CN204705972U - For the high-efficiency heat radiation structure of CPU - Google Patents

For the high-efficiency heat radiation structure of CPU Download PDF

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Publication number
CN204705972U
CN204705972U CN201520285998.4U CN201520285998U CN204705972U CN 204705972 U CN204705972 U CN 204705972U CN 201520285998 U CN201520285998 U CN 201520285998U CN 204705972 U CN204705972 U CN 204705972U
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China
Prior art keywords
heat
radiator
cpu
conducting block
holder
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Expired - Fee Related
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CN201520285998.4U
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Chinese (zh)
Inventor
章万春
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Dongguan Cool Solte Electronics Technology Co Ltd
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Dongguan Cool Solte Electronics Technology Co Ltd
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Abstract

The utility model discloses a kind of high-efficiency heat radiation structure for CPU; comprise heat-conductive assembly, radiator portion and fan component, heat-conductive assembly comprise holder, heat-conducting block, to lead with heat-conducting block hot linked many heat pipes and and the collecting plate of the inconsistent setting of thermal conductive surface of many heat pipes; Radiator portion is a ring body, and be connected to form a ventilation air duct by adjacent two tabs (heat radiator), heat radiator is connected with this collecting plate heat conduction; Fan component, comprises adaptation and is placed in the fan leaf of the home position of radiator portion, the motor of drive fan leaf rotation, and cover the air intake cover plate be located in this radiator portion.Compared with conventional art, the utility model is rationally more scientific in structural design, the more excellent and compact of heat dissipation.Meanwhile, the lighting design realizing CPU radiator structure entirety is beneficial to.Adapt to be used in server host, OPS computer or integrated computer, be beneficial to and extensively promote the use of.

