Ϊ378007 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種軸向受熱之熱管與熱傳導基座結 合方法，尤指一種經由壓製而使熱傳導基座與熱管結合更 為緊密之方法。 【先前技術】 按’有關熱管與熱傳導基座之結合技術，如我國發明 公開第200421071號「導熱管與導熱基座之結合方法」專利 一案即是。 而》亥專利案所揭露之技術，主要係於一實心之導熱基 座上設有對應導熱管之洞孔，並於導熱管植入洞孔内後， 再對該導熱基座施予外力而使其與導熱管一同變形，進而 令導熱官可緊密結合於導熱基座之洞孔内。Ϊ378007 IX. Description of the Invention: [Technical Field] The present invention relates to a method of combining an axially heated heat pipe with a heat conducting base, and more particularly to a method of bonding a heat conducting base and a heat pipe more tightly by pressing. [Prior Art] According to the combination technology of the heat pipe and the heat transfer base, the patent of the method of "the combination of the heat pipe and the heat transfer base" is disclosed in the Chinese Patent Publication No. 200421071. The technology disclosed in the "Hai Patent" mainly consists of a hole corresponding to a heat pipe on a solid heat-conducting base, and after the heat pipe is implanted in the hole, an external force is applied to the heat-conductive base. It is deformed together with the heat pipe, so that the heat conductor can be tightly coupled into the hole of the heat conductive base.
惟’眾所皆知，一般金屬材質在受外力施壓而產生$ 性變形時，必須藉著應力’使得材料產生塑性流動而造: 水久變形。而該專利卻係以—實心、之導熱基座，並直㈣ 該導熱基座之了貞面與底㈣行㈣，理論上其所施加之夕 力必須相當大’在實際製造上恐有固難 利經由壓製後會於壓合面上形成塑性流動紋路，即表面 1 故其在與熱源相貼附時彼此間即有間隙產兰 而成為熱阻，因而影響熱傳效果。 有=此’本發明人係為改善並解決上述之缺失，乃 配合學理之運用’終於提出—種設計合理且 有效改善上述缺失之本發明。 5 1378007 【發明内容】 本發明之主要目的，在於可提供一種軸向受熱之熱管 與熱傳導基座結合方法，其係改以側向撥壓而便於製成， 同時，於壓製完成t更進一步對該熱傳導基座底面進行研 2，以令各熱管之一端端部與該熱傳導基座底面相切平而 此直接文熱’俾達到較佳的熱傳效果。 為了達成上述之目的，本發明係提供一種軸向受熱之 _熱官與熱傳導基座結合方法，其步驟包括： a)準備一熱傳導基座及複數熱管； 片b)於該熱傳導基座之一表面上設有複數穿孔，並將該 等熱管之一端分別穿入於該熱傳導基座之各穿孔内； c) 對该熱傳導基座進行側向之擠壓，以使各該熱管與 其所對應之穿孔孔壁在播壓方向處形成緊密地平面接觸； d) 將該熱傳導基座底面予以磨平，並研磨至各該熱管 之一端的端部與該熱傳導基座底面相切齊。 ’、 • 【實施方式】 為了使貴審查委員能.更進一步瞭解本發明之特徵及 技術内容，請參閱以下有關本發明之詳細說明與附圖，然 而所附圖式僅提供參考與說明用，並非用來對本發明加以 限制者。 請參閱第一圖及第二圖，係分別為本發明熱傳導基座 熱S之分解不意圖及組合示意圖。本發明係提供一種軸 '父熱之熱管與熱傳導基座結合方法，其步驟如下： 首先’準備一熱傳導基座1及複數熱管2。該熱傳導 6 1378007 基座】係以導熱性良好之材I 制& , σ τ 孖貝所衣成，如鋁、銅等，並可 王一平板狀體；該孰傳導其成1 :工，ν ,，，，、得蜍基座1底面係具有一用以貼附於 熱源上之受熱面]〇 ’該受熱面1〇實 办姑“ 只月工々 干整面，而於 ]’；’ 土座1頂面則具有一與該受熱面】〇相之 :::並由該散熱面η上向受熱面10穿設有複數穿孔12:、該 寺牙孔12可於散熱面η上呈同 一、 王^匕1®1方式分佈（如第三圖所 不），且該等穿孔】2之數量係與上述熱管2之數量相一致 〇 心承上所述’各熱官2皆具有一受熱端2〇、以及—與該 端2G相遠離之冷凝端21 ’而各熱管2之受熱端難= 別牙入於熱傳導基座1之穿孔12内 ν σ為推j 、 心牙札U内，以王熱傳接觸而結合 ’且熱管2之受熱端2〇的管身軸線方向係與其所對應之穿 孔12的軸線方向相同，並與散熱面丨丨實質垂直。同時，亦 可於各熱管2之受熱端20與穿孔12間塗佈導熱膏 孔隙而增加熱傳效能。 -補 再請參閱第四圖所示，當各熱管2穿設於該哉傳導美 座1上後，即可對該熱傳導基座丨進行側向之壓製動作: 擠壓牯’可令該熱傳導基座丨一側以凹弧面之模具抵持、 而另一側則以一平面之模具施以外力擠壓（即如第四圖所 示）；或利用二具有平面之模具由一相對方向同時對該熱 傳導基座1之側向施以外力擠壓（即如第七圖所示）。如' 此，熱傳導基座1及各熱管2之受熱端20即可因受外力的 影響而產生塑性變形，因而使得各熱管2之受熱端加與其 所對應之穿孔12孔壁可在壓製方向處（即壓製後所形成的 7 1378007 扁平處）形成緊密地平面接觸（即如第五圖所示），以令 該熱傳導基座】與各熱管2相結合。 ^此外，在上述步驟後’亦可以如錫膏等焊料加熱熔化 後，以填入各熱管2之受熱端20與穿孔12間的孔隙内，俾 藉以增進熱傳效能。 β,取後，如第六圖所示，由於熱傳導基座〗經由上述擠 壓過程後，其受熱面]〇已無法維持原有的平整度。故須針 對該受熱面10進行磨平製程，同時，各熱f 2 的端部200亦可一併呈一卓而屈4丄 、 — 併王千面，俾豬由研磨等機械加工方 式’使各熱管2之受熱端20的端部2〇〇與熱傳導基座】之 受熱面ω相切齊，如此即可令各熱管2之受熱端2〇的端部 200直接文熱，以達到較佳的熱傳效果。 疋j ’精由上述之步驟流程，即可得到本發明軸向受 熱之熱管與導熱基座結合方法。 絲上所述’本發明確可達到預期之使用目的，而解決 = 又因極具新穎性及進步性，完全符合發明專 ^申^要件，爰依專利法提出申請，敬請詳查並賜准本案 專利’以保障發明人之權利。 的本P上所述僅為本發明之較佳可行實施例，非因此即 ==專利範圍，故舉凡運用本發明說明書及圖式 内合所為之寺效技術、手段 明之範圍内，合予㈣h寻父化’均同理皆包含於本發 8 1^/8007 【圖式簡單說明】 第 圖係本發明熱傳導基座與熱管之分解示意圖。 第一圖係本發明熱傳導基座與熱管之組合示意圖。 第三圖係第二圖之3-3斷面剖視圖。 第四圖係本發明對熱傳導基座施以壓製後之剖面示 意圖。 第五圖係第四圖之A部份放大詳圖。 第六圖係本發明將經壓製之熱傳導基座庇 平後之局部剖視圖。 底部進行磨 第七圖係本發明對熱傳導基座施以另— 之剖面示意圖。 