CN2553514Y - Improved radiator - Google Patents
Improved radiator Download PDFInfo
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- CN2553514Y CN2553514Y CN 02242347 CN02242347U CN2553514Y CN 2553514 Y CN2553514 Y CN 2553514Y CN 02242347 CN02242347 CN 02242347 CN 02242347 U CN02242347 U CN 02242347U CN 2553514 Y CN2553514 Y CN 2553514Y
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- heat
- radiator
- conducting block
- radiating fin
- sole plate
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Abstract
The utility model relates to an improved radiator(heat sink) used for the cooling device(cooler), which comprises a conduction component, a cooling case covered on the conduction component, and plurality sheet of cooling fins positioned on the cooling case. The conduction component is formed by a conduction motherboard and a conduction block positioned on the middle position of the conduction motherboard, and the area for the lower surface of the conduction block is bigger than the area of the upper surface. When the lower surface of the conduction motherboard is contacted with the cooling device, the conduction block increases the heat exchange volume for the middle part of the motherboard, which makes the heat energy produced by the cooling device obtained best releasing.
Description
Technical field
The utility model relates to a kind of radiator (heat sink) of modified form, particularly relates to a kind of radiator with three-dimension curved surface heat dissipation base.
Background technology
Continuous lifting along with electronic installation usefulness, heat abstractor or cooling system have become one of outfit indispensable in the existing electronic installation, because it is the heat energy that electronic installation produced is if inappropriate in addition dissipation gently then causes the usefulness variation, heavy then can cause burning of electronic installation.Heat abstractor is important especially for micromodule (for example integrated circuit), because along with the increase of aggregation degree and the progress of encapsulation technology, the area of integrated circuit constantly dwindles, the heat energy that the while per unit area is accumulated also can improve relatively, so the heat abstractor of high heat dissipation efficiency is the actively object of research and development of electronic industry circle always.
Heat abstractor generally is disposed at the surface of plan heat abstractor in order to its heat energy that is produced of dissipation.According to the shape of foot of radiator in the heat abstractor, radiator can be divided into floor type radiator and column type radiator.
Please refer to Fig. 1, Fig. 2 and Fig. 3, this known heat abstractor 10 comprises an axial-flow type radiator fan (axial-flow fan) 12 and one plate radiator (heat sink) 20.22 formations of radiating fin (fin) that the conductive sole plate 24 that plate radiator 20 is made by bronze medal or copper alloy, the radiating shell 26 that an aluminum or aluminum alloy is made and plural pieces aluminum or aluminum alloy are made, described radiating shell 26 is covered on the conductive sole plate 24, and radiating fin (fin) 22 vertically is located on the radiating shell 26.Radiator fan 12 is inlayed and is fixed on the plural pieces radiating fin 22 of radiator 20, and the lower surface of the conductive sole plate 24 of radiator 20 then is attached at one and intends on the heat abstractor (not showing, for example a central processing unit).
When intending the heat abstractor running, can discharge a large amount of heats,,, and flow on each sheet radiating fin 22 so the heat that this plan heat abstractor discharges can promptly flow to radiating shell 26 via conductive sole plate 24 because of copper material has good heat-conductive characteristic.Then, rely on brushing of radiator fan 12 again, make that the heat energy on each sheet radiating fin 22 gets dissipation, thereby this is intended the effect that heat abstractor produces heat radiation.Yet because the heat delivered that this plan heat abstractor is produced can form a heat flow field (as shown in Figure 3) in conductive sole plate 24 to conductive sole plate 24, the result will cause the heat-conducting effect variation of conductive sole plate 24 middle bodies.And, the general maximum position of intending heat that heat abstractor produces focuses mostly at the middle section (being the middle body of conductive sole plate 24) of this plan heat abstractor, therefore, plate radiator 20 needs preferable termal conductor module at the middle body of conductive sole plate 24 increases its radiating effect.
As from the foregoing, conductive sole plate 24 middle bodies of plate radiator 20 have shortcomings such as heat-conducting effect is not good, and therefore, another known technology provides a kind of column type radiator, address the above problem attempting.Please refer to Fig. 4, Fig. 5 and Fig. 6, another known heat abstractor 30 comprises an axial-flow type radiator fan 12 (with shown in Figure 1) and a column type radiator 40.42 formations of radiating fin (fin) that the heat conduction cylinder 44 that column type radiator 40 is made by bronze medal or copper alloy, the radiating shell 46 that an aluminum or aluminum alloy is made and plural pieces aluminum or aluminum alloy are made, described radiating shell 46 is coated on the periphery of heat conduction cylinder 44, and radiating fin (fin) 42 vertically is located on the radiating shell 46.Identical with above-mentioned heat abstractor, radiator fan 12 is inlayed and is fixed on the radiating fin 42 of radiator 40 1 ends, and the surface of radiator 40 other ends is attached at one and intends on the heat abstractor (not showing, for example a central processing unit).
