TW200524515A - Ceramic heat sink with composite multi-layered porous structure - Google Patents

Abstract

A ceramic heat sink with composite multi-layered porous structure, which mainly comprises: a heat-dissipation layer made of ceramic material, a heat-absorption layer made of metal material, and a conduction-connection layer between the heat-dissipation layer and the heat-absorption layer. The heat-dissipation layer has a heat-dissipation base and an external heat-dissipation top. The heat-dissipation base is made by extruding the ceramic powder particles with high thermal conductivity and different particle diameters by high pressure, then associated in the way of rolling-pressing formation, pressing formation, or slurry-instilling formation, followed by being sintered to have a porous structure having gaps. The external heat-sink top is made of the same material integrally, or is attached onto its top surface. The bottom surface of the heat-dissipation base in the heat-dissipation layer is connected to the heat-absorption layer through the conduction-connection layer. The heat-dissipation layer contacts with the contact surface of heat source, so that the heat-absorption layer can absorb the heat from the heat source. By means of the porous structure in the heat-dissipation base of the heat-dissipation layer and the external heat-dissipation top to dissipate more heat, the heat-dissipation capability of the heat sink is enhanced by natural convection using the air as the heat-dissipation medium, or by an enforced convection additionally.

Description

200524515 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention belongs to the technical field of electronic component radiators, a new design of a special multilayer porous hole structure ceramic radiator, which refers to a type of composite ceramic material and heat dissipation of porous holes. Layer of heat dissipation base and ^ = thermal conductivity of the ceramic area outside the heat dissipation top to improve the dissipation of the heat sink 2 contact with the air meter [prior art] ... knife test. Press' With the development of the information semiconductor industry, semiconductors have been developed at a frequency. In recent years, for example, central processing units (CPU + Of:

= Shang Wen? Question 'that is, how to effectively heat the electronic device (such as Chinese-Chinese, electric transistor, light-emitting diode LED, Chip set) ^ 4 + one, so that the electronic device can operate at an appropriate operating temperature, discharge, phase Key issues for development. ㈣ Has become a competition among various industry players. Take the computer as an example. The conventional radiator is installed on the central processing unit. Please refer to the second figure. Most of the conventional heat sinks (1) include a heat sink (2), and the heat sink (2, the heat absorption layer (12) is provided on the heat source (3), such as a central processing unit). ) 'And affixed with the heat source 孰, the above-mentioned loose fin UO is juxtaposed and has a heat sink book ⑴υ, and the heat sink ⑴) is provided with a fan (4) [a heat sink (11) and a fan (4) Gap (41)] = The convection air will dissipate the heat from the heat source (3)). The heat sink (1⑴, ..., convection strip away from the heat sink⑴) is exhausted (exhaust air or supply air, depending on the space and the gauge). (Required) 'to lower the temperature. Although the conventional heat sink () has been made of copper, copper, and copper with good heat dissipation,

Page 5 200524515 V. Description of the invention (2) 'One' The effect of heat conduction and heat dissipation is still difficult to meet the needs of high-speed and high-power development, and the huge volume required on some computers with limited space (such as notes Type computer), it is necessary to use other heat dissipation structures (such as heat pipes) to achieve the minimum requirements for heat dissipation. The above are the biggest weaknesses of conventional technology, which are urgent problems for the industry to overcome. The transistor is low, but the crystal or luminescence should be added to the metal. The designer's difficulty is the invention. This invention is used for the transistor or to reduce the heat source. The picture is based on multiple P4S800 computers. The temperature can be 70 3 ~ 5 ° C.

