CN1335644A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN1335644A CN1335644A CN 00121336 CN00121336A CN1335644A CN 1335644 A CN1335644 A CN 1335644A CN 00121336 CN00121336 CN 00121336 CN 00121336 A CN00121336 A CN 00121336A CN 1335644 A CN1335644 A CN 1335644A
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- China
- Prior art keywords
- heat
- sink unit
- fan
- fin
- base
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The computer chip head radiator includes: one base with two surfaces including the first for fixing the computer chip and the second for installing one heat radiating unit, the head radiating unit including several heat radiating fins, and one fan installed beside the heat radiating unit obliquely at an angle to the horizontal plane of 0-90 deg. It has also one wind guide covering the heat radiating unit, one fan fixture and one clamp fixing the chip to the base. The heat radiator has greatly raised heat dissipating efficiency.
Description
The invention provides a kind of heat abstractor that is used for electronic chip, in this heat abstractor, fan is mounted obliquely within its side.
Along with the enhancing day by day of electronic chip function, the complexity of its structure also increases day by day, and the heat energy that electronic chip produced is also more and more big.In addition, because information product is stressed short and small frivolously, the heat-dissipating space of electronic chip becomes more and more little.Therefore, under the prerequisite of keeping the electronic chip normal function, how to dispel the heat effectively in limited space has become an important problem.
As shown in Figure 1, it is the floor map of existing heat abstractor 10; With a central processing unit wafer is example, and among the figure, existing heat abstractor 10 is installed on the central processing unit wafer 12.The total height of supposing the housing 14 of computer server is H, and after putting motherboard 16, cpu socket 18 and central processing unit wafer 12, the height that can be used for installing heat abstractor 10 only is h.Heat abstractor 10 includes a base 20, a heat-sink unit 22, and it comprises several fin 23, and fin 23 is installed on the base 20, and a fan 24, is installed in the top of heat-sink unit 22.As can be seen from Figure 1, fan 24 too near the loam cake of housing 14, makes that air intake district 26 is too little, and heat-dissipating space is very limited.Therefore, the air quantity that can enter fan 24 is limited, even does not have air quantity to enter, and only is not have air quantity in idle running to sweep in the heat-sink unit 22 and cause fan 24, thus the heat that central processing unit wafer 12 is produced can't be taken away, and can't dispel the heat effectively.
In addition, because fan 24 is mounted in the top of heat-sink unit 22, the position of Fan axial center can cause the middle section of heat-sink unit 22 to produce phenomenon calm or that reflux, thereby causes the air themperature of middle section of heat-sink unit 22 very high.Because central processing unit wafer 12 is positioned at the below of heat-sink unit 22 middle sections, therefore, radiating effect is reduced.
Main purpose of the present invention is to provide a kind of heat abstractor that fan is tilted to install, and like this, not only can increase the air intake district of fan, can also effectively air be swept into the middle section of heat-sink unit, to reach best radiating effect.
For achieving the above object, the present invention takes following technical measures:
The present invention is used for the heat abstractor of electronic chip, comprising: a base, a heat-sink unit and a fan;
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is installed in the side of heat-sink unit.
Wherein, described fan is mounted obliquely within the side of described heat-sink unit, and the angle between fan and the horizontal plane is between 0 degree is spent to 90.
Wherein, also can comprise an air ducting, cover on the described heat-sink unit.
Wherein, also can comprise a fixture that is used for fixing fan.
Wherein, can comprise that also one is fixed on gripping mechanism on the described base with described electronic chip.
Another kind of the present invention is used for the heat abstractor of electronic chip, comprising: a base, a heat-sink unit and a fan;
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is mounted obliquely within the side of heat-sink unit;
Fin is the rectangle fin, and the rectangle fin is arranged on the base in the mode that is parallel to each other, and fin has the same tilt degree, to form a tilting zone at the heat-sink unit side.
Of the present invention another be used for the heat abstractor of electronic chip, comprising: a base, a heat-sink unit and a fan;
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is mounted obliquely within the side of heat-sink unit;
Fin is rectangular cylindricality fin, and fin has the same tilt degree, to form a tilting zone at the heat-sink unit side.
Reaching embodiment in conjunction with the accompanying drawings is described in detail as follows architectural feature of the present invention:
Description of drawings:
Fig. 1: the floor map of existing electronic chip heat abstractor.
Fig. 2 A: the schematic perspective view of heat abstractor first embodiment of the present invention.
Fig. 2 B: heat abstractor shown in Fig. 2 A is installed in a schematic perspective view on the central processing unit wafer.
Fig. 2 C: heat abstractor shown in Fig. 2 A is installed in an end view on the central processing unit wafer.
Fig. 3: the perspective exploded view of heat abstractor shown in Fig. 2 A.
Fig. 4: the schematic perspective view of another embodiment of heat-sink unit in the heat abstractor of the present invention.
Fig. 5: the schematic perspective view of another embodiment of heat abstractor of the present invention.
Fig. 6: the bottom view of heat abstractor shown in Figure 5.
Fig. 7: the end view of heat abstractor shown in Figure 5.
Fig. 8: the perspective exploded view of heat abstractor shown in Figure 5.
Please refer to Fig. 2 to Fig. 3, Fig. 2 A is the schematic perspective view of first embodiment of heat abstractor 30 of the present invention, Fig. 2 B is installed in a schematic diagram on the central processing unit wafer 41 for Fig. 2 A heat abstractor 30, Fig. 2 C is installed in an end view on the central processing unit wafer 41 for Fig. 2 A heat abstractor 30, and Fig. 3 is the perspective exploded view of heat abstractor 30 among Fig. 2.Heat abstractor 30 comprises a base 32, heat-sink unit 38, fan 40, air ducting 42, a fixture 48 and a gripping mechanism 44.Base 32 comprises first surface 34 and second surface 36.Central processing unit wafer 41 is fixed on the first surface 34.Heat-sink unit 38 is installed on the second surface 36 of base 32, and heat-sink unit 38 comprises several fin 46.As shown in Figure 3, heat-sink unit 38 is made up of several rectangle fin 46, and rectangle fin 46 is arranged on the base 32 in the mode that is parallel to each other.Fin 46 has identical gradient, forms a tilting zone with the side limit at heat-sink unit 38, makes fan 40 can be mounted obliquely within the side limit of heat-sink unit.The tilting zone of heat-sink unit 38 has in heat-sink unit 38 to the gradient of outer decline, and therefore, fan 40 is the tilting zones that are installed in heat-sink unit 38 in downward-sloping mode.In this embodiment, fan 40 is a kind of tube-axial fan.Tube-axial fan 40 is with the vertical direction air intake, with the vertical direction air-out.Therefore, the fan 40 that is mounted obliquely within heat-sink unit 38 sides is convenient to air is swept heat-sink unit 38.
As shown in Figure 3, air ducting 42 is a concave character type, covers upside, front side and the rear side of heat-sink unit 38.The fixed frame that fixture 48 extends out for the upper surface from air ducting 42, and and the upper surface of air ducting 42 between have an angle, fan 40 is fixed on obliquely the side of heat-sink unit 38.Shown in Fig. 2 B and Fig. 2 C, gripping mechanism 44 is the slots 43 that are used for heat abstractor 30 is fixed on the central processing unit wafer, so that heat abstractor 30 is fixed on the central processing unit wafer 41.
Angle between the upper surface of fan 40 and air ducting 42 is between 0 degree is spent to 90, and the big I of angle changes along with the variation of fan 40 positions.Fan 40 is convenient to air is swept the middle section of heat-sink unit 38, makes big flow velocity district can directly impact the middle section of heat-sink unit 38, impacts the jet flow effect and produce, and then can improve the heat dispersion of heat abstractor 30 greatly.
