CN206196216U - Heat radiator for compound thermal pad piece and communication equipment - Google Patents
Heat radiator for compound thermal pad piece and communication equipment Download PDFInfo
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- CN206196216U CN206196216U CN201621043556.XU CN201621043556U CN206196216U CN 206196216 U CN206196216 U CN 206196216U CN 201621043556 U CN201621043556 U CN 201621043556U CN 206196216 U CN206196216 U CN 206196216U
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- heat
- conducting pad
- sheet metal
- compound
- chip
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat radiator for compound thermal pad piece and communication equipment, communication equipment's heat abstractor includes: dispel the heat quick -witted case, chip and compound thermal pad piece, wherein, compound thermal pad piece is located dispel the heat quick -witted case with between the chip, compound thermal pad piece includes that thermal pad piece body reduces with being used for the foil of the thermal resistance of thermal pad piece body, foil inlay in inside the thermal pad piece body, and with surface parallel on the thermal pad piece body. The embodiment of the utility model provides a through at the inside embedded metal thin slice of thermal pad piece body, the thermal resistance of compound thermal pad piece has been reduced to accelerate the radiating rate of compound thermal pad piece, improved little encapsulation chip's radiating efficiency.
Description
Technical field
The utility model is related to technical field of heat dissipation, and more particularly to a kind of compound heat-conducting pad and communication equipment dissipate
Thermal.
Background technology
With continuing to develop for the communication technology, communication equipment is gradually sent out toward miniaturization, high integration and powerful trend
Exhibition, the heat dissipation problem of the chip of heat consumption high can not despise in communication equipment.In the prior art, by chip and cooling cabinet it
Between, heat-conducting pad is encased inside, the heat of chip is conducted to cooling cabinet, to accelerate the radiating of chip.
But for the small chip of some encapsulation, because chip heating area is small, correspondence heat-conducting pad area of dissipation is small, heat conduction
Pad can not be rapidly conducted to cooling cabinet heat, cause to pad heat concentration, surpassed so as to directly result in chip temperature
Its rated temperature is crossed, chip failure even burns.
The content of the invention
The utility model embodiment technical problem to be solved is：The low problem of the radiating efficiency of small package chip.
In order to solve the above problems, the utility model discloses a kind of heat abstractor of communication equipment, including：Radiating machine
Case, chip and compound heat-conducting pad, wherein,
The compound heat-conducting pad is located between the cooling cabinet and the chip；The compound heat-conducting pad bag
Heat-conducting pad body and the sheet metal for reducing the thermal resistance of the heat-conducting pad body are included, the sheet metal is embedded in described
Heat-conducting pad body interior, and it is parallel with the heat-conducting pad body upper surface.
Preferably, the sheet metal is near chip, the area of the area more than chip of the sheet metal.
Preferably, the sheet metal and the distance of chip are 0.2~0.5 millimeter.
Preferably, the thickness of the sheet metal is 0.5~1.5 millimeter.
In order to solve the above problems, the invention also discloses a kind of compound heat-conducting pad, above-mentioned communication is applied to
In the heat abstractor of equipment, the compound heat-conducting pad includes：Heat-conducting pad body and for reducing the heat-conducting pad sheet
The sheet metal of the thermal resistance of body, wherein, the sheet metal is embedded in the heat-conducting pad body interior, and with the heat-conducting pad
Body upper surface is parallel.
Preferably, the sheet metal is near heat source side.
Preferably, the sheet metal and the distance of heat source side are 0.2~0.5 millimeter.
Preferably, the thickness of the sheet metal is 0.5~1.5 millimeter.
Preferably, the compound heat-conducting pad, is led by pouring into liquid in the frock of the sheet metal is fixed with
Hot glue body, then liquid heat conductive colloid described in the frock is baked to solid-state is formed, wherein, the heat-conducting pad body passes through
Liquid heat conductive colloid is baked into solid-state to be formed.
