CN108124407A - High-efficiency heat conduction structure - Google Patents
High-efficiency heat conduction structure Download PDFInfo
- Publication number
- CN108124407A CN108124407A CN201711175430.7A CN201711175430A CN108124407A CN 108124407 A CN108124407 A CN 108124407A CN 201711175430 A CN201711175430 A CN 201711175430A CN 108124407 A CN108124407 A CN 108124407A
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- Prior art keywords
- heat
- heat conduction
- base material
- silk thread
- conduction silk
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- 239000000463 material Substances 0.000 claims abstract description 69
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000002041 carbon nanotube Substances 0.000 claims description 15
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 238000000053 physical method Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 2
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000007767 bonding agent Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006166 lysate Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000002303 thermal reforming Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a high-efficiency heat conduction structure, which comprises a base material, wherein a plurality of heat conduction silk threads are formed on two surfaces of the base material; the diameter or the section of the heat conducting wire is micron-sized or nanometer-sized; the length is the size from nano-scale to millimeter-scale; when in use, the invention can be placed between a heat source and a heat dissipation unit; the heat of the heat source is transmitted to the base material of the sheet through the heat conducting wires, and after the heat conduction path is readjusted on the base material, the heat can be more efficiently transmitted to the heat dissipation unit through the heat conducting wires on the other side of the base material; in addition, one end face of the invention can be contacted with a heat source, the other end face is directly exposed in the air, and the plurality of heat conduction wires of the end face exposed in the air can be pressed into a fin shape; the heat-conducting wires of the present invention do not need to be rearranged and do not need to be fixed by an adhesive; the substrate and the heat conducting wire of the invention have flexibility, and can be applied to surfaces with different flatness and curvature.
Description
Technical field
The present invention relates to a kind of conductive structure for having high-heat conductive efficency, the base material with a thin slice, the two sides of the base material
There is the heat conduction silk thread of generation；In use, the present invention will be placed between heat source and heat-sink unit；The heat of heat source is first via leading
Heated filament line passes to the base material of thin slice, through heat readjust heat conduction path on base material after, can be more efficiently again via another
Heat conduction silk thread on one side passes to heat-sink unit；The structure of the present invention has around property, can be applied to various different flatnesses and song
The surface of rate.
Background technology
It radiates for one of important technology of mainstream now, when being operated because of manavelins, because of the conversion of most energy, Duo Shuodou
Thermal energy is converted into, and with the increase of thermal energy and temperature, the efficiency of equipment running will be influenced, more having causes doubting for equipment burnout
Consider, therefore usually electrical equipment is all equipped with radiator, as far as possible to remove thermal energy, to tie up the normal operation of electrical equipment.
The technology of heat dissipation is found almost everywhere, one, and by the form of heat transfer, being set in a heat-sink unit one end can increase
With the structure of the contact area of air, such as：Radiating fin, and the other end is then to contact directly heat source by heat-sink unit, the phase with
The heat of heat source is conducted to heat-sink unit, then by heat-sink unit radiating fin through thermal convection current radiate to air or other
In fluid.
Due between heat-sink unit and heat source, the contact surface of the two has an irregular male and fomale(M＆F), thus the two connects
Many gaps are necessarily formed between tactile surface.If any the low-down air of thermal conductivity factor (0.024W/m-k) in this gap, must make
Into undesirable heat-conducting effect.To improve heat transfer efficiency, it is higher that spreading thermal conductivity factor is applied generally all between heat-sink unit and heat source
Heat-conducting cream (10-15W/m-k), such as：Silver paste to substitute the low-down air of thermal conductivity factor, makes heat source and heat-sink unit tight,
Make heat that can be conducted via heat-conducting cream and really to heat-sink unit；However, thermal grease is usually the high main composition of thermal conductivity factor,
Such as：Metallic, graphite, carbon pipe, diamond, the mixture with bonding agent；But the thermal conductivity coefficient of these bonding agents is far below scattered
The material (aluminium 237W/m-k) of hot cell, and the main composition that bonding agent is high by thermal conductivity factor is coated on, this causes heat straight
It connects and is passed directly to heat-sink unit through the high main composition of thermal conductivity factor by heat source, it is handing over for low bonding agent to be necessarily subject to thermal conductivity therebetween
Multiple barrier；Thus the promotion of overall thermal heat transfer efficiency is limited, and has the space to need further improvement.