Because fan 40 is mounted obliquely within the side of heat-sink unit 38, is by the side air intake, the air intake zone is bigger, therefore, can increase into intake, and then improves radiating efficiency.In addition, because fan 40 is installed in the side of heat-sink unit 38, therefore, the height of heat-sink unit 38 can suitably increase, to increase the area of dissipation of heat-sink unit 38.Moreover air ducting 42 can make the distinguished and admirable of fan 40 be convenient to import heat-sink unit 38, does not overflow and can not loose to all around, therefore can improve radiating efficiency.
In addition, the height of heat abstractor 30 reduces, and makes the space utilization in the computer casing have more elasticity.
Base 32 is made by high heat conducting material with heat-sink unit 38, and for example copper, aluminium etc. are to reach best radiating effect.In this embodiment, base 32 all is to become with copper with heat-sink unit 38, and heat-sink unit 38 is welded on the base 32.
Base 32 also can adopt other modes to make with the making of heat-sink unit 38.For example, base 32 can be integrated aluminium extruded type with heat-sink unit 38.Perhaps, heat-sink unit 38 can form fin by a copper sheet or aluminium flake bending, welds or sticks on the base 32.Perhaps, base 32 can the die casting mode be made with heat-sink unit 38.
As shown in Figure 4, it is another embodiment schematic diagram of heat-sink unit 52 in the heat abstractor of the present invention.Heat-sink unit 52 is that with the difference of Fig. 2 A heat-sink unit 38 heat-sink unit 52 is formed by several rectangular cylindricality fin 54.Wherein the cross sectional shape of the fin 54 of rectangular cylindricality is a rectangle, yet its cross sectional shape also can be span shape, sickle shaped or teardrop shaped.In this embodiment, the fin 54 of rectangular cylindricality has two kinds of different height, forms a housing region with the side at heat-sink unit 54, makes fan can be mounted obliquely within the side of heat-sink unit 52.In the present embodiment, the aluminium extruded type that base 56 and heat-sink unit 52 are formed in one.
In addition, rectangular cylindricality fin 54 also can have several different height, and the rectangular cylindricality fin 54 of the predetermined number of heat-sink unit 52 can have identical gradient, form a tilting zone with side, make fan can be mounted obliquely within the side of heat-sink unit 52 at heat-sink unit 52.
To shown in Figure 8, Fig. 5 is the schematic diagram of another embodiment of heat abstractor 60 of the present invention as Fig. 5, and Fig. 6 is the bottom view of Fig. 5 heat abstractor 60, and Fig. 7 is the end view of Fig. 5 heat abstractor 60, and Fig. 8 is the element decomposing schematic representation of Fig. 5 heat abstractor 60.Heat abstractor 30 differences among heat abstractor 60 and Fig. 2 A are that the fan 62 of heat abstractor 60 is a kind of centrifugal fan.Centrifugal fan is with the vertical direction air intake, with the horizontal direction air-out.Therefore, cooperate the wind direction of centrifugal fan 62, the heat-sink unit 64 of heat abstractor 60 and fixture 66 have the design different with heat abstractor 30.The tilting zone of heat-sink unit 64 is the gradient that rises to extroversion from the heat-sink unit 64, and therefore, fan 62 is the tilting zones that are installed in heat-sink unit 64 in acclivitous mode, makes the tilting zone of heat-sink unit 64 can be used for supports fan 62.Fixture 66 is used for fixing fan 62 for two fixed arms that the upper surface from air ducting 67 extends out.
In addition, the be inclined upwardly height that caused of fan 62 had better not surpass the height of heat-sink unit, to reach best enforcement state.