Because described plan heat abstractor directly contacts the surface of radiator 40, therefore a large amount of heats that discharged when this plan heat abstractor operation can promptly flow on heat conduction cylinder 44, radiating shell 46 and the radiating fin 42, via columned design, heat can prolong heat conduction cylinder 44, radiating shell 46 and radiating fin 42 and axially flow to the end that radiator 40 connects radiator fan 12.Then rely on brushing of radiator fan 12, reach effect this plan heat abstractor heat radiation.
As from the foregoing, thus column type radiator 40 has improved 20 pairs of not good situations of middle section heat transfer effect of plate radiator because of its heat conduction cylinder 44 with column.Yet, by the heat flow field distribution situation of Fig. 6 as can be known, an end that is connected with radiator fan 12 near radiator 40 on the radiator 40 there is no significant radiating effect to the release that this plan heat abstractor produces heat, thus, wasted the integral body of heat abstractor 30 and can utilize the space, in electronic component becomes the electronic installation of littleization, then seemed not too practical.
In addition, the conductive sole plate 24 of known radiator 20,40 and the 44 general using welding of heat conduction cylinder, close-fitting or engage with radiating shell 26,46 respectively by the method for machine high pressure pressing.If the accuracy of manufacture deficiency of conductive sole plate 24 or heat conduction cylinder 44 and radiating shell 26 or 46, then when close-fitting or pressing conductive sole plate 24 and radiating shell 26 or heat conduction cylinder 44 and radiating shell 46, its joint has air gap and produces.In addition, utilize processing method such as welding to increase the thermal resistance value of conductive sole plate 24 and radiating shell 26 or heat conduction cylinder 44 and radiating shell 46 contact-making surfaces.Above-mentioned phenomenon all can influence the thermal conduction effect of radiator 20,40.
As from the foregoing, above-mentioned known radiator obviously has inconvenience and exists with disappearance on reality is used, can wait to be improved.
Summary of the invention
Main purpose of the present utility model, be to provide a kind of modified form radiator with three-dimension curved surface heat dissipation base, this radiator can make fluid-tight engagement between heat dissipation base and the radiating shell, makes that intending heat abstractor obtains best radiating effect, to solve the problem that known radiator exists.
Above-mentioned purpose of the present utility model is achieved in that a kind of modified form radiator (heatsink), it comprises a heat dissipation base a and plural pieces radiating fin, the heat-conducting block that this heat dissipation base a is located on this conductive sole plate center by a conductive sole plate and is constituted, the following table area of described heat-conducting block is greater than its top surface area, and this plural pieces radiating fin is located on this conductive sole plate and this heat-conducting block with vertical direction.
Radiator described in the utility model, wherein the plural pieces radiating fin on this heat-conducting block places the side of this heat-conducting block, and this plural pieces radiating fin has different surface areas.
Radiator described in the utility model is characterized in that, this conductive sole plate and this heat-conducting block are made by integrated mode with high thermal conductivity coefficient materials such as aluminium, aluminium alloy, copper or copper alloys.
Radiator described in the utility model is characterized in that, high thermal conductivity coefficient material such as this plural pieces radiating fin also can aluminium, aluminium alloy, copper or copper alloy is made by integrated mode.
Radiator described in the utility model is characterized in that, this plural pieces radiating fin engages with this heat dissipation base with welding processing modes such as (solder).
Radiator described in the utility model is characterized in that, the height of this heat-conducting block is not more than the height of each sheet radiating fin on this heat dissipation base.
Radiator described in the utility model is characterized in that, the side of this heat-conducting block is a smooth surface.
Radiator described in the utility model is characterized in that, this radiating fin is provided with an axial-flow type radiator fan.
Above-mentioned purpose of the present utility model also can realize like this: a kind of modified form radiator (heatsink), it comprises a heat dissipation base b and plural pieces radiating fin, this heat dissipation base b is made of the radiating shell that a heat-conductive assembly and is covered in this heat-conductive assembly top, the lower surface of described heat-conductive assembly and one is intended heat abstractor and is contacted, and the following table area of this heat-conductive assembly is greater than its top surface area, and described plural pieces radiating fin is located on this radiating shell with vertical direction.
