TW200803706A - Heat conduction module and fabrication method thereof - Google Patents

Heat conduction module and fabrication method thereof Download PDF

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Publication number
TW200803706A
TW200803706A TW95123535A TW95123535A TW200803706A TW 200803706 A TW200803706 A TW 200803706A TW 95123535 A TW95123535 A TW 95123535A TW 95123535 A TW95123535 A TW 95123535A TW 200803706 A TW200803706 A TW 200803706A
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TW
Taiwan
Prior art keywords
heat
module
conducting plate
plate
groove
Prior art date
Application number
TW95123535A
Other languages
Chinese (zh)
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TWI308052B (en
Inventor
Feng-Kuan Li
Original Assignee
Cooler Master Co Ltd
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Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW95123535A priority Critical patent/TW200803706A/en
Priority to DE200610052753 priority patent/DE102006052753A1/en
Priority to JP2007109422A priority patent/JP2008010828A/en
Publication of TW200803706A publication Critical patent/TW200803706A/en
Application granted granted Critical
Publication of TWI308052B publication Critical patent/TWI308052B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a heat conduction module and its fabrication method, which can dissipate heat generated by electronic elements. The heat conduction module includes a heat conduction plate and a plurality of heat pipes, wherein the top of the heat conduction plate has a plurality of concave grooves paralleled with each other. Each concave groove penetrates through the front and rear surfaces of the heat conduction plate respectively, and has an arc surface at lower portion. Blocks are inwardly extended from two sides of the upper positions of the concave grooves. One end of the heat pipes is the heating section, and another end is the heat releasing section. The heating section passes through the concave groove of the heat conduction plate, and comes in touch with the internal walls of the concave grooves and the inside of the blocks. Accordingly, the stability between the heat conduction plate and each heat pipe is ensured to improve heat conduction efficiency of the heat conduction module.

Description

200803706 九、發明說明： 【發明所屬之技術領域】 本發明财關於—種導熱模組及其製造方法，尤指— 種用以提供電子元件導熱的導熱模組及其製造方法。 【先前技術】 、ίι業”在％子元件的導、散熱方面，係利用熱管所 具有高熱傳能力、快速傳熱、高熱傳導率、’、、 簡單及多用途等特性，苴可僂# + θ 、、、°構 1丨土 一」傅遞大f的熱量且不須藉肋帝 力，因此非常適合電子產口的i私“， 猎助电 、 φ电于產口口的導、散熱需求，且以熱管及 導熱板所組合成的導熱模組，其結合的良筹將直接影 導熱模組的熱傳導效能及固持穩定性，故如何增加熱管與 導熱板之間的穩固結合與密貼接觸，已成為業界 = 重要課題。 、習知導熱模組，主要包括一導熱板及複數熱管，其中 導熱板頂面以鑽頭鑽穿有複數凹槽，各凹槽之斷面狐形係 大於二分之-圓弧，且其係用以供熱管之一端穿接，再對 穿設於導熱板之凹槽内的熱管頂面進行壓平加工，以使熱 管之外表面與凹槽内壁貼附接觸。 … 然而，習知導熱模組在實際使用了，仍存在有下述的 問題點，由於該凹槽頂部兩侧係順著圓弧方向所延伸，並 呈一尖角型態，使其對熱管的夾掣力相當的微小，且易因 裝配過程中的碰觸或運作過程中的震動，而令熱管與導熱 板產生鬆脫與分離現象，進而導致熱傳導效能不章《及固持' 5 200803706 穩定性差等諸多問 有鐘於上述習 该行業多年之經驗 良，遂有本發明『 題’而亟待加以改善者。 知所產生之問題，本案發明人遂以從事 :亚本著精益求精之精神，積極研究改 導熱模組及其製造方法』之產生。 【發明内容】 方法，主要目的’在於提供—種導熱模組及其製造 敎管之各凹槽之播塊的設置，可確保導熱板與各 傳導效^ 性及密貼性，進而提昇導熱模組之熱 1制成上述之目的，本發明係提供—種導熱模組及 導以將電子元件所產生的熱量導離，包括一 互數熱管，其中於該導熱板頂面開設有複 凹槽’各凹槽分別貫穿導熱板之前、後端面，且 伸靜梯形卿面，另在凹槽之上方兩側分別向内延 埶^二该寻熱管一端為受熱段另一端為放熱段，該受 貼導熱板之凹槽内，並與凹槽内壁及擋塊内侧 ^達成上述之目的，本發明係提供—種導熱模組製 Xe方法’其步驟包括： a) 以成型刀具在導熱板上加工複數道凹槽，· b) 將熱管之一端穿入導熱板之凹槽内； C) Μ具對穿設於導熱板之凹槽内的熱管頂面壓 掣加工；以及 6 200803706 d)即可完成一導熱模組成品。 【實施方式】 有關本發明之詳細說明及技術内容，配 下，然而所附圖式僅提供參考與說明用° =况明如 明加以限制者。 w _用來對本發 請參照第-、二及三圖所示，係分別為抑明之立卿 ===及組合剖視圖，本發明係提供-種; 熱极組及其製造方法，該導熱模組主要包 = 及複數熱管20，其中： 令¥熱板10 該導熱板10係可為紹、銅等散熱性良好的矩形體，於 〃頂面上開設有複數道相互平行的凹仙 二 別貫穿導熱板H)之前、後端面，且 =11係刀 ⑴，於弧形面m之兩端分別向上延=:=面 另在凹槽11之上方兩側分別向内水平延伸有.「：= 12 ’ :=ΓΓ112之相接處形成有内圓二… 甘 」形 形或其他各種不 门成料狀，其-端為受熱段 ㈣;f於其内部裝填有毛細組織及工作流體，藉以： 二=熱;:機制來達成快速熱傳效果，該受細係 牙投於導熱板〗〇之凹槽η内， ⑺ 側相互貼附接觸。 亚與凹槽]1内壁及擋仙内 此外，本發明之導熱模组更包括 導熱介㈣射為錫膏等材料，其係佈設於熱管^受;亥 7 200803706 1人熱板10之凹槽Η内壁面之間，藉以增加熱管刈與 凹槽11之間密貼效果及避免氣孔的存在，而大幅提昇軌傳 導效能。 · 明芩,日、?、第四至七圖所示，係分別為本發明之製造流程 圖、熱管穿接於導熱板之組合示意目、壓具尚未壓入導熱 板之剖視圖及壓具壓人導熱板之剖視圖，本發明之導熱模 組製造方法，其步驟包括： ’、、 a) 首先’以成型刀具在導熱板10上加工複數道凹槽 11 ;在此步驟中，係可將導熱板10夾固於銑床之工作台 後，再以成型銑刀對導熱板10之頂面銑切出複數道相互平 行的凹槽11。 b) 其次，將熱管20之一端穿入導熱板10之凹槽n内； 在此步驟中，係可先對熱管20進行彎曲加工，而使其呈一 「U」形者，再將熱管20之一端對應於導熱板1〇之凹槽u 穿入。 C)嗣’以壓具5對穿設於導熱板10之凹槽η内的熱管 20頂面進行壓掣加工；在此步驟中，先預製一壓具5，該 壓具5具有複數對應導熱板10之凹槽11位置的凸塊51，將 各凸塊51分別對正於熱管20上，再向下壓掣壓具5移動， 以令各凸塊51對各熱管20進行成形加工，並使各熱管20產 生相應的塑性變形，而與導熱板10之凹槽11内壁及擋塊12 内侧相互貼附接觸。 d)最後，即可完成一導熱模組成品。 此外’本發明之製造步驟更包括一e)步驟，該e)步驟 8 200803706 介於a)步驟盥+ 内涂你一省)义之間，且其係在於導熱板10之凹槽11 驟Γ該;另外’在c)步驟之後更包括一f)步 熱而炫化八係對導熱板10進行加溫，而使導熱介質30受 =所述’當知本發明之導熱模組及其製造方法已具 見於同類產品及八Γ 本發明之構造亦未曾 差I Α開使用，完全符合發明專利申請要件， 犮依專利法提出申請。 干 准以上所述僅為本發明之較佳可行每祐彻„, 式内容所為之舉凡運用本發明說明書及圖 n/、、 、、、D構變化，或直接或間接運用於i它相 關之技術領域，均同 ' /、匕序目 合予陳明 白L3於本發明所涵蓋之範圍内， 【圖式簡單說明】 第一圖 弟二圖 第三圖 第四圖 弟五圖 第六圖 第七®| 係本發明之立體分解圖。 係本發明之組合示意圖。 係本發明之組合剖視圖。 係本發明之製造流程圖。 :系：發明之熱管穿接於導熱板之組合 係本發明之編未屋入導熱板之剖視圖。 係本發明之麗具以導熱板之剖視圖。 主要元件符號說明】 9 200803706 【本發明】 導熱板10 凹槽11 弧形面111 縱向面112 擋塊12 内圓角13 熱管20 受熱段21 放熱段22 導熱介質30 壓具5 凸塊51 步驟流程a〜f 10200803706 IX. Description of the Invention: [Technical Field] The present invention relates to a thermal conduction module and a method of manufacturing the same, and more particularly to a thermal conduction module for providing thermal conductivity of an electronic component and a method of manufacturing the same. [Prior Art], ίι industry" in the conduction and heat dissipation of the % sub-components, the heat pipe has high heat transfer capability, rapid heat transfer, high thermal conductivity, ', simple and multi-purpose characteristics, etc. θ,,, °,1,1,1,1,1,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The combination of the heat-conducting module combined with the heat pipe and the heat-conducting plate will directly affect the heat conduction performance and the holding stability of the heat-conducting module, so how to increase the stable bonding and close-fitting between the heat pipe and the heat conducting plate Contact has become an important issue in the industry. The conventional thermal conduction module mainly includes a heat conducting plate and a plurality of heat pipes. The top surface of the heat conducting plate is drilled with a plurality of grooves by a drill bit, and the cross section of each groove is larger than two points. The arc-shaped arc is used for the one end of the heat pipe to be connected, and then the top surface of the heat pipe penetrating in the groove of the heat conducting plate is flattened so that the outer surface of the heat pipe is in contact with the inner wall of the groove ... However, the conventional thermal module is The use of the same, there are still the following problems, because the top of the groove extends along the direction of the arc, and has a sharp angle, so that the clamping force on the heat pipe is quite small, and It is easy to loosen and separate the heat pipe and the heat conducting plate due to the contact during the assembly process or the vibration during the operation process, which leads to the heat conduction performance being inconsistent and stable. 5 200803706 The stability is poor, etc. The industry has many years of experience, and there are problems in the invention that need to be improved. Knowing the problems, the inventor of this case is engaged in: Yaben is pursuing the spirit of excellence, actively researching and changing the thermal conductivity module and its manufacturing method. [Summary of the Invention] The main purpose of the method is to provide a heat-conducting module and a device for manufacturing the groove of each groove of the manifold, which can ensure the heat-conducting plate and each conductivity and adhesion. Further improving the heat of the heat-conducting module 1 for the above purpose, the present invention provides