CN2538017Y

CN2538017Y - Radiator

Info

Publication number: CN2538017Y
Application number: CN 02207459
Authority: CN
Inventors: 陈国星
Original assignee: 邓淑贞
Priority date: 2002-03-13
Filing date: 2002-03-13
Publication date: 2003-02-26
Anticipated expiration: 2012-03-13

Abstract

The utility model relates to a computer heat radiation device to increase the whole heat radiation area. The heat radiation device comprises heat radiating fins, a fan, an upper cover and a fixing element. The bottom board of the heat radiating fins is provided with upright fins and attached on the upper surface of wafers. The utility model is characterized in that: the fins on the surfaces of the bottom board of the heat radiating fins are smooth S shaped and can be used in computer etc.

Description

Heat abstractor

Technical field

The utility model relates to the heat abstractor of computer.

Background technology

Existing computer radiating apparatus, general all is to install heat radiator on the central processing unit surface of computer, the heat conduction that makes the central processing unit generation is to each heat radiator, blow to the radiating fin surface with cold air by fan again and dispel the heat, yet the principal element that influences radiating efficiency is an area of dissipation, so the relation that is provided with of fin greatly, but mostly there are certain standard and restriction in the mounting height of heat abstractor and space now, particularly under the condition that satisfies this standard and restriction, the integral heat sink area and the fin height of the radiating fin of heat abstractor now are still not ideal enough, do not fill a part performance radiating efficiency as yet.

Goal of the invention

The purpose of this utility model provides a kind of heat abstractor that reduces the fin height and increase the integral heat sink area.

The purpose of this utility model is achieved in that heat abstractor, it comprises: heat radiator, fan, loam cake and retaining element, the base plate of heat radiator is provided with the fin of vertical, and base plate fits in upper wafer surface, it is characterized in that: the fin of this heat radiator backplate surface is for being level and smooth S shape.

Above-mentioned design is the fin of level and smooth S shape by this kind, reached the effect that increases area of dissipation and reduce the fin height, and the cooling air that fan is blowed has the effect of flow-disturbing.

Description of drawings

Fig. 1 is the three-dimensional appearance synoptic diagram of the utility model first embodiment;

Fig. 2 is the perspective exploded view of the utility model first embodiment;

Fig. 3 is the three-dimensional appearance synoptic diagram of the utility model second embodiment;

Fig. 4 is the perspective exploded view of the utility model second embodiment;

Fig. 5 is the side-looking cross-sectional schematic of the utility model second embodiment;

Fig. 6 is the three-dimensional appearance synoptic diagram of the utility model the 3rd embodiment.

Embodiment

As shown in Figure 1, 2: the utility model comprises: heat radiator 1, fan 2, loam cake 3 and retaining element 4, the base plate 11 of heat radiator 1 is provided with the fin 12 of vertical, base plate 11 fits in upper wafer surface, it is characterized in that: the fin 12 on these heat radiator 1 base plate 11 surfaces is for being level and smooth S shape.Wherein, each fin 12 surface is provided with profile groove 121; Wherein, 12 of fins in base plate 11 tops are provided with an accommodation space 13, and have inserted fan 2 and be the location in accommodation space 13.This fan 2 is for being underslung type design, and pass the perforation 21 of 3 perforation 31 of corresponding loam cake and fan 2 in regular turn with retaining element 4 after, locks to fin 12 gaps to be the location again.The quantity of above-mentioned fin 12 and profile groove 121 thereof can optionally design.

Shown in Fig. 3-5: when the specification of heat abstractor and height are in permissible range, use for can directly being positioned with a fan 2 on fin 12 tops, this mode, then fin 12 two side faces can have the not upper and lower protuberance of coplanar, the cooling air that fan 2 is blowed downwards can a part clash into protuberance, make the wind flow-disturbing that blows out, it is more even to dispel the heat.

As shown in Figure 6: wherein, this fan 2 is positioned at the side of the fin 12 of heat radiator 1, is applicable to fin 12 size condition with higher.The material of fin 12 is not subjected to this limit advantage of the present utility model then extremely obvious with being connected etc.

Claims

1, heat abstractor, it comprises: heat radiator, fan, loam cake and retaining element, the base plate of heat radiator is provided with the fin of vertical, and base plate fits in upper wafer surface, it is characterized in that: the fin of this heat radiator backplate surface is for being level and smooth S shape.

2, want 1 described heat abstractor as right, it is characterized in that: wherein, each fin surface is provided with profile groove.

3, want 1 described heat abstractor as right, it is characterized in that: wherein, between the fin of base plate top, be provided with an accommodation space, and in accommodation space, inserted fan and be the location.

4, want 1 described heat abstractor as right, it is characterized in that: wherein, this fan is positioned at the side of the fin of heat radiator.