CN204936365U - High heat radiating metal aluminum-based copper-clad plate - Google Patents
High heat radiating metal aluminum-based copper-clad plate Download PDFInfo
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- CN204936365U CN204936365U CN201520596694.XU CN201520596694U CN204936365U CN 204936365 U CN204936365 U CN 204936365U CN 201520596694 U CN201520596694 U CN 201520596694U CN 204936365 U CN204936365 U CN 204936365U
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Abstract
The utility model height heat radiating metal aluminum-based copper-clad plate relates to technical field of heat dissipation.With " arranging high thermal paste " key technology, its copper foil layer, high heat-conducting medium layer, aluminium base, high heat radiation glue-line are bonding successively.For heat radiation.Technique is simple, effective, cost is low, profit is promoted.
Description
Technical field
The utility model height heat radiating metal aluminum-based copper-clad plate, relates to technical field of heat dissipation.
Background technology
At present, the copper-clad plate of LED metal aluminum based has high heat conduction product, but does not also have high heat radiation product and technology.High-heat-conductionaluminum aluminum base copper clad board is that the medium binder course height heat radiation glued membrane between aluminium base and Copper Foil is made, its effect be by fill be attached to copper-clad surface the heat that sends of LED lamp bead by high heat-conducting medium layer (i.e. the high glued membrane that dispels the heat), heat is transmitted to aluminium base flaggy as early as possible, by aluminium sheet by thermal diffusion in space, reach the object helping LED lamp bead radiating and cooling.And the method for current this aluminium sheet heat radiation, one is heat conducting and radiating, and two is adopt the anodised method of surface of aluminum plate, improves the thermal diffusivity in bright and clean aluminium face.Deficiency, defect and drawback that this existing known technology and present situation exist are: slin emissivity is low, heat radiation is slow; its heat radiation mainly relies on heat transfer; do not make full use of thermal-radiating heat dissipating method, and surface anodization, with a large amount of electric energy; produce a large amount of waste water; production cost is high, not energy-conserving and environment-protective, the not anti-soda acid of oxide layer; cannot protect aluminium base surface, service life is short.Based on the professional knowledge of inventor and abundant working experience and to the excelsior unremitting pursue of cause, in conscientious and fully investigation, understand, analyze, sum up, on the existing known technology of research and present situation basis, creationaryly take " high thermal paste is set " key technology, succeed in developing the utility model.The utility model is at aluminium base coating high heat radiation rete, improves the thermal emissivity of surface of aluminum plate, makes full use of the principle of heat-radiation heat-dissipating faster than heat conducting and radiating, reach quick heat radiating and the effect reducing LED lamp bead temperature.And high thermal dispersant coatings (be namely made up of high thermal paste height heat radiation glue-line) can anti-soda acid; well can protect aluminium base surface; postpone the life-span; the method is free from environmental pollution; production cost is low; but notice that coating can not too thick (be 2-3 μm to coating thickness requirement), otherwise affect radiating effect.The utility model effectively solves deficiency, defect and the drawback that existing known technology and present situation exist, and effectively raises the technical merit of the industry.
Utility model content
Key technology that the utility model is taked " arranging high thermal paste ", provide " high heat radiating metal aluminum-based copper-clad plate preparation method " and " high heat radiating metal aluminum-based copper-clad plate " new product, its copper foil layer of the utility model, high heat-conducting medium layer, aluminium base, high heat radiation glue-line are bonding successively.
The object reached by the utility model is: 1., take " arranging high thermal paste " key technology, provide " high heat radiating metal aluminum-based copper-clad plate preparation method " and " high heat radiating metal aluminum-based copper-clad plate " new product.2., polyimide resin 20-50 weight portion, dicy-curing agent 1-2 weight portion, acetone solvent 30-100 weight portion, nano-carbon powder and carbon ball 10-50 weight portion, Graphene 5-10 weight portion, boron nitride 5-10 weight portion, carborundum 5-10 weight portion, magnesium hydroxide 20-30 weight portion put to mix in a kettle. and be prepared into high thermal paste by the utility model, solves and utilize heat radiation the principles of science to carry out the root problem dispelled the heat.3., the utility model takes full advantage of the principle of heat-radiation heat-dissipating faster than heat conducting and radiating, its good heat dissipation effect.4., high thermal paste of the present utility model can anti-soda acid, well can protect aluminium base surface, postpone the life-span.5., method of the present utility model is free from environmental pollution, and production cost is low.6., the utility model has that cost is low, effective, technical process is simple, convenient to operation, the advantage easily promoted.7., the utility model solves deficiency, defect and the drawback that existing known technology and present situation exist.8., by the utility model, the technical merit of the industry is effectively raised.