a heat-conducting module and a guide for guiding the heat generated by the electronic component, including a mutual heat pipe, wherein the heat conduction The top surface of the plate is provided with a double groove. The grooves are respectively penetrated through the front and rear end faces of the heat conducting plate, and the trapezoidal clear surface is extended, and the two sides of the groove are respectively extended inwardly. The other end is an exothermic section, and the above-mentioned purpose is achieved in the groove of the heat-conducting plate and the inner wall of the groove and the inner side of the block. The present invention provides a method for manufacturing the Xe method of the heat-conducting module, the steps of which include: a) The plurality of grooves are machined on the heat conducting plate by the forming tool, and b) one end of the heat pipe is inserted into the groove of the heat conducting plate; C) the cookware is pressed against the top surface of the heat pipe penetrating in the groove of the heat conducting plate And 6 200803706 d) can complete a thermal conduction module product. [Embodiment] The detailed description and technical content of the present invention are provided, but the drawings are only provided for reference and description. w _ used for the present invention, please refer to the first, second and third figures, respectively, which are the stipulations of the singularity === and the combined sectional view, the present invention provides a kind; the thermal pole group and the manufacturing method thereof, the heat conducting mold The main package = and the plurality of heat pipes 20, wherein: the hot plate 10 of the heat plate 10 can be a rectangular body with good heat dissipation such as Shao, copper, etc., and a plurality of mutually parallel concave fairy two on the top surface of the dome Through the front and rear end faces of the heat conducting plate H), and = 11 series knives (1), respectively, the two ends of the curved surface m are upwardly extended =: = the surface is further horizontally extended inwardly on both sides of the groove 11 respectively. = 12 ' : = ΓΓ 112 is formed at the junction of the inner circle two... Gan" shape or other various types of non-door material, the end is the heated section (four); f is filled with capillary structure and working fluid inside, by : 2 = heat;: mechanism to achieve rapid heat transfer effect, the fine teeth are cast into the groove η of the heat conducting plate, and (7) the sides are attached to each other. In addition, the heat-conducting module of the present invention further comprises a heat-conducting medium (four) which is sprayed as a solder paste and the like, and is disposed on the heat pipe; the black 7 200803706 1 person hot plate 10 groove Between the inner wall surfaces of the crucible, the adhesion between the heat pipe 刈 and the groove 11 is increased, and the existence of the vent holes is avoided, and the rail conduction efficiency is greatly improved. · The alum, day, ?, and fourth to seventh figures are respectively the manufacturing flow chart of the present invention, the combination of the heat pipe through the heat conducting plate, the cross-sectional view of the pressure tool not pressed into the heat conducting plate, and the pressure of the press. A cross-sectional view of a human heat conducting plate, the method of manufacturing the heat conducting module of the present invention, the steps comprising: ',, a) first processing a plurality of grooves 11 on the heat conducting plate 10 with a forming tool; in this step, the heat can be transferred After the plate 10 is clamped to the table of the milling machine, a plurality of mutually parallel grooves 11 are milled on the top surface of the heat conducting