CN2681325Y - Apertured structure ceramic radiator - Google Patents
Apertured structure ceramic radiator Download PDFInfo
- Publication number
- CN2681325Y CN2681325Y CN 03266923 CN03266923U CN2681325Y CN 2681325 Y CN2681325 Y CN 2681325Y CN 03266923 CN03266923 CN 03266923 CN 03266923 U CN03266923 U CN 03266923U CN 2681325 Y CN2681325 Y CN 2681325Y
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- heat
- layer
- heat dissipating
- dissipating layer
- conducting layer
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Abstract
The utility model relates to an apertured structure ceramic radiator, comprising a heat dissipating layer, a heat conducting layer and a fan. The heat dissipating layer is made of ceramic materials, and the heat dissipating layer is fully distributed with micropores. The heat conducting layer is stuck to the under surface of the heat dissipating layer, the heat dissipating layer and the heat conducting layer are combined as an integrity, and the fan is fixed on the heat dissipating layer. The heat dissipating layer and the heat conducting layer can be combined as an integrity through an epoxy resin layer or through a buckling device. The fan, the heat dissipating layer and the heat conducting layer can be fixedly connected as an integrity through a buckling device. The heat conducting layer can be made of copper, silver or diamond materials. Compared with traditional radiators, the utility model has the advantages that the heat dissipating effect of the apertured structured heat dissipating layer made of ceramic materials is considerably improved compared with the original metallic radiation fin made of copper or aluminium with large volume. Moreover, the volume of the whole radiator is greatly reduced. The apertured structure ceramic radiator is easy to be molded, with low material cost and manufacturing cost, and can be widely used for the heat dissipation of various heating electronic devices.
Description
Technical field
The utility model relates to electronic component radiator, is meant a kind of hole structural ceramics radiator especially, has the surface area that improves the radiator ingress of air, to improve the radiating efficiency of radiator.
Background technology
Along with the development of semiconductor industry, semiconductor wafer is constantly towards the high frequency development.For example the processing speed of central processing unit electronic installations such as (CPU) improves constantly.The problem of Chan Shenging is thereupon, the high temperature that high processing rate produces down, and the high temperature how effectively the electronic installation thermal source to be produced is discharged, and electronic installation can be turned round under suitable working temperature.With the computer is example, is equiped with radiator on the existing central processing unit, is used to assist to discharge the heat that the central processing unit wafer produces.See also shown in Figure 1, existing radiator mostly includes a fin A, this fin A below has heat-conducting layer F, this heat-conducting layer F is arranged at above the central processing unit B, and fit with central processing unit B, also design the radiating fin C with suitable shape on the aforementioned fin, fin A upper end is provided with a fan D in addition.Fin A has pad pin piece E between fan D, be used for producing the convection current air, takes away by convection current with the heat of the radiating fin C that will absorb the central processing unit heat, discharges from fin, with the reduction temperature.Though existing radiating fin B makes with copper, the aluminum metal of heat conduction, excellent in heat dissipation effect, but because the effect of heat conduction and heat radiation still is difficult to meet the demand of high speed high power development, and the fin type fin makes entire radiator bulky, the processing technology complexity, the cost height, this bulkiness, radiator that radiating effect is not good enough also need just can reach by other radiator structure the minimum requirements of heat radiation on the limited computer in some space (as notebook computer).This is the existing greatest weakness of prior art.
Summary of the invention
The purpose of this utility model is to provide a kind of hole structural ceramics radiator, utilizes the superior heat dispersion of the ceramic material of hole structure, and the contact surface that improves thermal convection by air medium is long-pending, to improve the heat-sinking capability of radiator.
Above-mentioned purpose of the present utility model is achieved through the following technical solutions:
A kind of hole structural ceramics radiator, include heat dissipating layer, one deck heat-conducting layer and fan at least, this heat dissipating layer is made by ceramic material, be covered with micropore on it, porosity is 5-40%, be fitted with one deck heat-conducting layer at least below the heat dissipating layer, heat dissipating layer and heat-conducting layer are combined as a whole, and fan is fixedly arranged on above the heat dissipating layer.
