JP2007019267A - Wiring board and electronic equipment having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board that can be miniaturized, and to provide electronic equipment having the wiring board. <P>SOLUTION: Copper foil inside a core material 11 is etched to form first wiring 15', and a fiducial mark M is formed simultaneously. The mark M is utilized to position a metal mask when a conductive paste, which connects an electronic component 20 to the first wiring 15' electrically, is printed, is utilized to position the electronic component 20, and is utilized to position a via hole 24. When the electronic component 20 is positioned, the mark M is detected from the inside of the core material 11. When the via hole 24 is punched, the mark M is detected from the outside of the core material 11 via a substrate 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to, for example, a wiring board incorporated in an electronic device as a memory module of a TV tuner or a mobile phone, and the electronic device.

  Conventionally, as a wiring board with built-in electronic components, a multi-layer print in which another positioning mark is formed on the core board based on the positioning mark provided on the IC chip, and a via hole is formed based on the positioning mark on the core board. A wiring board is known (see Patent Document 1).

When manufacturing this printed wiring board, it is necessary to form another positioning mark on the core substrate based on the positioning mark of the IC chip in order to form a via hole at an accurate position with respect to the IC chip. There is a problem that the manufacturing cost increases. Further, since the positioning mark is formed in two stages, there is a problem that the positional accuracy of the via hole with respect to the IC chip is lowered and the product yield is lowered. Furthermore, it is necessary to form a large number of positioning marks, and it is necessary to secure a space for forming the positioning marks, and there is a problem that the printed wiring board is enlarged.
JP 2001-332863 A (Abstract, FIG. 6)

  An object of the present invention is to provide a wiring board capable of facilitating manufacturing, reducing manufacturing costs, increasing product yield, and realizing downsizing of the wiring board, and an electronic apparatus including the wiring board.

  In order to achieve the above object, a wiring board according to the present invention has a first board on which electronic components are mounted and a positioning fiducial mark on the same side, and the first board facing the first board. And a resin layer for laminating the electronic component between the first and second substrates.

  According to the above invention, since the electronic component is built in between the first and second substrates and the positioning fiducial mark is formed on the same side as the electronic component, the outside of the first substrate or the second substrate It is not necessary to secure a space for mounting electronic components or forming fiducial marks for positioning on the outside of the wiring board, and the wiring board can be made smaller accordingly. In particular, another electronic component can be mounted on the outside of the first substrate and the outside of the second substrate at a position overlapping the fiducial mark, and the wiring board can be made small.

  The wiring board of the present invention has a positioning fiducial mark on one side, a first board formed of a material that transmits light to such an extent that the fiducial mark can be detected from the other side, A second substrate facing one side of the first substrate; and a resin layer between the first and second substrates.

  According to the above invention, the electronic component can be positioned and mounted on one side of the first substrate based on the fiducial mark formed on one side of the first substrate, and the fiducial mark is detected from the other side of the first substrate. Thus, the hole for wiring can be positioned and drilled. That is, the mounting of the electronic component and the drilling of the via hole can be performed with reference to the same fiducial mark. For this reason, the mounting position of an electronic component and the position of the hole for wiring of an electronic component can be matched correctly and easily, manufacture can be made easy and manufacturing cost can be reduced. In addition, since the electronic component is mounted on one side of the first substrate using the same fiducial mark and the hole is drilled from the other side of the first substrate, the reliability of positioning can be improved. Yield can be improved. Furthermore, since the fiducial mark for positioning is formed on one side of the first substrate, it is not necessary to form the fiducial mark on the outside of the first substrate or the outside of the second substrate, and accordingly, other electrons are formed on the outside. Components can be mounted and the wiring board can be made smaller. In particular, when the fiducial mark is formed by patterning the metal foil simultaneously with the wiring, there is no fear that the electronic component mounted on the outside contacts the fiducial mark and short-circuits, and the reliability can be improved.

  According to the present invention, it is possible to reduce the size of the wiring board.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a schematic view partially enlarging a cross section of a wiring board 10 according to an embodiment of the present invention. For example, the wiring board 10 is incorporated in a housing 101 of an electronic device 100 such as a TV, a mobile phone, or a laptop computer (see FIG. 11).

  The wiring board 10 has a structure in which an electronic component 20 such as a capacitor or a chip resistor is disposed between two core materials 11 and 12 and laminated with a resin layer 22. Thus, by incorporating the electronic component 20, a mounting space outside the core materials 11 and 12 can be secured, and the wiring board 10 can be downsized. Here, the mounting structure of one electronic component 20 will be described as a representative, but a plurality of electronic components can be arranged between the two core members 11 and 12.