plate 10 by a forming cutter. b) Next, one end of the heat pipe 20 is inserted into the groove n of the heat conducting plate 10; in this step, the heat pipe 20 may be bent first to make it a "U" shape, and then the heat pipe 20 One end corresponds to the groove u of the heat conducting plate 1 穿 penetrates. C) 嗣 'pressing the top surface of the heat pipe 20 which is inserted into the groove η of the heat conducting plate 10 by the presser 5; in this step, a presser 5 is prefabricated, and the presser 5 has a plurality of corresponding heat conduction The bumps 51 at the position of the groove 11 of the plate 10 respectively align the bumps 51 with respect to the heat pipe 20, and then press the presser 5 downwards to cause the respective bumps 51 to form the heat pipes 20, and The heat pipes 20 are caused to undergo corresponding plastic deformation, and are in contact with the inner wall of the groove 11 of the heat conducting plate 10 and the inner side of the stopper 12. d) Finally, a finished thermal module can be completed. In addition, the manufacturing step of the present invention further includes an e) step, the step 8 of 200803706 is between a) step 盥+ and the inside of the process, and is in the groove 11 of the heat conducting plate 10. In addition, after the step c), a step f) is further included to heat the heat conducting plate 10, and the heat conducting medium 30 is subjected to the heat conduction module of the present invention and the manufacturing thereof. The method has been found in similar products and gossip. The structure of the present invention has not been used in any way, and it fully complies with the requirements of the invention patent application, and is filed according to the patent law. The above description is only a preferred and feasible method of the present invention, and the content of the present invention is applied to the description of the present invention and the configuration of the n/, , D, D, or directly or indirectly applied to i. In the technical field, the same as ' /, 匕 目 予 陈 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白 明白VII®| is a perspective exploded view of the present invention. It is a combined schematic view of the present invention. A cross-sectional view of the combination of the present invention. A manufacturing flow chart of the present invention: a combination of the heat pipe of the invention penetrated by a heat conducting plate. A cross-sectional view of a heat-conducting plate. A cross-sectional view of a heat-conducting plate of the present invention. A description of the main components: 9 200803706 [The present invention] a heat-conducting plate 10 a groove 11 a curved surface 111 a longitudinal surface 112 a block 12 inner circle Angle 13 Heat pipe 20 Heated section 21 Heat release section 22 Heat transfer medium 30 Presser 5 Bump 51 Step flow a~f 10

Claims (1)

200803706 十、申請專利範圍： 1· 一種導熱模組，包括： 一導熱板’於其頂面開設有複數道相互平行 各凹槽係分別貫穿導埶 1 ^ 、牙V,、、、板之刖、後端面，且於其下 有弧形面，另在凹_之卜 ι成 及 长凹钇之上方兩侧分別向内延伸有擋塊；以 為孰s ’錢f—端為受熱段另—端為放熱段，該 二:、' 又’'牙設於導熱板之凹槽内，並與凹槽内壁及擋塊内 側相互貼附接觸。 鈿塊内 2如+請專利範圍第丨項所述之導熱模組 熱板係為鋁材料。 _=申請專利範目第1項所述之導熱模組，其中該導 六、、板係為鋼材料。 申明專利範圍第1項所述之導熱模組，其中該導 熱板之擋塊係呈一「匸」形體。 、 # 5’如申請專·圍第1項所述之導熱模組，其中該凹 曰之:瓜形面：端分別向上延伸有縱向面。 申明專利範圍第5項所述之導熱模組，其中該縱 向面與擋塊之相接處形成有内圓角。 rj ^ 咏少 申明專利範圍第1項所述之導熱模組，其中該熱 官係呈一「Π TT/ ΑΛ- u」形管體。 〜如申請專利範圍第1項所述之導熱模組，其中該熱 官係呈-「L」形管體。 9·如申請專利範圍第1項所述之導熱模組，其更包括 200803706 ==質，其係佈設於熱管之受熱段與導熱板之凹槽 1〇.—種導熱模組製造方法，其步驟包括： a) 以成型刀具在導熱板上加工複數道凹槽； b) 將熱管之一端穿入導熱板之凹槽内； 制/)以壓具對穿設於導熱板之凹槽_熱管頂面進行壓 手加工；以及 d)即可完成一導熱模組成品。 立^^請糊範圍㈣項職之導熱模組製造方法， 相凹對導熱板之頂—複數道 其二i:請:利範圍第丨°項所述之導熱模組製造方法， ' y ’先對熱官進行彎曲加工，而使其呈一「U y再將熱官之一端對應於導熱板之凹槽穿入。 =如申請專利範圍第10項所述之導熱模組製造方法， 對正上先3;，：凸塊的1具，次將各凸塊分別 管進行成形加工堅寧厂堅具移動，以令各凸塊對各熱 苴=如申請專利範圍第10項所述之導熱模組製造方法， 曰、— e)步驟’糾步驟介糾步驟與b)步驟之間， 於導熱板之凹槽内塗佈一導熱介質。 二如申請專利範圍第】。項所述之導熱模組製造方法， 熱板進’其係在C)步驟之後，該f)步驟係對導 '，，、丁加溫，而使導熱介質受熱而熔化。 12200803706 X. Patent application scope: 1. A heat-conducting module comprising: a heat-conducting plate 'opening on its top surface with a plurality of mutually parallel grooves extending through the guide 1 ^, the teeth V, , , and the plate The rear end face has a curved surface underneath, and a stopper is respectively extended inwardly on both sides of the concave _ ι ι and the long concave ; ; ; 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱 钱The end is an exothermic section, and the second:, 'again' teeth are disposed in the grooves of the heat conducting plate, and are in contact with the inner wall of the groove and the inner side of the block. In the block 2, such as +, please refer to the thermal module of the patent range, the hot plate is aluminum. _=The thermal conduction module described in claim 1 of the patent specification, wherein the guide plate and the plate are made of steel. The heat-conducting module of claim 1, wherein the block of the heat-conducting plate has a "匸" shape. The heat conduction module according to the above item 1, wherein the concave shape: the melon-shaped surface: the ends respectively extend upwardly with a longitudinal surface. The heat conduction module according to claim 5, wherein the longitudinal surface and the stopper are formed with a fillet. Rj ^ 咏 导热 申 申 申 申 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热 导热The heat-transfer module of claim 1, wherein the thermal system is an "L"-shaped tubular body. 9. The heat-transducing module according to claim 1, further comprising a 200803706 == quality, which is disposed in the heat-receiving section of the heat pipe and the groove of the heat-conducting plate. The steps include: a) processing a plurality of grooves on the heat conducting plate with the forming tool; b) penetrating one end of the heat pipe into the groove of the heat conducting plate; making /) the groove facing the heat conducting plate with the presser_heat pipe The top surface is subjected to press processing; and d) a finished thermal conductive module is completed.立 ^ 范围 范围 糊 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四First, the heat officer is bent to make a "U y and then one end of the heat officer is corresponding to the groove of the heat conducting plate. = The manufacturing method of the heat conducting module according to claim 10 of the patent application, First, the first 3;,: one of the bumps, and each of the bumps is separately formed into a tube. The Jianning factory moves to make each of the bumps entangled as described in item 10 of the patent application scope. The heat conduction module manufacturing method, 曰, - e) step between the correcting step and the step b), coating a heat conducting medium in the groove of the heat conducting plate. 2. As described in the patent scope. In the method of manufacturing the heat-conducting module, after the step of the hot plate is carried out, the step f) is to heat the conductive material, and the heat-conductive medium is heated and melted.
TW95123535A 2006-06-29 2006-06-29 Heat conduction module and fabrication method thereof TW200803706A (en)

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TW95123535A TW200803706A (en) 2006-06-29 2006-06-29 Heat conduction module and fabrication method thereof
DE200610052753 DE102006052753A1 (en) 2006-06-29 2006-11-08 Heat dissipation module for dissipating heat produced by electronic element, has heat dissipating plate, provided at upper side with multiple parallel grooves, which penetrate through front and rear front surface of heat dissipating plate
JP2007109422A JP2008010828A (en) 2006-06-29 2007-04-18 Heat-conducting module and method for manufacturing the same

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