Described heat dissipating layer combines with heat-conducting layer, can it is combined as a whole by an epoxy resin layer, or by a fastener both is combined as a whole.Also can fan, heat dissipating layer and heat-conducting layer three be connected to one by a fastener.
Heat-conducting layer can be made by copper, silver or diamond material.
To sum up, compare with the traditional heat-dissipating device, the utlity model has following advantage: the hole structure heat dissipating layer of being made by ceramic material, significantly improve than the radiating effect of large volume copper or aluminum metal radiating fin in the past, and make the entire radiator volume reduce weight saving greatly; This radiator is easy to machine-shaping, and material cost, (seeing following table for details) cheap for manufacturing cost can be widely used in various heating electronic installation heat radiation.
The every index contrast of the utility model and traditional heat-dissipating device
| The copper heat-conducting layer | The copper heat-conducting layer | The aluminium heat-conducting layer | The aluminium heat-conducting layer | The conventional aluminum radiating fin | |
| Heat-conducting layer thickness (mm) | 2.0 | 3.0 | 3.0 | 4.0 | |
| Heat dissipating layer thickness (mm) | 1.8 | 1.8 | 1.8 | 1.8 | |
| Gross thickness (mm) | 3.8 | 4.8 | 4.8 | 5.8 | Minimum 40 |
| Heat-conducting layer weight (g) | 86 | 132 | 39 | 52.5 | |
| Heat dissipating layer weight (g) | 16.7 | 16.7 | 17.3 | 17.1 | |
| Weight epoxy (g) | 1.3 | 1.3 | 1.3 | 1.3 | |
| Total weight (g) | 104 | 150 | 57.6 | 70.9 | The lightest by 300 |
| Total material cost (NTD) | 8.97 | 13.48 | 3.95 | 5.12 | 26.1 |
| Material is saved ratio (%) | 65.6％ | 48.4％ | 84.8％ | 80.3％ | Original comparison value |
Description of drawings
Fig. 1 is a conventional metals finned radiator structure schematic diagram.
Fig. 2 is the utility model hole structural ceramics heat spreader structures schematic diagram.
Fig. 3 is with the example structure schematic diagram of epoxy resin layer with heat dissipating layer and heat-conducting layer combination.
Fig. 4 is with the example structure schematic diagram of fastener with heat dissipating layer and heat-conducting layer combination.
The example structure schematic diagram of Fig. 5 for fan, heat dissipating layer and heat-conducting layer being combined as a whole by fastener.
The number in the figure explanation:
A-fin B-central processing unit C-radiating fin D-fan E-pad pin piece F-heat-conducting layer
1-heat-conducting layer 2-heat dissipating layer 3-pad pin piece 4-fan 5-central processing unit 6-epoxy resin layer
7-fastener 8-fastener
Embodiment
Embodiment 1:
See also shown in Figure 2, a kind of hole structural ceramics radiator, include heat dissipating layer 2, heat-conducting layer 1, pad pin piece 3 and fan 4, this heat dissipating layer 2 is fired into hole structure heat dissipating layer by ceramic material, the one side that contacts with thermal source central processing unit 5 has one deck heat-conducting layer 1 at least, this heat-conducting layer 1 fits and is combined as a whole with heat dissipating layer 2, and fan 4 is affixed with heat dissipating layer 2 by pad pin piece 3.The heat that gives out when absorbing central processing unit 5 work by conduction heat-conducting layer 1, relend ceramic heat-dissipating layer 2 with hole structure, with the air is the heat radiation media, adds to place the fan 4 of heat dissipating layer top that conditions of forced convection is provided, and heat is dispersed in the external environment.Heat-conducting layer 1 in the present embodiment can adopt copper sheet, its coefficient of heat conduction K=380W/mK.If use the more Heat Conduction Material of high heat-conduction coefficient, as silver, diamond etc., can be more helpful to radiating effect, but the moment heat energy must have enough unit volumes to absorb the CPU start time dispels the heat by hole structural ceramics heat dissipating layer 2 then.