Radiator described in the utility model is characterized in that, this plural pieces radiating fin and this radiating shell are made by integrated mode with high thermal conductivity coefficient materials such as aluminum or aluminum alloy.
Radiator described in the utility model, it is characterized in that, this heat-conductive assembly also comprises a conductive sole plate and a heat-conducting block, the lower surface of described conductive sole plate contacts with this plan heat abstractor, described heat-conducting block is located on the center of this conductive sole plate and with this conductive sole plate and is engaged, the upper surface of this heat-conducting block and side surface contact with this radiating shell, wherein the upper and lower surface area of this conductive sole plate is greater than the upper and lower surface area of this heat-conducting block, and the top surface area of this heat-conducting block is less than the following table area of this heat-conducting block.
Radiator described in the utility model is characterized in that, the conductive sole plate of described heat-conductive assembly and this heat-conducting block are made by integrated mode with high thermal conductivity coefficient materials such as copper or copper alloys.
Radiator described in the utility model is characterized in that, described plural pieces radiating fin is disposed on the radiating shell outside the side of this heat-conducting block, makes this plural pieces radiating fin have different surface areas.
Radiator described in the utility model is characterized in that, the height of this heat-conducting block is not more than the height of each sheet radiating fin on this radiating shell.
Radiator described in the utility model is characterized in that, its surface of radiating shell that is attached at this heat-conducting block lateral parts is a smooth surface.
Radiator described in the utility model, it is characterized in that, it comprises a conjugative component, and this radiating shell is provided with a through hole, also be furnished with on this heat-conducting block one with the groove of this through hole uniform internal diameter, the radius of this conjugative component is slightly larger than the radius of this groove and is used for passing this through hole and assigns in this groove, makes this radiating shell closely be disposed on this heat-conducting block by this conjugative component.
Radiator described in the utility model is characterized in that, described conjugative component is a self-tapping screw.
Radiator described in the utility model is characterized in that, this radiating fin is provided with an axial-flow type radiator fan.
Description of drawings
Fig. 1 is the schematic diagram of known heat abstractor;
Fig. 2 is the vertical view of Fig. 1 middle plateform type radiator;
Fig. 3 is the end view of plate radiator along hatching line 3-3;
Fig. 4 is the schematic diagram of another known heat abstractor;
Fig. 5 is the vertical view of column type radiator among Fig. 4;
Fig. 6 is the end view of column type radiator along hatching line 6-6;
Fig. 7 is the schematic diagram of heat abstractor described in the utility model;
Fig. 8 is the vertical view of the radiator of first embodiment described in the utility model;
Fig. 9 is the end view of the radiator of first embodiment described in the utility model along hatching line 9-9;
Figure 10 a is the change curve between the thermal resistivity of the ratio of cross-sectional width of the cross-sectional width of its heat-conducting block lower surface of heat dissipation base of described first embodiment of utility model and conductive sole plate and heat dissipation base;
Figure 10 b is that the lower surface of the vertical height of heat dissipation base of first embodiment described in the utility model and heat dissipation base is to the change curve between the thermal resistivity of the ratio of the vertical height on radiating fin top and heat dissipation base;
Figure 10 c is the change curve between the thermal resistivity of the angle of its lower surface of heat-conducting block of heat dissipation base of first embodiment described in the utility model and side surface and heat dissipation base;
Figure 11 is the end view of the radiator of second embodiment described in the utility model along hatching line 11-11;
Figure 12 is the end view of the radiator of the 3rd embodiment described in the utility model along hatching line 12-12.
Embodiment
Radiator described in the utility model (heat sink) all is configured in one and intends on the heat abstractor, this plan heat abstractor can be a microprocessor (microprocessor) or a central processing unit (centralprocessing unit, CPU).See also Fig. 7, Fig. 8 and Fig. 9, heat abstractor 50 described in the utility model comprises the modified form radiator 60 of an axial-flow type radiator fan 12 and one first embodiment.Radiator 60 comprises the heat dissipation base 70 and the plural pieces radiating fin (fin) 62 of a three-dimension curved surface.Heat dissipation base 70 comprises a conductive sole plate 64 and a heat-conducting block 66, and described heat-conducting block 66 is disposed on the center of upper surface 61 of conductive sole plate 64.On plural pieces radiating fin 62 is disposed at conductive sole plate 64 with vertical direction upper surface 61 and the side surface 68 of heat-conducting block 66, along with the variation of side surface 68 positions,, plural pieces radiating fin 62 is corresponding to have different surface areas.In addition, 12 of radiator fans can rely on four fixation kits (for example: four screws) be fixed on the radiating fin 62 in 60 4 corners of radiator.