Hereinafter, a method for manufacturing the wiring substrate 10 will be described with reference to FIGS.
First, a core material 11 (first substrate) whose cross section is partially enlarged and shown in FIG. 2 is prepared. When manufacturing the wiring board 10, for example, as shown in FIG. 3, a plurality of (six in the present embodiment) wiring boards 10 ′ (in the middle of reaching the finished product) are integrated as a single workpiece 100. Therefore, the core material 11 is also prepared in a size that allows a plurality of core materials 11 to be handled. In the present embodiment, the core material 11 having a size of 330 mm × 300 mm is prepared in order to integrally manufacture six wiring boards 10 ′ of 70 mm × 100 mm.

  As shown in FIG. 2, the core material 11 is formed by laminating copper foils 15 and 17 on both surfaces of a substrate 13 made of, for example, a resin material (prepreg) containing glass fibers. Glass fiber is mixed with the substrate 13 in order to ensure rigidity against warping and to match the thermal expansion coefficient of the substrate 13 with the copper foils 15 and 17. Thereby, the curvature of the core material 11 by heating can be suppressed. A core material 12 (second substrate) described later also has the same structure as the core material 11.

  Note that the substrate 13 of the core material 11 has a fiducial mark M (hereinafter simply referred to as a mark M) formed on the side (one side) facing the core material 12 on the outer side of the core material 11. Are formed of a material that transmits light (visible light in the present embodiment) to the extent that it can be detected. Further, the substrate 14 and the resin layer 22 of the other core material 12 to be described later are also formed of a material that transmits light to the extent that the mark M of the core material 11 can be detected from the outside of the core material 12.

  And as shown in FIG. 4, the copper foil 15 laminated | stacked on the one side of the prepared core material 11 is etched and patterned, and 1st wiring 15 'for electrically connecting the electrode terminal of the electronic component 20 is connected. At the same time, the positioning mark M is formed. At this time, a photoresist layer (not shown) is formed on the copper foil 15, a mask pattern (not shown) is formed by exposure and development, and the copper foil 15 is etched through the mask pattern to thereby form one core material 11. A first wiring 15 'and a mark M are formed on the side. For example, as shown in FIG. 3, two marks M are provided at each diagonal of the wiring board 10 ′ for each wiring board 10 ′ of the workpiece 100.

  In addition, the copper foil 17 laminated | stacked on the other side of the core material 11 is a part (namely, diagonal part of a wiring board) which overlaps with each mark M in order to enable each mark M mentioned above to be detected from the outer side of the core material 11. Need to be at least partially removed. In the present embodiment, the copper foil 17 in a portion overlapping the mark M is partially removed during the manufacturing process of the wiring board 10.

  Thereafter, as shown in FIG. 5, the conductive paste 2 (paste) is printed on a portion where the electronic component 20 is connected on the first wiring 15 ′. At this time, two marks M formed on each wiring board 10 ′ of the workpiece 100 positioned and arranged in a predetermined coordinate system are detected by a camera (not shown), and the image is binarized to obtain the coordinates of each mark M. To do. Since each mark M is formed of a copper foil that reflects visible light, the image of the mark M becomes white and the image around the mark becomes black. Then, based on the acquired coordinates of each mark M, the positional deviation of the workpiece 100 in this coordinate system is detected, and a metal mask (mask member) (not shown) is aligned with the inner surface of the wiring board 10 ′ based on the detection result. To do. The metal mask has an opening at a portion where the conductive paste 2 is printed. By aligning the metal mask, the conductive paste 2 is positioned at an accurate position on the first wiring 15 'through each opening. Can print.

  Then, as shown in FIG. 6, the electrode terminal of the electronic component 20 is electrically connected to the first wiring 15 ′ via the conductive paste 2, and the electronic component 20 is mounted on one side of the core material 11. At this time, in the same manner as when the conductive paste 2 is printed, the mark M on each wiring board 10 ′ is detected to detect the positional deviation of the workpiece 100, and a mounter (not shown) is operated based on the detection result to perform the electronic component. Mount 20 in the correct position. Then, the conductive paste 2 is melted to connect the electrode terminals of the electronic component 20 to the first wiring 15 '.

  As described above, by printing the conductive paste 2 with the mark M formed on one side of the core material 11 as a reference and mounting the electronic component 20, the positional accuracy of the electronic component 20 with respect to the first wiring 15 ′ is improved. The reliability of the connection can be increased. In particular, in the present embodiment, since the positioning mark M is formed on the mounting surface (one side) of the core material 11 on which the electronic component 20 is mounted, the positioning system can be made extremely high.

