CN100592864C - Micro heat radiation module - Google Patents
Micro heat radiation module Download PDFInfo
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- CN100592864C CN100592864C CN200710002860A CN200710002860A CN100592864C CN 100592864 C CN100592864 C CN 100592864C CN 200710002860 A CN200710002860 A CN 200710002860A CN 200710002860 A CN200710002860 A CN 200710002860A CN 100592864 C CN100592864 C CN 100592864C
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Abstract
A micro heat dissipation module, comprising a micro heat dissipation substrate and micro heat dissipation blower. The micro heat dissipation substrate comprises a locating space, at least one airflowchannel and at least two locating part, with all of them mounted on a surface of the micro heat dissipation substrate, and the locating space is formed between at least two locating parts of the microheat dissipation substrate. The heat dissipation blower is provided with an air outlet, an air inlet and a fan wheel with rotary area thereof less than 1.6 square centimeters. The micro heat dissipation blower is bond into locating space of the micro heat dissipation substrate while being clamped by locating part of the substrate, and one of airflow outlet and airflow inlet is selected to correspond to one end of airflow channel. The invention is applicable to minimized electronic devices, and has effects of simplifying assembling structure and enhancing assembling efficiency.
Description
Technical field
The present invention relates to a kind of micro heat radiation module, especially relate to a kind of at least two location divisions that on a miniature heat-radiating substrate, are provided with, by this location division with a miniature air-heater folder firm micro heat radiation module that is incorporated on this miniature heat-radiating substrate of pulling that drives.
Background technology
Radiating module of the prior art please refer to shown in Figure 1ly, and it comprises a heat-radiating substrate 7, several fixation kits 8 and a radiator fan 9.One surface of this heat-radiating substrate 7 is provided with several radiating fins 71 and several heat radiation conduits 72, and respectively this heat radiation conduit 72 is formed between this each adjacent radiating fin 71.In addition, the bottom surface of this heat radiation conduit 72 is formed with several assembly holes 73, wears the location for these fixation kit 8 correspondences.This fixation kit 8 is provided with a buckling parts 81, and supports a shoulder 82 and a back-moving spring 83.This buckling parts 81 is formed at an end of this fixation kit 8, and it is selected from inverted cone shape structure, and offers a kerf (not indicating) in these buckling parts 81 central authorities, and then a strain space is provided.This supports the other end that shoulder 82 is formed at this fixation kit 8.These back-moving spring 83 correspondences are sheathed on this fixation kit 8, and the one end is resisted against this and supports shoulder 82.The corner location of this radiator fan 9 is to being provided with several through holes 91 by assembly hole 73.
When this radiator fan 9 of assembling is on this heat-radiating substrate 7, at first with each through hole 91 of this radiator fan 9 assembly hole 73 to being positioned at this heat-radiating substrate 7 respectively, then the buckling parts 81 of this fixation kit 8 is forced in this through hole 91 by inverted cone shape and the corresponding elasticity of this otch, after this buckling parts 81 is by this through hole 91 and assembly hole 73,81 of this buckling partss elastic reset at once recover its external diameter originally, and via the bottom clip of this buckling parts 81 in the bottom surface of this heat-radiating substrate 7.At this moment, the back-moving spring of this fixation kit 8 83 produces an elastic reset bias voltage, makes the firm bottom surface that is resisted against this heat-radiating substrate 7, bottom of this buckling parts 81.Like this, utilize this radiator fan 9 to expel hot gas in this heat radiation conduit 72, improve the radiating efficiency of this heat-radiating substrate 7.
Generally speaking, this radiating module often is applied on the electronic installation (not illustrating, for example: computer chip or microprocessor etc.).Along with science and technology is maked rapid progress, the size of this electronic installation develops towards microminiaturization, makes this electronic installation more and more accurate and small.Thus, the size and the also necessary further relative microminiaturization of volume that cause this radiating module.Yet.Above-mentioned existing radiating module has following shortcoming, and for example: existing radiating module must can be reached the effect of strong fix by this fixation kit 8 and assembly hole 73 are set respectively.But the size of this radiating module is small to a certain degree the time, just be not easy on this heat-radiating substrate 7, to offer the assembly hole 73 that is enough to hold this fixation kit 8, also be difficult to the corresponding minute sized fixation kit 8 of making, cause existing radiating module to be difficult to be applied on the electronic installation of this microminiaturization.
