CN112105216A - Manufacturing method of radiator, radiator and electronic equipment - Google Patents
Manufacturing method of radiator, radiator and electronic equipment Download PDFInfo
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- CN112105216A CN112105216A CN201910475503.7A CN201910475503A CN112105216A CN 112105216 A CN112105216 A CN 112105216A CN 201910475503 A CN201910475503 A CN 201910475503A CN 112105216 A CN112105216 A CN 112105216A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 103
- 239000000843 powder Substances 0.000 claims abstract description 99
- 230000017525 heat dissipation Effects 0.000 claims abstract description 69
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 14
- 238000010288 cold spraying Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 238000007605 air drying Methods 0.000 claims description 6
- 238000007751 thermal spraying Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 10
- 229910010293 ceramic material Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a manufacturing method of a radiator, the radiator and electronic equipment, wherein the manufacturing method of the radiator comprises the following steps: providing ceramic powder and a heat dissipation base, wherein the heat dissipation base is provided with a surface to be dissipated; and attaching the ceramic powder to the surface to be heat-dissipated in a way of impact deformation at a preset speed rate to form a heat-dissipating layer, wherein the porosity of the heat-dissipating layer is 5% -20%. The heat dissipation layer is formed by attaching ceramic powder to the surface to be dissipated in a mode of impact deformation at a preset speed, and the porosity of the heat dissipation layer is 5% -20%, so that the surface radiation rate of the radiator is enhanced, the contact area of the heat dissipation layer and air is increased, the heat dissipation performance is improved, the manufacturing is convenient, and the manufacturing cost is reduced.
Description
Technical Field
The present disclosure relates to the field of communication devices, and in particular, to a method for manufacturing a heat sink, and an electronic device.
Background
The existing ceramic radiator has the advantages of high surface emissivity and strong heat radiation capability, however, the ceramic radiator has higher manufacturing cost due to the large forming difficulty and complex manufacturing process of the structural part made of ceramic materials.
Disclosure of Invention
The application provides a manufacturing method of a radiator, the radiator and electronic equipment.
The application provides a manufacturing method of a radiator, wherein the manufacturing method of the radiator comprises the following steps:
providing ceramic powder and a heat dissipation base, wherein the heat dissipation base is provided with a surface to be dissipated;
the ceramic powder is attached to the surface to be cooled in a mode of impact deformation at a preset speed rate to form a heat dissipation layer, and the porosity of the heat dissipation layer is 5% -20%.
The application provides a radiator, wherein, the radiator includes heat dissipation base and heat dissipation layer, the heat dissipation base is equipped with treats the heat dissipation surface, the heat dissipation layer by ceramic powder with predetermine speed striking deformation's mode attached to treat on the heat dissipation surface form, the porosity on heat dissipation layer is 5% ~ 20%.
The application provides an electronic device, wherein the electronic device comprises the radiator.
The application provides a manufacturing method of a radiator, the radiator and electronic equipment, through form the heat dissipation layer on the surface of waiting to dispel the heat of heat base, the heat dissipation layer by ceramic powder with predetermine speed striking deformation's mode attached to wait to dispel the heat and form on the surface, and the porosity on heat dissipation layer is 5% ~ 20%, makes the surface radiance of radiator strengthens, heat dissipation layer and air area of contact increase improve heat dispersion to convenient preparation reduces the cost of manufacture.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a heat sink according to an embodiment of the present disclosure;
fig. 2 is a schematic flowchart of step 101 of a method for manufacturing a heat sink according to an embodiment of the present application;
fig. 3 is a schematic processing diagram of a manufacturing method of a heat sink according to an embodiment of the present disclosure;
fig. 4 is a schematic processing diagram of a manufacturing method of a heat sink according to an embodiment of the present disclosure;
FIG. 5 is a schematic cross-sectional view of a heat sink provided in an embodiment of the present application;
fig. 6 is a schematic cross-sectional view of an electronic device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
In the description of the embodiments of the present application, it should be understood that the terms "thickness" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, and do not imply or indicate that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, the present application provides a method for manufacturing a heat sink, the method for manufacturing the heat sink includes the steps of:
101: a ceramic powder and a heat sink base 900 are provided, the heat sink base 900 having a surface 910 to be heat dissipated.