The body and the light-emitting diode are used for high-speed diodes to generate convection. Then take "the heat dissipation hole ceramic heat dissipation motherboard produced on the multi-pole L-hole light-emitting diode as an example. When the temperature is lowered to 52 ° C for electrical products, the electrical heat is grounded." "Electro-ceramic materials" to make 'take air as a natural problem. This part is like the actual test results of a chip applied to a transistor. At the same time, the thermal energy generated by the motherboard is mostly imported into the motherboard by the road designer, and the heat is not exported. In the past, the magnetic effect caused electricity to act as a heat sink and then adhered to the convection medium. In addition, the temperature of the surface of the transistor of Hua Shiyuan's transistor can also reduce the applicant's previous application for an invention patent in November 91. The warp knitting: $ "hole structure ceramics", and Approved patents, published in the 91st, "Shen Yi case No. 9 11 3 5 8 6 report, announcement number 555723. The patent published on October 1st is composed of a heat-dissipating layer and a heat-conducting layer. The principle of the a-hole structure ceramic heat sink is based on the unevenness of the latex-like slurry. Erdaosan 'forms microcellular junctions of ceramic powder

200524515 V. Description of the invention (3) Structure, combined with sub-micron powder, and then sintering the structure heat dissipation layer, which heat dissipation layer? The L-gap ratio is in the hole-shaped cavity of the Zhongchang factory, and it has a layer of thermal conductivity in contact with the heat source between the tomb and the tombstone :: ^ Source heat :: The hole of the hollow crystal body is further passed through the heat dissipation layer Air is used as a heat dissipation medium to improve the heat dissipation of the heat sink. Another method is to improve the heat dissipation ability of the heat sink. [Inventive content] Li Zhenfanshan The inventor of the present invention, in view of the lack of the aforementioned conventional technology == granules, is extruded by high pressure and then roll-molded or stamped; or: 成 聚 ^ ^ ^ ° The porous sound structure of the porous structure ceramics 'and the same material are integrated or attached to the top surface to form a shell. The air convection is used to improve thermal convection = easy production process.' Products with high added value are After design, continuous research, and improvement, the research and development of the present invention is finally successful and made public. In the present invention, ceramic powder materials (such as: gasification, silicon nitride SiN, boron nitride BN, silicon carbide Sic, graphite c, etc.) with appropriate powders with high thermal conductivity are added, and an appropriate proportion of inorganic binder and organic plastic are added. Through the process of uniformly mixing J, sintering, and the like, a porous hole with high thermal conductivity and high heat dissipation rate is manufactured; and =: and combined with the heat absorption layer of the metal material to form a high heat dissipation electronic element edge, the main purpose of the present invention is to Provide a "composite hole structure ceramic heat sink", mainly composed of heat dissipation layer, heat absorption layer and intermediary 200524515 V. Description of the invention (4) The density of the structure of the conductive layer between the heat layer and the heat absorption layer and high specific heat characteristics; metal Has a high (such as: the conductivity coefficient of copper metal special 22: those with "the thermal conductivity of ...", your number is 382W / mK). The scattered thermal expansion m core particle size of high thermal conductivity ceramic powder ( Such as: carbonized stone eve Sic ϋ series 2 different 270W / mK), ceramic and right and you from L & υ thermal conductivity as material. Manufactured by ceramics, two high voltage ^ Α 〇; Formula for slurry infusion molding: the company has 2 ff type or pressure molding or adjustment And the external dispersion i; two upper: ::; =: body or attached to its top heat absorption layer, the heat absorption layer and the base m conductive = strengthen the heat dissipation outside the top of the heat, to the air: the "" and a mandatory Convection conditions to improve the heat dissipation performance of the radiator, [Embodiment] 2 Technical means to achieve the aforementioned purpose of the invention 'are listed here == Mingru, your reviewer can match it; Ming: =, characteristics = achieved The effect is better understood. Please refer to the second to ninth pictures. The hole structure of this hair is sobbing ... Gan * Fayue's composite multi-layer type (21), full; 1 # ί (), which should contain ceramic materials The heat absorbing layer (22) of the heat absorbing layer (22) and the heat radiating top outside the heat absorbing layer: a layer (23), the heat radiating layer (21) has a heat radiating base (211) and a connection & 213, 214, 215, 216, 217), the conductive layer (23) 2 is connected to the bottom surface of the heat-radiating base (211) and the top of the heat-absorbing layer (22). The soldering layer (23) can use solder paste. Soldering the heat-radiating base (211) to page 8 200524515 V. Description of the invention (5) The heat-absorbing layer (22) is welded, and the heat-radiating adhesive (2 1 1) and The endothermic layer (22) is adhered. … The heat dissipation layer (2 1) has a heat dissipation base (2 11) and an outer heat dissipation top (2 丨 2, 2 1 3, 2 1 4, 2 1 5, 2 1 6, 2 1 7), wherein the heat dissipation base (2 11) It uses high thermal conductivity ceramic powder with different particle diameters, and combines it with 're-sintering to form a porous porous structure with gaps by high pressure extrusion and then roll molding or stamping or slurry infusion molding. The top (2 1 2, 2 1 3, 2 1 4, 21 5, 2 1 6, 2 1 7) is made of the same material or attached to the top surface. The manufacturing method of the heat-dissipating layer (21) of the present invention includes the following steps: Raw materials are prepared from 100-600 meshes, and ceramic powders with high thermal conductivity (heat-conductivity ceramics) with different powder particle sizes () at appropriate proportions are prepared. Actual powders such as: aluminum nitride A1N, silicon nitride SiN, boron nitride BN, silicon carbide S i C, graphite C, etc. are added with an appropriate proportion of binder (for example: Shi Xisol