Summary of the invention
Main purpose of the present invention provides a kind of micro heat radiation module, it passes through by form two location divisions on a miniature heat-radiating substrate at least, and utilize this location division that the one miniature air-heater that drives is pressed from both sides firm being incorporated on this miniature heat-radiating substrate of pulling, and any assembled components need be set, make the present invention have and simplify assembled component and improve the effect of assembling reliability and quality.
Secondary objective of the present invention provides a kind of micro heat radiation module, and wherein the rotation area of a miniature impeller that drives air-heater is less than 1.6cm
2(square centimeter), and then the size of dwindling this micro heat radiation module make the present invention can be applicable to microminiaturized electronic product.
For achieving the above object, the present invention adopts following technical scheme: a kind of micro heat radiation module, it comprises a miniature heat-radiating substrate and a miniature air-heater that drives.This miniature heat-radiating substrate has certain bit space, at least one gas channel, at least two location divisions and several radiating fins, this locatees the space, at least one gas channel and at least two location divisions all are arranged on the same surface of this miniature heat-radiating substrate, respectively this radiating fin is convexly equipped with this surface that is arranged in this miniature heat-radiating substrate relatively, respectively this gas channel is formed between any two adjacent radiating fins, respectively an end of this radiating fin constitutes one of them of these at least two location divisions jointly, and respectively this radiating fin one of them end of forming these at least two location divisions is located the space in abutting connection with this, and this space, location is formed between two location divisions of this miniature heat-radiating substrate at least, makes this surface of this miniature heat-radiating substrate and this at least two location divisions constitute this space, location jointly.This miniature air-heater that drives is provided with an air outlet, an air intake vent and an impeller, the rotation area of this impeller is less than 1.6 square centimeters, rely on this miniature heat-radiating substrate these at least two location divisions will this miniature drive air-heater folder pull in the space, location that is incorporated into this miniature heat-radiating substrate also butt should the surface, and select a correspondence in this air outlet and the air intake vent towards an end of this gas channel.
The present invention has improved the prior art shortcoming, and it forms at least two location divisions on a miniature heat-radiating substrate, and utilizes this location division that the one miniature firm cramping of air-heater that drives is positioned on this miniature heat-radiating substrate.In addition, the rotation area of this miniature impeller that drives air-heater is less than 1.6cm
2(square centimeter), and then the size of dwindling this micro heat radiation module, the present invention can be applicable on the microminiaturized electronic installation, and has the effect of simplifying assembled component and promoting packaging efficiency.
Description of drawings
Fig. 1: the exploded perspective view of existing radiating module.
Fig. 2: the exploded perspective view of the micro heat radiation module of first embodiment of the invention.
Fig. 3: the exploded perspective view of the micro heat radiation module of second embodiment of the invention.
Fig. 4: the exploded perspective view of the micro heat radiation module of third embodiment of the invention.
Fig. 5: the exploded perspective view of the micro heat radiation module of fourth embodiment of the invention.
Fig. 6: the combination of side view of the micro heat radiation module of fourth embodiment of the invention.
Fig. 7: the exploded perspective view of the micro heat radiation module of fifth embodiment of the invention.
Fig. 8: the exploded perspective view of the micro heat radiation module of sixth embodiment of the invention.
[primary clustering symbol description]
1 miniature heat-radiating substrate 11 radiating fins 12 gas channels, 13 first location divisions
141 holding pieces 15 the 3rd location division, 14 second location divisions, 151 holding pieces
Space, 17 location, 16 the 4th location divisions 2 miniature air-heater 20 housings that drive
21 air intake vents, 22 air outlets, 23 impellers, 7 heat-radiating substrates
71 radiating fins, 72 heat radiation conduits, 73 assembly holes, 8 fixation kits
81 buckling partss 82 support shoulder 83 back-moving springs 9 radiator fans
91 through hole a guide groove b guide projection
Embodiment
For above-mentioned and other purpose, feature and advantage of the present invention can be become apparent, the preferred embodiments of the present invention cited below particularly, and conjunction with figs. are described in detail below:
Please refer to shown in Figure 2ly, the micro heat radiation module of first embodiment of the invention comprises a miniature heat-radiating substrate 1 and a miniature air-heater 2 that drives, and these miniature air-heater 2 correspondences of driving are positioned on this miniature heat-radiating substrate 1, to form a micro heat radiation module (indicating).