In this embodiment, the heat dissipation base 900 may be manufactured after the ceramic powder is manufactured. The heat dissipation base 900 may be manufactured first and then the ceramic powder may be manufactured. The ceramic powder and the heat sink base 900 may be simultaneously manufactured.
In one embodiment, the step 101 comprises the steps of:
1011: providing ceramic powder to be treated.
In this embodiment, the ceramic powder to be treated may be formed by crushing a ceramic material. And the ceramic powder to be treated is filtered by a filter screen and then is placed in a storage container. The manufacturing steps of the ceramic powder to be treated are carried out in a dust-free workshop. The outer diameter of the particles of the ceramic powder to be treated is in a nanometer level, namely the ceramic powder to be treated is the nanometer ceramic powder. Of course, in other embodiments, the outer diameter of the ceramic powder to be processed may be set to micron level, or other ceramic powder with larger outer diameter.
1012: and carrying out air drying treatment on the ceramic powder to be treated at a preset temperature to obtain liquid-free ceramic powder.
In the present embodiment, the ceramic powder to be processed is placed in an air drying apparatus, an air drying preset temperature of the ceramic powder to be processed is set to 40 ℃ to 60 ℃, and an air drying airflow rate of the ceramic powder to be processed is set so that moisture of the ceramic powder is sufficiently evaporated so that the ceramic powder to be processed forms a ceramic powder free from a liquid component.
1013: a base to be processed 110 is provided, the base to be processed 110 having a surface to be processed 111.
In the present embodiment, the base to be processed 110 includes a base plate 112 and a plurality of heat radiating fins 113 fixed to the base plate 112. Each of the heat sinks 113 is substantially perpendicular to the base plate 112. Each of the heat sinks 113 extends substantially in a straight line. The plurality of heat dissipation fins 113 are arranged at equal intervals. A preset distance exists between two adjacent heat dissipation fins 113. Each of the heat dissipation fins 113 is integrally formed with the bottom plate 112, that is, the base 110 to be processed may be formed by milling a plate. The base 110 to be processed is formed by processing an aluminum profile. The heat conduction coefficient of the pedestal 110 to be processed is 150-200.
Specifically, the bottom plate 112 has a bottom surface 114 and a top surface 115 disposed opposite the bottom surface 114. The heat sink 113 is formed on the top surface 115. Each of the fins 113 has two opposite side surfaces 116 and an end surface 117 opposite to the base plate 112. The side surfaces 116, the end surfaces 117 and the top surface 115 together form the surface to be processed 111 in correspondence to the spacing areas between the heat sinks 113.
1014: and grinding and polishing the surface to be processed 111 to form a surface to be cooled 910, wherein the surface roughness of the surface to be cooled 910 is less than 0.4 micrometer.
In this embodiment, the surface to be processed 111 is first ground to remove burrs on the surface to be processed 111, then the surface to be processed 111 is mechanically polished, and after the base to be processed 110 is polished, impurities on the base to be processed 110 are removed, so that the heat dissipation base 900 is finally obtained. The heat dissipation base 900 has a surface 910 to be dissipated with a surface roughness of less than 0.4 μm. The surface roughness of the surface 910 to be heat-dissipated is less than 0.4 μm, so that the surface 910 to be heat-dissipated is smooth, and the surface 910 to be heat-dissipated has high deformation adhesion stress, which facilitates increasing the bonding rate between the ceramic powder and the surface 910 to be heat-dissipated when the ceramic powder is additionally attached to the surface 910 to be heat-dissipated, so that the ceramic powder can be effectively and stably fixed on the surface 910 to be heat-dissipated.
Referring to fig. 1 and 5, the method for manufacturing the heat sink further includes the steps of:
102: the ceramic powder is attached to the surface 910 to be heat-dissipated by impact deformation at a predetermined rate to form the heat-dissipating layer 800, wherein the porosity of the heat-dissipating layer 800 is 5% -20%.
In one embodiment, a cold spraying device is provided, and compressed gas is used as a carrier to drive the ceramic powder to impact and deform on the surface 910 to be heat dissipated. The compressed gas can be compressed by a compression device of the cold spraying equipment to form a gas with a certain gas pressure. The compressed gas may be an inert gas, such as nitrogen. The compressed gas does not easily react with the ceramic powder, does not easily corrode the ceramic powder, and does not easily corrode the heat dissipation base 900. The compressed gas does not contain water vapor, the water vapor is prevented from being condensed, the ceramic powder is wetted and agglomerated, particles of each ceramic powder are deformed and combined with each other, moisture is prevented from being present in gaps among the particles of the ceramic powder, and the heat dissipation efficiency of the heat dissipation layer 800 is improved. By setting the operation parameters of the cold spraying device, the compressed gas drives the ceramic powder to impact the surface to be heat dissipated 910 at a preset rate. The ceramic powder is deformed after striking the surface 910 to be heat-dissipated, and can be effectively combined with the heat-dissipating base 900. The ceramic powders are deformed after being impacted with each other, so that the ceramic powders are stacked on each other to finally form the heat dissipation layer 800 on the surface 910 to be dissipated, and finally the heat sink 1000 is obtained. The heat dissipation layer 800 has a high surface emissivity of a ceramic material and a high thermal radiation performance of a ceramic material, so that the heat sink 1000 has a high thermal conductivity of an aluminum material and a high surface emissivity of a ceramic material, and improves heat dissipation performance.
In the present embodiment, the ceramic powder is sprayed on the surface to be heat-dissipated 910 multiple times, and the excess ceramic powder is removed once after the ceramic powder layer 810 with a preset thickness is formed by each spraying. Specifically, after the cold spraying equipment drives ceramic powder to be sprayed on the surface 910 to be heat-dissipated and a ceramic powder layer 810 with a preset thickness is formed, the cold spraying equipment stops spraying the ceramic powder on the surface 910 to be heat-dissipated, the blowing equipment blows off redundant ceramic powder on the ceramic powder layer by using compressed gas, then the cold spraying equipment continues to spray ceramic powder on the ceramic powder layer next time to form another ceramic powder layer, and finally multiple ceramic powder layers are stacked to form the heat-dissipating layer 800. The ceramic particles in the heat dissipation layer 800 are impacted with each other, deformed and firmly combined, no redundant ceramic powder exists, the combination stress of the ceramic particles in the heat dissipation layer 800 is improved, the heat dissipation layer 800 is stable in structure, the porosity is accurately controlled, and the heat dissipation performance is improved.
In another embodiment, substantially the same as the embodiment shown in fig. 1, except that in the step of providing the ceramic powder to be treated, the ceramic powder to be treated is provided to have a predetermined outer particle diameter. Specifically, the ceramic powder to be treated is extracted by a preset weight, whether the average particle outer diameter of the ceramic powder to be treated of the preset weight meets a preset value is detected, if yes, the ceramic powder to be treated is determined to have the preset particle outer diameter, and the ceramic powder to be treated is subjected to the next treatment step. In the step of attaching the ceramic powder to the surface to be heat-dissipated 910 by impact deformation at a preset rate, a thermal spraying apparatus is provided, and the ceramic powder is heated to a molten state by the thermal spraying apparatus to impact deform the ceramic powder in the molten state on the surface to be heat-dissipated 910. Specifically, the ceramic powder after air drying is added into the thermal spraying equipment; setting spraying parameters of the thermal spraying equipment, and heating the ceramic powder to a preset temperature to enable the ceramic powder to be in a molten state; the ceramic powder in a molten state is driven to impact and deform on the surface 910 to be heat dissipated by using compressed gas as a carrier through cold spraying equipment, and finally the heat dissipation layer 800 is formed. Through with ceramic powder with molten state striking deformation in treat on the radiating surface 910, improved ceramic powder with the bonding rate of heat dissipation base 900 has and improved ceramic powder's cohesion each other makes radiator 1000 structure is firm.
Referring to fig. 5, the present application further provides a heat sink 1000, and the heat sink 1000 can be obtained by using the manufacturing method of the heat sink. The heat sink 1000 includes a heat sink base 900 and a heat sink layer 800, the heat sink base 900 is provided with a surface 910 to be heat dissipated, the heat sink layer 800 is attached to the surface to be heat dissipated by ceramic powder in a manner of impact deformation at a predetermined rate, and the porosity of the heat sink layer is 5% -20%.