Preferably, area of the area of the sheet metal more than thermal source.
Compared with prior art, the utility model embodiment includes advantages below：
The heat abstractor of the communication equipment of the utility model embodiment, including：Cooling cabinet, chip and compound heat conductive pad
Piece, wherein, the compound heat-conducting pad is located between the cooling cabinet and the chip；The compound heat-conducting pad bag
Heat-conducting pad body and the sheet metal for reducing the thermal resistance of the heat-conducting pad body are included, the sheet metal is embedded in described
Heat-conducting pad body interior, and it is parallel with the heat-conducting pad body upper surface.Because the thermal conductivity factor of metal is more than heat conductive pad
The thermal conductivity factor of piece body, and thermal resistance is inversely proportional with thermal conductivity factor, therefore, it is embedded in metal foil by heat-conducting pad body interior
Piece, reduces the thermal resistance of compound heat-conducting pad, so as to accelerate the radiating rate of compound heat-conducting pad, improves small package
The radiating efficiency of chip.
Brief description of the drawings
Fig. 1 shows a kind of structural representation of compound heat-conducting pad of the present utility model；
Fig. 2 shows a kind of structural representation of the heat abstractor of communication equipment of the present utility model；
Fig. 3 shows a kind of structural representation of the heat abstractor of communication equipment of the present utility model.
Specific embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings and tool
Body implementation method is described in further detail to the utility model.
The heat abstractor of the communication equipment of the utility model embodiment, including：Cooling cabinet, chip and compound heat conductive pad
Piece, wherein, the compound heat-conducting pad is located between the cooling cabinet and the chip；The compound heat-conducting pad bag
Heat-conducting pad body and the sheet metal for reducing the thermal resistance of the heat-conducting pad body are included, the sheet metal is embedded in described
Heat-conducting pad body interior, and it is parallel with the heat-conducting pad body upper surface.Because the thermal conductivity factor of metal is more than heat conductive pad
The thermal conductivity factor of piece body, and thermal resistance is inversely proportional with thermal conductivity factor, therefore, metal is embedded in by the body interior in heat-conducting pad
Thin slice, reduces the thermal resistance of heat-conducting pad body, so as to accelerate the radiating rate of heat-conducting pad, improves small package chip
Radiating efficiency.
The compound heat-conducting pad of the utility model offer is provided below by specific embodiment, and comprising described
The heat abstractor of the communication equipment of compound heat-conducting pad.
General heat-conducting pad includes solid-state heat conduction colloid and heat conduction particle, and the thermal conductivity factor of heat-conducting pad is general 0.6
Between~6.1W/mk, and the thermal conductivity factor of metal, in more than 15W/mk, such as common metal stainless steel is led in zero degrees celsius
Hot coefficient is 16.3W/mk, and in zero degrees celsius, thermal conductivity factor is 227W/mk to aluminium；It can be seen that, the thermal conductivity factor of metal is much larger than to be led
The thermal conductivity factor of heat pad piece.Thermal resistance is the comprehensive parameter of the ability that reflection prevents heat transfer, and thermal resistance is bigger, thermal energy transmission
Resistance is bigger；Thermal resistance is inversely proportional with the thermal conductivity factor and cross section product of material, the length with the transmission heat path of material
It is directly proportional, therefore, in the cross-sectional area and constant transmission channel length of material, thermal conductivity factor is bigger, and corresponding thermal resistance is smaller,
So as to the speed for conducting heat is faster.
Reference picture 1, shows a kind of structural representation of compound heat-conducting pad of the present utility model, described compound to lead
Heat pad piece includes heat-conducting pad body 11 and sheet metal 12, and the sheet metal 12 is embedded in heat-conducting pad body 11, and gold
Category thin slice 12 is parallel with the upper surface of heat-conducting pad body 11.The utility model embodiment utilizes sheet metal, instead of identical faces
The heat-conducting pad body of product and same thickness, reduces the thermal resistance of compound heat-conducting pad, increases the biography of compound heat-conducting pad
Lead speed.