Referring again to shown in Figure 2, the miniature heat-radiating substrate 1 of first embodiment of the invention is made by the metal or alloy of the high capacity of heat transmission of tool, for example aluminium, copper, gold, silver or its alloy etc., and this miniature heat-radiating substrate 1 preferably slightly has pliability.This miniature heat-radiating substrate 1 is provided with several radiating fins 11, at least one gas channel 12, at least two location divisions and certain bit space 17,11 pairs of this radiating fins should be located space 17 and are convexly equipped with a surface that is arranged in this miniature heat-radiating substrate 1, and respectively this gas channel 12 is formed between this each two adjacent radiating fins 11.This radiating fin 11, gas channel 12, location division and space 17, location all are arranged on the surface of this miniature heat-radiating substrate 1.This radiating fin 11 and gas channel 12 are used to increase the heat exchange area of this miniature heat-radiating substrate 1, to disperse the heat energy that this miniature heat-radiating substrate 1 is absorbed fast, improve radiating efficiency.
In addition, the miniature heat-radiating substrate 1 of first embodiment of the invention is provided with one first location division 13, one second location division 14 and one the 3rd location division 15, respectively a side of this radiating fin 11 its with constituting a blocking surface, and then as this first location division 13.One end of these outermost two radiating fins 11 extends to form this second location division 14 and the 3rd location division 15 along the side of this miniature heat-radiating substrate 1 respectively, and the top of this second location division 14 and the 3rd location division 15 also is bent to form a holding piece 141,151 respectively in opposite directions inwardly.This space, location 17 is formed between this first location division 13, second location division 14, the 3rd location division 15 and this holding piece 141,151.
Referring again to shown in Figure 2, first embodiment of the invention miniature drives blowing-type that air-heater 2 can be selected from an axial inlet air and radially air-out and drives the axial-flow type of air-heater and an axial inlet air and axially air-out and drive air-heater, and present embodiment miniature drives the blowing-type that air-heater 2 is chosen as an axial inlet air and radially air-out and drive air-heater.This miniature air-heater 2 that drives is provided with a housing 20, an air intake vent 21, an air outlet 22 and an impeller 23.These housing 20 inside have an accommodation space (not indicating).These air intake vent 21 chosen axis are to the top that is opened in this housing 20; 22 selections of this air outlet radially are opened in a side of this housing 20, and these air outlet 22 correspondences are towards an end of this gas channel 12.These impeller 23 rotating being arranged in this accommodation space, and its rotation area is selected less than 1.6cm
2(square centimeter) so that dwindle the size of this micro heat radiation module, further makes this micro heat radiation module be applied on the miniature electronic device (for example: microcomputer, miniature PDA and mobile phone etc.).
Referring again to shown in Figure 2, when first embodiment of the invention is assembled, at first because the pliability that has of this miniature heat-radiating substrate 1, make this miniature air-heater 2 that drives to be forced in this space, location 17 along the internal face of second location division 14, the 3rd location division 15 and the holding piece 141,151 of this miniature heat-radiating substrate 1.Because the width in this space, location 17 and highly be slightly less than this miniature width of air-heater 2 and highly of driving, so that this is miniature drive air-heater 2 and be forced into this space, location 17 after, except being resisted against this first location division 13 by this miniature end that drives air-heater 2, this second location division 14, the 3rd location division 15 and holding piece 141,151 also firm air-heater 2 crampings that should miniaturely drive are positioned in this space, location 17 simultaneously, avoid this miniature air-heater 2 that drives to break away from this miniature heat-radiating substrate 1 arbitrarily.Like this, this miniature heat-radiating substrate 1 and the miniature air-heater 2 that drives do not need can assemble this micro heat radiation module of formation fast via other assembled component (for example: screw, elastic component or fastener etc.) additionally is set, it helps to simplify assembly program and improves packaging efficiency, simultaneously also has good assembling reliability, further to be applied on this miniature electronic device.
