CN207651473U - A kind of alternative radiator nanometer heat radiating fin structure - Google Patents
A kind of alternative radiator nanometer heat radiating fin structure Download PDFInfo
- Publication number
- CN207651473U CN207651473U CN201721897479.9U CN201721897479U CN207651473U CN 207651473 U CN207651473 U CN 207651473U CN 201721897479 U CN201721897479 U CN 201721897479U CN 207651473 U CN207651473 U CN 207651473U
- Authority
- CN
- China
- Prior art keywords
- heat
- material layer
- metal material
- nanometer
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007769 metal material Substances 0.000 claims abstract description 24
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- 238000005452 bending Methods 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to chip cooling structure technical field, discloses a kind of alternative radiator nanometer heat radiating fin structure, is provided with the metal material layer of bending, the first heat-conducting glue band is filled between two panels metal material layer；The upper surface of metal material layer described in upper layer is pasted with a nanometer thermal dispersant coatings, and the lower surface of underlying-metallic material layer is pasted with heat absorbing coating, and the bottom surface of heat absorbing coating is pasted with the second heat-conducting glue band.The utility model is very frivolous using material, and thickness is only 0.6mm, connect with chip using adhesive means it is safe reliably, eliminate nut check technique；Structural integrity is molded, and is compared traditional heat sinks, is eliminated much complex technique, and complicated mold need not be designed；It is bent and is designed using metal material, improve heat dissipation effect by increasing even hot area, heat dissipation effect is better than traditional ceramics radiator；Cost reduces 20% or so compared with traditional heat sinks.
Description
Technical field
The utility model belongs to chip cooling structure technical field more particularly to a kind of alternative radiator is radiated with nanometer
Chip architecture.
Background technology
Currently, as television set, apparatus such as computer intelligence degree are higher and higher, chip power also accordingly increases, and leads
It causes fever serious, the material with high efficient heat dissipation performance need to be used to radiate；Current chip leads to common heat sink and radiates.
Radiator mainly has two major classes：One kind is metal heat sink；Another kind of is ceramic heat sink.Metal heat sink heat dissipation effect compared with
Good, poor corrosion resistance, service life is shorter, though its corrosion resistance can be improved by the way of anodic oxidation.But anodic oxidation
Complex process, and cost is higher；Though ceramic heat sink high temperature resistant, anticorrosion effect are preferable, ceramic heat sink heat dissipation effect compared with
Difference, and ceramic heat sink is more crisp and heavier, punching can not be used to use nut lock on chip it, is connected with from core by adhesive tape
The risk that on piece is fallen down.
In conclusion problem of the existing technology is：Existing metal heat sink poor corrosion resistance, service life compared with
It is short；The mode complex process of anodic oxidation, and cost is higher；Ceramic heat sink heat dissipation effect is poor, and ceramic heat sink is more crisp
And it is heavier, punching can not be used to use nut lock on chip it, the risk fallen down from chip is connected with by adhesive tape.
Invention content
In view of the problems of the existing technology, the utility model provides a kind of alternative radiator nanometer cooling fin knot
Structure.
The utility model is realized in this way a kind of alternative radiator nanometer heat radiating fin structure, is provided with bending
Metal material layer is filled with the first heat-conducting glue band between two panels metal material layer；
The upper surface of metal material layer described in upper layer is pasted with a nanometer thermal dispersant coatings, and the lower surface of underlying-metallic material layer is viscous
Heat absorbing coating is posted, the bottom surface of the heat absorbing coating is pasted with the second heat-conducting glue band.
Further, the metal material layer uses layers of copper or aluminium layer.
The advantages of the utility model and good effect are：
1) the alternative radiator is very frivolous using material with nanometer heat radiating fin structure, and thickness is only 0.6mm, using glue
Viscous mode connect with chip it is safe reliably, eliminate nut check technique；
2) the alternative radiator is integrally formed with nanometer heat radiating fin structure, is compared traditional heat sinks, is eliminated more multiple
General labourer's skill need not design complicated mold；
3) the alternative radiator passes through the even hot area of increase with nanometer heat radiating fin structure using metal material bending design
Heat dissipation effect is improved, heat dissipation effect is better than traditional ceramics radiator；
4) the alternative radiator reduces 20% or so with nanometer heat radiating fin structure cost compared with traditional heat sinks.
Description of the drawings
Fig. 1 is the alternative radiator nanometer heat sink structure illustration that the utility model embodiment provides；
In figure：1, nanometer thermal dispersant coatings；2, metal material layer；3, the first heat-conducting glue band；4, heat absorbing coating；5, the second heat conduction
Adhesive tape.
Specific implementation mode
For that can further appreciate that the invention, features and effects of the utility model, the following examples are hereby given, and coordinates
Detailed description are as follows for attached drawing.
The structure of the utility model is explained in detail below in conjunction with the accompanying drawings.
Fig. 1, the alternative radiator nanometer heat radiating fin structure that the utility model embodiment provides, is provided with the gold of bending
Belong to material layer 2, the first heat-conducting glue band 3 is filled between two panels metal material layer 2；
The upper surface of metal material layer 2 described in upper layer is pasted with nanometer thermal dispersant coatings 1, the following table of underlying-metallic material layer 2
Face is pasted with heat absorbing coating 4, and the bottom surface of the heat absorbing coating 4 is pasted with the second heat-conducting glue band 5.
