CN107167020B

CN107167020B - Manufacturing die and manufacturing method of integrated radiating fin

Info

Publication number: CN107167020B
Application number: CN201710414378.XA
Authority: CN
Inventors: 谢佑南
Original assignee: Shenzhen Hongfucheng New Material Co ltd
Current assignee: Shenzhen Hongfucheng New Material Co ltd
Priority date: 2017-06-05
Filing date: 2017-06-05
Publication date: 2023-08-11
Anticipated expiration: 2037-06-05
Also published as: WO2018223937A1; CN107167020A

Abstract

The invention discloses an integrated radiating fin, a manufacturing die and a manufacturing method thereof, wherein the integrated radiating fin comprises: the heat dissipation plate comprises a heat dissipation plate body provided with heat dissipation fins and a heat dissipation substrate, wherein a soft heat conduction pad is integrally formed on the bottom plane of the heat dissipation substrate in a thermosetting mode. Because the invention adopts the structure that the soft heat conduction pad and the radiating fin body are integrally formed, the working procedure of manual lamination is omitted, the production efficiency can be greatly improved, the soft heat conduction pad and the radiating fin body are combined more tightly, the heat conduction pad is not easy to separate from the radiating fin body, the heat transmission path is gapless, the thermal resistance is reduced, and the radiating efficiency is improved.

Description

Manufacturing die and manufacturing method of integrated radiating fin

Technical Field

The invention relates to the technical field of heat dissipation products, in particular to a manufacturing die and a manufacturing method of an integrated radiating fin.

Background

When the conventional radiating fin is used, in order to be in close contact with a heat source to achieve the effect of high heat conduction efficiency, a soft heat conduction pad is arranged between the bottom of a radiating substrate of the radiating fin and a heat source device, and the soft heat conduction pad is generally added by attaching the cut soft heat conduction pad to the bottom of the radiating substrate of the radiating fin in a manual mode and then sealing the radiating substrate by a protective film so as not to damage the soft heat conduction pad in storage and transportation. In fact, the manual application of soft thermal pads presents the following problems: the laminating degree is not firm enough, and production efficiency is lower, and artifical laminating makes soft heat conduction pad and fin's radiating substrate bottom surface have the contact gap, and though the gap is tiny, can not observe by the naked eye, can influence heat transfer to a certain extent, because this transmission path exists "fracture", thermal resistance increases.

Disclosure of Invention

The invention provides an integrated radiating fin, a manufacturing die and a manufacturing method thereof, which are used for solving the problems.

The embodiment of the invention provides an integrated radiating fin, which comprises: the heat dissipation plate comprises a heat dissipation plate body provided with heat dissipation fins and a heat dissipation substrate, wherein a soft heat conduction pad is integrally formed on the bottom plane of the heat dissipation substrate in a thermosetting mode.

Preferably, the soft heat-conducting pad adopts heat-conducting silica gel, heat-conducting silicone grease or heat-conducting gel.

Preferably, the heat dissipation substrate is made of heat-conductive resin or heat-resistant plastic.

The invention also provides a manufacturing die of the integrated radiating fin, which comprises a die with a containing groove, wherein a separation plate is arranged in the containing groove and separates the containing groove into a plurality of separation grooves which are vertically and horizontally arranged and are used for containing soft heat conducting pad raw materials in a fluid state and are matched with the outline of a radiating substrate of the integrated radiating fin.

Preferably, the top opening of the separation groove is provided with a step groove with caliber larger than that of the separation groove and used for accommodating and fixing the heat dissipation substrate.

Preferably, the height of the stepped groove or the inclined groove is smaller than the thickness of the heat dissipation substrate.

The invention also provides a manufacturing method of the integrated radiating fin, which comprises the following steps:

pouring a raw material in a fluid state for forming the soft heat conducting pad into the mold groove;

scraping and coating the raw materials in the fluid state of the soft heat conducting pad into a fluid soft pad with a set thickness;

placing the formed radiating fin body on a fluid cushion to enable the bottom surface of a radiating substrate of the radiating fin body to be attached to the fluid cushion;

the heating mould groove enables the fluid cushion to form a soft heat conduction pad and be integrally formed and solidified at the bottom of the heat dissipation substrate of the heat dissipation fin body.

