US20130168047A1 - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
- Publication number
- US20130168047A1 US20130168047A1 US13/433,308 US201213433308A US2013168047A1 US 20130168047 A1 US20130168047 A1 US 20130168047A1 US 201213433308 A US201213433308 A US 201213433308A US 2013168047 A1 US2013168047 A1 US 2013168047A1
- Authority
- US
- United States
- Prior art keywords
- heat
- fan
- dissipation module
- heat dissipation
- duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Definitions
- the disclosure relates to heat dissipation, and particularly to a heat dissipation module with a fan duct.
- a heat dissipation module is often used to dissipate heat from heat generating components, such as central procession units (CPUs).
- CPUs central procession units
- Many conventional heat dissipation modules include a centrifugal fan, a fin assembly arranged at an air outlet of the fan, and a heat pipe thermally connected a heat generating component with the fin assembly.
- heat generated by the heat generating component is transferred to the fin assembly via the heat pipe.
- the fan generates an airflow through the fin assembly to dissipate the heat.
- the heat generated by the heat generating component is taken away only by making using of the airflow towards the fin assembly, resulting in a unitary heat dissipation way.
- a heat dissipation efficiency of the heat dissipation module is not satisfactory.
- FIG. 1 is an assembled, isometric view of a heat dissipation module, according to an exemplary embodiment of the present disclosure.
- FIG. 2 is an exploded, isometric view of the heat dissipation module of FIG. 1 .
- FIG. 3 is an inverted view of the heat dissipation module of FIG. 2 .
- FIG. 4 is a schematic view showing a work state of the heat dissipation module of FIG. 1 .
- FIGS. 1 to 3 show a heat dissipation module 100 in accordance with an exemplary embodiment of the present disclosure.
- the heat dissipation module 100 includes a heat sink 10 , a fan 20 , a heat absorption plate 40 , and a heat pipe 30 thermally interconnecting the heat sink 10 and the heat absorption plate 40 .
- the fan 20 is a centrifugal fan, which includes a base 22 , a sidewall 23 extending perpendicularly and upwardly from an outer periphery of the base 22 , a cover 21 engaging with the sidewall 23 , and an impeller 24 .
- the cover 21 , the base 22 and the sidewall 23 cooperatively define a cavity 25 , the impeller 24 is received in the cavity 25 .
- the cover 21 and the base 22 respectively define a plurality of first air inlets 211 and a second air inlet 221 .
- the base 22 and the sidewall 23 cooperatively define an air outlet 26 between two ends of the sidewall 23 .
- the heat sink 10 is located at the air outlet 26 of the fan 20 , and includes a plurality of fins 11 stacked together. Each fin 11 is parallel to and spaced from a neighboring fin 11 . A passage (not labeled) is defined between each two neighboring fins 11 for airflow generated by the fan 20 . In the present embodiment, one lateral side of the stacked fins 11 away from the fan 20 extends upwardly to define a notch 12 in a top portion of the heat sink 10 near the air outlet 26 of the fan 20 .
- a duct 28 extends from the sidewall 23 of the fan 20 away from the outlet 26 of the fan 20 , and interconnects a fixing board 27 and the sidewall 23 of the fan 20 .
- the duct 28 and the outlet 26 are located at two opposite sides of the fan 20 , respectively.
- the fixing board 27 is parallel to the base 22 of the fan 20 .
- the fixing board 27 defines an elongated channel 271 in a top surface, and a receiving hole 272 in a bottom surface for receiving the heat absorption plate 40 .
- the receiving hole 272 communicates with the channel 271 .
- the heat absorption plate 40 thermally connects a heat generating component (not shown) to absorb heat generated therefrom.
- the duct 28 is a hollow sealed channel with two open ends, and cooperatively defined by a bottom plate 281 , two side plates 282 extending from two opposite sides of the bottom plate 281 , and a top plate 283 .
- the bottom plate 281 and the two side plates 282 are integral with the sidewall 23 by formed from one piece member.
- a first open end of the duct 28 extends to and communicates with the cavity 25 of the fan 20 , and a second open end extends to and communicates with the receiving hole 272 .
- the two side plates 282 and the top plate 283 extend beyond the bottom plate 281 at the second open end.
- the heat generating component is adjacent to the second open end of the duct 28 .
- the heat dissipation module 100 works, a part of the airflow generated by the fan 20 is guided to the heat sink 10 via the outlet 26 , and another part of airflow is guided to the heat absorption plate 40 and the heat generating component via the duct 28 .
- the first open end of the duct 28 communicates with the cavity 25 by the first open end extending into and through the sidewall 23 .
- the heat pipe 30 is U-shaped, and includes an evaporator section 31 , a condenser section 32 parallel to and spaced from the evaporator section 31 , and a connecting section 33 interconnecting the evaporator section 31 and the condenser section 32 .
- the evaporator section 31 is received in the elongated channel 271 and thermally connects the heat absorption plate 40 .
- the condenser section 32 is received in the notch 12 of the heat sink 10 .
- heat generated by the heat generating component is evenly absorbed by the heat absorption board 40 .
- a part of the heat from the heat absorption board 40 is absorbed by the evaporator section 31 of the heat pipe 30 , and transferred to the heat sink 10 via the condenser section 32 .
- the impeller 24 of the fan 20 rotates and drives airflow towards the air outlet 26 and the duct 28 .
- a part of the airflow towards the air outlet 26 takes away the heat absorbed by the heat sink 10 ; thereby defining a first heat dissipation way.
- the duct 28 functions as an air guiding channel to dissipate heat generated by the heat generating component, it can prevent the heat from being over concentrated in the heat generating component and the heat absorption plate 40 ; therefore, it can improve heat dissipation efficiency of the heat dissipation module 100 .
Abstract
Description
- 1. Technical Field
- The disclosure relates to heat dissipation, and particularly to a heat dissipation module with a fan duct.
- 2. Description of Related Art
- A heat dissipation module is often used to dissipate heat from heat generating components, such as central procession units (CPUs). Many conventional heat dissipation modules include a centrifugal fan, a fin assembly arranged at an air outlet of the fan, and a heat pipe thermally connected a heat generating component with the fin assembly.
- During operation, heat generated by the heat generating component is transferred to the fin assembly via the heat pipe. The fan generates an airflow through the fin assembly to dissipate the heat. However, the heat generated by the heat generating component is taken away only by making using of the airflow towards the fin assembly, resulting in a unitary heat dissipation way. Thus, a heat dissipation efficiency of the heat dissipation module is not satisfactory.
- Thus, it is desired to overcome the described limitations.
-
FIG. 1 is an assembled, isometric view of a heat dissipation module, according to an exemplary embodiment of the present disclosure. -
FIG. 2 is an exploded, isometric view of the heat dissipation module ofFIG. 1 . -
FIG. 3 is an inverted view of the heat dissipation module ofFIG. 2 . -
FIG. 4 is a schematic view showing a work state of the heat dissipation module ofFIG. 1 . -
FIGS. 1 to 3 show aheat dissipation module 100 in accordance with an exemplary embodiment of the present disclosure. Theheat dissipation module 100 includes aheat sink 10, afan 20, aheat absorption plate 40, and aheat pipe 30 thermally interconnecting theheat sink 10 and theheat absorption plate 40. - The
fan 20 is a centrifugal fan, which includes abase 22, asidewall 23 extending perpendicularly and upwardly from an outer periphery of thebase 22, acover 21 engaging with thesidewall 23, and animpeller 24. Thecover 21, thebase 22 and thesidewall 23 cooperatively define acavity 25, theimpeller 24 is received in thecavity 25. Thecover 21 and thebase 22 respectively define a plurality offirst air inlets 211 and asecond air inlet 221. Thebase 22 and thesidewall 23 cooperatively define anair outlet 26 between two ends of thesidewall 23. - The