And existing separately provide a kind of " preparation method of radiator " such as Chinese patent certificate the CN100517661Cth
Method, the one side directly contacted with heat source in heat-sink unit grows the carbon nanotubes (20000W/m-k) of high thermal conductivity coefficient,
It is contacted by the carbon nanotubes on heat-sink unit with heat source, it directly will be in the thermal conductivity of heat source to heat-sink unit.But in order not to non-
Contact surface also grows carbon nanotubes, needs that entire heat-sink unit first is covered a passivation layer (20) in making, is then connect with heat source
Tactile removes this passivation layer on one side, and then what is made grows carbon nanotubes.Since the volume of heat-sink unit is not small, shape is also complicated,
The making of the method is simultaneously remarkable, and the carrying stage space of product also needs to protect.
And it is existing a kind of thermal interface material is separately provided, it is general such as the hot interface material of TaiWan, China patent certificate I 331132
Expect manufacturing method, the total condensation material of carbon nanotubes of U.S. Patent Publication the 2007/0244245th and its manufacturing method (Carbon
Nanotube Composite Material And Method For Manufacturing The Same), United States Patent (USP) it is public
Accuse manufacturing method (the Method For Manufacturing A Thermal of the thermal interface material of No. 7674410
Interface Material), the thermal interface material of U.S. Patent Publication the 2006/0234056th and its manufacturing method
(Thermal interface material and method for making the same) and U.S. Patent Publication
The thermal interface material and its manufacturing method of No. 2008/0081176
(Thermal Interface Material And Method For Manufacturing Same), is taken off
The person of showing is tied up to after carbon nanotubes generates and be arranged in same direction, the bonding agent of liquid is perfused, with after bonding agent solidifies
To position carbon nanotubes, and then form thermal interface material person；Only this, since the arrangement of carbon nanotubes is not easy, and between carbon pipe between
Gap is minimum, is intended to the bonding agent for having suitable viscosity being filled in the gap between carbon pipe, is extremely difficult and feasibility is not high
Thing；Even if after being made, by the carbon nanotubes that bonding agent coats, existing heat conduction will be not higher than in the radiating efficiency of radial direction
Cream.
And " the electronic equipment of radiator structure and the application radiator structure of TaiWan, China patent of invention I 458933
(HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE USING THE SAME) " a cases, nanometer
Carbon pipe and the surface of its conductive structure are mutually parallel, and can not nearly be suitable for the convex-concave surface of micron order or nano-grade size, therefore
When between heat source or heat-sink unit being convex-concave surface, there will be gap between heat source or heat-sink unit, it is made to radiate and lead
The thermal efficiency is greatly reduced；Furthermore since for carbon nanotubes, axial thermal conductivity is higher than the thermal conductivity of radial direction, therefore
Its carbon nanotubes design parallel with surface, it is clear that its heat transfer efficiency will be influenced.
In addition, on TaiWan, China patent of invention disclose No. 200951063 " high effect nano wire heat conducting film characteristic and
Its manufacturing method (THE CHARACTERIZATION AND FABRICATION OF HIGH EFFICIENCY NANOWIRES
OF THERMAL INTERFACE MEMBRANE) " a case, base material is AAO templates (aluminium oxide) and equipped with copper metal line, institute
Copper metal line is stated through the base material, however, the thermal conductivity factor of aluminium oxide is low and intensity is poor, in addition, it is only logical when heat conduction
It crosses copper metal line and carries out heat transfer, and hardly by AAO templates, therefore the ability of its thermal reforming is low, it can not uniform heat conduction；Again
Person, processing procedure is complicated, and because it must deposit copper in the hole of AAO templates, then makes copper metal line naked by dissolving AAO templates
Dew, process will cause the length limited of copper metal line, if because hole is too deep, copper will be caused not deposit really, and dissolve
In the process, because the density of copper metal line is high, it will cause lysate that can not dissolve the AAO templates between copper metal line, cause its yield
It is poor, and large area processing procedure can not be carried out.
The content of the invention
Whence is that present invention aim to address foregoing problems, and to reach cause object above, inventor provides a kind of efficient
The conductive structure of rate.
To achieve the above object, the technical solution adopted by the present invention is：
A kind of efficient conductive structure, it is characterized in that comprising：
One base material is set in flake, and thickness simultaneously not limits, and can set its thickness on demand, the base material
Biend forms plural heat conduction silk thread；The heat conduction silk thread is in the form of a column or tubulose is set, and the cross section of the heat conduction silk thread
Length is micron order or nano level size, and the length of the heat conduction silk thread is nanoscale to millimetre-sized size；The base material
And the heat conduction silk thread is made of high heat conduction material.
The efficient conductive structure, wherein, the heat conduction silk thread is taken shape in physical method or chemical method
The biend of the base material.
The efficient conductive structure, wherein, the material of the base material be can with physical method or chemical method into
The highly heat-conductive material of type heat conduction silk thread, and be copper, aluminium, silver, carbon or diamond film.
The efficient conductive structure, wherein, the heat conduction silk thread for high heat conductive material column or
Tubulose, and be carbon nanotubes, aluminium, copper or silver.
The efficient conductive structure, wherein, which is set in the form of sheets or other geometries are set.
The efficient conductive structure, wherein, also comprising a heat source and a heat-sink unit, and the base material is located at the heat
Between source and the heat-sink unit, the heat conduction silk thread of the base material one end is linked to the heat source, and the base material other end
The heat conduction silk thread be linked to the heat-sink unit.
The efficient conductive structure, wherein, also comprising a heat source, the heat conduction silk thread of the end face of the base material
The heat source is linked to, and the heat conduction silk thread of the base material other end is in air.
The efficient conductive structure, wherein, the heat conduction silk thread of the base material other end is suppressed to form fin
Shape.
In use, the conductive structure system of the present invention is placed between heat source and heat-sink unit；The heat of heat source is first via leading
Heated filament line is conducted to base material, if the temperature of heat-sink unit in itself is uneven, because the position of each heat conduction silk thread is different, and heat is by height
Temperature is conducted toward at low temperature, thus heat via base material readjust heat conduction path after, can be more efficiently again via another side
Heat conduction silk thread passes to heat-sink unit；This conductive structure has around property, can be employed uneven surface, while be also easy to produce.
It in addition, because being respective array between heat conduction silk thread, and is not coated by binding agent, because heat source is single with heat dissipation during assembling
Contact surface out-of-flatness between member, part heat conduction silk thread contact with each other bending, this will increase the path of heat transfer, further carry
Rise heat conduction efficiency；In addition, heat conduction silk thread has around property, uneven surface can be applied to.
The present invention is in production, it is only necessary to directly generate heat conduction silk thread in base material two sides；Because of heat conduction silk thread, oneself is fixed and arranges
It on base material, need not rearrange, it is not required that bonding agent is perfused between heat conduction silk thread；The production tool of structure of the present invention is feasible
Property and at low cost.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of the present invention.
Fig. 2 is the schematic side view of the present invention.
Fig. 3 is the heat conduction thread contact heat source of one end of the present invention, and the heat conduction thread contact of other end heat dissipation member
The schematic cross-sectional view of part.
Fig. 4 is the heat conduction thread contact heat source of one end of the present invention, and the heat conduction silk thread of other end is exposed to air,
And the stereoscopic schematic diagram of arrangement form fin-like.
Reference sign：1 base material；2a, 2b heat conduction silk thread；3 heat sources；4 heat-sink units；H high temperature distributed areas；L low temperature
Distributed areas.
Specific embodiment
On the technological means of we inventor, several preferred embodiments cooperation schemas are hereby lifted in hereafter carrying out specifically
It is bright, for being understood in depth on an ancient unit of weight and accepting the present invention.
Please referring initially to shown in Fig. 1, Fig. 2, the present invention is a kind of efficient conductive structure, it includes：
One base material 1 in one embodiment, is set in flake, and thickness simultaneously not limits, and can set it on demand
Thickness, the base material for it is any can be on it through either physically or chemically generating the highly heat-conductive material of plural heat conduction silk thread, such as：Copper,
Aluminium, silver, carbon, diamond film etc..