Description

For the high-efficiency heat radiation structure of CPU
Technical field
The utility model relates to a kind of computer heat radiation parts, specifically a kind of high-efficiency heat radiation structure for CPU.
Background technology
In computer operational process, very crucial to the heat radiation of the central processing unit of main board, heat dissipation is related to and brings detrimental damage to the hardware in mainboard, shortens the serviceable life of hardware; And, the working temperature of central processing unit as distributed not in time, when the temperature of large load operating conditions or external environment condition is higher; under the high temperature self-shield effect of central processing unit; now, computer there will be blue screen and automatic shutdown, has a strong impact on the use of user.
The cpu heat of conventional art is reasonable not in structural design, its structure is: fin section and thermal conduction portions are structure as a whole, heat radiator is open layout, good air channel effect can not be formed, during work, when fan is blown to fin section, can sinuous flow be formed around fin section, easily occur in the heat that distributes again suction fan, and then hot blast is delivered in fin section again, heat dissipation is low; In conventional art, because fin section and thermal conduction portions are one-piece construction, for improving heat dissipation, the volume of fin section is comparatively large, is weight reduction, and the general overall heat conductivility aluminium alloy low compared with copper that adopt is made, and heat dissipation is excellent not; And overall adopt heat conductivility more excellent copper time, cost is high, and weight is large, and this weight can form larger acting force to mainboard, and mainboard is out of shape, and, high to the requirement of attachment fastener.In sum, form the restriction of the cpu heat usable range to conventional art, can not well be used in high to heat dissipation requirement or that requirements of installation space is high server host, OPS computer or integrated computer.
Utility model content
The purpose of this utility model is, for above-mentioned deficiency, provides a kind of scientific structure design reasonable, the high-efficiency heat radiation structure for CPU of the excellent and compact of heat dissipation.
For achieving the above object; technical scheme provided by the utility model is: a kind of high-efficiency heat radiation structure for CPU; comprise: heat-conductive assembly; heat-conductive assembly comprises holder, the heat-conducting block be located in holder one resistance surface, be located in another resistance surface of holder and lead hot linked many heat pipes and the collecting plate with the inconsistent setting of the thermal conductive surface of many heat pipes with heat-conducting block, and holder is provided with multiple mounting hole for fastener assembly along the surrounding of holder; Radiator portion, comprising quantity is that the heat radiator of multi-disc radially arranges formation one ring body, and the dual-side that this heat radiator parallels all vertically bends to form one folding piece, and adjacent two tabs are connected to form a ventilation air duct, and heat radiator is connected with this collecting plate heat conduction; Fan component, comprises the motor that adaptation is placed in the fan leaf of the home position of radiator portion, drive fan leaf rotates, and lid be located at this radiator portion be provided with pod apertures for cool exterior air enter in fan leaf air intake cover plate.
Another preferred version of the present utility model, a resistance surface of this holder offers the through hole that this heat-conducting block adaptive is installed, heat-conducting block is lamellar; These many heat pipes are bending curved pipe, are uniformly distributed and are located in another resistance surface of holder, and a wherein thermal conductive surface of the many homogeneous ends of heat pipe and heat-conducting block is inconsistent.
Another preferred version of the present utility model, these many heat pipes respectively surround into a circle so that one end is corresponding, and the size lid of the area corresponding circle of this collecting plate is located on many heat pipes, and the one side of collecting plate is connected with heat sink conducts heat.
Another preferred version of the present utility model, this heat radiator is alloy in lightweight product.
Another preferred version of the present utility model, this fan leaf is direct-connected on the driving shaft of motor, and fan leaf is alloy in lightweight product; This motor is thin electric motor.
Another preferred version of the present utility model, this heat-conducting block, heat pipe and collecting plate are copper fitting.
The beneficial effects of the utility model are: compared with conventional art, and the utility model is rationally more scientific in structural design, the more excellent and compact of heat dissipation.Meanwhile, the lighting design realizing CPU radiator structure entirety is beneficial to.Wherein, be provided with and be the excellent heat-conducting block of copper fitting heat conductivility, many heat pipes and collecting plate, the heat of central processing unit imports in many heat pipes by heat-conducting block, many heat pipes strengthen the transmission usefulness of heat, the heat of central processing unit is rapidly and efficiently delivered in collecting plate, and then to radiator portion heat trnasfer;
The dual-side that the heat radiator of radiator portion parallels all vertically bends, form one folding piece, adjacent two tabs are connected to form a ventilation air duct, and multiple ventilation air duct radially arranges formation one ring body, the hot-wind inlet of this ventilation air duct is towards the center of circle of ring body, and hot-blast outlet is environment towards the outside; During work, the cold air that fan is sent into flows to hot-blast outlet end by hot-wind inlet end, externally environment distribute heat.Meanwhile, the cold air of feeding evenly can be filled in multiple ventilation air duct and carry out heat interchange, and utilizes fluid mechanics principle, there will not be the hot-air that gives out again by phenomenon that fan sucks.