  After the electronic component 20 is mounted on the core material 11 as described above, as shown in FIG. 7, another sheet is placed opposite to one side of the core material 11 so as to sandwich the electronic component 20 via the resin layer 22. The core material 12 is disposed. The resin layer 22 and the core material 12 also have substantially the same size as the core material 11. The core material 12 also has the same structure as the core material 11 and is formed by laminating copper foils 16 and 18 on both surfaces of the prepreg substrate 14.

  In the present embodiment, the copper foil 16 on the side where the core material 12 faces the core material 11 is also patterned by etching, so that the third wiring 16 ′ is formed in advance. In addition, the copper foils 16 and 18 of the core material 12 at least partially remove the portion overlapping the mark M, that is, the diagonal portion of the wiring board 10 ′ so that the mark M can be detected from the outside of the core material 12. (FIG. 7). The diagonal part of the copper foil 16 is removed when the third wiring 16 ′ is patterned, and the diagonal part of the copper foil 18 is removed when the copper foil 18 is patterned. Although not shown here, another electronic component may be mounted on the third wiring 16 ′ of the core material 12 so as to be nested with the electronic component 20 mounted on the core material 11. Can be mounted.

  Then, as shown in FIG. 8, the electronic component 20 is sandwiched between two core materials 11 and 12 and heated and pressurized to melt the resin layer 22, so that the electronic component 20 is sandwiched between the two core materials 11 and 12. Laminate. In this state, the mark M formed on one side of the core material 11 is also sealed with the resin layer 22 and can be detected from the outside of the core material 11 through the substrate 13 of the core material 11. The core material 12 can be detected from the outside of the core material 12 through the substrate 14.

  Further, as shown in FIG. 9, holes 24 (via holes) connected to the first wiring 15 ′ are formed from the outside of the core material 11 by laser processing on each wiring board 10 ′, and the third wiring 16 ′ is formed. A connecting hole 26 (via hole) is formed from the outside of the core material 12. And the hole 28 which penetrates the two core materials 11 and 12 and the resin layer 22 is formed by drilling as needed.

  When the via hole 24 is formed, the mark M formed inside the core material 11 is detected from the outside of the core material 11 through the substrate 13, and the position of the via hole 24 is determined based on the position of the detected mark M. decide. When the via hole 26 is formed, the mark M formed inside the core material 11 is detected from the outside of the core material 12 through the substrate 14 and the resin layer 22, and the position of the detected mark M is used as a reference. The position of the via hole 26 is determined.

  As described above, in the present embodiment, the mark M formed inside the core material 11 can be detected from the outside of the core material 11 and can be detected from the outside of the core material 12. The used mark M can be used at the time of drilling the via holes 24 and 26, and the number of positioning marks M can be minimized.

  Finally, the six wiring boards 10 ′ processed as described above are separated from the workpiece 100.

  As described above, according to the present embodiment, the mark M formed inside the core material 11 can be used for printing the conductive paste 2, can be used for positioning the electronic component 20, and the via holes 24 and 26 can be used. It can be used for drilling and the number of marks M can be minimized. For this reason, the manufacturing process of the wiring board 10 can be reduced, manufacturing can be facilitated, and manufacturing cost can be reduced.

  Further, by forming the mark M on the inner side of the core material 11 as in the above-described embodiment, the mark M is placed on the outer side of the wiring substrate 10 (that is, the outer side of the core material 11 or the outer side of the core material 12). There is no need to provide it, and there is no fear of short-circuiting with the mark M of the copper foil formed outside when the electronic component is mounted outside the core material 11 or outside the core material 12. In other words, by incorporating the mark M in the wiring board 10, an electronic component can be mounted even at a position overlapping the mark M outside the core material 11 or outside the core material 12 (see FIG. 1). .

  In addition, according to the present embodiment, since the via holes 24 and 26 can be positioned using the mark M for positioning the electronic component 20, the via holes 24 and 26 are formed at positions facing the electrode terminals of the electronic component 20. Positioning can be performed accurately and easily, the reliability of wiring connection can be improved, and the product yield can be improved.

  Furthermore, according to the present embodiment, a plurality of electronic components 20 are arranged between the two core members 11 and 12 and the mark M is formed on the inner side of the core member 11. The number of electronic components 20 to be arranged can be reduced, and it is not necessary to form the mark M on the outer side of the core materials 11 and 12, and accordingly, the outer space can be reduced, and as a result, the wiring board can be reduced in size. . Although it is conceivable that the thickness of the wiring board is increased by disposing the electronic component 20 between the two core materials 11 and 12, the height of the electronic component 20 itself can be reduced or the core material can be reduced. By arranging the electronic component mounted on 11 and the electronic component mounted on the core material 12 in a nested manner, the wiring board can be prevented from becoming thick.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

  For example, in the above-described embodiment, the structure in which the electronic component 20 is laminated between the two core materials 11 and 12 has been described. However, the invention is not limited to this, and the electronic component is mounted on the outer side of the core materials 11 and 12. Thus, another core material may be laminated via the resin layer, and the number of core materials can be arbitrarily set. For example, when four core materials are laminated, electronic components can be mounted on the second and third core materials.