裡麼製方式 【主要元件符號說明】 <本發明> 熱傳導基座 1 散熱面 11 魯 受熱面 穿孔 12However, it is well known that when a metal material is pressed by an external force to produce a sexual deformation, it must be made by the plastic force of the material to cause plastic deformation: water deformation. The patent is based on a solid, thermally conductive pedestal, and straight (four) the base and bottom (four) of the heat-conducting base (four), in theory, the force exerted by it must be quite large 'in actual manufacturing, there may be solid Difficult to form a plastic flow pattern on the pressing surface after pressing, that is, the surface 1 so that when it is attached to the heat source, there is a gap between the two to form a thermal resistance, thereby affecting the heat transfer effect. The present invention has been made to improve and solve the above-mentioned deficiencies, and in conjunction with the use of the theory, has finally proposed a present invention which is rational in design and effective in improving the above-mentioned deficiencies. 5 1378007 SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for combining an axially heated heat pipe and a heat conducting base, which is modified to be laterally pressed to facilitate the preparation, and at the same time, the pressing is completed further. The bottom surface of the heat conducting base is ground 2 so that one end end of each heat pipe is tangential to the bottom surface of the heat conducting base, and this direct heat is used to achieve a better heat transfer effect. In order to achieve the above object, the present invention provides a method for combining an axially heated heat and a heat conducting base, the steps comprising: a) preparing a heat conducting base and a plurality of heat pipes; and b) one of the heat conducting bases a plurality of perforations are provided on the surface, and one end of the heat pipes is respectively inserted into the perforations of the heat conducting base; c) laterally pressing the heat conducting base so that the heat pipes correspond to the heat pipes The perforated hole wall forms a close planar contact at the direction of the weaving; d) the bottom surface of the heat conducting base is ground and ground to the end of each end of the heat pipe to be aligned with the bottom surface of the heat conducting base. [Embodiment] In order to enable the reviewing committee to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings. It is not intended to limit the invention. Please refer to the first figure and the second figure, which are respectively a schematic diagram of the decomposition and combination of the heat conduction base of the present invention. The present invention provides a method of combining a shaft 'father heat pipe and a heat conduction base, the steps of which are as follows: First, a heat conducting base 1 and a plurality of heat pipes 2 are prepared. The heat conduction 6 1378007 pedestal is made of a material with good thermal conductivity I, & σ τ mussels, such as aluminum, copper, etc., and can be a flat plate; ν , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The top surface of the soil seat 1 has a surface corresponding to the heat receiving surface::: and the plurality of perforations 12 are formed by the heat dissipating surface η to the heating surface 10: the temple hole 12 is disposed on the heat dissipating surface η In the same way, the distribution is in the same way as the above, and the number of the perforations is the same as the number of the heat pipes 2 described above. A heated end 2〇, and a condensing end 21' away from the end 2G, and the heated end of each heat pipe 2 is difficult = the teeth are inserted into the perforation 12 of the heat conducting base 1 ν σ is a push j, a heart tooth The direction of the axis of the tube of the heat-receiving end 2 of the heat pipe 2 is the same as the axis direction of the corresponding perforation 12, and is substantially perpendicular to the heat-dissipating surface. At the same time, the heat transfer paste pores may be applied between the heated end 20 and the perforation 12 of each heat pipe 2 to increase the heat transfer efficiency. - Please