Be provided with air intake cover plate, fan component is built in the home position of radiator portion, cover corresponding with collecting plate of air intake cover plate is located in radiator portion, formed and hold fan component space and air intake space, for cold air by the pod apertures suction fan assembly of air intake cover plate, to be formed by pod apertures to the air channel of hot-blast outlet, meet fluid mechanics principle, be beneficial to the heat interchange of heat radiator, realize heat radiation usefulness.
The utility model heat dissipation is excellent, compact, entirety can realize lighting design, adapts to be used in server host, OPS computer or integrated computer, is beneficial to and extensively promotes the use of.
Below in conjunction with accompanying drawing and embodiment, the utility model is further illustrated.
Accompanying drawing explanation
Accompanying drawing is used to provide further understanding of the present utility model, and forms a part for instructions, is used from explanation the utility model with embodiment one below, does not form restriction of the present utility model, in the accompanying drawings.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the STRUCTURE DECOMPOSITION figure of Fig. 1.
Fig. 3 is another structural representation of Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described.Should be understood that, embodiment described herein, only for instruction and explanation of the utility model, is not limited to the utility model.
See Fig. 1 and Fig. 2, a kind of high-efficiency heat radiation structure for CPU that the present embodiment provides, comprising:
Heat-conductive assembly; heat-conductive assembly comprises holder 11, the heat-conducting block 12 be located in holder 11 1 resistance surface, be located in another resistance surface of holder 11 and lead hot linked many heat pipes 13 and the collecting plate 14 with the inconsistent setting of the thermal conductive surface of many heat pipes 13 with heat-conducting block 12, and holder 11 is provided with multiple mounting hole for fastener 19 assembly along the surrounding of holder 11; Fastener 19, by locking in hole corresponding in mainboard, is fixed for holder 11, and under the effect of fastener 19, heat-conducting block 12 and central processing unit form gapless elasticity and conflict; Heat-conducting block 12, many heat pipes 13 and collecting plate 14 are copper fitting, and heat conductivility is excellent.The heat of central processing unit imports in many heat pipes 13 by heat-conducting block 12, and many heat pipes 13 strengthen the transmission usefulness of heat, are rapidly and efficiently delivered in collecting plate 14 by the heat of central processing unit, and then to radiator portion heat trnasfer.
Radiator portion 16, comprising quantity is that the heat radiator of multi-disc radially arranges formation one ring body, the dual-side that this heat radiator parallels all vertically bends to form one folding piece, and adjacent two tabs are connected to form a ventilation air duct, and heat radiator is connected with this collecting plate 14 heat conduction; The heat radiator of the present embodiment is an aluminium alloy lamellar body, the dual-side that heat radiator parallels all vertically bends, form one folding piece, adjacent two tabs are connected to form a ventilation air duct, multiple ventilation air duct radially arranges formation one ring body, the hot-wind inlet of this ventilation air duct is towards the center of circle of ring body, and hot-blast outlet is environment towards the outside; During work, the cold air that fan is sent into flows to hot-blast outlet end by hot-wind inlet end, externally environment distribute heat.Meanwhile, the cold air of feeding evenly can be filled in multiple ventilation air duct and carry out heat interchange, and utilizes fluid mechanics principle, there will not be the hot-air that gives out again by phenomenon that fan sucks
Fan component, comprise the motor (not shown) that adaptation is placed in the fan leaf 17 of the home position of radiator portion 16, drive fan leaf 17 rotates, and lid be located at this radiator portion 16 be provided with pod apertures 181 for cool exterior air enter in fan leaf 17 air intake cover plate 18; Be provided with air intake cover plate 18, fan component is built in the home position of radiator portion 16, cover corresponding with collecting plate 14 of air intake cover plate 18 is located in radiator portion 16, formed and hold fan component space and air intake space, for cold air by the pod apertures 181 suction fan assembly of air intake cover plate 18, formed by the air channel of pod apertures 181 to hot-blast outlet, meet fluid mechanics principle, be beneficial to the heat interchange of heat radiator, realize heat radiation usefulness.
See Fig. 3, a resistance surface of the holder 11 of the present embodiment offers the through hole that this heat-conducting block 12 adaptive is installed, heat-conducting block 12 is in lamellar; These many heat pipes 13 are bending curved pipe, are uniformly distributed and are located in another resistance surface of holder 11, and a wherein thermal conductive surface of the many homogeneous ends of heat pipe 13 and heat-conducting block 12 is inconsistent; Preferably, these many heat pipes 13 respectively surround into a circle so that one end is corresponding, and the size lid of the area corresponding circle of this collecting plate 14 is located on many heat pipes 13, and the one side of collecting plate 14 is connected with heat sink conducts heat; Many heat pipes 13 distribute and arrange at grade, increase the thermal conductive surface of heat pipe, have simplified structure, are beneficial to the utility model simultaneously and realize thin design, are a practical design of simplifying structure, reduction component volume.
The fan leaf 17 of the present embodiment is direct-connected on the driving shaft of motor, and fan leaf 17 is articles made of aluminium alloy, is beneficial to and improves fan leaf 17 rigidity, reduces the heat radiation that nuisance vibration is beneficial to motor simultaneously; This motor is thin electric motor, is beneficial to the utility model entirety and realizes thin design.
Compared with conventional art, the utility model structural design and heat dissipation rationally more scientific, smaller and more exquisite on volume, meanwhile, be beneficial to overall lighting design.Adapt to be used in server host, OPS computer or integrated computer, be beneficial to and extensively promote the use of.
Above embodiment is only for illustration of the utility model; and be not limitation of the utility model; the those of ordinary skill of relevant technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.

