TW200631482A - Rigid flexible printed circuit board and method of fabricating same - Google Patents

Rigid flexible printed circuit board and method of fabricating same

Info

Publication number
TW200631482A
TW200631482A TW094125441A TW94125441A TW200631482A TW 200631482 A TW200631482 A TW 200631482A TW 094125441 A TW094125441 A TW 094125441A TW 94125441 A TW94125441 A TW 94125441A TW 200631482 A TW200631482 A TW 200631482A
Authority
TW
Taiwan
Prior art keywords
rigid flexible
circuit board
printed circuit
flexible printed
fabricating same
Prior art date
Application number
TW094125441A
Other languages
Chinese (zh)
Other versions
TWI308854B (en
Inventor
Bum-Young Myung
Dong-Kuk Kim
Young-Po Park
Young-Seok Yoon
Dek-Gin Yang
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200631482A publication Critical patent/TW200631482A/en
Application granted granted Critical
Publication of TWI308854B publication Critical patent/TWI308854B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

Disclosed herein is a rigid flexible PCB and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and poor reliability of adhesion at an interface between different materials are avoided.
TW094125441A 2005-02-25 2005-07-27 Rigid flexible printed circuit board and method of fabricating same TWI308854B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050016044 2005-02-25
KR1020050055647A KR100651335B1 (en) 2005-02-25 2005-06-27 Rigid-flexible Print circuit board and method for manufacturing thereof

Publications (2)

Publication Number Publication Date
TW200631482A true TW200631482A (en) 2006-09-01
TWI308854B TWI308854B (en) 2009-04-11

Family

ID=36936395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125441A TWI308854B (en) 2005-02-25 2005-07-27 Rigid flexible printed circuit board and method of fabricating same

Country Status (2)

Country Link
KR (1) KR100651335B1 (en)
TW (1) TWI308854B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474767B (en) * 2009-08-12 2015-02-21 Tatsuta Densen Kk Multilayer flexible printed circuit board, and method for fabricating the same,partial multilayer flexible printed circuit board
CN105472906A (en) * 2014-09-11 2016-04-06 富葵精密组件(深圳)有限公司 Flexible and hard combined circuit board and manufacturing method thereof
TWI737316B (en) * 2020-05-20 2021-08-21 大陸商鵬鼎控股（深圳）股份有限公司 Circuit board and method for manufacturing the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796979B1 (en) * 2007-01-31 2008-01-22 삼성전기주식회사 Rigid-flexible printed circuit board and manufacturing method thereof
CN114554691A (en) * 2020-11-25 2022-05-27 鹏鼎控股(深圳)股份有限公司 Ultra-long circuit board and preparation method thereof
CN114173494A (en) * 2021-12-06 2022-03-11 博罗县精汇电子科技有限公司 Method for manufacturing multilayer flexible circuit board with inner layer needing to be pasted

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0955564A (en) * 1995-08-11 1997-02-25 Cmk Corp Printed wiring board
KR100467844B1 (en) * 2002-12-26 2005-01-25 삼성전기주식회사 Rigid flexible printed circuit board for mobile phone, and manufacturing method thereof
KR20040065861A (en) * 2003-01-16 2004-07-23 삼성전기주식회사 Printed circuit board for using all layer interstitial via hole, and manufacturing method thereof
KR100651386B1 (en) * 2004-10-15 2006-11-29 삼성전기주식회사 Method for release treating polyimide coverlay and preparing method for rigid-flexible multi-layer printed circuit board using the said polyimide coverlay

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474767B (en) * 2009-08-12 2015-02-21 Tatsuta Densen Kk Multilayer flexible printed circuit board, and method for fabricating the same,partial multilayer flexible printed circuit board
CN105472906A (en) * 2014-09-11 2016-04-06 富葵精密组件(深圳)有限公司 Flexible and hard combined circuit board and manufacturing method thereof
TWI737316B (en) * 2020-05-20 2021-08-21 大陸商鵬鼎控股（深圳）股份有限公司 Circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
KR100651335B1 (en) 2006-11-29
KR20060094828A (en) 2006-08-30
TWI308854B (en) 2009-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees