CN216668393U

CN216668393U - Heat radiator

Info

Publication number: CN216668393U
Application number: CN202122327043.9U
Authority: CN
Inventors: 张平平; 高相启; 刘玉伟; 徐奔
Original assignee: Henan New Kelong Electrical Appliances Co ltd
Current assignee: Henan New Kelong Electrical Appliances Co ltd
Priority date: 2021-09-23
Filing date: 2021-09-23
Publication date: 2022-06-03
Anticipated expiration: 2031-09-23

Abstract

The embodiment of the application discloses a radiator includes: a blow-up plate; the blowing plate is internally provided with mutually communicated blowing channels which are filled with superconducting working media; the edge of the bottom side edge of the blowing plate comprises a filling port for filling the superconducting working medium into the blowing channel; a heat conducting block attached to the chip is arranged on one side, provided with the filling port, of the surface of one side of the blowing plate in the vertical direction on the symmetrical axis; and a cooling fin is arranged on the surface of one side of the blowing plate, which is far away from the side with the heat conducting block. The heat of the chip is transferred to the blowing plate through the heat conducting block on the surface of one side of the blowing plate, the superconducting working medium in the blowing plate absorbs the heat, a dual circulating heat dissipation system is formed by utilizing the gravity and the pressure of the superconducting working medium, and passive heat dissipation can be realized without a power source; in addition, part of heat in the blowing expansion plate can be transferred to the radiating fins, and the radiating efficiency is further improved through the radiating fins; the radiator that this application provided has advantages such as simple structure, small, radiating efficiency height.

Description

Heat radiator

Technical Field

The present application relates to the field of heat dissipation technology, and more particularly, to a heat sink.

Background

With the progress and development of science and technology, the electronic technology manufacturing industry in China has been developed rapidly. Many high-end consumer electronic products such as household appliances and mobile phones are more and more complex in design and more intelligent, and the products are also developed synchronously in multiple directions such as light, thin, integrated, intelligent and multifunctional.

When the product works normally, in a limited space in the product, if the heat dissipation requirement of the product is to be met, the requirement on the heat conductivity coefficient of the internal radiator is higher; the working time of the product can be prolonged only if the heat conductivity coefficient of the radiator meets the requirement.

The heat dissipation in the product is mainly the chip heat dissipation, and in the using process, if the chip heat dissipation has a problem, the product can not run at high frequency directly, so that the internal refrigeration effect of the product is greatly reduced, and the product is stopped or the internal chip is burnt seriously; for example, the heat dissipation mode of the existing air conditioner chip mainly adopts an aluminum profile for heat dissipation, and the heat dissipation is enhanced by a fan of an air conditioner outdoor unit, but the heat dissipation requirement of the air conditioner cannot be met in a limited heat dissipation space, the heat dissipation efficiency is low, and the service life of the air conditioner is shortened.

Therefore, in order to overcome the defects of the prior art, a heat sink needs to be provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a radiator to solve the problem that the prior art cannot meet the radiating requirement of a chip in a product.

In order to achieve at least one of the above purposes, the following technical scheme is adopted in the application:

the application provides a heat sink, includes: a blow-up plate;

the blowing plate is internally provided with blowing channels which are communicated with each other, and the blowing channels are filled with superconducting working media;

the edge of the bottom side edge of the blowing plate comprises a filling port for filling the superconducting working medium into the blowing channel;

a heat conducting block attached to the chip is arranged on one side, provided with the filling port, of the surface of one side of the blowing plate in the vertical direction on the symmetrical axis;

and a cooling fin is arranged on the surface of one side of the blowing plate, which is far away from the side with the heat conducting block.

Alternatively, the fins can be serpentine formed.

Optionally, one side of the blowing plate with the heat-conducting block is a blowing surface, and the other opposite side surface is a blowing surface or a non-blowing surface.

Optionally, the blowing plate comprises a plurality of rolling points arranged in an array;

the gaps between adjacent rolling points are communicated with each other to form the inflation channel.

Optionally, reinforcing ribs are further included on two opposite side edges of the blowing plate in the vertical direction.

Alternatively, the heat conduction block and the heat radiation fin are each provided on one side surface and the opposite other side surface of the inflation plate by brazing, respectively.

Optionally, a first mounting hole is formed in the heat conduction block;

the first fixing piece penetrates through the first mounting hole to fix the chip on the heat conducting block.

Optionally, a second mounting hole is further formed in the heat conduction block;

and the second fixing piece penetrates through the second mounting hole to fix the circuit board with the chip on the heat conducting block.

Optionally, the heat conduction block is an aluminum block or a copper block.

Optionally, the heat sink is a composite material.

The beneficial effect of this application is as follows:

aiming at the problems in the prior art, the heat of a chip is transferred into the blowing plate through the heat conducting block positioned on the surface of one side of the blowing plate, the superconducting working medium in the blowing plate absorbs the heat, a dual circulating heat dissipation system is formed by utilizing the gravity and the pressure of the superconducting working medium, and passive heat dissipation can be realized without a power source; in addition, part of heat in the blowing expansion plate can be transferred to the radiating fins, and the radiating efficiency is further improved through the radiating fins; the radiator that this application provided has advantages such as simple structure, small, radiating efficiency height.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 shows a first structural diagram of a heat sink in an embodiment of the present application.

Fig. 2 shows a schematic structural diagram of a heat sink in an embodiment of the present application.

Fig. 3 illustrates a front view of a heat sink in one embodiment of the present application.

Fig. 4 illustrates a front view of a heat sink with a heat conduction block removed in one embodiment of the present application.

Fig. 5 is a schematic view showing a structure of a heat sink fin in a heat sink according to an embodiment of the present application.

Fig. 6 shows a schematic view of a heat sink in one embodiment of the present application mounted with a chip, a circuit board with a chip, and a housing of the circuit board in use.

Fig. 7 shows a schematic view of a heat sink in one embodiment of the present application in use connected to a circuit board with a chip and a housing for the circuit board.

Detailed Description

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.

It is further noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

To solve the problems in the prior art, an embodiment of the present application provides a heat sink, as shown in fig. 1 to 7, including: a blow-up panel 1; the blowing plate 1 is internally provided with blowing channels 11 which are communicated with each other, and the blowing channels 11 are filled with superconducting working media; the edge of the side edge of the bottom of the blowing plate 1 comprises a filling port 12 which is used for filling superconducting working medium into a blowing channel 11; a heat conducting block 2 attached to the chip 6 is arranged on one side, which is provided with the filling opening 12, of the surface of one side of the blowing plate 1 in the vertical direction; the side surface of the blowing plate 1 facing away from the heat conducting block 2 is provided with a heat radiating fin 3.

In the embodiment, the heat of the chip 6 is transferred to the blowing plate 1 through the heat-conducting block 2 positioned on the surface of one side of the blowing plate 1, the superconducting working medium in the blowing plate 1 absorbs the heat, a dual circulating heat-radiating system is formed by utilizing the gravity and the pressure of the superconducting working medium, and passive heat radiation can be realized without a power source; in addition, partial heat in the blowing plate 1 can be transferred to the radiating fins 3, and the radiating efficiency is further improved through the radiating fins 3; the radiator that this application provided has advantages such as simple structure, small, radiating efficiency height.

Specifically, in the radiator provided by the application, the heat conducting block 2 is directly attached to the inflation plate 1, so that the heat of the chip 6 is directly transferred to the inflation plate 1, the chip is radiated by the internal superconducting working medium, and part of the heat is radiated by the radiating fins 3; different from the prior art, a substrate is fixedly attached to the heat conducting block 2, the substrate is a flat plate, the other side of the substrate, which is far away from the heat conducting block 2, is provided with a blowing plate 1 fin group (namely a radiating fin 3), and heat is radiated through superconducting working media in the blowing plate 1 fin group; in such a way, a base plate is arranged between the fin group of the blowing plate 1 and the heat conducting block 2 at intervals, so that the heat dissipation effect is greatly reduced, and the fins of the blowing plate 1 are provided with a plurality of fins, so that the cost is high and the time is wasted during manufacturing.