heat sink 10 is located at theair outlet 26 of thefan 20, and includes a plurality offins 11 stacked together. Eachfin 11 is parallel to and spaced from a neighboringfin 11. A passage (not labeled) is defined between each two neighboringfins 11 for airflow generated by thefan 20. In the present embodiment, one lateral side of thestacked fins 11 away from thefan 20 extends upwardly to define anotch 12 in a top portion of theheat sink 10 near theair outlet 26 of thefan 20. - A
duct 28 extends from thesidewall 23 of thefan 20 away from theoutlet 26 of thefan 20, and interconnects afixing board 27 and thesidewall 23 of thefan 20. Theduct 28 and theoutlet 26 are located at two opposite sides of thefan 20, respectively. Thefixing board 27 is parallel to thebase 22 of thefan 20. Thefixing board 27 defines anelongated channel 271 in a top surface, and areceiving hole 272 in a bottom surface for receiving theheat absorption plate 40. In the present embodiment, thereceiving hole 272 communicates with thechannel 271. Theheat absorption plate 40 thermally connects a heat generating component (not shown) to absorb heat generated therefrom. Theduct 28 is a hollow sealed channel with two open ends, and cooperatively defined by abottom plate 281, twoside plates 282 extending from two opposite sides of thebottom plate 281, and atop plate 283. Thebottom plate 281 and the twoside plates 282 are integral with thesidewall 23 by formed from one piece member. A first open end of theduct 28 extends to and communicates with thecavity 25 of thefan 20, and a second open end extends to and communicates with thereceiving hole 272. The twoside plates 282 and thetop plate 283 extend beyond thebottom plate 281 at the second open end. The heat generating component is adjacent to the second open end of theduct 28. When theheat dissipation module 100 works, a part of the airflow generated by thefan 20 is guided to theheat sink 10 via theoutlet 26, and another part of airflow is guided to theheat absorption plate 40 and the heat generating component via theduct 28. In this embodiment, the first open end of theduct 28 communicates with thecavity 25 by the first open end extending into and through thesidewall 23. - The
heat pipe 30 is U-shaped, and includes anevaporator section 31, acondenser section 32 parallel to and spaced from theevaporator section 31, and a connectingsection 33 interconnecting theevaporator section 31 and thecondenser section 32. Theevaporator section 31 is received in theelongated channel 271 and thermally connects theheat absorption plate 40. Thecondenser section 32 is received in thenotch 12 of theheat sink 10. - Referring to
FIG. 4 , during operation, heat generated by the heat generating component is evenly absorbed by theheat absorption board 40. A part of the heat from theheat absorption board 40 is absorbed by theevaporator section 31 of theheat pipe 30, and transferred to theheat sink 10 via thecondenser section 32. Theimpeller 24 of thefan 20 rotates and drives airflow towards theair outlet 26 and theduct 28. A part of the airflow towards theair outlet 26 takes away the heat absorbed by theheat sink 10; thereby defining a first heat dissipation way. Another part of the airflow towards theduct 28 passes through theduct 28 and directly cools the heat generating component, thecondenser section 32 and theheat absorption plate 40 adjacent to theduct 28; thereby defining a second heat dissipation way. Theduct 28 functions as an air guiding channel to dissipate heat generated by the heat generating component, it can prevent the heat from being over concentrated in the heat generating component and theheat absorption plate 40; therefore, it can improve heat dissipation efficiency of theheat dissipation module 100. - It is to be further understood that even though numerous characteristics and advantages have been set forth in the foregoing description of embodiments, together with details of the structures and functions of the embodiments, the disclosure is illustrative only; and that changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100149144A TW201328570A (en) | 2011-12-28 | 2011-12-28 | Thermal module |
