TWI558307B - Heat dissipation module - Google Patents

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module suitable for an electronic device.

In recent years, with the development of the technology industry, electronic devices such as notebook computers, tablet computers, and smart phones have frequently appeared in daily life. Some of the electronic components mounted inside these electronic devices usually generate thermal energy during operation. Once the thermal energy accumulates inside the electronic device and does not instantaneously escape to the outside world, the performance of the electronic device may be affected. Therefore, the heat dissipation module or the heat dissipation component is usually disposed inside the electronic device, for example, a heat dissipation fan, a heat dissipation material, a heat dissipation pipe, or a two-phase thermosyphon cooling system to assist in operating the electronic components. The generated heat energy escapes to the outside world.

In the above-mentioned heat dissipation module or heat dissipation component, the heat dissipation effect of the heat dissipation material and the heat dissipation tube is limited, and thus the heat dissipation fan is most widely used. However, the operation of the cooling fan depends on the power provided by the battery of the electronic device, which is bound to accelerate the consumption of electricity. At present, some electronic devices use a two-phase flow siphon cooling system to achieve the purpose of heat dissipation by transmitting the latent heat required by the fluid during phase change. However, the two-phase flow siphon heat dissipation system needs to be used as the power of the fluid to circulate in the pipeline by the difference of the potential energy and the attraction between the fluid molecules. Once the relative state between the electronic device and the gravity direction changes, the fluid may be The efficiency of the cycle has an impact.

The invention provides a heat dissipation module which has a good heat dissipation effect.

The invention provides a heat dissipation module suitable for being disposed in an electronic device to dissipate heat from electronic components in the electronic device. The heat dissipation module includes an evaporator, a flow guiding structure, a first circulation pipe and a second circulation pipe disposed opposite to each other, a heat dissipation plate, and a fluid. The evaporator is thermally coupled to the electronic component, wherein the evaporator has a first chamber. The flow guiding structure has a housing and at least one fan. The fan is located in the second chamber of the housing and is pivotally mounted on the housing. The first circulation tube and the second circulation tube are both in communication with the first chamber and the second chamber to form a loop. The heat dissipation plate is thermally coupled to at least one of the first circulation tube and the second circulation tube. The fluid is filled in the circuit. The heat generated by the electronic components is transferred to the evaporator and transferred to the fluid by the evaporator. After the fluid absorbs heat, the fluid flows into the first circulation tube and flows toward the second chamber. After the fluid flows into the second chamber, the fan is driven by the fluid to rotate relative to the housing to allow fluid to flow out of the second chamber from the second circulation tube and back into the first chamber via the second circulation tube.

Based on the above, the first circulation tube and the second circulation tube of the heat dissipation module of the present invention are both in communication with the first chamber of the evaporator and the second chamber of the housing of the flow guiding structure to form a circuit, and the fluid is filled. In the loop. In detail, the evaporator can be used to receive heat generated when the electronic component operates, and the fluid located in the first chamber of the evaporator is converted from a liquid state to a gaseous state after the heat is absorbed. Then, the gaseous fluid flows through the first chamber, the first circulation tube, the second chamber, and the second circulation tube in sequence, wherein when the fluid flows through the second circulation tube, the heat carried by the fluid is transferred to the heat dissipation. The plate is condensed into a liquid fluid. Thereafter, the liquid fluid will flow back into the first chamber to repeat the two-phase flow cycle within the loop. In other words, the heat dissipation module of the present invention can use the fluid as a heat dissipation medium to dissipate the heat generated when the electronic component operates to the outside, so that the heat dissipation effect is good.

The above described features and advantages of the invention will be apparent from the following description.

