CN106134529B - A kind of assembling method of flat ceramic encapsulated ic device - Google Patents
A kind of assembling method of flat ceramic encapsulated ic deviceInfo
- Publication number
- CN106134529B CN106134529B CN201218000520.4A CN201218000520A CN106134529B CN 106134529 B CN106134529 B CN 106134529B CN 201218000520 A CN201218000520 A CN 201218000520A CN 106134529 B CN106134529 B CN 106134529B
- Authority
- CN
- China
- Prior art keywords
- pin
- moulding
- pcb pad
- flat ceramic
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000000919 ceramic Substances 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- 238000000465 moulding Methods 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims description 17
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 abstract 1
- 239000000306 component Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 230000035939 shock Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
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- 230000007613 environmental effect Effects 0.000 description 3
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- 238000012856 packing Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000007596 consolidation process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- 230000008646 thermal stress Effects 0.000 description 1
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Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
An assembling method for flat ceramic encapsulated ic device, step is: (1) carries out original flat ceramic encapsulated ic device brake forming and is placed on PCB pad, and device and PCB pad all need to meet certain condition of molding; (2) pin of device after moulding is checked and adjusted, the pin of device after moulding is all contacted with PCB pad; (3) between the bottom of the device after moulding and PCB pad, fill adhesive TRABOND 8.2; (4) pin of device is welded with PCB pad respectively; (5) surrounding that adopts EC2216 epoxyn to be applied to device is reinforced. The inventive method can effectively improve the properties of device anti-adverse environment, is applicable to all four limit flat package devices, bilateral flat package device, simultaneously in the high high reliability circuit product of antivibration performance requirement.
Description
Technical field
The present invention relates to the assembling method of a kind of large scale, high performance components, be applicable to all heat radiation requirementsHeight, in the higher high reliability circuit product of drag shock and vibration Capability Requirement, comprises various many pinsFlat-four-side packaging, the circuit assembly application circuit of many pins double-side flat packaging.
Background technology
Space flight power supply product is in operation and need to stands high low temperature alternation, thermal vacuum, vibration, impact etc. badlyThe impact of environmental condition. As the core components and parts of space flight power supply product in recent years, the large rule of flat ceramic packageVlsi die device should possess the performance that meets the above-mentioned mal-condition of opposing. CQFP (Ceramic QuadFlat Pack) packaging belongs to the ceramic flat package device of four sides gull aerofoil profile pin. Examine from technological angleConsider, this class device has that pin wire diameter is thin and shock resistance is poor, and power is large and heat radiation requires high. WhereinLarge-sized flat ceramic component, because its pin number is many, device weight is large, used at dress connection and productIn journey, easily under the impact of shock and vibration, there is especially device pin fracture impaired, thereby cause product to loseThe situation of effect.
For pin forming technology, heat conduction and the reinforcement technique of this class large scale, high power device, if stillSo adopt existing assembling method, cannot meet the long-time requirement using under adverse circumstances.
Summary of the invention
Technology of the present invention is dealt with problems and is: overcome the deficiencies in the prior art, a kind of large scale, large is providedThe assembling method of power component, can make the components and parts after dress connection meet to anti-high and low-temp alternation, hot trueThe severe environmental conditions such as sky, vibration, impact.
Technical solution of the present invention is: a kind of assembling method of flat ceramic encapsulated ic device,Step is as follows:
(1) original flat ceramic encapsulated ic device carried out to brake forming and be placed on PCB welderingOn dish, when device brake forming, meet four conditions: the shoulder breadth size B of device is greater than 2 times of devices and draws simultaneouslyPin thickness; In the moulding of device, curved radius R is greater than 2 times of device pin width and is greater than device pin thickness;Device bottom is 0.5～1mm with the clearance D of PCB pad; Device pin and pad lap of splice C, whenWhen device pin width is greater than 0.5mm, C is between 3 times of device pin width and 5 times of device pin widthBetween; In the time that device pin width is less than 0.5mm, C is not less than 1.25mm; Described PCB padLength is greater than C+0.75mm, and the width of PCB pad is greater than 1.5 times of device pin width;
(2) pin of device after step (1) moulding checked and adjusted, making device after mouldingPin all contact with PCB pad;
(3) between the bottom of the device after moulding and PCB pad, fill adhesive TRABOND 8.2;
(4) pin of device is welded with PCB pad respectively;
(5) surrounding that adopts EC2216 epoxyn to be applied to device is reinforced.
Check that the pin of device after moulding checks and the method adjusted is in described step (2): adopt flatFace mirror replaces PCB pad, the device after moulding is placed on level crossing to pin deviation while utilizing mirror-reflectionThe principle that value can present 2 times of amplifications to moulding after the height of pin of device regulate.
The method of filling adhesive in described step (3) is: adopts and is with pertusate template as aid,With the perforate guarantee filling area of template, with the thickness guarantee filling thickness of template.
The outer width of frame of described template is greater than 5mm.
In described step (3), the filling bond area of adhesive TRABOND 8.2 is greater than device bottom facesLong-pending 80%.
The method of in described step (4), the pin of device and PCB pad being welded is: first at deviceAfter 2 pins of each side welding of part, 2 pins that turn adjacent side weld, and locate whole device; SoThe mode of welding 1 pin in every 5 pins of rear employing, welds the pin of device both sides, the most in turnAll pin has welded one by one.
The present invention's advantage is compared with prior art:,
(1) first the inventive method carried out the design technology inspection of PCB device layout before dress connection,Design technology is checked as the effective prerequisite that improves device dress and join quality, form that type checking is qualified, bottomFill, the dress connection process that after welding, surrounding is strengthened has ensured the reliability of dress connection;
(2) when the inventive method is utilized mirror-reflection, pin deviate can be the principle pair of ready-made 2 times of amplificationsAfter moulding, the pin forming flatness of device checks, method is practical simple and effective, can avoid checkingThe damage that process causes device pin, especially for pin number compared with device large and that wire diameter is little, phaseMore effective than other optical detecting methods;
(3) the inventive method has been used for reference the principle of screen printed with solder paste in surface mounting component reflow welding termination process, makesCarry out the control of adhesive filling area and height with mould. Because adhesive is epoxide resin material, and stickySpend greatlyr, elect mould as nonmetallic materials and be beneficial to the demoulding, avoided adhesive to remain on mould;
(4) the inventive method adopts the manual method of welding in turn after manual positioning welding, has effectively avoidedThe deviation of weld size, ensures that solder joint is heated evenly, and Thermal Shock Damage is reduced to minimum, and this is for deviceAnti-seismic performance after dress connection is most important.
Brief description of the drawings
Fig. 1 is the FB(flow block) of the inventive method;
Fig. 2 is device molding technique parameter schematic diagram of the present invention.
Detailed description of the invention
Major effect CQFP packaging lost efficacy factor a lot, comprise components and parts itself physical property,The welding of the layout of printed circuit board assembly, casing structure design, component's feet moulding, device pinWith reinforcing mode of device etc.
Consider from technological angle, improper if dress connection technological parameter is selected, the vibration resistance of product will weaken to some extent,The bad phenomenon such as device very easily produces pin breakage in development or environmental test process, and solder joint is impaired, and thenAffect the reliability of whole power supply product.
From the viewpoint of design technology, should be this large scale, high power device in the PCB layout stageBe placed in figure relatively rule, structure mounting hole site or mechanical support point be evenly distributed, the PCB that size is lessOn. Such layout designs can effectively ensure that product is in adverse circumstances, and device and pin are stressed relatively even,Four sides pin stress relief channel is distributed symmetrically.
In addition, consider from formed product, operability bonding, that weld and reinforce, device around should leaveEnough process allowance areas, to meet the enforcement of dress connection.
As shown in Figure 1, be the flow chart of the inventive method. The dress of large scale of the present invention, high performance componentsLinked method relates generally to following three aspects: the selection of device moulding, heat conduction and reinforcement material and enforcement, withAnd welding procedure.
One, device moulding
The brake forming of large scale, high power device, shearing size, and the corresponding pad size coupling of pinThe requirements such as degree are vital for the reliable dress connection of device. Dark by device forming process of the present inventionEnter research, important technological parameter has been carried out to refinement, be decomposed into following several respects, and with regard to parametersForming requirements carried out studying one by one and quantizing, refer to shown in table 1 and Fig. 2:
Table 1 molding technique parameter
How to check after above-mentioned moulding the coplanarity of device pin whether to meet the demands and directly affect the follow-up dress of deviceThe enforcement of connection, conventional method is to detect by the matching degree of observation pin and PCB pad. And at thisIn bright assembling method, the device after moulding is carefully placed on to the mirror surfaces that flatness is very high, if there is certain rootThere is part and warp in pin, has affected the flatness of whole device pin, utilizes mirror-reflection principle, deviationValue can be ready-made 2 times of amplifications, has greatly strengthened detection efficiency.
Two, the selection of Heat Conduction Material and coating technique
In order to take into account device drag shock and vibration ability and heat conduction demand, to the potential inefficacy hidden danger of deviceAnalyze. Because device pin is thin, size is large, and the fracture of bending part very easily occurs in mechanical environment,And this fracture is generally distributed in the two ends on the each limit of device, because end positions belongs to the antivibration weak point of devicePosition. Breaking part is because the mechanical failure intensity that tomography is subject to up and down differs greatly, and causes the final fracture that occurs.And the great disparity of mechanical strength may be because the adhesive strength of device underfill is lower, cannot resist largeThe mechanical test of magnitude; In addition because the lower heat dispersion of packing material cannot effectively be derived device and existedThe local heat energy accumulating under duty, makes the indivedual pins of device produce thermal stress, causes final indivedual pinFracture.
Based on above-mentioned analysis, device underfill is positioned at and has both bonding and cementation material heat sinking functionMaterial, selects thermal conductivity factor higher, and has the thermal conductive adhesive of certain shear strength. Anti-for strengthening product in additionThe performance of shaking is selected to the epoxyn that mechanical strength strengthens after device has welded. The former forDevice bottom and PCB's is bonding, and this adhesive shear strength is good, plays and fills bottom, strengthens cementabilityHeat conduction and heat radiation function is had both in the effect of energy simultaneously; The latter is applied to device surrounding after device pin welding, rightDevice carries out second consolidation, effectively improves its resistance to shock.
1. the selection of heat conduction adhesives
The surface for the treatment of bonding large scale, high power device encapsulation is ceramic material, and device installed surface is FR-4Printed circuit board material. In the time of selector underfill, should be from adhering object and by bonding plane materialThe two thermal coefficient of expansion (CTE) is considered, because the CTE of pottery and FR-4 differs larger, Ying XuanSelect the packing material that thermal conductivity factor is very high, the amount of localized heat that device is produced derives rapidly, avoids causing heat to answerPower. Because adhesive TRABOND 8.2 thermal conductivity factors belong to insulating materials, take into account very high thermal conductivity factorAnd adhesive strength, can ensure the heat radiation requirement of device, strengthen again the bonding mechanical strength of device, makeThe components and parts that this size is very large are effectively guaranteed in the quality aspect calorifics, mechanics and electrical property, canLean on property greatly to strengthen.
The heat conductivility of TRABOND 8.2 and domestic conventional heat-conducting glue are compared, in table 2, canTo find out that TRABOND 8.2 has certain superiority. Meanwhile, by the cementability of TRABOND 8.2Can compare with conventional adhesive, refer to table 3, can find out that TRABOND 8.2 not only possesses wellHeat conductivility, more have both high mechanical performance.
The comparison of table 2 adhesive thermal conductivity factor
| Sequence number | Title | Storage environment | Condition of cure | Handbook data/reinspection standard |
| 1 | TRA BOND 8-2 (effectively) | Lower than 25 DEG C | 75 DEG C 4 hours | Thermal conductivity factor > 1.5W/mK |
| 2 | Two-component room-temperature-vulcanized heat-conducting silicon rubber | Room temperature sealing | Room temperature | Thermal conductivity factor > 1.2W/m DEG C |
The comparison of table 3 adhesive shear strength
2. the improvement of thermal conductive adhesive coating technique
Because device bottom is the square that area is larger, and the bond area of packing material should be greater than device80% of bottom area, and to meet the even thickness of bonding portion, contour requirement. So logicalAfter crossing the concrete size such as the length of side, thickness that calculates bonding plane, the present invention has used for reference screen printed with solder pastePrinciple and technique (for example can use for reference soldering paste silk screen), will be with pertusate template as gluing aid,Ensure filling area with the perforate of template, ensured the thickness of adhesive with the thickness of template. This selectionProperty coating technique, effectively prevent that adhesive from overflowing the drawback by mistake adhering to pin from device body below.
In the time that template size designs, outer width of frame should be greater than 5mm, so that gluing process has certain behaviourDo surplus limit. In the time of template selection, should select the nonmetallic materials of the easy demoulding as far as possible, as polytetrafluoroethylene (PTFE),Avoid adhesive in knockout course, to remain in die edge or four jiaos. In addition, in the time of PCB Butut, strengthen establishingMeter manufacturability, can not cloth other any device and solder joints in 5mm region around this device.
3. the selection of reinforced glue materials of adhesive
Select the second consolidation of EC2216 epoxyn as device, after device pin welding, be coated withIn device surrounding, effectively improve its resistance to shock. EC2216 has good bonding as can be seen from Table 3Performance.
Three, welding
Flat package large scale integrated circuit belongs to many pins, thin pin, high density components and parts. For this classComponents and parts should be avoided the local heating of pin solder joint and the thermal shock that causes as far as possible. For this reason, adopt effectivelyWelding method avoids pin impaired, and welding step is as follows:
1. on PCB, use after template gluing, device body is placed on adhesive gently, meanwhile,Carefully check whether components and parts meet installation direction requirement, aim at Pin locations No. 1, then check deviceWhether pin is all intact with pad overlap joint.
2. after 2 pins of each side welding of device, 2 pins that turn adjacent side weld, and accomplish wholeThe location of individual device.
3. guarantee after exactitude position, in every 5 pins, weld 1 pin, weld in turn drawing of the every side of devicePin, the most all pin has welded one by one. Such welding method has effectively discharged due to electric ironLocalized heat stress, had both ensured the precision of weld size, and while having avoided welding flatiron head due to operationThe localized heat stress that person introduces.
The content not being described in detail in description of the present invention belongs to those skilled in the art's known technology.
Claims (6)
1. an assembling method for flat ceramic encapsulated ic device, is characterized in that step is as follows:
(1) original flat ceramic encapsulated ic device carried out to brake forming and be placed on PCB welderingOn dish, when device brake forming, meet four conditions: the shoulder breadth size B of device is greater than 2 times of devices and draws simultaneouslyPin thickness; In the moulding of device, curved radius R is greater than 2 times of device pin width and is greater than device pin thickness;Device bottom is 0.5～1mm with the clearance D of PCB pad; Device pin and pad lap of splice C, whenWhen device pin width is greater than 0.5mm, C is between 3 times of device pin width and 5 times of device pin widthBetween; In the time that device pin width is less than 0.5mm, C is not less than 1.25mm; Described PCB padLength is greater than C+0.75mm, and the width of PCB pad is greater than 1.5 times of device pin width;
(2) pin of device after step (1) moulding checked and adjusted, making device after mouldingPin all contact with PCB pad;
(3) between the bottom of the device after moulding and PCB pad, fill adhesive TRABOND 8.2;
(4) pin of device is welded with PCB pad respectively;
(5) surrounding that adopts EC2216 epoxyn to be applied to device is reinforced.
2. the assembling method of a kind of flat ceramic encapsulated ic device according to claim 1,It is characterized in that: in described step (2), the pin of device after step (1) moulding is checked and adjustedWhole method is: adopt level crossing to replace PCB pad, the device after moulding is placed on level crossing, utilizeThe principle that when mirror-reflection, pin deviate can present 2 times of amplifications to moulding after the height of pin of device adjustJoint.
3. the assembling method of a kind of flat ceramic encapsulated ic device according to claim 1,It is characterized in that: the method for filling adhesive in described step (3) is: adopt and be with pertusate template conductAid, with the perforate guarantee filling area of template, with the thickness guarantee filling thickness of template.
4. the assembling method of a kind of flat ceramic encapsulated ic device according to claim 3,It is characterized in that: the outer width of frame of described template is greater than 5mm.
5. the assembling method of a kind of flat ceramic encapsulated ic device according to claim 1,It is characterized in that: in described step (3), the filling bond area of adhesive TRABOND 8.2 is greater than device80% of part bottom area.
6. the assembling method of a kind of flat ceramic encapsulated ic device according to claim 1,It is characterized in that: the method for in described step (4), the pin of device being welded with PCB pad respectivelyFor: first, after 2 pins of each side welding of device, 2 pins that turn adjacent side weld, locationWhole device; Then adopt the mode of welding 1 pin in every 5 pins, weld in turn device both sidesPin, the most all pin has welded one by one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201218000520.4A CN106134529B (en) | 2012-03-21 | 2012-03-21 | A kind of assembling method of flat ceramic encapsulated ic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201218000520.4A CN106134529B (en) | 2012-03-21 | 2012-03-21 | A kind of assembling method of flat ceramic encapsulated ic device |
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| Publication Number | Publication Date |
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| CN106134529B true CN106134529B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201218000520.4A Expired - Fee Related CN106134529B (en) | 2012-03-21 | 2012-03-21 | A kind of assembling method of flat ceramic encapsulated ic device |
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| Country | Link |
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| CN (1) | CN106134529B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
-
2012
- 2012-03-21 CN CN201218000520.4A patent/CN106134529B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
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| GR03 | Grant of secret patent right | ||
| GRSP | Grant of secret patent right | ||
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| DCSP | Declassification of secret patent | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 |
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| CF01 | Termination of patent right due to non-payment of annual fee |