Plural heat conduction silk thread 2a, 2b are the biend that respective array takes shape in the base material 1；
Described heat conduction silk thread 2a, 2b include carbon nanotubes, aluminium, copper, silver or other tool high heat conductive materials tubulose or
Column；The diameter or cross-section lengths of described heat conduction silk thread 2a, 2b are micron order or nano level size；Length is then nanoscale
To millimetre-sized size；
It, can be by either physically or chemically to be molded, specifically physically or chemically for the shaping of heat conduction silk thread 2a, 2b
Forming method is the prior art, therefore is not described in detail herein；
In this way, as shown in figure 3, in the present embodiment, conductive structure system of the invention is placed on a heat source 3 and a heat dissipation is single
Between member 4, that is, the base material 1 is located between the heat source 3 and the heat-sink unit 4, the heat conductive filament of 1 one end of base material
Line 2a is linked to the heat source 3, and the heat conduction silk thread 2b of the base material other end is linked to the heat-sink unit 4；And the heat source 3
Surface with heat-sink unit 4 can be irregular male and fomale(M＆F)；Due to base material 1 and its two sides heat conduction silk thread 2a, 2b by tool around
Property high heat conduction material be made, when heat-sink unit 4 and heat source 3 are with pressing, conductive structure of the invention can with heat-sink unit 4 and
Heat source 3 is effectively tightly engaged into；Therefore, the heat of heat source 3 can directly pass to heat-sink unit 4.
The setting pattern of heat-sink unit 4 itself is different different from the radiating condition of different position, therefore heat-sink unit 4 will appear from
High temperature distributed areas H and low temperature distributed areas L will be presented in the phenomenon that temperature is uneven, therefore, heat-sink unit 4, this will influence it and dissipate
The thermal efficiency；By heat from high temperature toward low temperature at conduct characteristic, therefore, heat conduction silk thread of the heat through one end of heat source 3
When 2b is conducted to base material 1, base material 1 will adjust heat conduction path, and as shown the direction of arrow in Figure 3, heat can be conducted to foregoing
The relatively low region L of temperature, with further improving heat radiation efficiency.
When combining, if heat conduction silk thread 2a, 2b stress due to the surface irregularity of heat source 3 and heat-sink unit 4 is bent, phase
Adjacent heat conduction silk thread 2a, 2b may be contacted with each other, this will can also increase the path of heat transfer, and heat transfer efficiency can be therefore and more into one
Step is promoted.
Work as narrow space, when not distinguishing that method sets foregoing heat-sink unit 4, then the setting in embodiment that can be as shown in Figure 4；
The heat conduction silk thread 2a of 1 one end of base material, is linked to the surface of a heat source 3, and the heat conduction silk thread of the other end of the base material 1
2b is to be directly exposed in air, and the heat conduction silk thread 2b of other end can be pressed into fin-like, empty with flowing to promote it
Contact area between gas, and then thermal convection current can be relied on to carry out removing for heat.
It should be specified, heat conduction silk thread 2a, 2b independently arrange the two sides for taking shape in the base material 1, in addition, heat conduction
Silk thread 2a, 2b not by other objects (such as：Existing high molecular material or thermal grease) it is coated, the heat of heat source 3 can be from
Barrier, and directly pass to heat-sink unit 4.
Described above to be merely exemplary for the purpose of the present invention, and not restrictive, those of ordinary skill in the art understand,
In the case where not departing from the spirit and scope that claim is limited, can many modifications may be made, variation or equivalent, but will all fall
Enter within protection scope of the present invention.
Claims (8)
1. a kind of efficient conductive structure, it is characterized in that comprising：
One base material, the biend of the base material form plural heat conduction silk thread；The heat conduction silk thread is in the form of a column or tubulose is set, and institute
The cross-section lengths of heat conduction silk thread are stated as micron order or nano level size, and the length of the heat conduction silk thread is nanoscale to milli
The size of meter level；The base material and the heat conduction silk thread are made of high heat conduction material.
2. efficient conductive structure according to claim 1, which is characterized in that the heat conduction silk thread is with physical method
Or chemical method takes shape in the biend of the base material.
3. efficient conductive structure according to claim 1, which is characterized in that the material of the base material is can be with physics
The highly heat-conductive material of method or chemical method shaping heat conduction silk thread, and be copper, aluminium, silver, carbon or diamond film.
4. efficient conductive structure according to claim 1, which is characterized in that the heat conduction silk thread is with high heat conduction
The column or tubulose of coefficient material, and be carbon nanotubes, aluminium, copper or silver.
5. efficient conductive structure according to claim 1, which is characterized in that the base material is set in the form of sheets or other are several
What shape is set.