Referring again to shown in Figure 2, when the driving first embodiment of the invention is dispelled the heat work, because this miniature air intake vent 21 that drives air-heater 2 axially exposes to the top of this miniature heat-radiating substrate 1, and the air outlet 22 that this is miniature to drive air-heater 2 is also to a end that should gas channel 12, make this miniature air-heater 2 that drives to suck an outer gas stream via this air intake vent 21, and send this air-flow towards an end of this gas channel 12 via this air outlet 22, leave from the other end of this gas channel 12 to force the heated air on this gas channel 12.In addition, the top of this radiating fin 11 preferably is not less than the apical margin of this air outlet 22, with the heat exchanger effectiveness of relative this micro heat radiation module of raising.
Please refer to shown in Figure 3ly, it discloses the micro heat radiation module of second embodiment of the invention.Compared to first embodiment, the miniature heat-radiating substrate 1 of second embodiment is one-body molded this second location division 14 that upwards is bent to form in an end limit of this miniature heat-radiating substrate 1 further.This space, location 17 is formed between this first location division 13 and second location division 14, and the distance of 14 of this first location division 13 and second location divisions is slightly less than this miniature length of driving air-heater 2.Be positioned in this space, location 17 by this first location division 13 and second location division, 14 firm air-heater 2 crampings that should miniaturely drive, this miniature end that drives air outlet 22 correspondences of air-heater 2 towards this gas channel 12 simultaneously, make the present invention can effectively improve packaging efficiency, also have good assembling reliability simultaneously.
Please refer to shown in Figure 4ly, it discloses the micro heat radiation module of third embodiment of the invention.Compared to second embodiment, the miniature heat-radiating substrate 1 of the 3rd embodiment is being located on three end limits in space 17 one-body molded respectively this second location division 14, the 3rd location division 15 and one the 4th location division 16 of upwards being bent to form in abutting connection with this.This second location division 14, the 3rd location division 15 and the 4th location division 16 all are chosen as one and support projection structure, and its three's width and highly all selecting less than this miniature height and width that drives air-heater 2.17 in this space, location centers on and is formed between this first location division 13, second location division 14, the 3rd location division 15 and the 4th location division 16, and the length in this space, location 17 and/or width are slightly less than this miniature length and width that drives air-heater 2.Like this, drive after air-heater 2 is assembled in this space, location 17 when this is miniature, this first location division 13, second location division 14, the 3rd location division 15 and the 4th location division 16 be this miniature neighboring of driving air-heater 2 of cramping respectively, to avoid this miniature air-heater 2 that drives to break away from this miniature cooling base 1 arbitrarily, make the present invention can effectively improve packaging efficiency and reliability, and simplify assembled component.
Please refer to shown in Figure 5ly, it discloses the micro heat radiation module of fourth embodiment of the invention.Compared to the 3rd embodiment, the radiating fin 11 of miniature heat-radiating substrate 1 dual-side of the 4th embodiment extends this first location division 13 and second location division 14, and the top of this first location division 13 and second location division 14 preferably is not higher than this and miniaturely drives air-heater 2 and be not less than between apical margin (as shown in Figure 6) air outlet 22 of this air outlet 22, reducing the whole height of this micro heat radiation module, and keep its radiating efficiency.This space, location 17 is formed between this first location division 13 and second location division 14, and it is positioned at a side of this gas channel 12 and is communicated with this gas channel 12, and the width in this space, location 17 selects to be equal to or slightly less than this miniature width that drives air-heater 2.By this first location division 13 and this miniature air-heater 2 that drives of second location division, 14 tight fit crampings, these miniature air outlet 22 correspondences of driving air-heater 2 are towards this gas channel 12, so that expel the heated air of putting aside on this gas channel 12 simultaneously.
In addition, referring again to shown in Figure 6, this is miniature when driving air-heater 2 and entering this miniature heat-radiating substrate 1 in assembling, the faying face that this is miniature to drive between the surface in the bottom surface of air-heater 2 and this space, location 17 can select to utilize an adhesion coating (indicating) bonding, can promote this miniature heat-radiating substrate 1 and this miniature bond strength of driving 2 of air-heaters like this.