1 is a schematic exploded view of an electronic device and a heat dissipation module according to an embodiment of the invention. 2 is a schematic structural view of the electronic device and the heat dissipation module of FIG. 1 . 3 is a partial cross-sectional view of the electronic device and the heat dissipation module of FIG. 2 taken along line I-I. Referring to FIG. 1 to FIG. 3 , in the embodiment, the heat dissipation module 100 is configured to be disposed in the electronic device 10 to dissipate heat from the electronic component 11 in the electronic device 10 . The electronic device 10 may be a smart phone, a tablet, a part of a notebook computer or a docking station, etc., and the electronic component 11 may be a central processing unit, a graphics chip or a memory chip or the like. In detail, the heat dissipation module 100 includes an evaporator 110 , a flow guiding structure 120 , a first circulation tube 130 and a second circulation tube 140 , a heat dissipation plate 150 , and a fluid 160 . The evaporator 110 has a first chamber 111, and the flow guiding structure 120 has a housing 121, a first fan 122, and a second fan 123. The first chamber 111 can communicate with the second chamber 121a of the housing 121 through the first circulation tube 130 and the second circulation tube 140, respectively, to form a circuit for accommodating the fluid 160.

In the present embodiment, the evaporator 110 is thermally coupled to the electronic component 11. In detail, the heat dissipation module 100 further includes a heat pipe 170 for connecting the electronic component 11 and the evaporator 110 to transfer heat generated when the electronic component 11 operates to the evaporator 110 . On the other hand, the evaporator 110 includes a plurality of heat transfer columns 112 having flow guiding regions 111a and heating regions 111b communicating with each other, and these heat transfer columns 112 are located in the heating regions 111b. The heat conducting columns 112 may be made of copper or other suitable heat dissipating material to increase the contact area of the evaporator 110 with the fluid 160. As shown in FIG. 2, the orthographic projection of heat pipe 170 on evaporator 110 overlaps heating zone 111b. Thus, most of the heat transferred to the evaporator 110 is, for example, heat exchanged with the fluid 160 through the thermally conductive columns 112 located within the heating zone 111b, wherein the fluid 160 is converted from a liquid to a gaseous state upon absorption of heat. Next, the fluid 160 (i.e., the gaseous fluid) flows from the heating zone 111b to the flow guiding zone 111a, and flows out of the first cavity 111 from the flow guiding zone 111a. Then, the fluid 160 (ie, the gaseous fluid) flowing out of the first chamber 111 flows into the second chamber 121a via the first circulation pipe 130.

Specifically, the casing 121 has an upper cover 121b, a partition 121c, and a lower cover 121d. The upper cover 121b is butted to the lower cover 121d to define a second chamber 121a, and the partition 121c is disposed between the upper cover 121b and the lower cover 121d to divide the second chamber 121a into the upper chamber 121a1 and the lower chamber 121a2. The first circulation pipe 130 and the second circulation pipe 140 are in communication with the first chamber 111 and the lower chamber 121a2. As shown in FIGS. 2 and 3, the first fan 122 is located in the upper chamber 121a1, and the second fan 123 is located in the lower chamber 121a2. The first fan 122 and the second fan 123 are respectively pivoted on the partition 121c and are, for example, coaxially disposed. As shown in FIG. 1 and FIG. 3, the second fan 123 may have an interlocking shaft 123a. The interlocking shaft 123a is disposed through the through hole 121c1 of the partition plate 121c and is inserted into the assembly hole 122a of the first fan 122. Therefore, after the fluid 160 (ie, the gaseous fluid) flows into the chamber 121a2 via the first circulation pipe 130, the second fan 123 is driven by the fluid 160 (ie, the gaseous fluid) to drive the first fan 122 to rotate in the same rotational direction. In other embodiments, the first fan 122 and the second fan 123 may be non-coaxially disposed, and magnetic members are disposed on the first fan 122 and the second fan 123 respectively, so that the fluid 160 is attracted by magnetic attraction or repulsion. The second fan 123 driven by the gaseous fluid drives the first fan 122 to rotate in the same rotational direction.