For achieving the above object, the technical scheme that the utility model provides is:
A kind of high heat radiating metal aluminum-based copper-clad plate, is made up of copper foil layer, high heat-conducting medium layer, aluminium base, high heat radiation glue-line;
Described high heat radiating metal aluminum-based copper-clad plate, its copper foil layer, high heat-conducting medium layer, aluminium base, high heat radiation glue-line are all connected in bonding mode successively.
Described high heat radiating metal aluminum-based copper-clad plate, described copper foil layer is foil like structure, and described high heat-conducting medium layer, high heat radiation glue-line are film like structures, and described aluminium base is platy structure.
Described high heat radiating metal aluminum-based copper-clad plate, the thickness of described height heat radiation glue-line is 2-3 μm.
Principle of the present utility model is: method of the present utility model is a kind of high thermal paste of configuration, by the coating process such as roller coating, spraying, be coated on metal aluminum sheet surface, increase the thermal emissivity of surface of aluminum plate, utilize heat-radiation heat-dissipating faster than heat conducting radiating rate, quick reduction surface of aluminum plate temperature, the low-temperature safety realizing LED uses, and extends life-span and the brightness of LED.
Below the thermal emissivity abridged table of the different surfaces of metallic copper and aluminium:
| Material | Temperature | Slin emissivity |
| Polishing copper | 50℃ | 0.03 |
| Polished aluminum | 50℃ | 0.04 |
| Cupric oxide | 50℃ | 0.6 |
| Aluminium oxide | 50℃ | 0.2 |
| High thermal dispersant coatings | 50℃ | 0.92 |
Can be drawn by above data: the thermal emissivity of high thermal dispersant coatings is all higher than aluminium oxide, polished aluminum, cupric oxide, polishing copper, so radiating effect is best.
Here be under normal temperature open environment in same time heat-radiation heat-dissipating cooling extent abridged table:
| Object temperature | 40℃ | 80℃ | 120℃ |
| Cooling extent | 7℃ | 25℃ | 42℃ |
From above cooling extent, object temperature is higher, and cooling extent is larger.
The utility model is exactly take full advantage of heat-radiation heat-dissipating cooling extent under the high and object normal temperature open environment of the thermal emissivity of high thermal dispersant coatings, effectively solves deficiency, defect and drawback that existing known technology and present situation exist.
Owing to have employed technical scheme provided by the utility model; Because the utility model takes " arranging high thermal paste " key technology; Described in principle of the present utility model; Because its copper foil layer of the utility model, high heat-conducting medium layer, aluminium base, high heat radiation glue-line are bonding successively.Make the utility model compared with existing known technology and present situation, the beneficial effect of acquisition is:
1, the utility model takes " arranging high thermal paste " key technology, provides " high heat radiating metal aluminum-based copper-clad plate preparation method " and " high heat radiating metal aluminum-based copper-clad plate " new product.
2, polyimide resin 20-50 weight portion, dicy-curing agent 1-2 weight portion, acetone solvent 30-100 weight portion, nano-carbon powder and carbon ball 10-50 weight portion, Graphene 5-10 weight portion, boron nitride 5-10 weight portion, carborundum 5-10 weight portion, magnesium hydroxide 20-30 weight portion are put to mix in a kettle. and are prepared into high thermal paste by the utility model, solve and utilize heat radiation the principles of science to carry out the root problem dispelled the heat.
3, the utility model takes full advantage of the principle of heat-radiation heat-dissipating faster than heat conducting and radiating, its good heat dissipation effect.
4, high thermal paste of the present utility model can anti-soda acid, well can protect aluminium base surface, postpone the life-span.
5, high heat-conducting medium glue described in the utility model (i.e. high heat-conducting medium layer) is existing known technology, make with use all very convenient, the high heat-conducting medium layer stay in grade formed after described high heat-conducting medium adhesive curing, durable in use.
6, method of the present utility model is free from environmental pollution, and production cost is low.
7, the utility model have that cost is low, effective, technical process is simple, convenient to operation, the advantage easily promoted.