Si02 sol, aluminum sol A1 203 sol, zirconium sol Zr02 sol, aluminum phosphate solution A1 (H2P04) 3, etc. ^ ... and molding agents (for example: starch, lignin ^ lignocellulose about carboxymethyl cellulose, methyl fiber Vegetarian, etc.);

η Stirring and mixing of raw materials: ceramic powders with high thermal conductivity of different powder particle sizes are uniformly mixed with the binder and the molding agent, so that each powder surface has a uniform layer of the binding agent and the molding agent; extrusion molding: The high-pressure extrusion molding method can be used to extrude the aforementioned materials into a shape of 0 or has been poured. Roll forming: pressurized by means of rolling 〖· 〇 ~ 3 · Thick ceramic pieces combined with each powder (each The combined dose between powders is the smallest), so that the structural density is averaged; Drying · The shaped ceramic sheet is dried and dried for less than 2000

200524515

As mentioned above, the heat-dissipating layer (21) of the present invention has a heat-dissipating base (211) and a heat-dissipating top (212, 213, 214, 215, 216, 217) which is integrated with or attached to the top surface of the heat-dissipating base (21 丨) using the same material. The following are the descriptions of the composite shapes of the outer heat dissipation top (212, 213, 214, 215, 216, 217) and the heat dissipation base (211) as follows: 1 · Flat type heat sink: Please refer to the second figure, which The heat dissipation layer (2 丨) is made of Sic powder (particle size 100 ~ 600 mesh), its solid content is about 70 ~ 90% by weight, and about 10 ~ 30% by weight and 3% of fluorene-based fiber The elements are mixed uniformly. After that, the plate-shaped ceramic sheet heat-radiating base (211) is prepared through the aforementioned process, and then dried to sinter between 1 3 0 ~ 1 4 5 0 C into a plate-shaped porous hole structure heat-radiating bay layer. (21), the porosity of which is 20 ~ 60%, this heat-dissipating layer (21) is an integrated heat-dissipating base (2 11) and is located on the top surface of the heat-dissipating base (2 1 1). Top 邛 (2 1 2). Still referring to the second picture, the heat dissipation layer (21) of the porous cavity structure ceramic and the heat source (3) have a heat absorption layer (22) on the contact surface. [The heat absorption layer (22) is made of a metal with a higher specific heat, such as copper, aluminum … Etc.], the heat absorption layer (22) absorbs heat from the heat source (3), and then passes through the porous hole structure of the heat dissipation layer (2 1). Natural convection or a forced convection condition [such as a fan (^)] to improve the heat dissipation capacity of the radiator. This heat sink has been proven # 2 to achieve the best heat dissipation with a thickness of 1 · 0 ~ 2 · 0mm. This flat-plate heat sink has been tested through Intel puntium 4 'Socket 478 (86 * 70mm length and width) and then 70 * 70 * 1 5ππη 460 0rPm fan for forced convection, which can solve 68 watts ( Watts), the central bottom of its CPU