Referring to FIG. 2 and FIG. 3, the fluid 160 (ie, gaseous fluid) can be pushed out of the lower chamber 121a2 by the rotation of the first fan 122 and the second fan 123 to be returned to the first chamber via the second circulation tube 140. Within 111. When the fluid 160 (ie, the gaseous fluid) flows through the second circulation pipe 140, since the heat dissipation plate 150 is thermally coupled to the second circulation pipe 140, the heat carried by the fluid 160 (ie, the gaseous fluid) is transferred to the heat dissipation plate 150. Condensed from a gaseous state to a liquid state. Thereafter, fluid 160 (i.e., liquid fluid) will flow back into the first chamber 111 to repeat the two-phase flow cycle within the loop. In other words, the heat dissipation module 100 can use the fluid 160 as a heat dissipation medium to dissipate the heat generated when the electronic component 11 operates to the outside, so that the heat dissipation effect is good. In other embodiments, the first circulation tube 130 can be selectively thermally coupled to the heat sink 150.

Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

4 is a schematic structural view of an electronic device and a heat dissipation module according to another embodiment of the present invention. Referring to FIG. 4 , the heat dissipation module 100A of the present embodiment is substantially similar to the heat dissipation module 100 of FIG. 2 . The difference between the two is that the heat dissipation module 100A can push the airflow through the first fan 122 into the internal space of the electronic device 10A. The electronic component 11 located in the internal space of the electronic device 10A is radiated. In the present embodiment, the upper cover 121b may have an intake opening 121b1 and an air outlet opening 121b2. The upper chamber 121a1 communicates with the air outlet opening 121b2 and the air outlet opening 121b2 in the internal space of the electronic device 10A, and the air outlet opening 121b2 faces the electronic component 11. In detail, when the second fan 123 is driven by the fluid 160 (ie, the gaseous fluid) to drive the first fan 122 to rotate in the same rotational direction, the first fan 122 can introduce the airflow from the air inlet 121b1 and the self-venting opening. The 121b2 pushes the airflow into the internal space of the electronic device 10A to dissipate heat from the electronic component 11 located in the internal space of the electronic device 10A. In other words, the heat dissipation module 100A can simultaneously circulate through the two-phase flow of the fluid 160 and the forced convection generated by the first fan 122 to dissipate the heat generated when the electronic component 11 operates to the outside, so that the heat dissipation effect is good.

In summary, the first circulation tube and the second circulation tube of the heat dissipation module of the present invention are both in communication with the first chamber of the evaporator and the second chamber of the housing of the flow guiding structure to form a loop, and The fluid is filled in the circuit. In detail, the evaporator can be used to receive heat generated when the electronic component operates, and the fluid located in the first chamber of the evaporator is converted from a liquid state to a gaseous state after the heat is absorbed. Then, the gaseous fluid flows through the first chamber, the first circulation tube, the second chamber, and the second circulation tube in sequence, wherein when the gaseous fluid flows through the second circulation tube, the heat carried by the fluid is transmitted to The heat sink is condensed into a liquid fluid. Thereafter, the liquid fluid will flow back into the first chamber to repeat the two-phase flow cycle within the loop. In other words, the heat dissipation module of the present invention can use the fluid as a heat dissipation medium to dissipate the heat generated when the electronic component operates to the outside, so that the heat dissipation effect is good.

In another aspect, in an embodiment, the housing can have an opening in communication with the interior space of the electronic device. When the gaseous fluid flows through the second chamber, the two fans located in the second chamber can be driven by the gaseous fluid, and one of the fans corresponding to the opening can drive the airflow from the opening into the internal space of the electronic device to be located The electronic components in the internal space of the electronic device dissipate heat.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10, 10A‧‧‧ electronic devices
11‧‧‧Electronic components
100, 100A‧‧‧ Thermal Module
110‧‧‧Evaporator
111‧‧‧First chamber
111a‧‧‧ diversion area
111b‧‧‧heating zone
112‧‧‧thermal column
120‧‧‧drain structure
121‧‧‧Shell
121a‧‧‧Second chamber
121a1‧‧‧Upper chamber
121a2‧‧‧ lower chamber
121b‧‧‧Upper cover
121b1‧‧‧Intake opening
121b2‧‧‧ Venting opening
121c‧‧‧Baffle
121d‧‧‧Undercover
122‧‧‧First fan
123‧‧‧second fan
130‧‧‧First circulation tube
140‧‧‧second circulation tube
150‧‧‧heating plate
160‧‧‧ fluid
170‧‧‧ heat pipe