8, the utility model solves deficiency, defect and the drawback that existing known technology and present situation exist.
9, by the utility model, the technical merit of the industry is effectively raised.
Accompanying drawing explanation
Figure of description is the generalized section of the utility model detailed description of the invention.
Label in figure: 1, copper foil layer, 2, high heat-conducting medium layer, 3, aluminium base, 4, high heat radiation glue-line.
Detailed description of the invention
Detailed description of the invention one
Below in conjunction with Figure of description, the utility model is described in detail.Shown in Figure of description:
A kind of high heat radiating metal aluminum-based copper-clad plate, is made up of copper foil layer 1, high heat-conducting medium layer 2, aluminium base 3, high heat radiation glue-line 4;
Described high heat radiating metal aluminum-based copper-clad plate, its copper foil layer 1, high heat-conducting medium layer 2, aluminium base 3, high heat radiation glue-line 4 are all connected in bonding mode successively.
Described high heat radiating metal aluminum-based copper-clad plate, described copper foil layer 1 is foil like structure, and described high heat-conducting medium layer 2, high heat radiation glue-line 4 are film like structures, and described aluminium base 3 is platy structure.
Described high heat radiating metal aluminum-based copper-clad plate, the thickness of described height heat radiation glue-line 4 is 2-3 μm.
Detailed description of the invention two
A kind of high heat radiating metal aluminum-based copper-clad plate preparation method:
1., the preparation of high thermal paste: polyimide resin 20-50 weight portion, dicy-curing agent 1-2 weight portion, acetone solvent 30-100 weight portion, nano-carbon powder and carbon ball 10-50 weight portion, Graphene 5-10 weight portion, boron nitride 5-10 weight portion, carborundum 5-10 weight portion, magnesium hydroxide 20-30 weight portion are put and mixes that to be prepared into high thermal paste stand-by in a kettle.;
2., half-finished preparation: bonding copper foil layer 1 after the coated on one side height heat-conducting medium glue of aluminium base 3, is coated with high thermal paste at the another side of aluminium base 3, is made into high heat radiating metal aluminum-based copper-clad plate semi-finished product stand-by;
3., the preparation of finished product: with 150 DEG C, 1 hour is smoked to high heat radiating metal aluminum-based copper-clad plate semi-finished product, just just become high heat radiation glue-line 4 after becoming high heat-conducting medium layer 2, described high thermal paste solidification after described high heat-conducting medium adhesive curing, thus be made into high heat radiating metal aluminum-based copper-clad plate finished product.
Described high heat radiating metal aluminum-based copper-clad plate preparation method, the polyimide resin of described 20-50 weight portion selects the one replaced with in epoxy resin, polyimide resin and epoxy resin each 1/2nd.
Described high heat radiating metal aluminum-based copper-clad plate preparation method, the nano-carbon powder of described 10-50 weight portion and carbon ball are nano-carbon powder and carbon ball each 1/2nd.
Described high heat radiating metal aluminum-based copper-clad plate preparation method, described coating high heat-conducting medium glue, be coated with high thermal paste use machinery be coating roller.
Described high heat radiating metal aluminum-based copper-clad plate preparation method, the thickness of the high thermal paste of described coating is 2-3 μm.
In above-mentioned specific implementation process: described polyimide resin 20,25,30,35,40,45,50 weight portion is implemented; Described dicy-curing agent 1,2 weight portion is implemented; Described acetone solvent 30,35,40,45,50,55,60,65,70,75,80,85,90,95,100 weight portion is implemented; Described nano-carbon powder and carbon ball 10,15,20,25,30,35,40,45,50 weight portion are implemented; Described Graphene 5,6,7,8,9,10 weight portion is implemented; Described boron nitride 5,6,7,8,9,10 weight portion is implemented; Described carborundum 5,6,7,8,9,10 weight portion is implemented; Described magnesium hydroxide 20,22,24,26,28,30 weight portion is implemented; The polyimide resin of described 20-50 weight portion is implemented with epoxy resin, polyimide resin and epoxy resin each 1/2nd respectively; The nano-carbon powder of described 10-50 weight portion and carbon ball are implemented with nano-carbon powder and carbon ball each 1/2nd; The thickness of the high thermal paste of described coating is implemented with 2 μm, 3 μm respectively; All obtain the good result of expection.