200524515 V. Description of the invention (7) The die temperature will not exceed 62 ° c. 2. Concavo-convex three-dimensional heat sink: Please refer to the third and fourth figures. In this embodiment, the formed heat dissipation layer (21) and the heat dissipation base (211) are punched by the mold, and also on top of the heat dissipation base (2 11). The surface is formed with a concave-convex three-dimensional shape with a predetermined geometrical arrangement, and the outer heat dissipation top (2 1 3) is demoulded, stamped into a predetermined shape, and then dried to sinter into an integrated concave-convex three-dimensional porous cavity structure ceramic heat sink ( twenty one). Still referring to the third and fourth figures, the heat dissipation layer of the porous cavity structure ceramic, said (2 1) has a concave and convex three-dimensional shape with a pre-arranged geometric arrangement, and the top (21-3) is in contact with the heat source (3). There is also a layer of heat absorption layer (22 °) between the surface, and the heat from the heat source (3) is absorbed by the heat absorption layer (2 2), and then heat dissipation is performed through 'ti: (21 two-hole structure and enhanced heat dissipation [.KΓι Self-convection or add a forced convection condition

Feather] to improve the heat dissipation ability of the two heat sinks. Due to the multiple: ,, π, the concave geometry of the predetermined geometrical arrangement of the ceramic heat dissipation layer (21) / S, the above-mentioned concave and convex three-dimensional scattered structure must be Cheng / 〇1,… > Fork is a more feasible embodiment. : And ::: = The convex and concave three-dimensional shape is just another kind of shape, and the right π η ^ is not limited to its shape. For example, the fifth figure is an example of a 3 =?-Shaped outer heat dissipation top (214). 3 · Surface-attached heat sink: As follows: First, the bismuth and figure bismuth are used to describe the method of spraying the surface as the surface-attached manufacturing method. The materials are mixed. Example Heat-sinking layer (21) Heat-sinking base (2 phase heating: the aforementioned guest ^ ^ Xi hole structure ceramic heat dissipation layer (21) heat dissipation base

200524515 V. Description of the invention ⑻---- (21 1) heating (after sintering is completed) heating; spraying the slurry ··· The slurry is evenly sprayed on the preheated 5,000. 〇 Above the surface of the heat dissipation base (211) of the porous structure ceramic; Sintering · Sintering the ceramic heat dissipation layer (2 丨) sprayed with the slurry of the porous structure into the heat dissipation layer of the porous structure ceramic 多孔Above the basin, the top surface of the thermal base (211) has an additional "square" shape (the particles are different in size and are not eye-catching 丨 妯 石 丨, spray-type external heat dissipation top (215) [Please read $ ^… 〇 surface area to improve heat dissipation effect. The second function is to increase heat dissipation by 5%.…, The thermal effect of the device is higher than the flat type

The description is in the form of slurry spraying. The net / structured ceramic heat dissipation layer additionally formed on the top surface of (21) heat dissipation base (21 丨) can also be printed on the surface. ”, Top (21 5), but this is a near and regular arrangement of the printed external type, and then sintered into small and large particles phase diagram]. Top (216) [please refer to the seventh 4 · reticulated sponge radiator (Please adjust the table: take (Scatter diagrams and ninth diagrams of the previous embodiment): materials, mixed and stirred to form a slurry;… the heat sink base (211) is the same as the carrier dipping paste: take the shape of the carrier and the material of the machine, and make the skeleton and the communication porous, Read hibiscus material, the shape of the shaped carrier is a poly-shaped shaped carrier with an average adherence (such as sponge), dipping pressure adhesion: the shape of the adhered slurry and maintain the communication of the channels. (21) of The heat dissipation base (2 11) is bonded. ^ Sintering of porous ceramic structure heat dissipation layer: _____, ceramic structure heat dissipation layer with hole material attached, page 12 200524515

V. Description of the invention (9) (1) The heat-radiating base (211) is sintered between 1 300 ~ 1 450 ° c, and the organic material skeleton possessed by the shaped carrier is burned to form a messy reticulated sponge knot outside the original top ( 217). Please refer to the eighth and ninth figures, the reticulated sponge ^ thermal outer heat dissipation top (217) has a ceramic skeleton (2171) with high heat rate, and each ceramic skeleton (21 71) has interconnected channels (2) 172). That is, the top surface of the heat dissipation base (2 11) of the porous ~ structure ceramic heat dissipation layer (21) is combined with a "layer evening net ^ 1 L heat dissipation top (2 1 7) outside each cotton structure, and the mesh sponge The heat dissipation top (217) outside the structure has a ceramic frame (2171) with a high heat rate, and each of the high heat dissipation rates (2172) has a through-hole (2172), which is used to increase the heat dissipation surface area and the heat dissipation effect. It has been confirmed through experiments that the mesh sponge: (21j is a messy interconnecting tunnel, if a fan is placed above it for strong & flow, it is not allowed to use a blower to dissipate heat, it needs to be exhausted to dissipate heat, because σ The hot air in the messy channel will cause turbulence. It has been proved through experiments that the light-emitting diode LED of 3 watts is used as an example. In order for the light-emitting diode to become a colorful billboard, it must have red, blue, and green. LED bulbs are used on the same module. At the same time, the temperature of three LED bulbs must not exceed 70 ° C, otherwise it will cause a composite color deviation. After experiments, it is found that a circle diameter of 8 cm is required, and the bottom heat dissipation base (211) requires 丨 · 5 ~ 2.0mm flat-plate radiator, the upper layer needs a 10mm-thick mesh sponge-type external heat dissipation top (217), so that it can achieve the heat dissipation of three LEDs under natural convection conditions. As shown in the figure, the figure is an experimental example of the application of the composite multi-layer porous hole and concrete ceramic radiator of the present invention to a transistor (50). The transistor of the electric body (50) is introduced Feet (5 2) and the ground plane (5 1) of the board is connected to the board by welding, and is adhered to the ASUS p4S800 with the heat dissipation layer (21) of the present invention.

Page 13 200524515 V. Description of the invention (ίο) The actual measurement results above the transistor on the computer motherboard are taken as an example. The surface temperature of the transistor (50) can be reduced from 70 ° C to 5 2 ° C; at the same time, The temperature of the motherboard can also be reduced by 3 ~ 5 ° C. The composite multilayer porous hole structure ceramic radiator of the present invention can use a ceramic material with high thermal conductivity, a heat dissipation layer of a porous hole structure, and a heat dissipation top that can increase the surface area outside the contact with air, greatly increasing the heat dissipation capacity, and completely solve the current large-scale problem. The volume of aluminum metal cooling fins lacks the poor heat dissipation effect. At the same time, it also has a simple production process and low materials and manufacturing costs. It can be widely used for heat dissipation of various electronic devices that can generate heat.

Page 14 200524515 Brief description of the diagram Brief description of the diagram: The first diagram is a side view of a traditional metal sheet radiator. The second figure is an elevational side view of the flat-plate heat sink assembly of the present invention. The third figure is an enlarged perspective view of a part of the concave-convex three-dimensional radiator of the present invention. The fourth figure is an elevational sectional view of the concave-convex three-dimensional heat sink assembly of the present invention. The fifth figure is a partially enlarged perspective view of another embodiment of the concave-convex three-dimensional heat sink of the present invention. The sixth figure is a sectional view of the surface-attached heat sink assembly of the present invention (spatter type, irregularly arranged).