Please refer to shown in Figure 7ly, it discloses the micro heat radiation module of fifth embodiment of the invention.Compared to the 3rd embodiment, the 5th embodiment miniature drives the axial-flow type that air-heater 2 is selected from an axial inlet air and axially air-out and drives air-heater, and the corresponding position, end limit that is convexly set in this miniature heat-radiating substrate 1 is selected in this second location division 14 and the 3rd location division 15.In addition, form a guide groove a respectively between this second location division 14, the 3rd location division 15 and this first location division 13, this guide groove a can accurately guide this miniature air-heater 2 that drives and be forced into this space, location 17.This space, location 17 is formed between this first location division 13, second location division 14 and the 3rd location division 15.In addition, this miniature air intake vent 21 (or air outlet 22) that drives air-heater 2 exposes to the opening (indicating) of 15 of this second location division 14 and the 3rd location divisions, and the air outlet 22 (or air intake vent 21) that should miniaturely drive air-heater 2 is correspondence end of this gas channel 12 respectively then.Compress this miniature side of driving air-heater 2 by this first location division 13, also this miniature another side of driving air-heater 2 of cramping of this second location division 14 and the 3rd location division 15 simultaneously, and then effectively improve packaging efficiency of the present invention and assembling accuracy.
Please refer to shown in Figure 8ly, it discloses the micro heat radiation module of sixth embodiment of the invention.Compared to the 5th embodiment, second location division 14 of the 6th embodiment and the 3rd location division 15 are that the side along this miniature heat-radiating substrate 1 extends to form respectively from an end of these outermost two radiating fins 11, and this second location division 14 and the 3rd location division 15 are respectively equipped with this guide groove a.In addition, this is miniature drive air-heater 2 with respect to the two sides of this second location division 14 and the 3rd location division 15 respectively correspondence one guiding projection b is set, it is used for contraposition and is forced in this guide groove a, 2 assemblings were positioned in this space, location 17 so that air-heater should be miniaturely driven in this guide groove a guiding, further improved packaging efficiency of the present invention and assembled accuracy.
As mentioned above, must be incorporated into the purpose of a heat-radiating substrate 7 to realize a radiator fan 9 strong fixs by several fixation kits 8 and several assembly holes 73 are set respectively compared to existing radiating module shown in Figure 1, but cause existing radiating module to be difficult to be applied on this miniature electronic device, and need additionally utilize the shortcomings such as numerous and diverse assembled component of assembled components, the present invention shown in Figure 2 is by forming this first location division 13 on this miniature heat-radiating substrate 1, second location division 14 and the 3rd location division 15, and utilize this first location division 13, second location division 14 and the 3rd location division 15 are positioned these miniature air-heater 2 firm crampings that drive on this miniature heat-radiating substrate 1.In addition, this miniature rotation area that drives the impeller of air-heater 2 must be less than 1.6cm
2(square centimeter) so just makes the present invention can be applicable on the microminiaturized electronic installation, and need not rely on any assembled components is set, and has the effect of simplifying assembled component and improving assembling reliability and quality.
Claims (10)
1, a kind of micro heat radiation module is characterized in that, it comprises:
A miniature heat-radiating substrate, it has space, a location, at least one gas channel, at least two location divisions and several radiating fins, and this space, location, at least one gas channel and at least two location divisions all are arranged on the same surface of this miniature heat-radiating substrate; Respectively this radiating fin is convexly equipped with this surface that is arranged in this miniature heat-radiating substrate relatively, respectively this gas channel is formed between any two adjacent radiating fins, respectively an end of this radiating fin constitutes one of them of these at least two location divisions jointly, and respectively this radiating fin one of them end of forming these at least two location divisions is located the space in abutting connection with this; And
The miniature air-heater that drives, it is provided with an air outlet, an air intake vent and an impeller, and the rotation area of this impeller is less than 1.6 square centimeters;
Wherein this space, location is formed between these two location divisions of this miniature heat-radiating substrate at least, make this surface and this at least two location divisions of this miniature heat-radiating substrate constitute this space, location jointly, these at least two location divisions should miniaturely drive air-heater folder pull be incorporated in this space, location also butt should the surface, and select in this air outlet and the air intake vent one to a end that should gas channel.