Detailed description of the invention three
Implement by detailed description of the invention two, just: described polyimide resin is 20 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 30 weight portions, nano-carbon powder and carbon ball are 10 weight portions, Graphene is 5 weight portions, boron nitride is 5 weight portions, carborundum is 5 weight portions, magnesium hydroxide is 20 weight portions; Have received the good result of expection.
Detailed description of the invention four
Implement by detailed description of the invention two, just: described polyimide resin is 25 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 35 weight portions, nano-carbon powder and carbon ball are 15 weight portions, Graphene is 6 weight portions, boron nitride is 6 weight portions, carborundum is 6 weight portions, magnesium hydroxide is 22 weight portions; Have received the good result of expection.
Detailed description of the invention five
Implement by detailed description of the invention two, just: described polyimide resin is 30 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 40 weight portions, nano-carbon powder and carbon ball are 20 weight portions, Graphene is 7 weight portions, boron nitride is 7 weight portions, carborundum is 7 weight portions, magnesium hydroxide is 24 weight portions; Have received the good result of expection.
Detailed description of the invention six
Implement by detailed description of the invention two, just: described polyimide resin is 35 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 45 weight portions, nano-carbon powder and carbon ball are 25 weight portions, Graphene is 8 weight portions, boron nitride is 8 weight portions, carborundum is 8 weight portions, magnesium hydroxide is 26 weight portions; Have received the good result of expection.
Detailed description of the invention seven
Implement by detailed description of the invention two, just: described polyimide resin is 40 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 50 weight portions, nano-carbon powder and carbon ball are 30 weight portions, Graphene is 9 weight portions, boron nitride is 9 weight portions, carborundum is 9 weight portions, magnesium hydroxide is 28 weight portions; Have received the good result of expection.
Detailed description of the invention eight
Implement by detailed description of the invention two, just: described polyimide resin is 45 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 55 weight portions, nano-carbon powder and carbon ball are 35 weight portions, Graphene is 10 weight portions, boron nitride is 10 weight portions, carborundum is 10 weight portions, magnesium hydroxide is 30 weight portions; Have received the good result of expection.
Detailed description of the invention nine
Implement by detailed description of the invention two, just: described polyimide resin is 50 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 60 weight portions, nano-carbon powder and carbon ball are 40 weight portions, Graphene is 5 weight portions, boron nitride is 5 weight portions, carborundum is 5 weight portions, magnesium hydroxide is 20 weight portions; Have received the good result of expection.
Detailed description of the invention ten
Implement by detailed description of the invention two, just: described polyimide resin is 20 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 65 weight portions, nano-carbon powder and carbon ball are 45 weight portions; Graphene is 5 weight portions, boron nitride is 7 weight portions, carborundum is 6 weight portions, magnesium hydroxide is 22 weight portions; Have received the good result of expection.
Detailed description of the invention 11
Implement by detailed description of the invention two, just: described polyimide resin is 25 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 70 weight portions, nano-carbon powder and carbon ball are 50 weight portions, Graphene is 7 weight portions, boron nitride is 8 weight portions, carborundum is 7 weight portions, magnesium hydroxide is 24 weight portions; Have received the good result of expection.
Detailed description of the invention 12
Implement by detailed description of the invention two, just: described polyimide resin is 30 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 75 weight portions, nano-carbon powder and carbon ball are 10 weight portions, Graphene is 8 weight portions, boron nitride is 8 weight portions, carborundum is 8 weight portions, magnesium hydroxide is 26 weight portions; Have received the good result of expection.
Detailed description of the invention 13
Implement by detailed description of the invention two, just: described polyimide resin is 35 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 80 weight portions, nano-carbon powder and carbon ball are 15 weight portions, Graphene is 9 weight portions, boron nitride is 9 weight portions, carborundum is 9 weight portions, magnesium hydroxide is 28 weight portions; Have received the good result of expection.
Detailed description of the invention 14
Implement by detailed description of the invention two, just: described polyimide resin is 40 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 85 weight portions; Nano-carbon powder and carbon ball are 20 weight portions, Graphene is 10 weight portions, boron nitride is 10 weight portions, carborundum is 10 weight portions, magnesium hydroxide is 30 weight portions; Have received the good result of expection.
Detailed description of the invention 15
Implement by detailed description of the invention two, just: described polyimide resin is 45 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 90 weight portions, nano-carbon powder and carbon ball are 25 weight portions, Graphene is 6 weight portions, boron nitride is 7 weight portions, carborundum is 8 weight portions, magnesium hydroxide is 20 weight portions; Have received the good result of expection.