Reference picture 2, shows a kind of structural representation of the heat abstractor of communication equipment of the present utility model, including：Dissipate
Heat engine case 21, compound heat-conducting pad 22 and chip 23；Wherein, compound heat-conducting pad 22 includes：The He of heat-conducting pad body 11
Sheet metal 12, the sheet metal 12 of stating is embedded in heat-conducting pad body 11, and sheet metal 12 and heat-conducting pad body 11
Upper surface it is parallel, compared to the heat-conducting pad of prior art, the conduction velocity of compound heat-conducting pad of the present utility model is more
Height, is radiated using the compound heat-conducting pad to small package chip, can improve the radiating efficiency of small package chip.Its
In, the compound heat-conducting pad shown in compound heat-conducting pad 22, with Fig. 1 in Fig. 2 is compound same compound heat conduction
Pad.
In a kind of preferred embodiment of the present utility model, the sheet metal 12 is close to chip 23, wherein, chip is to produce
The thermal source of heat amount；Due to the heat that the chip of small package is produced, accumulated on the surface of the heat-conducting pad body fitted with chip,
Therefore, it can be embedded in sheet metal near chip, the conduction of the heat of surface accumulation can be accelerated.Preferably, the metal
Thin slice 12 is 0.2~0.5 millimeter with the distance of chip 23.
Reference picture 3, shows a kind of structural representation of the heat abstractor of communication equipment of the present utility model, including：Dissipate
Heat engine case 31, compound heat-conducting pad 32 and chip 33, wherein, compound heat-conducting pad 32 includes heat-conducting pad body 11 and gold
Category thin slice 12；In a kind of preferred embodiment of the present utility model, the area of the area more than chip 33 of the sheet metal 12.
Because thermal resistance is inversely proportional with the area of material, therefore, increase the area of sheet metal 12, compound heat-conducting pad can be reduced
Thermal resistance, increases the conduction velocity of compound heat-conducting pad.Further, it is also possible to increase heat cross conduction ability, increase radiating surface
Product, specific heat conductive process as shown in figure 3, due to metal thermal resistance less than heat-conducting pad body thermal resistance, therefore, work as heat conduction
Shim body 11 gives off heat chip 33, conduct to sheet metal 12 when, sheet metal 12 except by heat longitudinally conduction in addition to,
Heat is also rapidly performed by cross conduction, therefore, the area of dissipation of heat-conducting pad body 11 and the contact of cooling cabinet 11, etc.
In the area with sheet metal 12；And in the prior art, area of dissipation when heat-conducting pad radiates to chip, equal to chip
Surface area；Area due to chip area less than sheet metal, therefore, the utility model embodiment further increases small envelope
The radiating efficiency of cartridge chip.
In a kind of preferred embodiment of the present utility model, the compound heat-conducting pad 32, by be fixed with it is described
Liquid heat conductive colloid is poured into the frock of sheet metal 12, then liquid heat conductive colloid described in the frock is baked to solid-state shape
Into, wherein, the heat-conducting pad body is formed by the way that liquid heat conductive colloid is baked into solid-state.Wherein, described frock is
The mould of compound heat-conducting pad is made, frock makes according to the requirement of compound heat-conducting pad, different compound heat-conducting pads
The different frock of correspondence, the fixed position of sheet metal 12 can be with identical in different frocks, it is also possible to different.
In a kind of preferred embodiment of the present utility model, the thickness of sheet metal 12 is 0.5~1.5 millimeter.
Wherein, the cooling cabinet and chip in Fig. 2 and Fig. 3 are schematic diagram, do not indicate that the size of size, are not limited here
The shape and size of cooling cabinet and chip, the compound heat-conducting pad in Fig. 3 is same with the compound heat-conducting pad in Fig. 1
A kind of heat-conducting pad.
A kind of compound heat-conducting pad and the heat abstractor of communication equipment for being provided the utility model embodiment above,
It is described in detail, specific case used herein is set forth to principle of the present utility model and implementation method, with
The explanation of upper embodiment is only intended to help and understands method of the present utility model and its core concept；Simultaneously for this area
Those skilled in the art, according to thought of the present utility model, will change in specific embodiments and applications, comprehensive
Upper described, this specification content should not be construed as to limitation of the present utility model.
Claims (10)
1. a kind of compound heat-conducting pad, it is characterised in that including heat-conducting pad body and for reducing the heat-conducting pad sheet
The sheet metal of the thermal resistance of body, the sheet metal is embedded in the heat-conducting pad body interior, and with the heat-conducting pad body
Upper surface is parallel.
2. compound heat-conducting pad according to claim 1, it is characterised in that the sheet metal is near heat source side.
3. compound heat-conducting pad according to claim 2, it is characterised in that the distance of the sheet metal and heat source side
It is 0.2~0.5 millimeter.
4. compound heat-conducting pad according to claim 1, it is characterised in that the thickness of the sheet metal is 0.5~
1.5 millimeters.
5. compound heat-conducting pad according to claim 1, it is characterised in that the compound heat-conducting pad, by
It is fixed with the frock of the sheet metal and pours into liquid heat conductive colloid, then liquid heat conductive colloid described in the frock is toasted
Formed to solid-state, wherein, the heat-conducting pad body is formed by the way that liquid heat conductive colloid is baked into solid-state.
6. compound heat-conducting pad according to claim 1, it is characterised in that the area of the sheet metal is more than thermal source
Area.
7. a kind of heat abstractor of communication equipment, it is characterised in that including：Cooling cabinet, chip and compound heat-conducting pad, its
In, compound heat-conducting pad is located between the cooling cabinet and the chip；The compound heat-conducting pad includes heat conductive pad
Piece body and the sheet metal for reducing the thermal resistance of the heat-conducting pad body, the sheet metal are embedded in the heat-conducting pad
Body interior, and it is parallel with the heat-conducting pad body upper surface.
8. the heat abstractor of communication equipment according to claim 7, it is characterised in that the sheet metal near chip,
Area of the area of the sheet metal more than chip.
9. the heat abstractor of communication equipment according to claim 8, it is characterised in that the sheet metal and chip away from
From being 0.2~0.5 millimeter.
10. the heat abstractor of communication equipment according to claim 7, it is characterised in that the thickness of the sheet metal is
0.5~1.5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621043556.XU CN206196216U (en) | 2016-09-07 | 2016-09-07 | Heat radiator for compound thermal pad piece and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621043556.XU CN206196216U (en) | 2016-09-07 | 2016-09-07 | Heat radiator for compound thermal pad piece and communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206196216U true CN206196216U (en) | 2017-05-24 |
Family
ID=58729260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621043556.XU Active CN206196216U (en) | 2016-09-07 | 2016-09-07 | Heat radiator for compound thermal pad piece and communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206196216U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107167020A (en) * | 2017-06-05 | 2017-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated radiating piece, manufacture mould and its manufacture method |
| CN109060495A (en) * | 2018-09-11 | 2018-12-21 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
-
2016
- 2016-09-07 CN CN201621043556.XU patent/CN206196216U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107167020A (en) * | 2017-06-05 | 2017-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated radiating piece, manufacture mould and its manufacture method |
| CN107167020B (en) * | 2017-06-05 | 2023-08-11 | 深圳市鸿富诚新材料股份有限公司 | Manufacturing die and manufacturing method of integrated radiating fin |
| CN109060495A (en) * | 2018-09-11 | 2018-12-21 | 四川省机械研究设计院 | The device of adjustable thermal resistance |
| CN109060495B (en) * | 2018-09-11 | 2024-03-15 | 四川省机械研究设计院(集团)有限公司 | Device capable of adjusting thermal resistance |
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