  In the embodiment described above, the case where two marks M are formed inside the core material 11 of each wiring board 10 has been described. However, the present invention is not limited to this, and the mark M is embedded in the core material 11. May be. Further, three or more marks M may be formed on one wiring board 10.

  In the above-described embodiment, the case where the two marks M are formed at the diagonals of each wiring board 10 ′ has been described. However, the present invention is not limited to this. For example, as shown in FIG. The mark M may be formed at a position off the wiring substrate 10 ′ of the workpiece 100 in which “is integrated”, ie, around the wiring substrate 10 ′. In this case, since the mark M is formed in the part to be cut off of the workpiece 100, the mark M cannot be used after the wiring board 10 'is separated.

  Furthermore, in the above-described embodiment, two marks M are formed at diagonal positions on each wiring board 10 ′. However, the mark M can be shared between adjacent wiring boards 10 ′. A mark M may be formed on the wiring board 10 ′ one by one, and two adjacent marks M may be detected and used for various alignments.

The partial expanded sectional view which expanded partially the structure of the principal part of the wiring board which concerns on embodiment of this invention. The figure for demonstrating the manufacturing method of the wiring board of FIG. Schematic which shows the workpiece | work for manufacturing the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the manufacturing method of the wiring board of FIG. The figure for demonstrating the example which provided the mark in the position remove | deviated from the wiring board of the workpiece | work.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Wiring board | substrate, 11, 12 ... Core material, 13, 14 ... Board | substrate, 15 '... 1st wiring, 20 ... Electronic component, 22 ... Resin layer, 24, 26 ... Via hole, 100 ... Workpiece, M ... Mark .

Claims (17)

A first substrate having electronic components mounted thereon and a positioning fiducial mark on the same side;
A second substrate facing the first substrate across the electronic component;
A resin layer for laminating the electronic component between the first and second substrates;
A wiring board comprising:   The wiring board according to claim 1, wherein the fiducial mark is patterned simultaneously with the first wiring connecting the electronic component.   The wiring board according to claim 2, wherein the fiducial mark is used when positioning a mask member for applying a paste for connecting the electronic component on the first wiring.   The wiring board according to claim 1, wherein the fiducial mark is used when positioning the electronic component.   2. The wiring board according to claim 1, wherein the first substrate is made of a material that transmits light to the extent that the fiducial mark can be detected from the outside.   6. The wiring board according to claim 5, wherein the second substrate and the resin layer are also formed of a material that transmits light to the extent that the fiducial mark can be detected from the outside of the second substrate.   7. The wiring board according to claim 5, wherein the fiducial mark is made of a material that reflects light.   2. The wiring board according to claim 1, wherein another electronic component is mounted on at least one of the outside of the first board and the outside of the second board. A hole formed by positioning from the outside of the first substrate using the fiducial mark;
A second wiring formed outside the first substrate and connected to the electronic component through the hole;
The wiring board according to claim 5, further comprising: A first substrate formed of a material having a positioning fiducial mark on one side and transmitting light to such an extent that the fiducial mark can be detected from the other side;
A second substrate facing one side of the first substrate;
A resin layer between the first and second substrates;
A wiring board comprising:   The wiring board according to claim 10, wherein an electronic component that is positioned using the fiducial mark is mounted on one side of the first board facing the second board.   The wiring board according to claim 11, wherein the fiducial mark is patterned simultaneously with the first wiring connecting the electronic component.   13. The wiring board according to claim 12, wherein the fiducial mark is used when positioning a mask member for applying a paste for connecting the electronic component on the first wiring.   11. The wiring board according to claim 10, wherein the second substrate and the resin layer are also formed of a material that transmits light to such an extent that the fiducial mark can be detected from the outside of the second substrate.   The wiring board according to claim 14, wherein an electronic component is mounted on at least one of the outside of the first board and the outside of the second board. A hole formed by positioning from the outside of the first substrate using the fiducial mark;
A second wiring formed outside the first substrate and connected to the electronic component through the hole;
The wiring board according to claim 11, further comprising:   An electronic device comprising the wiring board according to any one of claims 1 to 16, and a housing incorporating the wiring board.

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