Compared with prior art, the present invention has following effect:
In the heat abstractor of the present invention,, make the height of heat abstractor be lower than the height of existing heat abstractor because fan is mounted obliquely within the side of heat abstractor, thereby, the elasticity of space utilization can be increased.Moreover the fan in the heat abstractor of the present invention is from the side air intake, thereby, bigger air intake district is arranged, can avoid fan that idle running or air quantity situation generation very little take place, therefore can improve radiating efficiency.Because the fan of heat abstractor of the present invention is the middle section that obliquely air is swept into heat-sink unit, therefore, can produces and impact the jet flow effect, and the heat energy that electronic chip produced can be taken away effectively.Add the effect of air ducting, can make air-flow can import heat-sink unit 38, and improve radiating effect greatly.
Foregoing is to utilize embodiment that technical characterictic of the present invention is described, is not to be used to limit protection scope of the present invention, even there is the people to change slightly on the basis of the present invention's design, must belong in protection scope of the present invention.
Claims (20)
1, a kind of heat abstractor that is used for electronic chip comprises: a base, a heat-sink unit and a fan; It is characterized in that:
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is installed in the side of heat-sink unit.
2, heat abstractor according to claim 1 is characterized in that, described fan is mounted obliquely within the side of described heat-sink unit, and the angle between fan and the horizontal plane is between 0 degree is spent to 90.
3, heat abstractor according to claim 1 is characterized in that, also comprises an air ducting, covers on the described heat-sink unit.
4, heat abstractor according to claim 1 is characterized in that, also comprises a fixture that is used for fixing fan.
5, heat abstractor according to claim 1 is characterized in that, comprises that also one is fixed on gripping mechanism on the described base with described electronic chip.
6, heat abstractor according to claim 1 is characterized in that, described heat-sink unit is installed on the second surface of described base with welding manner.
7, heat abstractor according to claim 1 is characterized in that, described heat-sink unit and base are one-body molded.
8, heat abstractor according to claim 1 is characterized in that, described heat-sink unit and base are made by high heat conducting material.
9, heat abstractor according to claim 1 is characterized in that, described electronic chip is a central processing unit wafer.
10, heat abstractor according to claim 1 is characterized in that, described heat-sink unit is made up of several rectangle fin, and the rectangle fin is arranged on the described base in the mode that is parallel to each other.
11, heat abstractor according to claim 1 is characterized in that, described heat-sink unit is made up of several rectangular cylindricality fin.
12, heat abstractor according to claim 11 is characterized in that, the cross section of described rectangular cylindricality fin is one of in rectangle, span shape, sickle shaped or the teardrop shaped.
13, heat abstractor according to claim 1 is characterized in that, described fan is a tube-axial fan.
14, heat abstractor according to claim 1 is characterized in that, described fan is a centrifugal fan.
15, heat abstractor according to claim 10 is characterized in that, described heat-sink unit comprises the fin of predetermined number, holds the housing region of fan in heat-sink unit side formation one.
16, heat abstractor according to claim 15 is characterized in that, described fin has the same tilt degree, to form a tilting zone at described heat-sink unit side.
17, heat abstractor according to claim 11 is characterized in that, described rectangular cylindricality fin has differing heights, to form a housing region of fan at described heat-sink unit side.
18, heat abstractor according to claim 17 is characterized in that, the fin of described rectangular cylindricality has the same tilt degree, to form a tilting zone at described heat-sink unit side.
19, a kind of heat abstractor that is used for electronic chip comprises: a base, a heat-sink unit and a fan; It is characterized in that:
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is mounted obliquely within the side of heat-sink unit;
Fin is the rectangle fin, and the rectangle fin is arranged on the base in the mode that is parallel to each other, and fin has the same tilt degree, to form a tilting zone at the heat-sink unit side.
