-and-long location hole 14 on this base 2 is provided with supporting plate reference column 23, for the location and installation of general supporting plate 1.This base 2 is also arranged many row PCB reference columns 22, for matching with the PCB location hole (scheme depending on) on corresponding many groups PCB 3, to locate the PCB 3 of correspondence.This supporting plate reference column 23 and multiple PCB reference column 22 and base 2 interference fit, and this supporting plate reference column 23 and the outwardly directed height of multiple PCB reference columns 22 are greater than the thickness of general supporting plate 1.
In a further embodiment, Bi Wei district, front 11 can be different from the degree of depth in reverse side Bi Wei district 15, and both total depths can be identical with the thickness of general supporting plate 1.Bi Wei district, front 11 also can be at least one with the quantity in reverse side Bi Wei district 15, spaced setting respectively.Thin-and-long location hole 14 can not be placed in side centre position.Bi Wei district, front 11 and reverse side Bi Wei district 15 can be the different sunk areas of size dimension.The location hole quantity that this general supporting plate 1 is arranged can also be multiple.Bi Wei district, this front 11 can be the thickness being less than or equal to general supporting plate 1 with the summation of the opening degree of depth in reverse side Bi Wei district 15.
During operation, be first placed on base 2 by general supporting plate 1, matching to the corresponding supporting plate reference column 23 on base 2 by making the supporting plate location hole 13 on general supporting plate 1 and thin-and-long location hole 14 realizes the location and installation of general supporting plate 1.Then multiple PCB 3 is assembled on general supporting plate 1 successively, the PCB location hole on PCB 3 is matched, assembled a lot of groups of PCB 3 with corresponding PCB reference column 22.Due to Bi Wei district, front 11 and the existence in reverse side Bi Wei district 15, the PCB 3 of different specification size can be suitable for, and Bi Wei district, front 11 the make scope of application of this general supporting plate 1 pair PCB 3 different from the size in reverse side Bi Wei district 15 is larger.Base 2 is arranged multiple PCB reference column 22 so that select according to actual needs.
Refer to Fig. 9, second embodiment of the invention provides a kind of many spelling PCB production technologies, and it comprises the steps:
Step 401 a: sleeve clamp is provided, comprise general supporting plate and base that geomery matches, general supporting plate is placed on base, these positive and negative both sides of general supporting plate offer the Bi Wei district, at least one front varied in size respectively, at least one reverse side Bi Wei district, Bi Wei district, this front is identical with general plate thickness with reverse side Bi Wei district's total depth, this base is arranged at least one supporting plate reference column, and many groups PCB reference column of corresponding multiple PCB, this general supporting plate is provided with at least one supporting plate location hole that supporting plate reference column at least one with this matches, this PCB is provided with the PCB location hole of cooperation corresponding with PCB reference column, this many group PCB reference column matches with corresponding PCB location hole through after general supporting plate,
Step 402: rubberizing, coats double faced adhesive tape or silica gel around Bi Wei district, front and reverse side Bi Wei district;
Step 403: assembled PCB, the mode matched according to PCB location hole and corresponding PCB reference column by multiple PCB is assembled on general supporting plate;
Step 404: brush tin cream, assembled good PCB brushes tin cream;
Step 405: paster, with chip mounter by component mounter on the PCB spelled;
Step 406: Reflow Soldering, heating makes scolding tin thawing that element is welded mutually with circuit.
Provided by the invention spell PCB paster fixture by the general supporting plate 1 of increase by one and base 2 with the use of, general supporting plate 1 both sides are all provided with Bi Wei district, the PCB 3 going for various different size carries out assembled use, and the element on PCB 3 can be avoided to interference with general supporting plate 1, like this, the PCB 3 that one sleeve clamp goes for plurality of specifications produces, even and can ensure after PCB 3 design alteration, still can produce with original fixture, save production cost, in addition, because reference column has been separated from supporting plate, reference column can be mounted on base 2, need not all manual installation reference column on supporting plate at every turn, ensure that the consistency of location, thus improve positioning precision, advantageously paster and brush process of tin ground carry out later.The PCB of spelling production technology provided by the invention can reduce production cost guarantee production precision by introducing above-mentioned fixture more.
Above content is in conjunction with concrete execution mode further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made.
Claims (10)
1. spell PCB paster fixture one kind more, paster production is carried out for multiple PCB being combined to a sub-folder tool, it is characterized in that, comprise general supporting plate and base that geomery matches, general supporting plate is placed on base, these positive and negative both sides of general supporting plate offer the Bi Wei district, at least one front varied in size respectively, at least one reverse side Bi Wei district, this base is fixedly installed multiple supporting plate reference column, and many groups PCB reference column of corresponding multiple PCB, this general supporting plate is provided with the multiple supporting plate location holes matched with the plurality of supporting plate reference column, described many group PCB reference columns are corresponding with the PCB location hole be positioned on described multiple PCB respectively, this many group PCB reference column matches with corresponding PCB location hole through after general supporting plate.
2. many spelling PCB paster fixtures as claimed in claim 1, it is characterized in that, this Bi Wei district, at least one front, at least one reverse side Bi Wei district, in the spacing side by side setting respectively of the positive and negative both sides of general supporting plate, often form supporting traverse between adjacent Bi Wei district, two fronts or adjacent two reverse side Bi Wei districts.
3. many spelling PCB paster fixtures as claimed in claim 1, it is characterized in that, the degree of depth in Bi Wei district, this front, reverse side Bi Wei district is identical, and total depth is identical with general plate thickness.
4. many spelling PCB paster fixtures as claimed in claim 1, it is characterized in that, the quantity of the plurality of supporting plate reference column is three, wherein two two ends being separately positioned on base one side, another supporting plate reference column is arranged on another relative side, the setting corresponding with supporting plate reference column of supporting plate location hole.
5. many spelling PCB paster fixtures as claimed in claim 4, it is characterized in that, this location hole being arranged on another relative side is a thin-and-long location hole, and the width of this thin-and-long location hole is identical with two supporting plate location hole diameters, and length is larger than corresponding reference column diameter.
6. many spelling PCB paster fixtures as claimed in claim 2, is characterized in that, at least one supporting traverse is arranged multiple through circular hole.
7. many spelling PCB paster fixtures as claimed in claim 1, it is characterized in that, these base both sides are provided with the relief area caved inward.
8. the many spelling PCB paster fixtures as described in any one of claim 1-7, is characterized in that, this at least one supporting plate reference column and many group PCB reference columns and base interference fit.
9. spell a PCB production technology more, it is characterized in that, comprise the steps:
One sleeve clamp is provided, comprise general supporting plate and base that geomery matches, general supporting plate is placed on base, these positive and negative both sides of general supporting plate offer the Bi Wei district, at least one front varied in size respectively, at least one reverse side Bi Wei district, this base is fixedly installed multiple supporting plate reference column, and many groups PCB reference column of corresponding multiple PCB, this general supporting plate is provided with the multiple supporting plate location holes matched with the plurality of supporting plate reference column, described many group PCB reference columns are corresponding with the PCB location hole be positioned on described multiple PCB respectively, this many group PCB reference column matches with corresponding PCB location hole through after general supporting plate,
Assembled PCB, the mode matched according to PCB location hole and corresponding PCB reference column by multiple PCB is assembled on general supporting plate;
Brush tin cream, assembled good PCB brushes tin cream;
Paster, with chip mounter by component mounter on the PCB spelled;
Reflow Soldering.
10. the more spelling PCB production technology as claimed in claim 9, is characterized in that, rubberizing around the Bi Wei district of general supporting plate before assembled PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410664742.4A CN104684272B (en) | 2014-11-19 | 2014-11-19 | Multi-spliced PCB patch clamp and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410664742.4A CN104684272B (en) | 2014-11-19 | 2014-11-19 | Multi-spliced PCB patch clamp and production process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104684272A true CN104684272A (en) | 2015-06-03 |
| CN104684272B CN104684272B (en) | 2023-07-28 |
Family
ID=53318676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410664742.4A Active CN104684272B (en) | 2014-11-19 | 2014-11-19 | Multi-spliced PCB patch clamp and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104684272B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN106514527A (en) * | 2017-01-13 | 2017-03-22 | 昆山东野电子有限公司 | Assembling fixture for multi-printed-circuit-board (multi-PCB) group |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10119012A1 (en) * | 2001-04-18 | 2003-02-27 | Rainer Hesse | Positioning device for PCBs, has circuit board tray for different sized circuit boards with circuit board fixing element holders, and processing machine clamping/transport region matched to tray dimensions |
| JP2010098320A (en) * | 2008-10-17 | 2010-04-30 | Shu Kisei | Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same |