The radiator 60 of first embodiment described in the utility model is characterised in that: the heat-conducting block 66 of configuration one approximate circle cone structure on the upper surface 61 of the conductive sole plate 64 of heat dissipation base 70, that is to say that the following table area of heat-conducting block 66 is greater than the top surface area of heat-conducting block 66.Simultaneously, heat-conducting block 66 and conductive sole plate 64 are made the heat dissipation base 70 of three-dimension curved surface with high thermal conductivity coefficient materials such as aluminium, aluminium alloy, copper or copper alloys by integrated mode, and the plural pieces radiating fin 62 of heat dissipation base 70 tops utilizes welding artificial modes such as (solder) or engages with heat dissipation base 70 in integrated mode.
In addition, heat-conducting block 66 shapes systems at heat flow field in heat conductor the Flow Field Distribution situation and test measured preferable heat conduction design data and form.At this, the making and the forming principle of heat-conducting block 66 described in the utility model embodiment only described with simple character narrate and icon.See also Fig. 9, Figure 10 a, Figure 10 b and Figure 10 c.The major parameter of design heat-conducting block 66 comprises that the lower surface 63 of vertical height (total vertical height of conductive sole plate 64 and heat-conducting block 66) h, heat dissipation base 70 of cross-sectional width d, heat dissipation base 70 of lower surface 67 of cross-sectional width D, heat-conducting block 66 of conductive sole plate 64 is to vertical height (total vertical height of conductive sole plate 64, heat-conducting block 66 and the radiating fin 62) H on radiating fin 62 tops, lower surface 67 and the angle α of side surface 68 and the thermal resistance value R of heat dissipation base 70 of heat-conducting block 66.
Shown in Figure 10 a, Figure 10 b and Figure 10 c, the heat-conducting block 66 of first embodiment described in the utility model is characterised in that: the cross-sectional width d of the lower surface 67 of (1) heat-conducting block 66 is less than the cross-sectional width D of conductive sole plate 64, and both ratio d/D leveled off to 0.5 o'clock, and heat dissipation base 70 has thermal resistance value A point shown in Figure 10 a of a minimum; (2) the vertical height h of heat dissipation base 70 is less than or equal to the vertical height H of the lower surface 63 of heat dissipation base 70 to radiating fin 62 tops, that is to say, the height of the heat-conducting block 66 of heat dissipation base 70 is not higher than the height of each radiating fin 62, when both ratio h/H were between 0.9 and 1.0, heat dissipation base 70 can obtain thermal resistance value B point shown in Figure 10 b of a minimum; (3) lower surface 67 of heat-conducting block 66 and the angle α between the side surface 68 are less than 90 degree (degree), that is to say, the area of heat-conducting block 66 lower surfaces 67 is greater than the area of heat-conducting block 66 upper surfaces 65, when angle α between 80 to 85 the degree between the time, heat dissipation base 70 can obtain thermal resistance value C point shown in Figure 10 c of a minimum.
In sum, intend heat abstractor and (show when the lower surface 67 of the conductive sole plate 64 of the radiator 60 of first embodiment described in the utility model is attached at one, a central processing unit for example) time, the heat energy that this plan heat abstractor is produced can be by first embodiment described in the utility model the design of heat-conducting block 66 be passed on each sheet radiating fin 62, make the effect of this plan heat abstractor release heat reach best by brushing of axial-flow type radiator fan 12 again.