The seventh figure is a regular cross-section of the surface-attached heat sink assembly of the present invention). k I W π The eighth figure is a perspective side view of the reticulated sponge radiator assembly of the present invention. The ninth figure is a perspective view of the reticulated sponge radiator of the present invention. Illustration. The tenth figure is a diagram of an experimental embodiment of a composite multi-layer porous hole in a transistor of the present invention. It is a government heater application Symbol description: (1) heat sink (II) heat sink

(III) Heat dissipation fins (1 2) Heat absorption layer (2) Heat sink (21) Heat dissipation layer (211) Heat dissipation base

200524515 Brief description of the diagram (2 1 2, 2 1 3, 2 1 4, 2 1 5, 2 1 6, 2 1 7) Outer heat dissipation top (2 1 7 1) Ceramic skeleton (2172) Channel (22) Heat absorption layer (23) Conductor layer (3) Heat source (4) Fan (4 1) Clearance (50) Transistor (5 1) Board ground plane (52) Transistor pin

Page 16

Claims (1)

200524515 VI. The scope of the patent application contains 1 ceramic heat sink with a porous hole structure, which is composed of ceramics, ceramics, heat sinks, metal materials, etc., and conductive layers between layers. ^ ㈢ and the base of the heat dissipation system is not used 及 = and the top of the external heat dissipation ?: if press molding or stamping molding or deployment of slurry-enhanced ceramic powder, high-pressure two-dimensional i 粍 to form a porous hole structure with gaps The outer layer is shaped to absorb heat from the heat source, and then contacted by the second contact surface. The top of the hole is absorbed by heat absorption, and the porous structure is in a forced convection mode.丨 Natural convection or re-force, 2. According to the patent application, the meaning is: =: = force. The ceramic heat sink is constructed, in which the top surface of the multilayer porous hole junction is integrally formed with a predetermined number. ^ 2 heat dissipation base of ceramic heat dissipation layer 3. According to the patent application: Enclosure 2 = ^ structure ceramic heat sink, in which the top surface of the composite multilayer porous hole junction described by the member is combined with a layer of ^ ^ hole structure ceramic Heat-dissipating layer Splash type diffuser ^ 卩. The same material is irregularly arranged, and it is a ceramic heat sink according to the patent application. The composite multilayer porous hole junction described in the above item is added with One layer ▲ Two-hole structure ceramic heat-dissipating layer Heat-dissipating base I Granular printing type heat-dissipating top. The same material and regular arrangement are in the shape of 5. A ceramic heat sink is constructed according to the scope of the patent application. The heat dissipation base of the heat dissipation layer of the composite multilayer porous hole junction μ hole structure ceramics described in page 17, 200524515 VI. The top surface of the patent application part is combined with a layer of the same sponge-like external heat dissipation top, which is made of the same material. The top of the heat sink has a ceramic skeleton with high heat dissipation rate, and each ceramic frame has interconnected channels. 6. The composite multilayer porous hole structure ceramic heat sink according to item 丨 of the patent application scope, wherein the heat dissipation layer The heat-dissipating base contains a ceramic powder with a solid content of about 70 to 90 wt%; [0 to 30 wt% of a binder and 3% of a molding agent. 1 7. According to the composite multilayer porous cavity structure ceramic radiator described in item 6 of the patent application scope, the ceramic powder composition is aluminum nitride A 丨 N, silicon nitride SiN, boron nitride BN, silicon carbide Sic, and graphite C. 8. Basis. The composite multilayer porous hole structure ceramic heat sink described in item 6 of the scope of the patent application, wherein the binder components are silica sol Si02 sol, aluminum sol 1230 S0l, wrong Rongshen 02 sol and 璘 "Lu solution Ai (H2po4) 3. Solvent pottery 1 coincidence. Shen Lili: Wai] V Bureau®X Multi-layer Sail described in Item 6 "H-hole 3 structure ceramics are Zhengreyi '. Among them, the plasticizer ingredients are 1 acid, carboxymethyl cellulose, and methyl cellulose. Affordable Tokigi Jae 第 18 页