It is understood that the heat sink 1000 may be used in an electronic device, and the heat sink 1000 may dissipate heat of a functional device in the electronic device to prolong a service life of the functional device. The electronic equipment can be mobile phones, tablet computers or notebook computers and the like.
In this embodiment, the heat dissipation base 900 has a bottom plate 112 and a plurality of heat dissipation fins 113 fixed to the bottom plate 112, a space exists between two adjacent heat dissipation fins 113, and the surface 910 to be dissipated is formed on the surfaces of the plurality of heat dissipation fins 113 and on the region of the bottom plate 112 corresponding to the space. The heat dissipation layer 800 completely covers the surface 910 to be dissipated. The heat dissipation layer 800 is formed of ceramic powder. The heat dissipation layer 800 has a high surface emissivity and a high heat radiation performance. The porosity of the heat dissipation layer 800 is 5% -20%, so that the contact area of the heat dissipation layer 800 and the air is increased, and the heat dissipation performance of the heat dissipation layer 800 is improved. The heat dissipation base 900 is formed by an aluminum profile through a stamping process or a numerical control milling process. The heat sink base 900 has a high thermal conductivity. The heat sink 1000 has a high thermal conductivity of an aluminum material and a high surface emissivity of a ceramic material, and improves heat dissipation performance.
Referring to fig. 6, the present application further provides an electronic device 2000, where the electronic device 2000 includes the heat sink 1000, and the electronic device 2000 further includes a chassis 700, a device 600 to be cooled, and a heat conductive layer 500. The case 700 is provided with an accommodating cavity 710, the to-be-cooled device 600 is fixed in the accommodating cavity 710, the heat conduction layer 500 is attached to one side of the to-be-cooled device 600 facing the case 700, one side of the heat radiator 1000 opposite to the heat radiation layer 800 is attached to the heat conduction layer 500, and the heat radiation layer 800 and the case 700 have a gap.
In this embodiment, the electronic device 2000 may be a mobile phone. The electronic device 2000 further comprises a front cover assembly 400, wherein the front cover assembly 400 comprises a glass cover plate 410 and a display screen 420 attached to the glass cover plate 410. The case 700 is a rear cover of the battery. The case 700 is covered with the glass cover plate 410. The display screen 420 is located between the glass cover plate 410 and the cabinet 700. The device to be cooled 600 is located between the display screen 420 and the chassis 700. The device to be heat-dissipated 600 may be a motherboard and a processing chip disposed on the motherboard. The thermally conductive layer 500 may be thermally conductive silicon. The heat conducting layer 500 is attached to the heat generating surface of the device to be cooled 600. The bottom surface 114 of the heat sink 1000 is attached to the thermally conductive layer 500. The heat dissipation layer 800 of the heat sink 1000 faces the inside of the case 700. The heat dissipation layer 800 dissipates heat of the device 600 to be dissipated into the air. The airflow between the heat dissipation layer 800 and the chassis 700 may dissipate heat to lower the temperature of the electronic device 2000 and improve heat dissipation performance.
The application provides a manufacturing method of a radiator, the radiator and electronic equipment, through form the heat dissipation layer on the surface of waiting to dispel the heat of heat base, the heat dissipation layer by ceramic powder with predetermine speed striking deformation's mode attached to wait to dispel the heat and form on the surface, and the porosity on heat dissipation layer is 5% ~ 20%, makes the surface radiance of radiator strengthens, heat dissipation layer and air area of contact increase improve heat dispersion to convenient preparation reduces the cost of manufacture.
The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (12)
1. A manufacturing method of a radiator is characterized by comprising the following steps:
providing ceramic powder and a heat dissipation base, wherein the heat dissipation base is provided with a surface to be dissipated;
and attaching the ceramic powder to the surface to be heat-dissipated in a way of impact deformation at a preset speed rate to form a heat-dissipating layer, wherein the porosity of the heat-dissipating layer is 5% -20%.