See also Figure 11, the radiator 80 of embodiment two described in the utility model is with the maximum difference of the radiator 60 of embodiment one: radiator 80 comprises a heat dissipation base 90,90 of heat dissipation bases are made of the radiating shell 94 that a heat-conductive assembly 92 and is covered in heat-conductive assembly 92 tops, and radiating shell 94 is made of different metal materials with heat dissipation base 90, be made of copper as heat-conductive assembly 92, and radiating shell 94 is made of aluminum.In addition, plural pieces radiating fin 82 is also made by integrated mode with radiating shell 94, and radiating fin 82 only is located at the top of upper surface 81 with its side surface 88 of radiating shell 94.And, heat dissipation base 70 structural similarities of the heat-conductive assembly 92 of present embodiment and first embodiment, it also comprises a conductive sole plate 84 and one and the integrally formed heat-conducting block 86 of conductive sole plate 84.It should be noted that, the conductive sole plate 84 of heat-conductive assembly 92 is all similar to heat-conducting block 66 to the conductive sole plate 64 of first embodiment to shape, size, composition and the characteristic of heat-conducting block 86 in the present embodiment, difference wherein only is that the three-dimension curved surface of heat-conductive assembly 92 is waited processing mode or is coated on shell shape radiating shell 94 by the mode that high pressure is pressed into by welding, and the lower surface of heat-conductive assembly 9 (being the lower surface 83 of conductive sole plate 84) 83 also contacts with a plan heat abstractor.In the present embodiment, major parameter and first embodiment of design heat-conducting block 86 is unique different to be, cross-sectional width d is the thickness that lower surface 87 width of heat-conducting block 86 add the radiating shell 94 of both sides, therefore, in the present embodiment shape of heat-conducting block 86 also be at hot-fluid in heat conductor the Flow Field Distribution situation and test measured preferable heat conduction design data and form, its experimental result is also together with shown in Figure 10 a, Figure 10 b and Figure 10 c, and its radiating effect is also described together with first embodiment, so no longer add to give unnecessary details.
See also Figure 12, the radiator 100 of embodiment three described in the utility model is all identical with the composition and the structure of the radiator 80 of above-mentioned second embodiment, its maximum difference be in, radiator 100 comprises a self-tapping screw 102 in addition, with as the coupling unit that connects radiating shell 94 and heat-conducting block 86.Radiating shell 94 is provided with a through hole 104, and also is furnished with the groove 106 of an and uniform internal diameter corresponding with through hole 104 on the heat-conducting block 86.And the characteristic of present embodiment maximum is when heat-conductive assembly 92 combines with radiating shell 94, the self-tapping screw 102 that utilizes radius to be slightly larger than through hole 104 and groove 106 radiuses passes the through hole 104 of radiating shell 94, and by modes such as manual or mechanical rotation are pressed into self-tapping screw 102 is assigned in the groove 106 of heat-conducting block 86, radiating shell 94 closely is disposed on the heat-conductive assembly 92 by self-tapping screw 102.Thus, then can overcome known technology and cause the shortcoming that thermal resistance increases in the heat conduction because of the metal that connects two unlike materials with processing modes such as welding.
In addition, the side of the heat-conducting block among the above-mentioned utility model embodiment not only is limited to a plane, it also can be the curved surface of a level and smooth or tool camber line shape, and radiating fin can also be by changing its external form or promoting the radiating effect of this creation with big area of dissipation, these belong to all that the utility model is thought easily and variation, so no longer add to give unnecessary details.
Than known technology, the difference of the utility model maximum is: the radiator 60,80,100 of preferred embodiment described in the utility model all have three-dimension curved surface heat dissipation base 70,90 its at hot-fluid in heat conductor the Flow Field Distribution situation and test measured preferable heat conduction design data and form, therefore, not only solved the shortcoming of known plate radiator 20 and column type radiator heat-dissipation poor performance, also can increase the radiating effect of radiator integral by the conjugative component among the 3rd embodiment described in the utility model.
The above only is a preferable possible embodiments of the present utility model; be not to dwindle protection range of the present utility model thus; so the equivalent structure that every utilization the utility model specification and accompanying drawing content are carried out changes and modifies, and all is contained in protection range of the present utility model, closes and gives Chen Ming.
Claims (18)
1. modified form radiator is characterized in that it comprises:
One heat dissipation base, it comprises a conductive sole plate and and is located at heat-conducting block on this conductive sole plate center, and the following table area of described heat-conducting block is greater than its top surface area;
The plural pieces radiating fin, it is located on this conductive sole plate and this heat-conducting block with vertical direction.
2. radiator as claimed in claim 1 is characterized in that the plural pieces radiating fin on this heat-conducting block places the side of this heat-conducting block, and this plural pieces radiating fin has different surface areas.
3. radiator as claimed in claim 1 is characterized in that, this conductive sole plate and this heat-conducting block are made by integrated mode with high thermal conductivity coefficient materials such as aluminium, aluminium alloy, copper or copper alloys.
4. radiator as claimed in claim 3 is characterized in that, high thermal conductivity coefficient material such as this plural pieces radiating fin also can aluminium, aluminium alloy, copper or copper alloy is made by integrated mode.