According to the technical scheme, the soft heat conducting pad and the radiating fin body are integrally formed, so that the manual bonding process is omitted, the production efficiency can be greatly improved, the soft heat conducting pad and the radiating fin body are combined more tightly, the heat conducting pad is not easy to separate from the radiating fin body, a heat transmission path is free of gaps, the thermal resistance is reduced, and the radiating efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a front view of a heat sink according to an embodiment of the present invention;

FIG. 2 is a schematic top view of a manufacturing mold according to an embodiment of the present invention;

FIG. 3 is a schematic side cross-sectional view of a single separator tank with a stepped tank in an embodiment of the present invention;

FIG. 4 is a schematic side cross-sectional view of a single separator tank with a beveled tank according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Examples:

an embodiment of the present invention provides an integrated heat sink, as shown in fig. 1, including: the heat sink body 1 is provided with heat dissipation fins 11 and a heat dissipation substrate 12, and a soft heat conduction pad 2 is integrally solidified on the bottom plane of the heat dissipation substrate 12 in a thermosetting mode.

In this embodiment, the soft thermal pad is made of thermal conductive silica gel, but in other embodiments, thermal conductive silicone grease or thermal conductive gel may be used.

In order to make the combination of the soft heat conduction pad and the radiating fin body more stable, the radiating substrate can adopt heat conduction resin or heat-resistant plastic.

The soft heat conducting pad is integrally formed and solidified in a thermosetting mode after the cooling fin product is finished, so that the soft heat conducting pad is integrally formed after the cooling fin product is finished, and the cooling fin product is directly installed and used on the heat source device in the later period.

In the manufacturing process, firstly, pouring raw materials for forming a fluid state of the soft heat conduction pad into a mold groove, namely pouring heat conduction silica gel which is in a fluid state at normal temperature. The depth of the heat-conducting silica gel poured into the mold groove is determined according to the thickness of the needed soft heat-conducting pad.

In order to ensure that the combination of the formed radiating fin and the soft heat conduction pad is tighter, the raw material in the fluid state of the soft heat conduction pad (namely, heat conduction silica gel) needs to be scraped into a fluid cushion (namely, a fluid silica gel pad) with a set thickness in a die groove, and at the moment, the upper surface of the fluid cushion can be smoother.

Then, put the fin body of shaping on the fluid cushion and make the heat dissipation base plate bottom surface laminating of fin body this fluid cushion, mould groove can hold a plurality of fin bodies in this embodiment, therefore the fin body is the regular range on the fluid cushion of mould inslot, realizes mass production.

After placing the radiating fin body, putting the die into heating equipment for heating, heating the die groove to enable the fluid cushion to form a soft heat conduction pad and integrally solidifying at the bottom of the radiating substrate of the radiating fin body, at the moment, the radiating fin body in the die is solidified with the soft heat conduction pad in the die groove, taking out the whole soft heat conduction pad and the radiating fin body on the whole soft heat conduction pad from the die groove, and then cutting off the redundant soft heat conduction pad along the periphery of the radiating fin, thereby forming a complete and neat radiating fin finished product, and for the step of cutting off the redundant soft heat conduction pad, entering through uniform product size and cutting off the radiating fin through automatic equipment. After the heat sink product is completed, a protective film may optionally be attached to the bottom of the heat sink product.

For the production of the finished product of the heat sink in this embodiment, this embodiment also provides a mold for producing an integral heat sink, as shown in fig. 2 and 3, including a mold 3 having a receiving groove, in which a partition plate 31 is disposed, the partition plate 31 partitions the receiving groove into a plurality of partition grooves 32 arranged vertically and horizontally for containing soft heat conducting pad materials in a fluid state and matching with the heat dissipation substrate profile of the integral heat sink. In the embodiment, the mold can be integrally formed in a casting, stamping and other modes, is easy to process and produce, and can be used for curing a large number of radiating fins in a large batch in one mold, so that the production efficiency is high, and the labor cost is saved.