2. The method for manufacturing a heat sink according to claim 1, wherein in the step of providing the ceramic powder and the heat sink base, the ceramic powder is a nano-scale ceramic powder; and in the step of attaching the ceramic powder to the surface to be cooled in a way of impact deformation at a preset speed, providing cold spraying equipment, and driving the ceramic powder to impact and deform on the surface to be cooled by using compressed gas as a carrier through the cold spraying equipment.
3. The method for manufacturing a heat sink according to claim 1, wherein in the step of providing the ceramic powder and the heat sink base, the ceramic powder has a predetermined outer diameter of particles; in the step of attaching the ceramic powder to the surface to be radiated with impact deformation at a preset speed, providing a thermal spraying device, and heating the ceramic powder to a molten state by the thermal spraying device to impact deform the ceramic powder in the molten state on the surface to be radiated.
4. The method for manufacturing a heat sink according to claim 2 or 3, wherein the step of providing ceramic powder and the heat sink base comprises:
providing a base to be processed, wherein the base to be processed is provided with a surface to be processed;
and grinding and polishing the surface to be processed to form a surface to be radiated, wherein the surface roughness of the surface to be radiated is less than 0.4 micron.
5. The method for manufacturing a heat sink according to claim 2 or 3, wherein the step of providing ceramic powder and the heat sink base comprises:
providing ceramic powder to be treated;
and carrying out air drying treatment on the ceramic powder to be treated at a preset temperature to obtain liquid-free ceramic powder.
6. The method for manufacturing a heat sink according to claim 2 or 3, wherein in the step of attaching the ceramic powder to the surface to be heat-dissipated in a manner of impact deformation at a predetermined speed, the ceramic powder is sprayed on the surface to be heat-dissipated a plurality of times, and the excess ceramic powder is removed once after each spraying of a ceramic powder layer having a predetermined thickness.
7. The method of claim 6, wherein the excess ceramic powder is blown off by gas after each spraying step to form a ceramic powder layer with a predetermined thickness.
8. The method for manufacturing a heat sink according to claim 2 or 3, wherein in the step of providing the ceramic powder and the heat dissipation base, the heat dissipation base has a bottom plate and a plurality of heat dissipation fins fixed to the bottom plate, a space is provided between two adjacent heat dissipation fins, the surface to be dissipated is formed on the surface of the plurality of heat dissipation fins, and is formed on the bottom plate in a region corresponding to the space between two adjacent heat dissipation fins.
9. The heat radiator is characterized by comprising a heat radiation base and a heat radiation layer, wherein the heat radiation base is provided with a surface to be radiated, the heat radiation layer is attached to the surface to be radiated in a way of impact deformation at a preset speed by ceramic powder, and the porosity of the heat radiation layer is 5% -20%.
10. The heat sink as claimed in claim 9, wherein the heat dissipating base has a bottom plate and a plurality of heat dissipating fins fixed to the bottom plate, a space is provided between two adjacent heat dissipating fins, and the surface to be dissipated is formed on the surface of the plurality of heat dissipating fins and on the region of the bottom plate corresponding to the space.
11. An electronic device characterized in that it comprises a heat sink according to claim 9 or 10.
12. The electronic device of claim 11, further comprising a housing, a device to be heat-dissipated, and a heat-conducting layer, wherein the housing has a receiving cavity, the device to be heat-dissipated is fixed in the receiving cavity, the heat-conducting layer is attached to a side of the device to be heat-dissipated facing the housing, a side of the heat sink opposite to the heat-dissipating layer is attached to the heat-conducting layer, and a distance exists between the heat-dissipating layer and the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910475503.7A CN112105216A (en) | 2019-05-30 | 2019-05-30 | Manufacturing method of radiator, radiator and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910475503.7A CN112105216A (en) | 2019-05-30 | 2019-05-30 | Manufacturing method of radiator, radiator and electronic equipment |
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| CN112105216A true CN112105216A (en) | 2020-12-18 |
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| CN201521930U (en) * | 2009-11-12 | 2010-07-07 | 岳国伟 | Radiator with low-temperature and high radiation ceramic radiating coating |
| CN102390146A (en) * | 2011-06-23 | 2012-03-28 | 蔡州 | Manufacture method of heat transfer layer and heat-radiating layer arranged on surface of heat-radiating object, and heat-radiating layer structure |
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