refer to the fourth figure, when the heat pipes 2 are placed in the conductive conduction seat. After the upper one, the heat conducting base 丨 can be laterally pressed: the pressing 牯' can make the heat conducting base 丨 one side of the mold with a concave curved surface, and the other side with a plane The mold is pressed by an external force (that is, as shown in the fourth figure); or the outer surface of the heat conducting base 1 is simultaneously pressed by a pair of planar molds (ie, as shown in the seventh figure). For example, the heat-conducting base 1 and the heat-receiving end 20 of each heat pipe 2 can be plastically deformed by the influence of an external force, so that the heated end of each heat pipe 2 and the perforated 12-hole wall corresponding thereto can be pressed. The direction (ie, the flat portion of 7 1378007 formed after pressing) forms a close planar contact (ie as shown in the fifth figure) to combine the heat conducting base with each heat pipe 2. ^ In addition, after the above steps 'It can also be heated like a solder paste to melt it to fill in the heat. 2 in the pore between the heated end 20 and the perforation 12, to improve the heat transfer efficiency. β, after taking, as shown in the sixth figure, due to the heat conduction pedestal through the above extrusion process, the heating surface] It is not possible to maintain the original flatness. Therefore, the heating surface 10 must be subjected to a smoothing process, and at the same time, the end portion 200 of each heat f 2 can also be combined and displayed, and the Wang Qianmian, the pig The end surface 2 of the heat receiving end 20 of each heat pipe 2 is aligned with the heating surface ω of the heat conducting base by mechanical processing such as grinding, so that the end portion 200 of the heat receiving end 2 of each heat pipe 2 can be made. Direct heat, in order to achieve a better heat transfer effect. 精j 'fine by the above-mentioned step flow, the axial heat-heated heat pipe and thermal base of the present invention can be obtained. On the silk, 'the invention can achieve the intended purpose of use, and the solution = because it is very novel and progressive, fully meets the requirements of the invention, and applies for the patent law. Please check and give The patent in this case is 'to protect the rights of the inventor. The above description is only a preferred and feasible embodiment of the present invention, and therefore, it is not the scope of the patent. Therefore, within the scope of the application of the invention and the method of the invention, the combination of (4) h "Finding the father" is the same as in the hair 8 1 / 8007 [Simplified description of the drawings] The figure is a schematic diagram of the decomposition of the heat conduction base and the heat pipe of the present invention. The first figure is a schematic diagram of the combination of the heat conducting base and the heat pipe of the present invention. The third figure is a cross-sectional view taken along line 3-3 of the second figure. The fourth figure is a cross-sectional view of the heat transfer pedestal of the present invention after being pressed. The fifth figure is an enlarged detail of Part A of the fourth figure. Figure 6 is a partial cross-sectional view of the present invention after the pressed heat transfer pedestal is sheltered. The bottom is ground. The seventh figure is a schematic cross-sectional view of the heat conducting base of the present invention. In-line mode [Main component symbol description] <The present invention> Thermal conduction base 1 Heat dissipation surface 11 Lu Heating surface Perforation 12
2 受熱端 冷凝端 20 端部 200 9 212 heated end condensing end 20 end 200 9 21