Claims (6)

1. for a high-efficiency heat radiation structure of CPU, it is characterized in that, comprising:
Heat-conductive assembly; heat-conductive assembly comprises holder, the heat-conducting block be located in holder one resistance surface, be located in another resistance surface of holder and lead hot linked many heat pipes and the collecting plate with the inconsistent setting of the thermal conductive surface of many heat pipes with heat-conducting block, and holder is provided with multiple mounting hole for fastener assembly along the surrounding of holder;
Radiator portion, comprising quantity is that the heat radiator of multi-disc radially arranges formation one ring body, and the dual-side that this heat radiator parallels all vertically bends to form one folding piece, and adjacent two tabs are connected to form a ventilation air duct, and heat radiator is connected with this collecting plate heat conduction;
Fan component, comprises the motor that adaptation is placed in the fan leaf of the home position of radiator portion, drive fan leaf rotates, and lid be located at this radiator portion be provided with pod apertures for cool exterior air enter in fan leaf air intake cover plate.
2. a kind of high-efficiency heat radiation structure for CPU as described in claim l, is characterized in that, a resistance surface of this holder offers the through hole that this heat-conducting block adaptive is installed, heat-conducting block is lamellar; These many heat pipes are bending curved pipe, are uniformly distributed and are located in another resistance surface of holder, and a wherein thermal conductive surface of the many homogeneous ends of heat pipe and heat-conducting block is inconsistent.
3. a kind of high-efficiency heat radiation structure for CPU as claimed in claim 2, it is characterized in that, these many heat pipes respectively surround into a circle so that one end is corresponding, and the size lid of the area corresponding circle of this collecting plate is located on many heat pipes, and the one side of collecting plate is connected with heat sink conducts heat.
4. a kind of high-efficiency heat radiation structure for CPU as claimed in claim 3, it is characterized in that, this heat radiator is alloy in lightweight product.
5. a kind of high-efficiency heat radiation structure for CPU as claimed in claim 1, it is characterized in that, this fan leaf is direct-connected on the driving shaft of motor, and fan leaf is alloy in lightweight product; This motor is thin electric motor.
6. a kind of high-efficiency heat radiation structure for CPU as claimed in claim 1, it is characterized in that, this heat-conducting block, heat pipe and collecting plate are copper fitting.
CN201520285998.4U 2015-05-06 2015-05-06 For the high-efficiency heat radiation structure of CPU Expired - Fee Related CN204705972U (en)

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Application Number Priority Date Filing Date Title
CN201520285998.4U CN204705972U (en) 2015-05-06 2015-05-06 For the high-efficiency heat radiation structure of CPU

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109298761A (en) * 2018-10-19 2019-02-01 张静逸 A kind of heat dissipation integrated system of computer server
CN109413935A (en) * 2018-09-26 2019-03-01 天长市天毅电子科技有限公司 A kind of electric car charger convenient for heat dissipation
CN109445546A (en) * 2018-10-17 2019-03-08 刘玉婷 A kind of CPU radiating subassembly
CN113458333A (en) * 2021-05-28 2021-10-01 荣耀终端有限公司 Electronic product and preparation method of light alloy casting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109413935A (en) * 2018-09-26 2019-03-01 天长市天毅电子科技有限公司 A kind of electric car charger convenient for heat dissipation
CN109413935B (en) * 2018-09-26 2020-05-15 天长市天毅电子科技有限公司 Heat radiator for electric vehicle charging ware
CN109445546A (en) * 2018-10-17 2019-03-08 刘玉婷 A kind of CPU radiating subassembly
CN109298761A (en) * 2018-10-19 2019-02-01 张静逸 A kind of heat dissipation integrated system of computer server
CN113458333A (en) * 2021-05-28 2021-10-01 荣耀终端有限公司 Electronic product and preparation method of light alloy casting

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Granted publication date: 20151014

Termination date: 20180506