In practical application, the blowing plate 1 provided by the application is vertically arranged, and the heat conduction block 2 is arranged on one side of the surface of one side of the blowing plate 1, which is provided with the charging opening 12 on the symmetrical axis in the vertical direction; therefore, the superconducting working medium is positioned at the bottom of the blowing plate 1, so that the superconducting working medium in the blowing plate 1 can automatically flow to the bottom of the blowing plate 1 under the influence of self gravity, when the chip 6 generates heat, the superconducting working medium at the bottom of the blowing plate 1 can be heated, boiled and gasified and further float to the top of the blowing plate 1, the superconducting working medium condenses after the top of the blowing plate 1 dissipates heat and then flows back to the bottom of the blowing plate 1 under the action of gravity, and therefore passive circulation of the whole heat absorption and dissipation process is formed, and the circulation mode can realize passive heat dissipation of the radiator without any power; part of the heat in the blowing plate 1 is also radiated through the radiating fins 3, so that the radiating efficiency of the radiator is further enhanced.

Further, because the heat conduction block 2 absorbs heat, the bottom temperature of the inflation plate 1 is higher, the top temperature is lower, the temperature difference exists between the bottom and the top, the pressure of the superconducting working medium at the bottom of the inflation plate 1 with high temperature is relatively large, the superconducting working medium forms a circulating flow loop between the bottom and the top of the inflation plate 1, the superconducting working medium is enabled to be a dual-acceleration circulating heat dissipation system under the action of gravity and pressure difference, the heat dissipation effect can be furthest played, the heat dissipation efficiency is effectively improved, the whole heat dissipation process can be realized without any power source, and the energy is saved.

In practical application, as shown in fig. 1, the heat conducting block 2 is preferably disposed at the bottom of the expansion plate 1, that is, the bottom edge of the heat conducting block 2 is attached to the bottom edge of the expansion plate 1. Therefore, after the heat conducting block 2 absorbs the heat in the chip 6, the heat can be directly transferred to the superconducting working medium in the blowing plate 1 to dissipate the heat of the chip 6, and the heat dissipation efficiency is greatly improved.

In a specific embodiment, the heat conduction block 2 and the heat dissipation fins 3 may be respectively disposed on one side surface and the opposite other side surface of the expansion plate 1 by brazing; the connection between the heat conduction block 2 and the heat radiating fin 3 and the expansion plate 1 is more stable by adopting a sintering and brazing combined process; in practical application, after welding, the gaps between the heat conducting block 2 and the inflation plate 1 and between the heat radiating fins 3 and the inflation plate 1 can be filled with heat conducting glue, so that the connection stability between the heat conducting block 2 and the heat radiating fins 3 and the inflation plate 1 is further enhanced. In practical application, after heat conduction piece 2 and fin 3 welded respectively on the inflation board 1, the super-conductive working medium is injected into inflation board 1 through the filling mouth 12, fills to fill and seals filling mouth 12 after accomplishing, can adopt the welded mode when sealing.

In a specific embodiment, the heat conducting block 2 is provided with a first mounting hole 21; a first fixing member (not shown) passes through the first mounting hole 21 to fix the chip 6 to the heat conduction block 2. The heat conduction block 2 is also provided with a second mounting hole 22; a second fixing member (not shown) passes through the second mounting hole 22 to fix the circuit board 7 having the chip 6 to the heat conductive block 2. Specifically, as shown in fig. 4, in order to fix the chip 6 on the heat conducting block 2 more accurately, the blowing plate 1 is further provided with a third mounting hole 13, and the first fixing member sequentially passes through the first mounting hole 21 and the third mounting hole 13 to fix the chip 6; in a specific example, as shown in fig. 4, the third mounting hole 13 is located at the bottom edge of the expansion plate 1, and is separated from the channel of the expansion plate 1, and does not affect each other. In a specific example, the blowing plate 1 may be rectangular, fourth mounting holes 14 connected and fixed with the housing 4 of the circuit board 7 are further provided at positions of four corners of the rectangle, and the housing 4 of the circuit board 7 is connected and fixed with the blowing plate 1 through the fourth mounting holes 14 by third fixing pieces 16; here, the first fixing piece, the second fixing piece, and the third fixing piece 16 may be screws, and are not limited to screws; the heat conduction block 2 can be an aluminum block or a copper block.

In a specific embodiment, the mutually communicated inflation channels 11 arranged in the inflation plate 1 form a loop for the superconducting working medium to flow in a fixed flow direction between the bottom and the top of the inflation plate 1. Specifically, the blowing plate 1 comprises a plurality of rolling points 15 arranged in an array; the gaps between adjacent rolls 15 communicate with each other to form said inflation channel 11. Here, the shape of the cross section of the roll point 15 may be circular, elliptical or polygonal. Wherein, in the case that the shape of the cross section of the roll point 15 is a polygon, the edge of the roll point 15 is rounded. This facilitates the flow of superconducting working fluid along the nip point 15 in the inflation channel 11.

In a specific embodiment, one side of the expansion plate 1 having the heat conducting block 2 is an expansion surface, and the opposite other side surface is an expansion surface or a non-expansion surface, that is, the surface of the expansion plate 1 away from the side having the heat conducting block 2 is an expansion surface or a non-expansion surface; designing according to the actual situation; when the side surface of the inflation plate 1 departing from the heat conduction block 2 is the inflation surface, the radiating fins 3 are arranged between the two adjacent inflation channels 11, so that the radiating fins 3 are more stably connected with the inflation plate 1 and are not easy to fall off.

In a specific embodiment, as shown in fig. 5, the heat dissipation plate 3 may be formed by winding and bending, such that the heat dissipation area of the heat dissipation plate 3 is larger and the heat dissipation efficiency is higher; certainly, under the condition that the using effect of the present application is not affected, the heat sink 3 may also be a fin, a folded piece and a hobbing sheet, without limitation; here, the heat radiation fins 3 may be a composite material, and are not limited to the composite material.

In a specific embodiment, reinforcing ribs 5 are further included on two opposite side edges in the vertical direction of the inflation plate 1. The setting of strengthening rib 5 has strengthened the intensity of inflation board 1 for inflation board 1 is difficult to the problem of appearing in the use, has improved inflation board 1's life.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.

Claims

1. A heat sink, comprising:

a blow-up plate;

a heat conducting block attached to the chip is arranged on one side, provided with the filling port, of the surface of one side of the blowing plate in the vertical direction;

2. The heat sink of claim 1,

the heat radiating fins can be formed by winding and bending.

3. The heat sink of claim 1,

one side of the blowing plate, which is provided with the heat conducting blocks, is a blowing surface, and the other opposite side surface is a blowing surface or a non-blowing surface.

4. The heat sink of claim 1,

the blowing plate comprises a plurality of rolling points which are arranged in an array;

5. The heat sink of claim 1,

and reinforcing ribs are further arranged on two opposite side edges of the blowing plate in the vertical direction.

6. The heat sink of claim 1,

the heat conduction block and the heat radiating fin are respectively arranged on one side surface and the opposite other side surface of the blowing plate through brazing.

7. The heat sink of claim 1,

the heat conduction block is provided with a first mounting hole;

8. The heat sink of claim 1,

the heat conduction block is also provided with a second mounting hole;

9. The heat sink of claim 1,

the heat conduction block is an aluminum block or a copper block.

10. The heat sink of claim 1,

the radiating fin is made of composite materials.