2, micro heat radiation module according to claim 1 is characterized in that, the radiating fin of two sides of this miniature heat-radiating substrate extends to form this at least two location divisions.
3, micro heat radiation module according to claim 2 is characterized in that, the top of these at least two location divisions is bent to form a holding piece in opposite directions, with this miniature air-heater that drives of cramping.
4, micro heat radiation module according to claim 1 is characterized in that, one of them location division of these at least two location divisions upwards is bent to form by an end limit of this miniature heat-radiating substrate.
5, micro heat radiation module according to claim 1 is characterized in that, in one-body molded respectively other location division that upwards is bent to form at least two end limits in this space, location.
6, micro heat radiation module according to claim 1 is characterized in that, the top of this radiating fin is not higher than this miniature air-heater that drives, and is not less than the apical margin of this air outlet.
7, micro heat radiation module according to claim 1 is characterized in that, these at least two location divisions are provided with a guide groove respectively, is positioned in this space, location with this miniature air-heater that drives of guiding.
8, micro heat radiation module according to claim 7 is characterized in that, these miniature two sides of driving air-heater are respectively equipped with a guiding projection, and this guiding projection is forced in this guide groove in order to correspondence.
9, micro heat radiation module according to claim 1 is characterized in that, the faying face that this is miniature to drive between the surface in the bottom surface of air-heater and this space, location is provided with an adhesion coating.
10, micro heat radiation module according to claim 1 is characterized in that, this is miniature to drive air-heater and be selected from that axial-flow type is driven air-heater and blowing-type is driven the wherein a kind of of air-heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710002860A CN100592864C (en) | 2007-02-08 | 2007-02-08 | Micro heat radiation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710002860A CN100592864C (en) | 2007-02-08 | 2007-02-08 | Micro heat radiation module |
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| Publication Number | Publication Date |
|---|---|
| CN101242725A CN101242725A (en) | 2008-08-13 |
| CN100592864C true CN100592864C (en) | 2010-02-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710002860A Active CN100592864C (en) | 2007-02-08 | 2007-02-08 | Micro heat radiation module |
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| CN (1) | CN100592864C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333982A (en) * | 2020-10-30 | 2021-02-05 | 上海德衡数据科技有限公司 | Air-liquid double-cooling system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2380958Y (en) * | 1999-06-07 | 2000-05-31 | 林世仁 | Fixing seat for radiating device of central processor |
| CN1335644A (en) * | 2000-07-20 | 2002-02-13 | 宏碁电脑股份有限公司 | Heat radiator |
| US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
| CN2622446Y (en) * | 2003-02-20 | 2004-06-30 | 鸿富锦精密工业（深圳）有限公司 | Fan fixing frame |
-
2007
- 2007-02-08 CN CN200710002860A patent/CN100592864C/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2380958Y (en) * | 1999-06-07 | 2000-05-31 | 林世仁 | Fixing seat for radiating device of central processor |
| US6435467B1 (en) * | 2000-06-02 | 2002-08-20 | Yaw-Huey Lai | Clamping device of cooling fan |
| CN1335644A (en) * | 2000-07-20 | 2002-02-13 | 宏碁电脑股份有限公司 | Heat radiator |
| CN2622446Y (en) * | 2003-02-20 | 2004-06-30 | 鸿富锦精密工业（深圳）有限公司 | Fan fixing frame |
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| Publication number | Publication date |
|---|---|
| CN101242725A (en) | 2008-08-13 |
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Assignee: Kunshan Guangxing Electronics Co., Ltd. Assignor: Jianzhun Electric Motor Industry Co., Ltd. Contract record no.: 2012990000042 Denomination of invention: Micro heat radiation module Granted publication date: 20100224 License type: Exclusive License Open date: 20080813 Record date: 20120207 |
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Address after: The new Taiwan China Ya Lu Kaohsiung City No. 30 Lane 296 Patentee after: Jianzhun Electric Motor Industry Co., Ltd. Address before: Are China Taiwan Lingya Kaohsiung No. 120 12 floor 1 Patentee before: Jianzhun Electric Motor Industry Co., Ltd. |
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