6. efficient conductive structure according to any one of claim 1 to 5, which is characterized in that also comprising a heat source
And a heat-sink unit, and the base material is located between the heat source and the heat-sink unit, the heat conduction silk thread of the base material one end
The heat source is linked to, and the heat conduction silk thread of the base material other end is linked to the heat-sink unit.
7. efficient conductive structure according to any one of claim 1 to 5, which is characterized in that also comprising a heat source,
The heat conduction silk thread of the end face of the base material is linked to the heat source, and the heat conduction silk thread of the base material other end is exposed to
In air.
8. efficient conductive structure according to claim 7, which is characterized in that the heat conduction of the base material other end
Silk thread is suppressed to form fin-like.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105139400A TW201821585A (en) | 2016-11-30 | 2016-11-30 | High efficiency thermal conductivity structure |
| TW105139400 | 2016-11-30 |
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| CN108124407A true CN108124407A (en) | 2018-06-05 |
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| CN201711175430.7A Withdrawn CN108124407A (en) | 2016-11-30 | 2017-11-22 | High-efficiency heat conduction structure |
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| US (1) | US20180149436A1 (en) |
| CN (1) | CN108124407A (en) |
| TW (1) | TW201821585A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| USD903610S1 (en) * | 2019-08-28 | 2020-12-01 | Carbice Corporation | Flexible heat sink |
| US20210063099A1 (en) | 2019-08-28 | 2021-03-04 | Carbice Corporation | Flexible and conformable polymer-based heat sinks and methods of making and using thereof |
| USD904322S1 (en) * | 2019-08-28 | 2020-12-08 | Carbice Corporation | Flexible heat sink |
| USD906269S1 (en) * | 2019-08-28 | 2020-12-29 | Carbice Corporation | Flexible heat sink |
| DE102021107824A1 (en) * | 2021-03-29 | 2022-09-29 | Nanowired Gmbh | Connection of two components with a connecting element |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083234A (en) * | 2006-05-26 | 2007-12-05 | 香港科技大学 | Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
| CN103367275A (en) * | 2013-07-10 | 2013-10-23 | 华为技术有限公司 | Interface conducting strip, preparation method thereof and heat dissipating system |
| US20160106005A1 (en) * | 2014-10-13 | 2016-04-14 | Ntherma Corporation | Carbon nanotubes as a thermal interface material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040009353A1 (en) * | 1999-06-14 | 2004-01-15 | Knowles Timothy R. | PCM/aligned fiber composite thermal interface |
| US7273095B2 (en) * | 2003-03-11 | 2007-09-25 | United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Nanoengineered thermal materials based on carbon nanotube array composites |
| US20050126766A1 (en) * | 2003-09-16 | 2005-06-16 | Koila,Inc. | Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact |
| CN101054467B (en) * | 2006-04-14 | 2010-05-26 | 清华大学 | Carbon nano-tube composite material and preparation method thereof |
| KR101022954B1 (en) * | 2008-05-30 | 2011-03-16 | 삼성전기주식회사 | Cooling fin and package substrate comprising the cooling fin and fabricating method of the same |
| JP5239768B2 (en) * | 2008-11-14 | 2013-07-17 | 富士通株式会社 | Heat dissipating material, electronic equipment and manufacturing method thereof |
| US20120090816A1 (en) * | 2010-10-13 | 2012-04-19 | William Marsh Rice University | Systems and methods for heat transfer utilizing heat exchangers with carbon nanotubes |
-
2016
- 2016-11-30 TW TW105139400A patent/TW201821585A/en unknown
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2017
- 2017-11-22 CN CN201711175430.7A patent/CN108124407A/en not_active Withdrawn
- 2017-11-22 US US15/820,953 patent/US20180149436A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101083234A (en) * | 2006-05-26 | 2007-12-05 | 香港科技大学 | Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use |
| CN103367275A (en) * | 2013-07-10 | 2013-10-23 | 华为技术有限公司 | Interface conducting strip, preparation method thereof and heat dissipating system |
| US20160106005A1 (en) * | 2014-10-13 | 2016-04-14 | Ntherma Corporation | Carbon nanotubes as a thermal interface material |
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| US20180149436A1 (en) | 2018-05-31 |
| TW201821585A (en) | 2018-06-16 |
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Application publication date: 20180605 |