As shown in fig. 3, in this embodiment, the top opening of the separation groove 32 is provided with a step groove 33 with a caliber greater than that of the separation groove and used for accommodating and fixing the heat dissipation substrate, and the inner wall of the separation groove forms a step protruding outwards from bottom to top at the opening, so that the step groove is called as a step groove, therefore, it can be understood that the caliber of the separation groove is slightly smaller than the outline width of the heat dissipation substrate of the heat dissipation fin, the heat dissipation substrate of the heat dissipation fin can be accommodated and fixed in the step groove, the heat dissipation substrate just cannot sink into the separation groove, so that fluid in the separation groove is prevented from overflowing, raw material waste is caused, and the heat dissipation substrate of the heat dissipation fin and the soft heat conduction pad can be conveniently and smoothly taken out from the separation groove after being solidified.

As shown in fig. 4, the top opening of the separation groove 32 is provided with a bevel groove 34 with a caliber greater than that of the separation groove and used for accommodating and fixing the heat dissipation substrate, and the inner wall of the separation groove forms a bevel inclined outwards at the opening from bottom to top, so the separation groove is called as a bevel groove, the bevel groove has the same effect as a step groove, and due to the bevel structure and self gravity, the heat dissipation plate can automatically fall on the accurate position above the separation groove as long as the heat dissipation plate contacts with the bevel, thereby being more beneficial to operators to rapidly placing the heat dissipation plate and improving the production efficiency.

The height of the step groove or the inclined surface groove is not suitable to be larger than the thickness of the heat-dissipating substrate, namely, the height of the step groove or the inclined surface groove is smaller than or slightly smaller than the thickness of the heat-dissipating substrate, so that an operator can conveniently and rapidly take out the heat-dissipating fin smoothly, and even if the overflow liquid of the fluid is not overflowed to the upper surface of the heat-dissipating substrate.

The foregoing has described in detail the embodiments of the present invention, namely, an integrated heat sink and a method for manufacturing the same, wherein specific examples are employed to illustrate the principles and embodiments of the present invention, and the above examples are only for aiding in understanding the core idea of the present invention; also, as will be apparent to those skilled in the art in light of the present teachings, the present disclosure should not be limited to the specific embodiments and applications described herein.

Claims

1. A mold for manufacturing an integrated heat sink, the integrated heat sink comprising: the heat radiation fin comprises a heat radiation fin body provided with heat radiation fins and a heat radiation substrate, wherein a soft heat conduction pad is integrally solidified on the bottom plane of the heat radiation substrate in a thermosetting mode; the top opening of the separation groove is provided with a step groove or an inclined surface groove with a caliber larger than that of the separation groove and used for accommodating and fixing the heat dissipation substrate; the height of the step groove or the inclined surface groove is smaller than the thickness of the heat dissipation substrate; the radiating substrate of the radiating fin can be accommodated and fixed in the step groove, and the radiating substrate just cannot sink into the separation groove, so that the overflow of fluid liquid in the separation groove is avoided, and the radiating fin can automatically fall on the accurate position above the separation groove as long as the radiating fin contacts with the inclined surface due to the inclined surface structure and self gravity.

2. A method for manufacturing an integrated heat sink, comprising a mold having a receiving groove, wherein a partition plate is provided in the receiving groove, the partition plate partitions the receiving groove into a plurality of mold grooves which are vertically and horizontally arranged and are used for receiving soft heat-conducting pad raw materials in a fluid state and are matched with the outline of a heat-dissipating substrate of the integrated heat sink, the method is characterized by comprising the following steps:

placing the formed radiating fin bodies on a fluid cushion to enable the bottom surface of a radiating substrate of the radiating fin bodies to be attached to the fluid cushion, wherein the mold groove can accommodate a plurality of radiating fin bodies; the top opening of the separation groove is provided with a step groove or an inclined surface groove with a caliber larger than that of the separation groove and used for accommodating and fixing the heat dissipation substrate; the height of the step groove or the inclined surface groove is smaller than the thickness of the heat dissipation substrate; the radiating substrate of the radiating fin can be accommodated and fixed in the step groove, and the radiating substrate just cannot sink into the separation groove, so that overflow of fluid liquid in the separation groove is avoided, and the radiating fin can automatically fall on a correct position above the separation groove as long as the radiating fin contacts with the inclined surface due to the inclined surface structure and self gravity;