KR101257789B1 - High heat conductive pcb, heat emission module using the high heat conductive pcb, led lighting module using the heat emission module - Google Patents

Abstract

PURPOSE: A high thermal conductive printed circuit board with a high heat radiation property, a heat radiation module using the same, and an LED module using the heat radiation module are provided to implement a free design by reducing the weight and the size of a product. CONSTITUTION: A solder resist coverlay(100) protects an electronic circuit pattern(200) of a substrate. The solder resist coverlay is integrated with a reinforcement plate. A backward electronic circuit pattern is formed on a metal thin film backward electronic circuit pattern. A bonding unit bonds the metal thin film backward electronic circuit pattern to the solder resist coverlay. A metal thin film backward electronic circuit pattern protecting device partially or entirely protects the metal thin film backward electronic circuit pattern.

Description

High heat conductive printed circuit board, heat dissipation module using the high heat conductive printed circuit board, and led module using the heat dissipation module {High Heat Conductive PCB, Heat Emission Module Using the High Heat Conductive PCB, LED Lighting Module Using the Heat Emission Module}

The present invention relates to a high thermal conductive printed circuit board, a heat dissipation module using the high thermal conductive printed circuit board, and an LED module using the heat dissipation module. More specifically, the reinforcement plate of the PCB and the solder resist coverlay are integrated. The present invention relates to a high thermal conductive printed circuit board which is formed in the form of a circuit board and generates a reverse electronic circuit pattern, a heat dissipation module using the high thermal conductive printed circuit board, and an LED module using the heat dissipation module.

Many electronic components included in electronic products include a printed circuit board. The heat dissipation function has been regarded as an important function among the attributes that such a printed circuit board should have. If the heat dissipation function is insufficient, the lifespan of electronic components including the printed circuit board and the printed circuit board is also shortened. This is especially true in the case of printed circuit boards in which electronic components such as LEDs generate heat and are weak in heat.

1 to 3 are diagrams showing the structure of a conventional general FR4 PCB, general FPCB or metal PCB, respectively. In the conventional PCB, an electrically conductive metal thin film constituting the circuit of the PCB is bonded to an epoxy, polyimide, or aluminum (AL) reinforcing plate to secure electrical insulation or structural strength. Epoxy or polyimide reinforcement plate (Base) lacks thermal conductivity and lacks thermal conductivity to dissipate heat generated from electronic components such as LEDs and semiconductors to the outside.

Rigid metal PCB using rigid base (AL Base) which has better thermal conductivity than epoxy base of FR4 PCB and polyimide base of general FPCB to improve heat dissipation of electronic products Metal PCB) is used, but rigid metal PCB (Rigid Metal PCB) has a limitation that it is difficult to design free curved surface of products such as LED lighting.

In particular, existing PCB such as FR4 PCB, general FPCB or metal PCB has epoxy base, polyimide base and metal base between metal thin film circuit pattern and heat sink. Since the thermal resistance of various reinforcing plates (base) itself exists and the adhesive layer for bonding the reinforcing plate (Base) to the bottom of the metal thin film circuit pattern must exist, the thermal resistance of the adhesive itself exists. . In addition, since there is an adhesive interface between the metal thin film circuit pattern and the adhesive, and an interface between the adhesive and the reinforcing plate (Base), contact thermal resistance is additionally present at various interfaces, thereby causing a problem of low thermal conductivity.

4 to 5 are views of the structure of the heat dissipation module of the conventional general FPCB and metal PCB assembly, respectively.

PCB assembly heat dissipation module using existing PCB such as FR4 PCB, general FPCB or metal PCB has thermal resistance due to metal thin film circuit pattern, adhesive, heat resistance of reinforcement plate itself and contact heat resistance of adhesive interface between adhesive and reinforcement plate. High thermal conductivity double-sided tape, high thermal conductivity pads to bond the PCB assembly with electronic components such as LEDs, semiconductors, etc. using existing PCBs such as FR4 PCBs, general FPCBs or metal PCBs to the heat sink. When adhesives such as high thermal conductive adhesive bonds are used, LEDs and semiconductors are formed due to the additional thermal resistance of each adhesive interface as well as the thermal resistance of adhesives such as high thermal conductive double-coated tape, high thermal conductive pads or high thermal conductive adhesive bonds. Again, the thermal conductivity at which heat generated from electronic components is conducted to the heat sink is further reduced.

Therefore, due to the lack of thermal conductivity that transfers heat generated from electronic components such as LEDs and semiconductors to the heat sink, a large amount of heat is generated. It is difficult to use existing FR4 PCB or general FPCB in product design. When using general metal PCB, thermal conductivity is better than that of FR4 PCB or general FPCB, but the thermal conductivity of PCB is insufficient due to the thermal resistance of aluminum base and adhesive itself and the contact thermal resistance of each bonding interface.

In addition, the existing general FR4 PCB or metal PCB is a rigid PCB, there is a difficult limitation in the design and design of the product surface. When the conventional general FPCB is used for the curved surface design of the product, the thermal conductivity of the PCB is reduced due to the thermal resistance of the reinforcement plate of the FPCB, the adhesive itself and the contact thermal resistance of each adhesive interface as described above.

Accordingly, the electronic component industry needs a high thermal conductivity PCB that has improved the heat dissipation efficiency of heat emitted from electronic components such as LEDs and semiconductors, and a need for a high thermal conductivity FPCB capable of excellent heat dissipation efficiency and curved design of electronic components. Has been. On the other hand, high-heat-conducting PCBs with good heat dissipation characteristics and low cost have been steadily requested.Innovatively reducing the size and developing LED lighting products with an emotional and original streamlined design, as well as mobile phones, smartphones, notebook PCs, tablet PCs, and mobile printers. Innovative improvement in heat dissipation efficiency of various electronic products, such as reducing the size and weight of the product, and the development of a printed circuit board that can be curved design and free design implementation that is impossible with conventional rigid FR4 PCB or metal PCB has been continuously requested.

The first technical problem to be solved by the present invention is to disclose a high thermal conductive printed circuit board.

A second technical problem to be solved by the present invention is to disclose a heat dissipation module using a high thermal conductive printed circuit board.

A third technical problem to be solved by the present invention is to disclose an LED module using a heat dissipation module including a high thermal conductive printed circuit board.

In order to achieve the technical problem to be achieved by the present invention, a solder resist coverlay is used to protect the electronic circuit pattern of the printed circuit board to maximize the heat dissipation function of the heat generated from the electronic components such as LED, semiconductor, etc. Reinforcement plate integrated solder resist coverlay formed integrally with the reinforcement plate used for the purpose of preventing damage and ensuring structural durability; A metal thin film reverse electronic circuit pattern in which a reverse electronic circuit pattern is formed; An adhesive portion present between the metal thin film reverse electronic circuit pattern and the reinforcement plate integrated solder resist coverlay, the adhesive unit coupling the metal thin film reverse electronic circuit pattern and the reinforcement plate integrated solder resist coverlay; And at least one metal thin film reverse electronic circuit pattern protection means for protecting a part or all of the metal thin film reverse electronic circuit pattern.

The reinforcing plate integrated solder resist coverlay is preferably one of polyimide, PET, PC, PE, PEEK material.

The reinforcing plate integrated solder resist coverlay is an inner side or an outer side, or an inner side and an outer side of a material, which is one of polyimide, PET, PC, PE, and PEEK, in order to maximize heat dissipation function generated from electronic components such as LEDs and semiconductors. The thermal conductivity is preferably formed by coating a carbon nanotube (CNT) or graphene or boron nitride or ceramic.

The reinforcement plate integrated solder resist coverlay is a carbon nanotube filler or graphene having good thermal conductivity in one of polyimide, PET, PC, PE, and PEEK to maximize heat dissipation function generated from electronic components such as LEDs and semiconductors. It is preferable that it is formed by filling a pin filler, a boron nitride filler, or a ceramic filler.

The thickness of the reinforcing plate integrated solder resist coverlay is preferably 10um to 200um in order to form a flexible printed circuit board.

The thickness of the solder resist coverlay is preferably 100um or more, or made of high-strength plastic resin in order to form a rigid printed circuit board.

Preferably, the reinforcing plate integrated solder resist coverlay is formed with at least one solder land hole.

The metal thin film reverse electronic circuit pattern laminates a developing film on a bottom surface of the metal thin film, and performs reverse exposure of the electronic circuit pattern on the developing film to form a reverse electronic circuit pattern on the developing film, and then develops the developing film. And, it is preferred that the produced in such a way to corrode the metal thin film.

And at least one or more metal thin film reverse electronic circuit pattern protection means for protecting a part or all of the metal thin film reverse electronic circuit pattern.

Preferably, the metal thin film reverse electronic circuit pattern protection means is protection means for protecting a solder land hole side metal thin film reverse electronic circuit pattern portion of the metal thin film reverse electronic circuit pattern.

The metal thin film reverse electronic circuit pattern protection means protects the reverse metal thin film reverse electronic circuit pattern portion opposite the reinforcement plate integrated solder resist coverlay at a position corresponding to the solder land hole in the metal thin film reverse electronic circuit pattern. It is preferable that it is a means.

It is preferable that the said solder land hole side metal thin film reverse electronic circuit pattern partial protection means is an organic protective film or preset plating.

The reverse metal thin film reverse electronic circuit pattern protection means opposite the reinforcement plate integrated solder resist coverlay in a position corresponding to the solder land hole is a predetermined coating on the reverse electronic circuit pattern side surface opposite the reinforcement plate integrated solder resist coverlay. It is preferable that it is a coating film formed through a process.

The reverse metal thin film reverse electronic circuit pattern coating treatment opposite to the reinforcement plate integrated solder resist coverlay in a position corresponding to the solder land hole is to produce an organic protective film or to apply insulating ink or boron nitride or ceramics. It is preferable that it is.

The reverse metal thin film reverse electronic circuit pattern coating process on the opposite side of the solder resist coverlay in a position corresponding to the solder land hole is preferably coated with carbon nanotubes or graphene.

In order to achieve the technical problem to be achieved by the present invention, there is provided a heat dissipation module characterized in that the use of the printed circuit board.

The heat dissipation module may include the printed circuit board; Thermally conductive media; And a heat dissipation medium.

Preferably, the thermally conductive medium is any one or more than one of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, or a thermally conductive grease.

The heat dissipation medium is preferably any one of a heat sink or a heat dissipation case.

In order to achieve the technical problem to be achieved by the present invention, it proposes an LED module characterized in that using the above-described printed circuit board.

In order to achieve the technical problem to be achieved by the present invention, it proposes an LED module characterized in that using the above heat dissipation module.

The present invention has the following effects.

First, a printed circuit board having good heat dissipation efficiency, a heat dissipation module including the high thermal conductive printed circuit board, and an LED module including the heat dissipation module can be enabled.

Second, high thermal conductivity PCBs with innovative heat dissipation efficiency of electronic components are possible.

Third, a high thermal conductivity FPCB capable of good heat dissipation efficiency and curved design of electronic components is possible.

Fourth, it is possible to produce a low cost, high thermal conductivity PCB with good heat dissipation and low cost.

Fifthly, it is possible to innovatively reduce the size and develop an emotional and original streamlined design LED module.

Sixth, it is possible to innovatively reduce the size and develop an emotional and original streamlined design LED lighting products.

Seventh, by innovatively improving the heat dissipation efficiency of various electronic products such as mobile phones, smartphones, notebook PCs, tablet PCs, mobile printers, etc. to reduce the size and weight of products, and implement curved designs and free designs impossible with existing rigid FR4 PCBs or metal PCBs. This is possible.

1 to 3 are diagrams showing the structure of a conventional general FPCB, general FR4 PCB or metal PCB, respectively.
4 to 5 are views of the structure of the heat dissipation module of the conventional general FPCB and metal PCB assembly, respectively.
FIG. 6 is an exemplary view of a reinforcement plate coverlay integrated printed circuit board structure for high thermal conductivity efficiency of the present invention.
FIG. 7 is a view illustrating an exemplary configuration of a plane in which solder land holes are processed in the reinforcing plate integrated solder resist coverlay of the present invention.
FIG. 8 is a diagram illustrating an exemplary configuration of a plane on which the metal thin film reverse electronic circuit pattern is processed.
FIG. 9 is an exemplary view of an AA cross section of the printed circuit board in which the FIG. 7 reinforcement plate integrated solder resist coverlay and the FIG. 8 metal thin film reverse electronic circuit pattern are combined. FIG.
FIG. 10 is an exemplary diagram of a BB cross section of the printed circuit board in which the FIG. 7 reinforcement plate integrated solder resist coverlay and the FIG. 8 metal thin film reverse electronic circuit pattern are combined.
11 is a reinforcement plate coverlay for high thermal conductivity efficiency of the present invention in which an organic protective film (OSP) or insulation ink or boron nitride or ceramic or carbon nanotube or graphene coating is applied to the reverse electronic circuit pattern side. One exemplary diagram of an integrated printed circuit board.
12 is a view illustrating an exemplary embodiment of a structure of a heat dissipation module of a reinforcement plate coverlay integrated printed circuit board assembly for high thermal conductivity efficiency of the present invention.
FIG. 13 is an exemplary view of a heat dissipation module of a reinforcing plate coverlay integrated printed circuit board assembly for high thermal conductivity efficiency using the high thermal conductive adhesive bond of the present invention.
FIG. 14 is an exemplary view of a reinforcing plate coverlay integrated printed circuit board assembly heat dissipation module for high thermal conductivity efficiency using the high thermal conductivity double-sided foam tape of the present invention.
15 is a view of a reinforcement plate coverlay integrated flexible printed circuit board (Base Free FPCB) for high thermal conductivity efficiency of the present invention.
FIG. 16 is a view illustrating an exemplary embodiment of a rigid free printed circuit board of a reinforcement plate coverlay for high thermal conductivity of the present invention.
17 is an exemplary diagram of a method of manufacturing a printed circuit board of the present invention.
18 is a conceptual view of a method for processing a solder land hole by a roll-to-roll method.
FIG. 19 illustrates an example in which a metal thin film for an electronic circuit pattern and a solder resist cover lay in which a reinforcement plate integrated with a solder land hole are processed are bonded.
FIG. 20 is a diagram illustrating one example of bonding a photo resist film laminating and a carrier film.
FIG. 21 is an exemplary diagram in which reverse circuit pattern exposure is performed on a developing film. FIG.
FIG. 22 is an exemplary diagram as to which the developing film is developed. FIG.
FIG. 23 is an exemplary diagram as to where etching is performed.
FIG. 24 is an exemplary view of the stripping being performed.
FIG. 25 is an exemplary diagram of removal of a carrier film. FIG.
FIG. 26 is an exemplary diagram for front acid treatment (Acid Rinse) and drying. FIG.
FIG. 27 is an exemplary diagram of forming or plating an organic protective film (OSP) on a solder land.
FIG. 28 is a diagram illustrating one embodiment in which an organic protective film (OSP), an insulating ink, or boron nitride, ceramics, carbon nanotubes, or graphene are coated on a side of a reverse electronic circuit pattern.
FIG. 29 is an exemplary diagram of another method of manufacturing a printed circuit board of the present invention including a process of coating an electronic circuit pattern with carbon nanotubes or graphene.
30 is an exemplary view of another method of manufacturing the printed circuit board of the present invention, that is, a method of laser processing solder lands in a reinforcement plate integrated solder resist.
FIG. 31 is a view illustrating bonding a reinforcing plate-integrated cover lay film in which a metal thin film for forming an electronic circuit pattern and a solder land hole are not processed in a method of processing a solder land with a laser. Figure 1 is an exemplary diagram.
32 is a diagram illustrating an example of laminating a dry film on a metal thin film in a method of processing a solder land with a laser.
FIG. 33 is a diagram illustrating an example of reverse circuit pattern exposure on a laminating surface of a metal thin film in a method of processing a solder land with a laser.
FIG. 34 is an exemplary view of developing a laminating film for generating a reverse electronic circuit pattern in a method of laser processing a solder land. FIG.
FIG. 35 is an exemplary diagram of corrosion of a metal thin film for generation of a reverse electronic circuit pattern in a method of laser processing a solder land. FIG.
FIG. 36 is a diagram illustrating an example of peeling a laminating film remaining in a reverse electronic circuit pattern in a method of processing a solder land with a laser.
FIG. 37 illustrates a method of laser processing solder lands, in which a solder land hole is laser-processed in the reinforcement plate integrated solder resist coverlay for solder lands to solder the electronic components to the PCB. One exemplary diagram relating to a.
FIG. 38 is an exemplary diagram for acid treating and drying a PCB of the present invention. FIG.
FIG. 39 is a diagram for one embodiment of applying electrically conductive carbon nanotubes, electrically conductive graphene, or electrically conductive ceramics after short circuit prevention masking on the reverse electronic circuit pattern side of the present invention.
40 is a reinforcing plate coverlay integrated for high thermal conductivity efficiency using a combination of a high thermal conductive adhesive bond and a high thermal conductive foam tape on the printed circuit board integrated printed circuit board for high thermal conductivity efficiency of the present invention One embodiment of a printed circuit board assembly heat dissipation module is shown.
FIG. 41 is a view illustrating an embodiment of a heat dissipation module of a reinforcement plate coverlay integrated printed circuit board assembly for high thermal conductivity using a combination of a high thermal conductive adhesive bond and a high thermal conductive pad of the present invention.
42 is a carbon nanotube or graphene or nitride having good thermal conductivity on the inner side or the outer side or the inner side and the outer side of the material of polyimide, PET, PC, PE, PEEK to maximize the heat dissipation function of the present invention 1 is a view illustrating an exemplary configuration of the reinforcement plate integrated solder resist coverlay formed by coating boron or ceramic.
43 is formed by filling a good thermal conductivity of carbon nanotube filler or graphene filler or boron nitride filler or ceramic filler in the material of polyimide, PET, PC, PE, PEEK to maximize the heat dissipation function of the present invention 1 is a view illustrating an exemplary configuration of the reinforcing plate integrated solder resist coverlay.
FIG. 44 is an exemplary diagram of an LED PCB designed using a high thermal conductivity PCB.
45 is an exemplary diagram of a radial or cylindrical LED module that is curved by design using a high thermal conductivity PCB module.
FIG. 46 is a view illustrating an LED lighting lamp structure using a general hard metal PCB. FIG.
FIG. 47 is a diagram for one embodiment of maximizing light diffusion and minimizing product size using a high thermal conductivity PCB. FIG.
FIG. 48 is a view showing another embodiment of maximizing light diffusion and minimizing product size using a high thermal conductivity PCB.
FIG. 49 is a view showing another embodiment of maximizing light diffusion and minimizing product size using LED lamps using a high thermal conductivity PCB. FIG.
FIG. 50 is a view showing another embodiment of maximizing light diffusion and minimizing product size using LED lamps using a high thermal conductivity PCB. FIG.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

As can be seen in Figure 6, the printed circuit board of the present invention is a metal thin film reverse electronic circuit pattern 200 on the bottom of the reinforcement plate integrated solder resist coverlay 100 and the reinforcement plate integrated solder resist coverlay 100 on the top layer The formed metal thin film reverse electronic circuit pattern 200, wherein the reinforcement plate integrated solder resist coverlay 100 and the metal thin film reverse electronic circuit pattern 200 is a high thermal conductive bonding sheet 510 ( Bonded sheets). The printed circuit board includes at least one metal thin film reverse electronic circuit pattern protection means for protecting part or all of the metal thin film reverse electronic circuit pattern 200. Solder lands in which the reinforcement plate integrated solder resist on the surface of the reinforcement plate integrated solder resist coverlay 100 of the metal thin film reverse electronic circuit pattern 200 are opened may have an organic protective film (OSP; Organic) to prevent oxidation of the metal thin film. Solderability Preservative) or the oxidation prevention portion 300 is plated is formed. The solder resist coverlay is a solder resist coverlay used to protect the surface on which the metal thin film reverse electronic circuit pattern 200 is formed on the printed circuit board, thereby preventing damage to the printed circuit board and structural durability of the printed circuit board. It is formed integrally with the reinforcing plate used for securing purposes.

Figure 7 shows an exemplary configuration of the reinforcing plate integrated solder resist coverlay 100 of the present invention. At least one solder land hole 840 is formed in the reinforcing plate integrated solder resist coverlay 100. 8 shows an exemplary configuration of the metal thin film reverse electronic circuit pattern 200. 7 and 8, it can be seen that there are two lines for illustrating the AA section and the BB section of the printed circuit board. FIG. 9 is an exemplary diagram of an AA cross section of the printed circuit board, and FIG. 10 is an exemplary diagram of a BB cross section of the printed circuit board. 9 and 10, it can be seen that the metal thin film reverse electronic circuit pattern 200 exists under the solder land hole 840. On the other hand, as can be seen in Figure 10, the solder land hole 840 is always formed on the metal thin film reverse electronic circuit pattern 200, it can be seen that there are some. On the other hand, the solder land hole 840 is preferably formed smaller than the width (line width) of the line forming the metal thin film reverse electronic circuit pattern 200. In addition, the metal thin film reverse electronic circuit pattern 200 may include a ground pattern, and the metal thin film ground pattern may be formed with a substantially wide surface.

The metal thin film reverse electronic circuit pattern 200 laminates the development film 620 on the bottom surface of the metal thin film, and performs reverse exposure of the electronic circuit pattern on the development film 620, thereby forming the metal thin film on the development film 620. After the reverse electronic circuit pattern 200 is formed, the developing film 620 is developed, and the metal thin film is preferably generated in such a manner as to corrode the metal thin film. Existing printed circuit board is laminated by developing the developing film on the upper surface of the printed circuit board metal (for example, Cu) thin film on which the electronic circuit pattern is to be formed, and exposing the developing film in the forward direction on the upper surface of the metal thin film of the printed circuit board on which the electronic circuit pattern is to be formed. The method of forming a circuit pattern was used. However, since the reinforcement plate coverlay integrated printed circuit board of the present invention for high thermal conductivity efficiency makes a printed circuit board without a separate reinforcement plate at the bottom of the metal circuit pattern during the production process, the conventional printed circuit board production process and reverse exposure and Differentiated production process techniques including generating reverse electronic circuit patterns are applied.

The metal thin film reverse electronic circuit pattern protection means is a solder land hole for protecting a portion of the metal thin film reverse electronic circuit pattern 200 at a position corresponding to the solder land hole 840. The metal thin film reverse electronic circuit pattern 200 on the side of the (840) side or the reverse electronic circuit pattern side surface opposite to the reinforcing plate integrated solder resist coverlay 100 of the metal thin film reverse electronic circuit pattern 200. May be a coating treatment. As can be seen in FIG. 11, an insulating protective film layer 520 is formed on the bottom surface of the reverse electronic circuit pattern formed of a metal thin film on the opposite side of the reinforcing plate integrated solder resist coverlay 100. Can be. Coating may be a kind of the protective treatment. The coating may be formed of an organic protective film (OSP) to prevent oxidation of the metal thin film reverse electronic circuit pattern 200 and to facilitate handling of the PCB, and may include an insulating ink or boron nitride or ceramic or insulating CNT. Or with insulating graphene.

On the other hand, the bottom surface of the metal thin film reverse electronic circuit pattern 200 on the surface opposite the reinforcing plate integrated solder resist coverlay 100 prevents oxidation of the metal thin film reverse electronic circuit pattern 200 and facilitates the handling of the PCB. In order to increase thermal conductivity, carbon nanotube or graphene material may be coated.

FIG. 15 illustrates a flexible printed circuit board having a smaller thickness of the reinforcing plate integrated solder resist coverlay 100 than the rigid printed circuit board of FIG. 16. In the case of the flexible printed circuit board, the thickness of the reinforcement plate integrated solder resist coverlay 100 is often 10 μm to 200 μm, and the rigid printed circuit board is generally thicker than 100 μm. The material of the reinforcing plate integrated solder resist coverlay 100 is preferably polyimide, PET, PC, PE, PEEK or other plastics, and since there is no separate reinforcing plate, it may be desirable to require a certain degree of firmness or strength. .

FIG. 15 is an exemplary diagram for a flexible printed circuit board, and FIG. 16 is an exemplary diagram for a rigid printed circuit board.

Next, the manufacturing method of the printed circuit board of this invention is demonstrated, referring FIGS. 17-39.

17 is an exemplary diagram of a method of manufacturing a printed circuit board of the present invention.

In order to manufacture the printed circuit board of the present invention, first, a reinforcing plate integrated solder resist coverlay 100 (Base Integrated Solder Resist Cover Lay) is prepared (S1-1). Subsequently, the reinforcement plate integrated solder resist coverlay 100 and the solder land hole 840 are processed (S1-2). 18 illustrates a conceptual diagram of a method of processing solder land holes using the reinforcement plate integrated solder resist coverlay 100 by a roll-to-roll method. In FIG. 18, the left side shows the solder resist coverlay before the solder land hole processing 810 on the roll, and the right side shows the reinforcement plate integrated solder resist coverlay 100 after the solder land hole processing 830 on the roll. It is showing the wound. 18 illustrates a process 820 of solder land holes in which solder land holes 840 are formed in the reinforcement plate integrated solder resist coverlay 100. The roll-to-roll method is characterized in that the solder land cover is formed by perforating the solder land hole without unrolling the solder resist coverlay roll and winding the reinforcing plate-integrated solder resist coverlay 100 in which the solder land hole is processed. When the solder land hole 840 is processed in a roll state, the reinforcing plate-integrated solder resist coverlay 100 is transferred to a metal (eg, copper) thin film and a developing film 620 (Photo Resist Dry Film) and a carrier in the following process. The process of adhering to the film 610 or the like and subsequent exposure, development, corrosion, and peeling process also have advantages in that they can be used as a roll to roll method.

Subsequently, the metal thin film and the solder land hole 840 for the electronic circuit pattern are bonded to the reinforcing plate-integrated solder resist coverlay 100 (S1-3). A shape in which a reinforcing plate integrated solder resist coverlay 100 having a metal thin film and a solder land hole 840 is adhered to each other is illustrated in FIG. 19. Adhesion may be performed with a bonding sheet 510 or other adhesion medium.

Subsequently, the developing film 620 is formed by performing a treatment such as laminating on the lower surface of the metal thin film. Conventional PCB laminates the developing film 620 on the upper surface of the PCB metal thin film on which the electronic circuit pattern is to be formed, but the reinforcement plate coverlay integrated printed circuit board for high thermal conductivity efficiency has the electronic circuit pattern on the bottom of the PCB metal thin film on which the electronic circuit pattern is to be formed. In order to form in the reverse direction, the electronic circuit pattern is laminated on the bottom of the PCB metal thin film to be formed.

Then, the carrier film 610 for masking the solder land forming part is adhered to the upper surface of the reinforcing plate integrated solder resist coverlay 100 (S1-4). The carrier film 610 prevents the solder land of the metal thin film circuit pattern from being corroded and removed in a corrosion process during a printed circuit board manufacturing process, and prevents deformation of the PCB due to pressure and high temperature in development, peeling, corrosion, and plating processes. It performs the function.

FIG. 20 illustrates a configuration in which a developing film 620 and a laminating and carrier film 610 are bonded to each other.

Subsequently, a reverse circuit pattern exposure (S1-5) for generating a reverse electronic circuit pattern 630 on the developing film 620 is performed. In the printed circuit board of the present invention, since the metal thin film adhered to the bottom of the reinforcing plate integrated solder resist coverlay 100 must be processed to form a reverse circuit pattern, the development film 620 adhered to the bottom of the metal thin film is formed. Exposure in the reverse direction of the electronic circuit pattern. In order to expose the reverse circuit pattern of the developing film 620, a circuit board having a reverse circuit pattern mask film installed on the exposure machine is placed on the exposure film 620 adhered to the bottom of the metal thin film. The circuit board is exposed in the reverse direction of to form a reverse circuit pattern. 21 illustrates a configuration in which the reverse circuit pattern exposure is performed on the developing film 620.

Subsequently, the exposed developing film 620 is developed (S1-6). In the exposure process, a mask having a desired reverse circuit pattern is formed on a developing film 620 coated with photo-resist (PR) that reacts to light, and then exposed to ultraviolet rays to transfer the desired reverse circuit pattern to the photosensitive film to reverse the reverse circuit pattern. This forms. In the exposure process, when the lighted part reacts and is removed in the developer, it is called positive. When the unlighted part is removed, it is called negative. 22 shows a configuration in which a developing film is developed.

Subsequently, etching (S1-7) is performed. The corrosion process refers to forming a reverse electronic circuit pattern 630 by treating a metal thin film in a portion where the developing film 620 is developed with an alkali chemical such as ammonium chloride (NH 4 Cl). 23 shows a configuration in which corrosion is performed. As a result of the corrosion treatment, an electronic circuit pattern is formed on the metal thin film.

Subsequently, a stripping (S1-8) process of removing the developing film 620 is performed, and the carrier film 610 is removed (S1-9). Then, the front acid treatment (Acid Rinse) and drying (S1-10) process is performed. 24 illustrates a configuration in which peeling is performed, and FIG. 25 illustrates a configuration in which the carrier film 610 is removed.

Subsequently, in order to prevent oxidation of the solder land metal thin film, an organic protective film (OSP) or plating (S1-11) process is performed to form the oxidation prevention part 300. Since the metal thin film of the solder land is oxidized when it is directly in contact with the atmosphere, it covers the thin salt layer dissolved on the surface of the metal for the purpose of interfering with the atmosphere. The mixed salt used for this is called flux. The mixed lead of the organic protective film (OSP) is important to use a chloride, fluoride, resin, etc., and to maintain the correct acidity pH 2.0 to 3.0.

 In the plating process, a plating layer having a small amount of 0.02um to 0.06um is formed through electroless plating, and the metal plating of the solder land is prevented from being oxidized by plating with a thickness of about 10um to 50um in the dielectric plating process. In FIG. 27, an oxidation protection part 300 formed of an organic protective film or plating is illustrated in the solder land hole 840.

Subsequently, in order to secure insulation and corrosion protection of the bottom of the metal thin film reverse electronic circuit pattern formed of the metal thin film, an organic protective film (OSP) is formed on the surface of the reverse electronic circuit pattern formed of the metal thin film opposite to the reinforcement plate integrated solder resist coverlay 100. ) Can be created. When the organic protective film (OSP) is generated, the insulating function between the metal thin film reverse electronic circuit pattern 200 and the heat sink can be enhanced and the handleability of the PCB can be improved.

The organic protective film (OSP) is an environmentally friendly PCB surface treatment method for replacing the HSAL (Hot Solder Air Leveling) method in which lead (Pb) is used. An organic protective film (OSP) formed on the bottom surface of the metal thin film electronic circuit pattern of the PCB protects the metal thin film electronic circuit pattern surface from outside air and moisture. OSP is mainly composed of alkylbenzimidazole derivatives and has a thickness of 0.2um to 0.45um.

Resist ink or boron nitride or ceramics are applied to the surface of the reverse electronic circuit pattern side opposite to the reinforcing plate-integrated solder resist coverlay 100 in order to ensure more stable insulation and corrosion protection of the bottom of the electronic circuit pattern (S1). -12) Resist Ink or boron nitride or ceramic is applied to the bottom of the electronic circuit pattern formed of the metal thin film to more stably ensure insulation and corrosion protection of the bottom of the electronic circuit pattern formed of the metal thin film. Resist Ink or boron nitride or ceramic may be applied to enhance the insulating function between the metal thin film reverse electronic circuit pattern 200 and the heat sink and to improve the handling of the PCB.

By the above method, the insulating protective coating layer 520 made of insulating ink or boron nitride or ceramic or organic protective coating (OSP) or insulating CNT or insulating graphene can be generated.

In the insulating ink coating method or the boron nitride or ceramic coating method, a thermosetting ink is directly applied by a silk screen printing method or an inkjet printing method in the case of a low density PCB, and a photosensitive ink (Ph oto S) is applied in a similar manner to the circuit formation in the case of a high density PCB. / R) by silk screen printing or spray coating, there is a method of removing unnecessary parts by exposure and development, followed by thermosetting coating.

In addition, to selectively secure the insulation and corrosion protection of the bottom of the electronic circuit pattern, and to maximize the heat dissipation of heat generated from the electronic components such as LED, semiconductor, and transferred to the metal thin film reverse electronic circuit pattern 200, Graphene may be applied to the surface of the metal thin film reverse electronic circuit pattern 200 opposite to the reinforcing plate integrated solder resist coverlay 100 (S2-9).

The coating of the CNT or graphene is formed by the following method.

CNT (Carbon Spiral Tube) is a carbon fiber composite material in which a graphite sheet, which is one of allotrope of carbon, is rounded to a nano size diameter. Carbon nanotubes are cylindrical (tube) -shaped carbon fiber composite materials in which carbon layers of hexagonal honeycomb structure composed of six carbons are thin and long connected. CNTs include single-walled CNTs (SWNTs), multi-walled CNTs (DWNTs), and multi-walled CNTs (MWNTs), depending on the honeycomb carbon layer. Carbon nanotubes are four times stronger than steel, 50% lighter than aluminum, have excellent electrical conductivity and thermal conductivity that surpass diamond, which is the best in nature. Synthesis techniques of CNTs include arc-discharge, laser vapor deposition, or chemical vapor deposition. Carbon nanotubes are carbon fiber composites in which carbon atoms are continuously bonded in a hexagonal structure to form a plane of one atom thick. Carbon nanotubes are two-dimensional planar thin-film carbon fiber composites with a layer of carbon atoms. The honeycomb shape is also strong against impact. Just as you bend or pull the net, the shape changes, but the connection state of the net does not change. The strength is 100 times stronger than steel, and the elasticity is good enough to increase 20% of the area. Bending or stretching does not dissipate the electrical conductivity. Thermal conductivity is more than 10 times that of copper, which is metal, and is transparent enough to pass 98% of light.

<Comparison of Thermal Conductivity of Graphene and Carbon Nanotubes> matter Thermal Conductivity Kcal / m.hr.'C Carbon nanotubes 6,000 Grapina 5,000 Diamond 1,300-2,400 silver 360 Copper 320 gold 265 aluminum 175 plastic 0.2 to 0.5 paper 0.03-0.2

As described above, carbon nanotubes or carbon nanotubes having excellent thermal conductivity compared to other materials such as copper and diamond are coated on the bottom of the PCB circuit pattern and the ground earth pattern to further maximize thermal conductivity. It becomes a circuit board.

There is a wet coating method in which a CNT dispersion or a graphene raw material is ground or cut and then coated by applying a CNT dispersion to a target film. Coating of carbon nanotubes or graphene may be performed by spraying carbon nanotubes or graphene with a solvent such as water, ethanol (IPA) or acetate and spraying them, or coating them in the form of carbon nanotubes or graphene paste. . It is possible to secure excellent properties of carbon nanotubes or graphene coating through drying or UV treatment using a heat dryer.

There is also a dry coating method that can be used to coat CNTs or graphene as soon as it is produced, increasing performance while reducing costs and processes.

FIG. 28 illustrates a configuration in which an insulating ink or boron nitride, a ceramic or an organic protective film (OSP), or an insulating carbon nanotube or an insulating carbon nanotube is applied to an electronic circuit pattern.

FIG. 29 is an exemplary diagram of another method of manufacturing a printed circuit board of the present invention including a process of coating an electronic circuit pattern with carbon nanotubes or graphene. As can be seen in FIG. 29, a cover lay film in which PCB land holes at an soldering position of an electronic component such as an LED or a semiconductor is formed is bonded to a metal thin film for forming an electronic circuit pattern (S2). -1), laminating the developing film 620 for the exposure of the electronic circuit pattern formation on the metal thin film surface and adhering the carrier film 610 for masking the PCB land forming portion on the coverlay film surface (S2-2). And exposing the electronic circuit pattern on the laminating surface of the metal thin film in the reverse direction (S2-3), developing the laminating film for the electronic circuit reverse pattern (S2-4), and etching the metal thin film for the electronic circuit reverse pattern (S2- 5), the process of peeling the laminating film remaining in the electronic circuit reverse pattern (S2-6), removing the carrier film 610 (S2-7), and acid treatment and drying (S2-8) are described above with reference to FIG. 17. Is the same as the preparation method.

Subsequently, a bottom surface and / or a ground earth pattern of the metal thin film reverse electronic circuit pattern 200 of the printed circuit board is coated with an insulating carbon nanotube or a coating solution of insulating carbon nanotube material (S2-9). .

In this case, when the coating is performed using an electrically insulating carbon nanotube solution or CNT solution, carbon nanotube paste or CNT paste, the entire bottom surface of the printed circuit board having the metal thin film reverse electronic circuit pattern 200 and / or the ground ground pattern is coated. can do.

In case of coating with electroconductive carbon nanotube solution or graphene solution, carbon nanotube paste or CNT paste, the metal thin film using masking tape or masking jig to expose only the metal thin film reverse electronic circuit pattern 200 and / or the ground ground pattern surface The reverse electronic circuit pattern 200 and / or the ground ground pattern should be coated to prevent short circuits.

An example of a printed circuit board including electroconductive carbon nanotubes or electroconductive graphene coating 710 is well illustrated in FIG. 39. It will be appreciated that the example of FIG. 39 can be applied to both a hot press method and a land hole laser method described later.

 Compared to other materials, carbon nanotubes or graphene, which have excellent thermal conductivity, are coated on the bottom of the PCB circuit pattern and the ground earth pattern, thereby making the printed circuit board more maximized in thermal conductivity.

Next, another method of manufacturing a printed circuit board of the present invention including a land hole laser processing method will be described with reference to FIGS. 30 to 39.

First, a cover lay film is adhered to a metal thin film for forming an electronic circuit pattern (S3-1). The coverlay film may be made of polyimide, PC, PE or PEEK. As can be seen in Figure 31, it can be seen that the solder land hole is not formed in the coverlay film.

Subsequently, the developing film 620 (Laminating Dry Film) is laminated on the metal thin film (S3-2), the laminating surface of the metal thin film is exposed in the reverse direction of the electronic circuit pattern (S3-3), and the electronic circuit reverse pattern is exposed. The laminating film development (S3-4), the metal thin film corrosion (S3-5) for the electronic circuit reverse pattern, and the laminating film peeling (S3-6) remaining in the electronic circuit reverse pattern is as described above. Since it is the same or at least corresponding, the detailed description is omitted. 32 to 36 exemplarily show the configuration when each step process is applied.

Subsequently, a process of laser processing (S3-7) a land hole for a PCB land for soldering electronic components such as LED and semiconductor to the PCB is performed. FIG. 37 shows the configuration after laser processing a land hole for a PCB land to solder an electronic component to the PCB.

Subsequently, an acid treatment (Mordant) and drying (S3-8) process is performed, and optionally, the bottom surface and / or the ground earth pattern of the metal thin film reverse electronic circuit pattern 200 may be replaced with an organic protective film (OSP). Alternatively, the coating layer may be coated with a resist ink, boron nitride, or ceramic, or coated with a coating solution of carbon nanotube or graphene material (S3-9).

It may also optionally be applied as an electroconductive graphene solution or CNT solution or graphene paste or CNT paste. When the electrically conductive solution is applied, the metal thin film reverse electronic circuit pattern 200 and / or the ground ground pattern are short-circuited using a masking tape or a masking jig to expose only the metal thin film reverse electronic circuit pattern 200 and / or the ground ground pattern surface. It should be coated so as not to be a short circuit. An example of a printed circuit board including an electrically conductive carbon nanotube or electrically conductive graphene coating 710 is well illustrated in FIG. 39.

Subsequently, an inspection process S3-10 may be performed. On the other hand, although not shown, the organic protective film in order to protect the metal thin film solder land in which the solder resist coverlay is opened and then solder the electronic parts such as LEDs and semiconductors after processing the land holes with the laser. (OSP) formation or plating treatment may be performed.

Next, the article using the printed circuit board manufactured by the manufacturing method of the said printed circuit board is demonstrated. The printed circuit board of the present invention may be used in a heat dissipation module, and the heat dissipation module may be utilized in an LED module or the like.

12 to 14 and 40 to 41 are exemplary views of a heat dissipation module using the printed circuit board.

Reinforcement plate coverlay integrated printed circuit board assembly heat dissipation module for high thermal conductivity efficiency of the present invention is a high thermal conductivity adhesive bond 530, high thermal conductivity of the printed circuit board assembly for high thermal conductivity efficiency mounted electronic components such as LED, semiconductor Adherents such as conductive pads 550 and high thermal conductive double-faced foam tape 540 may be used singly or in combination, or adhesives such as LEDs or semiconductors may be adhered to a heat sink using a single or multiple adhesive materials. PCB assembly heat dissipation module that maximizes the heat dissipation function of PCB assembly.

FIG. 12 is a view illustrating a structure of a heat dissipation module of a printed circuit board assembly for high heat conduction efficiency according to an embodiment of the present invention. The high heat conductive adhesive bond 530 is used to heat the printed circuit board such as a heat sink or a heat dissipation case. It is shown that it is coupled to the medium portion 400. At this time, the high thermal conductive adhesive bond 530 should be electrically insulating, and the metal thin film electronic circuit patterns should be quantitatively applied and bonded to enable high thermal conductivity at the same time without generating a short circuit. FIG. 13 is an exemplary view of a printed circuit board assembly heat dissipation module for high thermal conductivity efficiency using the high thermal conductive adhesive bond 530 of the present invention.

Figure 14 is a high thermal conductive double-sided foam tape (Foam Tape) in bonding a reinforcement plate coverlay integrated printed circuit board (Base Free FPCB) for high thermal conductivity efficiency of the present invention to a heat dissipation medium 400 such as a heat sink or a heat dissipation case FIG. 1 is a diagram illustrating an example of a printed circuit board assembly heat dissipation module for high thermal conductivity efficiency.

40 is a high thermal conductive adhesive bond 530 and a high thermal conductive foam tape in bonding a reinforcement plate coverlay integrated printed circuit board for high thermal conductivity efficiency of the present invention to a heat dissipation medium 400 such as a heat sink or a heat dissipation case. (Foam Tape) 540 is an exemplary embodiment of a printed circuit board assembly heat dissipation module for high thermal conductivity efficiency using a composite, Figure 41 is a reinforcement plate coverlay integrated printed circuit board for high thermal conductivity efficiency of the present invention To a heat dissipation module for high thermal conductivity using a high thermal conductive adhesive bond 530 and a high thermal conductive pad 550 in combination with a heat dissipation medium 400 such as a heat sink or a heat dissipation case. Figure 1 is an exemplary diagram. 40 to 41, it can be seen that the conductive carbon nanotube or graphene coating layer 710 is formed on the bottom surface of the metal thin film reverse electronic circuit pattern 200.

When bonding the bottom of the PCB assembly metal (Cu) thin film circuit pattern of the present invention to the heat sink, it is possible to simultaneously use the high thermal conductive double-sided foam tape or high thermal conductive adhesive bond (530), etc. The heat of the electronic components such as LEDs and semiconductors transferred to the electronic circuit pattern 200 does not pass through various reinforcement plates and additional reinforcement plate adhesive sections of the PCB, and the adhesive such as the high thermal conductive adhesive bond 530 and the high thermal conductive double-sided foam tape. Since only the (Adherent) section passes through and conducts heat directly to the heat sink, the contact resistance of the PCB itself can be minimized to maximize heat dissipation efficiency.

The heat dissipation module using the printed circuit board of the present invention can reduce the size of the heat dissipation medium 400 such as the heat sink or the heat dissipation case because the heat dissipation efficiency is higher than that of the conventional PCB assembly heat dissipation module such as a conventional rigid FR4 PCB, a general FPCB, or a metal PCB. Therefore, the light and slim design of electronic products is possible. On the other hand, since the printed circuit board of the present invention does not use the reinforcement plate used in the existing general printed circuit board, it is thinner than the general FR4 printed circuit board or the metal printed circuit board, thereby improving workability. Accordingly, the printed circuit board of the present invention overcomes the product surface design limitations of the conventional FR4 PCB and the metal PCB, and enables free curved design of various products as in the case of using a conventional general FPCB. Enables free curved design design, which is an advantage of the existing general FPCB assembly heat dissipation module, enables innovative SLIM design of electronic products, while overcoming the lack of thermal conductivity, which is a disadvantage of the conventional general FPCB assembly heat dissipation module, It can be effectively used in the design of electronic products requiring heat dissipation efficiency, such as smart phones, notebook PCs, tablet PCs, mobile printers. In addition, since there is no separate reinforcement plate such as epoxy base plate of rigid FR4 PCB, polyimide base plate of general FPCB, or aluminum base plate of metal PCB, it is possible to reduce the cost of printed circuit board. Can be.

On the bottom of the metal thin film reverse electronic circuit pattern 200 of the present invention, an epoxy base plate of an existing rigid FR4 PCB, an polyimide base plate of a general FPCB, or an aluminum base plate of an aluminum PCB, etc. Since there is no separate reinforcement plate, there is no thermal resistance of various reinforcement plates themselves. In addition, since there is no contact between the circuit pattern of the existing PCB, the adhesive interface of the adhesive, and the interface between the adhesive and the reinforcing plate, there is no contact thermal resistance at various interfaces, so that heat generated from electronic components such as LEDs and semiconductors is metal (eg; Since only the Cu) thin film circuit pattern is transferred to the heat sink, heat dissipation efficiency may be maximized.

On the other hand, when the LED module PCB assembly is made using the high thermal conductivity PCB of the present invention, the heat dissipation function is improved, in which heat generated from the LED is conducted to the heat sink, thereby reducing the difference between the junction temperature and the heat sink temperature of the LED, and thus assuming the same LED junction temperature. The design reduces the heat sink size, enabling a lightweight heat dissipation module. These lightweight heat dissipation modules enable the development of smaller and lighter LED lights, and the LED module PCB assemblies of LED lighting products can be designed with curved surfaces than conventional LED lighting products. The same heat dissipation medium unit 400 may be extended to the inside of the diffusion cap of the LED lighting product to enable the LED module to innovatively reduce the size of the heat dissipation plate to be seen.

The reinforcement plate integrated solder resist coverlay 100 has an inner side or an outer side or an inner side of a material which is one of polyimide, PET, PC, PE, and PEEK in order to maximize heat dissipation function generated from electronic components such as LEDs and semiconductors. It is preferably formed by coating the carbon nanotubes or graphene or boron nitride or ceramic having good thermal conductivity on both the outer and the outer surfaces.

FIG. 42 illustrates three representative embodiments in which the heat dissipation coating layer 770 is formed on the reinforcing plate integrated solder resist coverlay 100. FIG. 42A illustrates a structure in which the heat dissipation coating layer 770 is coated on the outer surface of the reinforcement plate integrated solder resist coverlay 100. FIG. 42B illustrates the heat dissipation coating layer 770 in the reinforcement plate integrated solder resist cover. 42A illustrates a structure in which the heat dissipation coating layer 770 is simultaneously coated on the inner side and the outer side of the reinforcing plate integrated solder resist coverlay 100. Doing. The heat dissipation coating layer 770 may be made of CNT or graphene or boron nitride or ceramic coating.

Meanwhile, the carbon nanotube filler or graphene filler or boron nitride filler or ceramic filler having good thermal conductivity is filled in the reinforcement plate integrated solder resist coverlay 100 made of polyimide, PET, PC, PE, PEEK, or the like. To maximize heat dissipation. FIG. 43 exemplarily shows that the reinforcing plate integrated solder resist coverlay 100 is filled with a heat dissipation filler 780 such as a carbon nanotube filler or graphene filler or a boron nitride filler or a ceramic filler having good thermal conductivity. Is showing.

44 to 46 show an example of the high thermal conductivity PCB of the present invention and the LED lighting module using the same. FIG. 44 shows an embodiment of an LED PCB designed using a high thermal conductivity PCB, and FIG. 45 shows an embodiment of a radial or cylindrical LED module designed using a high thermal conductivity PCB module. have.

FIG. 46 is a view illustrating an LED lighting lamp structure using a general rigid METAL PCB. Since most of the LED lighting lamps have a heat dissipation case, the light diffusion part is extremely limited and the light diffusion angle is not wide. . In addition, it can be seen that the shape and structure of the LED lighting lamp did not vary.

On the other hand, as can be seen in Figure 47, when using the high thermal conductivity PCB of the present invention, most of the structure of the LED lighting lamp is composed of the light diffusing portion and the light diffusing surface is maximized to widen the light diffusion angle and product size Minimized LED lighting lamps are possible.

In addition, the printed circuit board for high thermal conductivity efficiency of the reinforcement plate integrated solder resist coverlay 100 formed of a plastic resin film or a plastic resin composite according to the use, characteristics, size, structure and design of the designer using the PCB. The thickness or raw material properties may be adjusted to be made of a high thermal conductivity FPCB (Flexible PCB) or a rigid PCB (Rigid PCB) having a ductile characteristic like a general FPCB.

The present invention can be widely used in the electronics industry, the lighting industry, and the like.

10: Masking Cover Lay
20: thermosetting adhesive bond
30: Copper Circuit Pattern
40: Polyimide Reinforcement Plate (Polyimide Base)
50: Masking PSR
60: adhesive bond (Bond)
70: epoxy base plate
80: insulated polyimide sheet
90: metal reinforcing plate (Metal Base)
95: high thermal conductivity adhesive bond
96: heat sink or heat dissipation case
100: reinforcement plate integrated solder resist coverlay
110: flexible reinforcement plate integrated solder resist coverlay
120: Rigid reinforcement plate integrated solder resist coverlay
200: metal thin film reverse electronic circuit pattern
300: oxidation prevention unit
400: heat dissipation medium
510: Bonding Sheet
520: Insulation protective film layer
530: High Thermal Conductive Adhesive Bond
535: thermosetting adhesive bond
540: High Thermal Conductive Foam Tape
545: High thermal conductivity adhesive bond coated on high thermal conductivity foam
550: High Thermal Conductive Pad
810: Before solder land hole machining
820: Solder Land Hole Machining
830: After solder land hole processing
840: Solder Land Hole
850: Solder Land
610: Carrier Film
620: Laminating Film
630: reverse electronic circuit pattern
640: developed laminating film
645: Laminating film removed by developing outside the electronic circuit
650: metal thin film removed due to corrosion outside the electronic circuit
660: Exposed developed film (Laminating Film)
670: Removed Carrier Film
680: Acid Treated and Dried Reverse Electronic Circuit Pattern
710: conductive carbon nanotube or graphene coating layer
730: adhesive bond
750: thin metal film
760: Laser Hole Machining
770: Heat dissipation coating layer of CNT or graphene or boron nitride or ceramic coating
780: heat dissipation filler of CNT or graphene or boron nitride or ceramic

Claims (20)

A reinforcement plate integrated solder resist coverlay for protecting the electronic circuit pattern of the printed circuit board;
A metal thin film reverse electronic circuit pattern in which a reverse electronic circuit pattern is formed;
An adhesive portion present between the metal thin film reverse electronic circuit pattern and the reinforcement plate integrated solder resist coverlay, the adhesive unit coupling the metal thin film reverse electronic circuit pattern and the reinforcement plate integrated solder resist coverlay; And
And at least one metal thin film reverse electronic circuit pattern protection means for protecting a part or all of the metal thin film reverse electronic circuit pattern.
The metal thin film reverse electronic circuit pattern protection means is a protection means for protecting the metal thin film reverse electronic circuit pattern portion of the solder land hole side of the metal thin film reverse electronic circuit pattern,
The metal thin film reverse electronic circuit pattern protecting means protects the reverse metal thin film reverse electronic circuit pattern portion opposite the reinforcement plate integrated solder resist coverlay at a position corresponding to the solder land hole in the metal thin film reverse electronic circuit pattern. Printed circuit board, characterized in that. The method of claim 1,
The reinforcing plate integrated solder resist coverlay is a printed circuit board, characterized in that the material of any one of polyimide, PET, PC, PE, PEEK. The method of claim 2,
Printed circuit board, characterized in that the coating of carbon nanotubes (CNT) or graphene, boron nitride or ceramic on any one or more of the inner surface and the outer surface of the reinforcement plate integrated solder resist coverlay. The method of claim 1,
The reinforcement plate integrated solder resist coverlay is formed by filling a CNT filler or graphene filler or a boron nitride filler or ceramic filler having good thermal conductivity to a material of polyimide, PET, PC, PE, or PEEK. Printed circuit board. The method of claim 1,
The reinforcement plate integrated solder resist coverlay is for a flexible printed circuit board, the thickness of the reinforcement plate integrated solder resist coverlay is 10um to 200um. The method of claim 1,
The reinforcement plate integrated solder resist coverlay is for a rigid printed circuit board, and the thickness of the reinforcement plate integrated solder resist coverlay is 100 μm or more, or a printed circuit board comprising a high strength plastic resin. The method of claim 1,
The metal thin film reverse electronic circuit pattern is
The development film is laminated on the bottom of the metal thin film, and the reverse exposure of the electronic circuit pattern is performed on the developing film to form a reverse electronic circuit pattern on the developing film, and then the developing film is developed to corrode the metal thin film. Printed circuit board, characterized in that it is produced in a manner. delete delete The method of claim 1,
And said solder land hole-side metal thin film reverse electronic circuit pattern portion protecting means is an organic protective film or a predetermined plating. The method of claim 1,
The metal thin film reverse electronic circuit pattern protection means
And a coating film formed on the surface of the reverse electronic circuit pattern side opposite to the reinforcement plate integrated solder resist coverlay of the metal thin film reverse electronic circuit pattern. 12. The method of claim 11,
The coating treatment
The printed circuit board is to produce an organic protective film, or to apply insulating ink or boron nitride or ceramic. 12. The method of claim 11,
The coating process is a printed circuit board, characterized in that the coating with carbon nanotubes or graphene. The method of claim 1,
The reinforcing plate integrated solder resist coverlay is a printed circuit board, characterized in that at least one solder land hole is formed. A heat dissipation module comprising the printed circuit board of any one of claims 1 to 7 and 10 to 14. 16. The method of claim 15,
The heat dissipation module
The printed circuit board;
Thermally conductive media; And
Heat dissipation module, characterized in that it comprises a heat dissipation medium. 17. The method of claim 16,
And the thermally conductive medium is any one or more than one of a thermally conductive adhesive bond, a thermally conductive foam tape, a thermally conductive foam pad, or a thermally conductive grease. 17. The method of claim 16,
The heat dissipation module, characterized in that any one of a heat sink or a heat dissipation case. An LED module comprising the printed circuit board of any one of claims 1 to 7 and 10 to 14. LED module, characterized in that using the heat dissipation module of claim 15.

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