TW100149144A | 2011-12-28 | ||
TW100149144 | 2011-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20130168047A1 true US20130168047A1 (en) | 2013-07-04 |
US9010406B2 US9010406B2 (en) | 2015-04-21 |
Family
ID=48693904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/433,308 Expired - Fee Related US9010406B2 (en) | 2011-12-28 | 2012-03-29 | Heat dissipation module |
Country Status (2)
Country | Link |
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US (1) | US9010406B2 (en) |
TW (1) | TW201328570A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140022724A1 (en) * | 2012-07-20 | 2014-01-23 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
TWI558307B (en) * | 2015-10-07 | 2016-11-11 | 宏碁股份有限公司 | Heat dissipation module |
US10757809B1 (en) * | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104735950A (en) * | 2013-12-20 | 2015-06-24 | 鸿富锦精密工业(武汉)有限公司 | Heat dissipation module |
US11218048B2 (en) | 2018-12-14 | 2022-01-04 | Nidec Motor Corporation | Shaft-mounted slinger for electric motor |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399877B1 (en) * | 1999-05-24 | 2002-06-04 | Takahiro Sakamoto | Heat sink |
US6474409B1 (en) * | 1998-10-28 | 2002-11-05 | Hewlett-Packard Company | Apparatus to enhance cooling of electronic device |
US6525936B2 (en) * | 2001-04-30 | 2003-02-25 | Hewlett-Packard Company | Air jet cooling arrangement for electronic systems |
US6732786B1 (en) * | 2002-10-29 | 2004-05-11 | Taiwan Trigem Information Co., Ltd. | Edge-mounted heat dissipation device having top-and-bottom fan structure |
US6914782B2 (en) * | 2002-02-08 | 2005-07-05 | Via Technologies, Inc. | Multi-opening heat-dissipation device for high-power electronic components |
US6924978B2 (en) * | 2002-12-27 | 2005-08-02 | Intel Corporation | Method and system for computer system ventilation |
US20080043436A1 (en) * | 2006-08-21 | 2008-02-21 | Foxconn Technology Co., Ltd. | Thermal module |
US7697288B2 (en) * | 2007-04-11 | 2010-04-13 | Kabushiki Kaisha Toshiba | Electronic apparatus |
-
2011
- 2011-12-28 TW TW100149144A patent/TW201328570A/en unknown
-
2012
- 2012-03-29 US US13/433,308 patent/US9010406B2/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6474409B1 (en) * | 1998-10-28 | 2002-11-05 | Hewlett-Packard Company | Apparatus to enhance cooling of electronic device |
US6399877B1 (en) * | 1999-05-24 | 2002-06-04 | Takahiro Sakamoto | Heat sink |
US6525936B2 (en) * | 2001-04-30 | 2003-02-25 | Hewlett-Packard Company | Air jet cooling arrangement for electronic systems |
US6914782B2 (en) * | 2002-02-08 | 2005-07-05 | Via Technologies, Inc. | Multi-opening heat-dissipation device for high-power electronic components |
US6732786B1 (en) * | 2002-10-29 | 2004-05-11 | Taiwan Trigem Information Co., Ltd. | Edge-mounted heat dissipation device having top-and-bottom fan structure |
US6924978B2 (en) * | 2002-12-27 | 2005-08-02 | Intel Corporation | Method and system for computer system ventilation |
US20080043436A1 (en) * | 2006-08-21 | 2008-02-21 | Foxconn Technology Co., Ltd. | Thermal module |
US7697288B2 (en) * | 2007-04-11 | 2010-04-13 | Kabushiki Kaisha Toshiba | Electronic apparatus |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140022724A1 (en) * | 2012-07-20 | 2014-01-23 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
TWI558307B (en) * | 2015-10-07 | 2016-11-11 | 宏碁股份有限公司 | Heat dissipation module |
US10757809B1 (en) * | 2017-11-13 | 2020-08-25 | Telephonics Corporation | Air-cooled heat exchanger and thermal arrangement for stacked electronics |
Also Published As
Publication number | Publication date |
---|---|
TW201328570A (en) | 2013-07-01 |
US9010406B2 (en) | 2015-04-21 |
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Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, YU-HSUAN;HSU, CHUNG-KAI;LIU, CHIA-YANG;REEL/FRAME:027951/0532 Effective date: 20120328 |
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Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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FP | Expired due to failure to pay maintenance fee |
Effective date: 20190421 |