As the preferred embodiment of the utility model, the metal material layer 2 uses layers of copper or aluminium layer.
The operation principle of the utility model：
Nanometer thermal dispersant coatings 1 use high radiation coefficient coating, are used for heat loss through radiation；Heat absorbing coating 4 can quickly be transmitted hot
Onto metal material.The alternative radiator nanometer heat radiating fin structure heat on chip can be passed through high thermal conductivity coefficient
One heat-conducting glue band 3 and the second heat-conducting glue band 5 are transmitted on heat absorbing coating 4, and heat absorbing coating 4 quickly transfers heat to metal material layer
On 2.Metal material layer 2 is by the high thermal conductivity coefficient of itself, and continuous bending structure increasing heat radiation area, by heat maximum
Limit is spread, then by the nanometer thermal dispersant coatings 1 with high radiation coefficient by heat be scattered to television set or computer chip with it is close
In gap between sealing, effectively radiate by cross-ventilation.
The above is only the preferred embodiment to the utility model, is not made in any form to the utility model
Limitation, it is every according to the technical essence of the utility model any simple modification made to the above embodiment, equivalent variations with
Modification, is all within the scope of the technical scheme of the utility model.
Claims (2)
1. a kind of alternative radiator nanometer heat radiating fin structure, which is characterized in that the alternative radiator is radiated with nanometer
Chip architecture is provided with the metal material layer of bending, and the first heat-conducting glue band is filled between two panels metal material layer；
The upper surface of metal material layer described in upper layer is pasted with a nanometer thermal dispersant coatings, and the lower surface of underlying-metallic material layer is pasted with
The bottom surface of heat absorbing coating, the heat absorbing coating is pasted with the second heat-conducting glue band.
2. alternative radiator nanometer heat radiating fin structure as described in claim 1, which is characterized in that the metal material layer is adopted
With layers of copper or aluminium layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897479.9U CN207651473U (en) | 2017-12-29 | 2017-12-29 | A kind of alternative radiator nanometer heat radiating fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721897479.9U CN207651473U (en) | 2017-12-29 | 2017-12-29 | A kind of alternative radiator nanometer heat radiating fin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207651473U true CN207651473U (en) | 2018-07-24 |
Family
ID=62875804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721897479.9U Active CN207651473U (en) | 2017-12-29 | 2017-12-29 | A kind of alternative radiator nanometer heat radiating fin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207651473U (en) |
-
2017
- 2017-12-29 CN CN201721897479.9U patent/CN207651473U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203353019U (en) | Graphene metal cooling fin and electronic product cooling structure | |
| CN205082059U (en) | heat dissipation circuit board | |
| CN205920959U (en) | Temperature of air conditioner controller chip is reduced radiator and air conditioner | |
| CN103206805A (en) | Semiconductor refrigerating device | |
| KR20180084095A (en) | Manufacturing method of heat radiator, electronic device, lighting device and radiator | |
| CN202406450U (en) | Radiator with uniform temperature plate | |
| TWI603441B (en) | Power module and manufacturing method thereof | |
| CN207651473U (en) | A kind of alternative radiator nanometer heat radiating fin structure | |
| CN207435368U (en) | The interior heat-conducting pad equipped with rugosity graphite flake | |
| CN207180103U (en) | A kind of graphene condenser fins | |
| CN206196216U (en) | Heat radiator for compound thermal pad piece and communication equipment | |
| CN204005868U (en) | LED radiator | |
| CN209710564U (en) | A kind of new radiator | |
| CN205609502U (en) | Copper aluminium composite substrate with fin structure | |
| CN103648253A (en) | Novel thermally conductive and insulating structure | |
| CN208589434U (en) | A kind of flexible membrane radiator | |
| CN209119076U (en) | A kind of novel chip package module | |
| CN203642131U (en) | LED heat sink with high-heat dissipation performance and LED lamp provided with LED heat sink | |
| CN207639070U (en) | A kind of cooling fast aluminum alloy radiator casing | |
| CN206620350U (en) | A kind of wiring board for being easy to radiate | |
| CN209794770U (en) | Low-melting-point alloy composite heat conduction material | |
| CN206493657U (en) | Nanometer fin | |
| CN204707389U (en) | A kind of flexible heat sink fin | |
| CN109195320A (en) | Semiconductor optimization heat-conducting method and structure based on graphene | |
| CN202463051U (en) | Heat dissipation type composite aluminum sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Building 3-301, 302, Zone 9, Industrial Fang-A, Science and Technology City, No. 189 Kunlun Mountain Road, High tech Zone, Suzhou City, Jiangsu Province, 215000 Patentee after: Suzhou Huanming New Material Technology Co.,Ltd. Address before: Building 9, No. 189 Kunlun Mountain Road, High tech Zone, Suzhou City, Jiangsu Province, 215163 Patentee before: SUZHOU ENBRIGHTECH Co.,Ltd. |