1 is a schematic exploded view of an electronic device and a heat dissipation module according to an embodiment of the invention. 2 is a schematic structural view of the electronic device and the heat dissipation module of FIG. 1 . 3 is a partial cross-sectional view of the electronic device and the heat dissipation module of FIG. 2 taken along line I-I. 4 is a schematic structural view of an electronic device and a heat dissipation module according to another embodiment of the present invention.

10‧‧‧Electronic devices

11‧‧‧Electronic components

100‧‧‧ Thermal Module

110‧‧‧Evaporator

111‧‧‧First chamber

111a‧‧‧ diversion area

111b‧‧‧heating zone

112‧‧‧thermal column

120‧‧‧drain structure

121b‧‧‧Upper cover

121d‧‧‧Undercover

122‧‧‧First fan

130‧‧‧First circulation tube

140‧‧‧second circulation tube

150‧‧‧heating plate

160‧‧‧ fluid

170‧‧‧ heat pipe

Claims (10)

A heat dissipation module is disposed in an electronic device for dissipating heat from an electronic component in the electronic device, the heat dissipation module comprising: an evaporator thermally coupled to the electronic component, wherein the evaporator has a a first flow chamber; a flow guiding structure having a casing and at least one fan, the fan being located in a second chamber of the casing and pivoted to the casing; a first circulating pipe and a oppositely disposed The second circulation tube is connected to the first chamber and the second chamber to form a circuit; a heat dissipation plate is thermally coupled to at least one of the first circulation tube and the second circulation tube; And a fluid filled in the circuit, heat generated by the electronic component is transferred to the evaporator and transferred to the fluid by the evaporator, and after the fluid absorbs heat, the fluid flows into the first circulation pipe and faces the a second chamber flows, after the fluid flows into the second chamber, the fan is driven by the fluid to rotate relative to the housing to cause the fluid to flow out of the second chamber from the second circulation tube, and Returning to the via the second circulation tube A chamber. The heat dissipation module of claim 1, further comprising: a heat pipe connecting the electronic component and the evaporator. The heat dissipation module of claim 2, wherein the evaporator comprises a plurality of heat conducting columns, the first chamber has a flow guiding region and a heating region communicating with each other, and the heat conducting columns are located at the heating In the district. The heat dissipation module of claim 3, wherein the orthographic projection of the heat pipe on the evaporator overlaps the heating zone. The heat dissipation module of claim 1, wherein the housing has an upper cover, a partition, and a lower cover, the upper cover abuts the lower cover to define the second chamber, and the partition is disposed on The upper cover and the lower cover divide the second chamber into an upper chamber and a lower chamber. The heat dissipation module of claim 5, wherein the first circulation tube and the second circulation tube are both in communication with the first chamber and the lower chamber. The heat dissipation module of claim 5, wherein the number of the fans is two, and the two fans are respectively located in the upper chamber and the lower chamber, and are pivotally disposed on the partition. The heat dissipation module of claim 7, wherein the two fans are coaxial. The heat dissipation module of claim 8, wherein the fan located in the lower chamber is driven by the fluid to rotate relative to the partition, and drives the fan located in the upper chamber relative to the partition The board rotates. The heat dissipation module of claim 7, wherein the upper cover has at least one opening, and the upper chamber communicates with the internal space of the electronic device through the opening.