5. radiator as claimed in claim 1 is characterized in that, this plural pieces radiating fin engages with this heat dissipation base with processing modes such as welding.
6. radiator as claimed in claim 1 is characterized in that the height of this heat-conducting block is not more than the height of each sheet radiating fin on this heat dissipation base.
7. radiator as claimed in claim 1 is characterized in that, the side of this heat-conducting block is a smooth surface.
8. radiator as claimed in claim 1 is characterized in that this radiating fin is provided with an axial-flow type radiator fan.
9. modified form radiator is characterized in that it comprises:
One heat dissipation base, it is made of the radiating shell that a heat-conductive assembly and is covered in this heat-conductive assembly top, and the lower surface of described heat-conductive assembly and is intended heat abstractor and is contacted, and the following table area of this heat-conductive assembly is greater than its top surface area;
The plural pieces radiating fin, it is located on this radiating shell with vertical direction;
10. radiator as claimed in claim 9 is characterized in that, this plural pieces radiating fin and this radiating shell are made by integrated mode with high thermal conductivity coefficient materials such as aluminum or aluminum alloy.
11. radiator as claimed in claim 9 is characterized in that, this heat-conductive assembly comprises:
One conductive sole plate, its lower surface contacts with this plan heat abstractor;
One heat-conducting block, it is located on the center of this conductive sole plate and with this conductive sole plate and engages, and the upper surface of this heat-conducting block and side surface contact with this radiating shell;
Wherein the upper and lower surface area of this conductive sole plate is greater than the upper and lower surface area of this heat-conducting block, and the top surface area of this heat-conducting block is less than the following table area of this heat-conducting block.
12. radiator as claimed in claim 11 is characterized in that, the conductive sole plate of described heat-conductive assembly and this heat-conducting block are made by integrated mode with high thermal conductivity coefficient materials such as copper or copper alloys.
13. radiator as claimed in claim 11 is characterized in that, described plural pieces radiating fin is disposed on the radiating shell outside the side of this heat-conducting block, makes this plural pieces radiating fin have different surface areas.
14. radiator as claimed in claim 11 is characterized in that, the height of this heat-conducting block is not more than the height of each sheet radiating fin on this radiating shell.The height of this heat-conducting block is not more than the height of each sheet radiating fin on this radiating shell.
15. radiator as claimed in claim 11 is characterized in that, its surface of radiating shell that is attached at this heat-conducting block lateral parts is a smooth surface.
16. radiator as claimed in claim 11, it is characterized in that, it comprises a conjugative component, and this radiating shell is provided with a through hole, also be furnished with on this heat-conducting block one with the groove of this through hole uniform internal diameter, the radius of this conjugative component is slightly larger than the radius of this groove and is used for passing this through hole and assigns in this groove, makes this radiating shell closely be disposed on this heat-conducting block by this conjugative component.
17. radiator as claimed in claim 16 is characterized in that, described conjugative component is a self-tapping screw.
18. radiator as claimed in claim 9 is characterized in that, establishes an axial-flow type radiator fan on this radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02242347 CN2553514Y (en) | 2002-08-05 | 2002-08-05 | Improved radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02242347 CN2553514Y (en) | 2002-08-05 | 2002-08-05 | Improved radiator |
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| CN2553514Y true CN2553514Y (en) | 2003-05-28 |
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| CN 02242347 Expired - Fee Related CN2553514Y (en) | 2002-08-05 | 2002-08-05 | Improved radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427695A (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Copper-aluminum composite stepped cooling fin |
| CN102646787A (en) * | 2012-01-11 | 2012-08-22 | 东莞市博康五金制品有限公司 | Combined type LED (light-emitting diode) heat dissipater |
| CN111570244A (en) * | 2020-05-06 | 2020-08-25 | 盈甲医疗器械制造（上海）有限公司 | Ultrasonic transducer of ultrasonic surgical instrument and ultrasonic surgical instrument thereof |
-
2002
- 2002-08-05 CN CN 02242347 patent/CN2553514Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427695A (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Copper-aluminum composite stepped cooling fin |
| CN102646787A (en) * | 2012-01-11 | 2012-08-22 | 东莞市博康五金制品有限公司 | Combined type LED (light-emitting diode) heat dissipater |
| CN111570244A (en) * | 2020-05-06 | 2020-08-25 | 盈甲医疗器械制造（上海）有限公司 | Ultrasonic transducer of ultrasonic surgical instrument and ultrasonic surgical instrument thereof |
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| CF01 | Termination of patent right due to non-payment of annual fee |