Detailed description of the invention 16
Implement by detailed description of the invention two, just: described polyimide resin is 50 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 95 weight portions, nano-carbon powder and carbon ball are 30 weight portions, Graphene is 6 weight portions, boron nitride is 9 weight portions, carborundum is 10 weight portions, magnesium hydroxide is 26 weight portions; Have received the good result of expection.
Detailed description of the invention 17
Implement by detailed description of the invention two, just: described polyimide resin is 20 weight portions, dicy-curing agent is 1 weight portion, acetone solvent is 100 weight portions, nano-carbon powder and carbon ball are 35 weight portions, Graphene is 5 weight portions; Boron nitride is 9 weight portions, carborundum is 10 weight portions, magnesium hydroxide is 26 weight portions; Have received the good result of expection.
Detailed description of the invention 18
Implement by detailed description of the invention two, just: described polyimide resin is 35 weight portions, dicy-curing agent is 2 weight portions, acetone solvent is 70 weight portions, nano-carbon powder and carbon ball are 40 weight portions, Graphene is 8 weight portions, boron nitride is 10 weight portions, carborundum is 6 weight portions, magnesium hydroxide is 28 weight portions; Have received the good result of expection.
Detailed description of the invention 19
Detailed description of the invention two, three, four, five, six, seven, eight, nine, ten, 11,12,13,14,15,16,17,18 practice processes is implemented respectively, just: weight portion is changed into and gram to implement; Obtain the good result of expection.
Detailed description of the invention 20
By detailed description of the invention two, three, four, five, six, seven, eight, nine, ten, 11, 12, 13, 14, 15, 16, 17, 18, 19 implement, just: to described polyimide resin, dicy-curing agent, acetone solvent, nano-carbon powder and carbon ball, Graphene, boron nitride, carborundum, the consumption of magnesium hydroxide, respectively to reduce 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, implement for 30 times, also respectively to expand 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, implement for 30 times, all have received the good result of expection.Make the utility model have the solid foundation of small test, laboratory test, expanding test, industrial experimentation, there is the operability of theoretical direction and production application.
These are only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model; All industry technical staff all can smooth and easyly implement; But do not depart from technical solutions of the utility model make modify with develop equivalent variations, be the technical solution of the utility model.
Claims (3)
1. a high heat radiating metal aluminum-based copper-clad plate, is characterized in that: be made up of copper foil layer (1), high heat-conducting medium layer (2), aluminium base (3), high heat radiation glue-line (4);
Described high heat radiating metal aluminum-based copper-clad plate, its copper foil layer (1), high heat-conducting medium layer (2), aluminium base (3), high heat radiation glue-line (4) are all connected in bonding mode successively.
2. high heat radiating metal aluminum-based copper-clad plate according to claim 1, it is characterized in that: described copper foil layer (1) is foil like structure, described high heat-conducting medium layer (2), high heat radiation glue-line (4) are film like structures, and described aluminium base (3) is platy structure.
3. high heat radiating metal aluminum-based copper-clad plate according to claim 1, is characterized in that: the thickness of described height heat radiation glue-line is 2-3 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520596694.XU CN204936365U (en) | 2015-08-11 | 2015-08-11 | High heat radiating metal aluminum-based copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520596694.XU CN204936365U (en) | 2015-08-11 | 2015-08-11 | High heat radiating metal aluminum-based copper-clad plate |
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| CN204936365U true CN204936365U (en) | 2016-01-06 |
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| CN201520596694.XU Expired - Fee Related CN204936365U (en) | 2015-08-11 | 2015-08-11 | High heat radiating metal aluminum-based copper-clad plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
| CN108501475A (en) * | 2018-05-31 | 2018-09-07 | 郭凯华 | The high heat-resisting high proof voltage pliability aluminum-based copper-clad plate production method of high heat conduction |
-
2015
- 2015-08-11 CN CN201520596694.XU patent/CN204936365U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
| CN108501475A (en) * | 2018-05-31 | 2018-09-07 | 郭凯华 | The high heat-resisting high proof voltage pliability aluminum-based copper-clad plate production method of high heat conduction |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160106 Termination date: 20180811 |
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| CF01 | Termination of patent right due to non-payment of annual fee |