20, a kind of heat abstractor that is used for electronic chip comprises: a base, a heat-sink unit and a fan; It is characterized in that:
Base comprises two surfaces, and electronic chip is fixed on the first surface;
Heat-sink unit is installed on the second surface of base, and heat-sink unit comprises several fin;
Fan is mounted obliquely within the side of heat-sink unit;
Fin is rectangular cylindricality fin, and fin has the same tilt degree, to form a tilting zone at the heat-sink unit side.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001213369A CN100377339C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
| CNB2005101193572A CN100433309C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001213369A CN100377339C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101193572A Division CN100433309C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1335644A true CN1335644A (en) | 2002-02-13 |
| CN100377339C CN100377339C (en) | 2008-03-26 |
Family
ID=4588737
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101193572A Expired - Fee Related CN100433309C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
| CNB001213369A Expired - Fee Related CN100377339C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101193572A Expired - Fee Related CN100433309C (en) | 2000-07-20 | 2000-07-20 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN100433309C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100592864C (en) * | 2007-02-08 | 2010-02-24 | 建准电机工业股份有限公司 | Micro heat radiation module |
| CN100592863C (en) * | 2007-02-08 | 2010-02-24 | 建准电机工业股份有限公司 | Micro heat radiation module |
| CN101212882B (en) * | 2006-12-27 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Video card display device |
| CN102591433A (en) * | 2011-01-10 | 2012-07-18 | 技嘉科技股份有限公司 | Radiation module and electronic device with same |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10085363B2 (en) * | 2014-05-22 | 2018-09-25 | General Electric Company | Integrated compact impingement on extended heat surface |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5309983B1 (en) * | 1992-06-23 | 1997-02-04 | Pcubid Computer Tech | Low profile integrated heat sink and fan assembly |
| US5526875A (en) * | 1994-10-14 | 1996-06-18 | Lin; Shih-Jen | Cooling device for CPU |
| US5787971A (en) * | 1996-03-25 | 1998-08-04 | Dodson; Douglas A. | Multiple fan cooling device |
| CN2271026Y (en) * | 1996-06-18 | 1997-12-17 | 叶元璋 | Radiating structure of semiconductor circuit assembly |
| CN2317501Y (en) * | 1997-10-16 | 1999-05-05 | 蔡坤明 | Heat sink of central processor of computer system |
| CN2343624Y (en) * | 1998-01-09 | 1999-10-13 | 爱美达股份有限公司 | CPU radiator fixed by tenon |
| TW438215U (en) * | 1998-02-10 | 2001-05-28 | D Link Corp | Heat sinks in an electronic production |
| CN2387579Y (en) * | 1999-06-07 | 2000-07-12 | 林世仁 | CPU radiator |
-
2000
- 2000-07-20 CN CNB2005101193572A patent/CN100433309C/en not_active Expired - Fee Related
- 2000-07-20 CN CNB001213369A patent/CN100377339C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101212882B (en) * | 2006-12-27 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Video card display device |
| CN100592864C (en) * | 2007-02-08 | 2010-02-24 | 建准电机工业股份有限公司 | Micro heat radiation module |
| CN100592863C (en) * | 2007-02-08 | 2010-02-24 | 建准电机工业股份有限公司 | Micro heat radiation module |
| CN102591433A (en) * | 2011-01-10 | 2012-07-18 | 技嘉科技股份有限公司 | Radiation module and electronic device with same |
| CN103874395A (en) * | 2012-12-17 | 2014-06-18 | 西门子（上海）电气传动设备有限公司 | Radiator and frequency converter employing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100377339C (en) | 2008-03-26 |
| CN100433309C (en) | 2008-11-12 |
| CN1790690A (en) | 2006-06-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: WEICHUANG ZITONG CO., LTD. Free format text: FORMER OWNER: NONE Effective date: 20020718 Owner name: HONHQI CO., LTD. Free format text: FORMER OWNER: ACER COMPUTER CO., LTD. |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20020718 Address after: Taiwan, China Applicant after: Acer Inc Co-applicant after: Weichuang Zitong Co., Ltd. Address before: Taiwan, China Applicant before: Acer Computer Co., Ltd. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080326 Termination date: 20190720 |
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| CF01 | Termination of patent right due to non-payment of annual fee |