| CN201690687U (en) * | 2009-12-14 | 2010-12-29 | 安捷利（番禺）电子实业有限公司 | Supporting board base for surface mounting of flexible printed circuit boards |
| CN202285460U (en) * | 2011-11-04 | 2012-06-27 | 北京航天达盛电子技术有限公司 | Technical equipment for surface mount technology (SMT) through hole backflow technology |
| CN102711391A (en) * | 2012-06-12 | 2012-10-03 | 东莞市海拓伟电子科技有限公司 | High-efficiency soldering process of circuit board connector |
| CN202587616U (en) * | 2012-04-25 | 2012-12-05 | 苏州友佳电子有限公司 | Surface mount jig of flexible printed circuit (FPC) |
| CN202721915U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Magnetic tool used for flexible circuit board |
| CN103874341A (en) * | 2012-12-13 | 2014-06-18 | 赛龙通信技术（深圳）有限公司 | Surface mount carrier and surface mount method |
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN204259287U (en) * | 2014-11-19 | 2015-04-08 | 深圳市海能达通信有限公司 | Many spelling PCB paster fixtures |
-
2014
- 2014-11-19 CN CN201410664742.4A patent/CN104684272B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10119012A1 (en) * | 2001-04-18 | 2003-02-27 | Rainer Hesse | Positioning device for PCBs, has circuit board tray for different sized circuit boards with circuit board fixing element holders, and processing machine clamping/transport region matched to tray dimensions |
| JP2010098320A (en) * | 2008-10-17 | 2010-04-30 | Shu Kisei | Surface mounting process for flexible printed circuit board, and magnetic tool and steel mesh used in the same |
| CN201690687U (en) * | 2009-12-14 | 2010-12-29 | 安捷利（番禺）电子实业有限公司 | Supporting board base for surface mounting of flexible printed circuit boards |
| CN202285460U (en) * | 2011-11-04 | 2012-06-27 | 北京航天达盛电子技术有限公司 | Technical equipment for surface mount technology (SMT) through hole backflow technology |
| CN202587616U (en) * | 2012-04-25 | 2012-12-05 | 苏州友佳电子有限公司 | Surface mount jig of flexible printed circuit (FPC) |
| CN102711391A (en) * | 2012-06-12 | 2012-10-03 | 东莞市海拓伟电子科技有限公司 | High-efficiency soldering process of circuit board connector |
| CN202721915U (en) * | 2012-08-17 | 2013-02-06 | 腾捷（厦门）电子有限公司 | Magnetic tool used for flexible circuit board |
| CN103874341A (en) * | 2012-12-13 | 2014-06-18 | 赛龙通信技术（深圳）有限公司 | Surface mount carrier and surface mount method |
| CN103974557A (en) * | 2014-05-27 | 2014-08-06 | 苏州市易德龙电器有限公司 | Method and jig for attaching bare chip to IC (Integrated Circuit) substrate |
| CN204259287U (en) * | 2014-11-19 | 2015-04-08 | 深圳市海能达通信有限公司 | Many spelling PCB paster fixtures |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN106514527A (en) * | 2017-01-13 | 2017-03-22 | 昆山东野电子有限公司 | Assembling fixture for multi-printed-circuit-board (multi-PCB) group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104684272B (en) | 2023-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204259287U (en) | Many spelling PCB paster fixtures | |
| CN103692289B (en) | A kind of Horizontal dividing device | |
| CN104684272A (en) | Multi-splicing PCB (printed circuit board) patch clamp and production process thereof | |
| CN205202391U (en) | General equipment tool | |
| CN204823142U (en) | Assembly line product is led and is just installed | |
| CN106941764A (en) | The device that a kind of B faces socket A faces Through-hole reflow connects | |
| CN203356924U (en) | Welding fixture | |
| CN203076160U (en) | Clamp structure | |
| CN104148795A (en) | Parallel seam welding packaging device | |
| CN203992932U (en) | The tooling device of Fast Installation, welding aviation plug | |
| CN203875545U (en) | Tool special for clamping and installing LED lamps | |
| CN101114040A (en) | Bracket tray positioning platform | |
| CN204736144U (en) | LED lamp pearl picture peg anchor clamps spare | |
| CN207765639U (en) | Arrange needle female seat and pcb board component | |
| CN103464860A (en) | LED plug lamp positioning device | |
| CN203171607U (en) | Temporary storage rack of PCBs | |
| CN204620803U (en) | A kind of finding closely spaced array splicing thin plate and punching press lower die structure thereof | |
| CN204140564U (en) | Panel beating fastening structure | |
| CN203659302U (en) | Direct-connection combination experimental board | |
| CN203918158U (en) | The indoor module Reflow Soldering of a kind of LED Two bors d's oeuveres is crossed furnace tool | |
| CN206136443U (en) | PCB makeup on no technology limit | |
| CN208523061U (en) | A kind of pcb board pasting board jig | |
| CN202621410U (en) | Glue spreading fixture | |
| CN205275756U (en) | Electroplating clamp | |
| CN207531188U (en) | A kind of dials for removing dust in hole |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |