JP2007019267A5 - - Google Patents

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Publication number
JP2007019267A5
JP2007019267A5 JP2005199151A JP2005199151A JP2007019267A5 JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5 JP 2005199151 A JP2005199151 A JP 2005199151A JP 2005199151 A JP2005199151 A JP 2005199151A JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5
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JP
Japan
Prior art keywords
substrate
wiring board
fiducial mark
board according
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005199151A
Other languages
Japanese (ja)
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JP2007019267A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005199151A priority Critical patent/JP2007019267A/en
Priority claimed from JP2005199151A external-priority patent/JP2007019267A/en
Publication of JP2007019267A publication Critical patent/JP2007019267A/en
Publication of JP2007019267A5 publication Critical patent/JP2007019267A5/ja
Pending legal-status Critical Current

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Claims (13)

電子部品を実装しているとともに同じ側に位置決め用のフィディシャルマークを有する第１基板と、
上記電子部品を挟んで上記第１基板に対向した第２基板と、
上記第１および第２基板間で上記電子部品を積層する樹脂層と、
を有することを特徴とする配線基板。 A first substrate having electronic components mounted thereon and a positioning fiducial mark on the same side;
A second substrate facing the first substrate across the electronic component;
A resin layer for laminating the electronic component between the first and second substrates;
A wiring board comprising: 上記フィディシャルマークは、上記電子部品を接続する第１配線と同時にパターニングされることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the fiducial mark is patterned simultaneously with the first wiring that connects the electronic components. 上記フィディシャルマークは、上記第１配線上に上記電子部品を接続するためのペーストを塗布するためのマスク部材を位置決めするときに用いられることを特徴とする請求項２に記載の配線基板。   The wiring board according to claim 2, wherein the fiducial mark is used when positioning a mask member for applying a paste for connecting the electronic component on the first wiring. 上記フィディシャルマークは、上記電子部品を位置決めするときに用いられることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the fiducial mark is used when positioning the electronic component. 上記第１基板は、その外側から上記フィディシャルマークを検出可能な程度に光を透過する材料により形成されていることを特徴とする請求項１に記載の配線基板。   The wiring board according to claim 1, wherein the first substrate is made of a material that transmits light to the extent that the fiducial mark can be detected from the outside. 上記第２基板および樹脂層も、該第２基板の外側から上記フィディシャルマークを検出可能な程度に光を透過する材料により形成されていることを特徴とする請求項５に記載の配線基板。   6. The wiring board according to claim 5, wherein the second substrate and the resin layer are also formed of a material that transmits light to the extent that the fiducial mark can be detected from the outside of the second substrate. 上記フィディシャルマークは、光を反射する材料により形成されていることを特徴とする請求項５または請求項６に記載の配線基板。   7. The wiring board according to claim 5, wherein the fiducial mark is made of a material that reflects light. 上記第１基板の外側および上記第２基板の外側のうち少なくとも一方に他の電子部品を実装していることを特徴とする請求項１に記載の配線基板。   2. The wiring board according to claim 1, wherein another electronic component is mounted on at least one of the outside of the first board and the outside of the second board. 上記フィディシャルマークを利用して上記第１基板の外側から位置決めして穿設された孔と、
上記第１基板の外側に形成され、上記孔を介して上記電子部品に接続した第２配線と、
をさらに有することを特徴とする請求項５に記載の配線基板。 A hole formed by positioning from the outside of the first substrate using the fiducial mark;
A second wiring formed on the outside of the first substrate and connected to the electronic component through the hole;
The wiring board according to claim 5, further comprising: 一側に位置決め用のフィディシャルマークを有し、このフィディシャルマークを他側から検出可能な程度に光を透過する材料により形成された第１基板と、
この第１基板の一側に対向した第２基板と、
上記第１および第２基板間の樹脂層と、
を有することを特徴とする配線基板。 A first substrate formed of a material having a positioning fiducial mark on one side and transmitting light to such an extent that the fiducial mark can be detected from the other side;
A second substrate facing one side of the first substrate;
A resin layer between the first and second substrates;
A wiring board comprising: 上記第１基板が上記第２基板に対向する一側には、上記フィディシャルマークを用いて位置決めされる電子部品が実装されていることを特徴とする請求項１０に記載の配線基板。   11. The wiring board according to claim 10, wherein an electronic component that is positioned using the fiducial mark is mounted on one side of the first board facing the second board. 上記第２基板および樹脂層も、上記フィディシャルマークを該第２基板の外側から検出可能な程度に光を透過する材料により形成されていることを特徴とする請求項１０に記載の配線基板。   11. The wiring board according to claim 10, wherein the second substrate and the resin layer are also formed of a material that transmits light to such an extent that the fiducial mark can be detected from the outside of the second substrate. 請求項１乃至請求項１２のいずれか１項に記載の配線基板、およびこの配線基板を内蔵した筐体を有する電子機器。 An electronic apparatus comprising the wiring board according to any one of claims 1 to 12 and a housing in which the wiring board is built.
JP2005199151A 2005-07-07 2005-07-07 Wiring board and electronic equipment having the same Pending JP2007019267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005199151A JP2007019267A (en) 2005-07-07 2005-07-07 Wiring board and electronic equipment having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005199151A JP2007019267A (en) 2005-07-07 2005-07-07 Wiring board and electronic equipment having the same

Publications (2)

Publication Number Publication Date
JP2007019267A JP2007019267A (en) 2007-01-25
JP2007019267A5 true JP2007019267A5 (en) 2008-07-03

Family

ID=37756149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005199151A Pending JP2007019267A (en) 2005-07-07 2005-07-07 Wiring board and electronic equipment having the same

Country Status (1)

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JP (1) JP2007019267A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5032870B2 (en) * 2007-03-27 2012-09-26 パナソニック株式会社 Manufacturing method of uneven circuit board
US8024858B2 (en) 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US7935893B2 (en) 2008-02-14 2011-05-03 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
JP2009218545A (en) 2008-03-12 2009-09-24 Ibiden Co Ltd Multilayer printed wiring board and its manufacturing method
JP2009231818A (en) 2008-03-21 2009-10-08 Ibiden Co Ltd Multilayer printed circuit board and method for manufacturing the same
JP2009239247A (en) * 2008-03-27 2009-10-15 Ibiden Co Ltd Method of manufacturing multilayer printed circuit board
WO2009147936A1 (en) * 2008-06-02 2009-12-10 イビデン株式会社 Method for manufacturing multilayer printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3482826B2 (en) * 1997-08-01 2004-01-06 セイコーエプソン株式会社 IC mounting method, liquid crystal display device, electronic equipment, and liquid crystal display device manufacturing apparatus
JP4854846B2 (en) * 2000-02-25 2012-01-18 イビデン株式会社 Manufacturing method of multilayer printed wiring board
JP3870018B2 (en) * 2000-10-12 2007-01-17 日本アビオニクス株式会社 Multilayer printed wiring board and manufacturing method thereof
JP4392157B2 (en) * 2001-10-26 2009-12-24 パナソニック電工株式会社 WIRING BOARD SHEET MATERIAL AND ITS MANUFACTURING METHOD, AND MULTILAYER BOARD AND ITS MANUFACTURING METHOD
JP4137451B2 (en) * 2002-01-15 2008-08-20 ソニー株式会社 Multilayer substrate manufacturing method
JP2004343021A (en) * 2003-03-17 2004-12-02 Matsushita Electric Ind Co Ltd Method for manufacturing module with built-in component and manufacturing apparatus
JP2004296562A (en) * 2003-03-26 2004-10-21 Sharp Corp Substrate with built-in electronic components, and its manufacturing method
FI20031201A (en) * 2003-08-26 2005-02-27 Imbera Electronics Oy Procedure for manufacturing an electronics module and an electronics module

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