Above-mentioned manufacture method with hole structural ceramics radiator is:
(1) sizes mixing: the ceramic material (main component: TiO of getting proper proportion
2, SrO, BaO, Al
2O
3, ZrO) with organic solvent ethanol, toluene and dispersant allotment, be uniformly dispersed, grind with abrading-ball again and stir into time micron powder;
(2) add the binding agent polyvinyl alcohol water solution, stir, to generating liliquoid;
(3) drying: liliquoid is dried into solid, makes the hole structural ceramic material;
(4) granulation: the hole structural ceramic material is levigate in mortar, strike out the heat dissipating layer of reservation shape;
(5) sintering: sinter the heat dissipating layer of reservation shape into the tool ceramic heat-dissipating layer of even hole structure naturally.
(6) heat dissipating layer, heat-conducting layer, fan are assembled into one.
Embodiment 2:
See also shown in Figure 3, a kind of hole structural ceramics radiator, include ceramic material and be fired into the heat dissipating layer 2 of hole structure, one deck heat-conducting layer 1, pad pin piece 3, fan 4 at least, be provided with epoxy resin layer 6 between heat dissipating layer 2 and the heat-conducting layer 1 in the present embodiment, heat dissipating layer 2 and heat-conducting layer 1 be combined as a whole by this epoxy resin layer 6.
Manufacture process (1)-(5) of the hole structural ceramics radiator in the present embodiment are with embodiment 1, and then heat dissipating layer 2 and heat-conducting layer 1 be pasted together by epoxy resin layer 6 get final product.
Embodiment 3:
See also shown in Figure 4ly, heat dissipating layer 2 and heat-conducting layer 1 back of fitting is snapped with fastener 7 in the present embodiment at two ends, by this fastener 7 both is combined as a whole.
Embodiment 4:
See also shown in Figure 5ly, by a shaped as frame fastener 8 fan 4, heat dissipating layer 2 and heat-conducting layer 1 are combined as a whole in the present embodiment.
Claims (5)
1, a kind of hole structural ceramics radiator, include heat dissipating layer, one deck heat-conducting layer and fan at least, it is characterized in that: described heat dissipating layer is made by ceramic material, be covered with micropore on it, porosity is 5-40%, be provided with heat-conducting layer below the heat dissipating layer, heat dissipating layer and heat-conducting layer are combined as a whole, and fan is fixedly arranged on above the heat dissipating layer.
2, hole structural ceramics radiator according to claim 1, it is characterized in that: be provided with epoxy resin layer between heat dissipating layer and the heat-conducting layer, heat dissipating layer, epoxy resin layer and heat-conducting layer are combined as a whole.
3, hole structural ceramics radiator according to claim 1 is characterized in that: be combined as a whole with fastener between heat dissipating layer and the heat-conducting layer.
4, the described hole structural ceramics of claim 1 radiator is characterized in that: have a fastener that fan, heat dissipating layer and heat-conducting layer are combined as a whole.
5, the described hole structural ceramics of claim 1 radiator is characterized in that: heat-conducting layer can be made by copper, silver or diamond material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03266923 CN2681325Y (en) | 2003-07-08 | 2003-07-08 | Apertured structure ceramic radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03266923 CN2681325Y (en) | 2003-07-08 | 2003-07-08 | Apertured structure ceramic radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2681325Y true CN2681325Y (en) | 2005-02-23 |
Family
ID=34598908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03266923 Expired - Lifetime CN2681325Y (en) | 2003-07-08 | 2003-07-08 | Apertured structure ceramic radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2681325Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105216A (en) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | Manufacturing method of radiator, radiator and electronic equipment |
| CN113782504A (en) * | 2021-09-08 | 2021-12-10 | 中国矿业大学 | Simplified packaging structure of power module of integrated radiator and manufacturing method |
-
2003
- 2003-07-08 CN CN 03266923 patent/CN2681325Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112105216A (en) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | Manufacturing method of radiator, radiator and electronic equipment |
| CN113782504A (en) * | 2021-09-08 | 2021-12-10 | 中国矿业大学 | Simplified packaging structure of power module of integrated radiator and manufacturing method |
| CN113782504B (en) * | 2021-09-08 | 2024-06-25 | 中国矿业大学 | Simplified packaging structure of power module of integrated radiator and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20130708 Granted publication date: 20050223 |