CN209561394U - Power integrated circuit electroplating lead frame - Google Patents
Power integrated circuit electroplating lead frame Download PDFInfo
- Publication number
- CN209561394U CN209561394U CN201920331306.3U CN201920331306U CN209561394U CN 209561394 U CN209561394 U CN 209561394U CN 201920331306 U CN201920331306 U CN 201920331306U CN 209561394 U CN209561394 U CN 209561394U
- Authority
- CN
- China
- Prior art keywords
- cooling fin
- integrated circuit
- power integrated
- lead frame
- chip substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a kind of power integrated circuit electroplating lead frames, including cooling fin, chip substrate, terminal pin, the cooling fin is through connection sheet link chips substrate, a heat dissipation air holes along cooling fin towards chip substrate direction is opened up in connection sheet, cooling fin front punching press impression, the back side form heat dissipation fin by impression, the chip substrate is equipped with electroplated layer, and electroplated layer is in constant velocity spiral shape.Its structure is simple, is able to satisfy the larger heat dissipation capacity demand of high-power integrated circuit, takes into account plating, plastic packaging performance.
Description
Technical field
The utility model designs a kind of lead frame, specifically a kind of power integrated circuit electroplating lead frame.
Background technique
With the development of electronics industry, high-power circuit is integrated using the more and more of Plastic Package form, wherein using
Lead frame must adapt to the heat dissipation after plastic packaging different structure chip, conduction and the requirement for carrying high-power chip, this is just right
Size, electric conductivity and the heat dissipation performance of lead frame require highest.The lead frame of traditional structure is divided into full plating or part
Dotted plating, full electroplating cost is high, the dotted plating in part then cannot the completely compatible welding using different structure chip, existing makes
With limitation.
Summary of the invention
It is simple that the utility model provides a kind of structure, is able to satisfy the larger heat dissipation capacity demand of high-power integrated circuit, takes into account
It is electroplated, the power integrated circuit electroplating lead frame of plastic packaging performance.
The technical solution adopted in the utility model is: a kind of power integrated circuit electroplating lead frame, including cooling fin,
A chip substrate, terminal pin, it is characterised in that: the cooling fin is opened up along dissipating in connection sheet through connection sheet link chips substrate
For backing towards the heat dissipation air holes in chip substrate direction, cooling fin front punching press impression, the back side form heat dissipation fin by impression, described
Chip substrate is equipped with electroplated layer, and electroplated layer is in constant velocity spiral shape.
The left and right pin of the middle pin link chips substrate of the terminal pin, terminal pin is equipped with welding section, welding section
It is equipped with electroplated layer.
The cooling fin front punching press impression coats thermal grease layer.
The graphene coated heat-radiation coating bed of material of cooling fin backside radiator fin.
The utility model opens up heat dissipation air holes in the connection sheet of cooling fin and chip substrate transmission radiating, in lead frame
Effective heat dissipation is carried out during interior heat transmission first, then when heat transmission arrives cooling fin, in conjunction with positive, the back side pressure
Trace, fin radiate, double-radiation function effect, are more able to satisfy the larger heat dissipation capacity demand of high-power integrated circuit；Chip substrate
Upper setting is in constant velocity spiral shape electroplated layer, is electroplated without whole face, reduces electroplating cost and is able to satisfy different shapes and sizes simultaneously
The convenient stabilization of subsequent plastic packaging is taken into account in the welding of chip any position on chip substrate.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is Fig. 1 right view.
In figure: cooling fin 1, thermal grease layer 3, heat dissipation fin 4, the graphene heat-radiation coating bed of material 5, connection sheet 6, dissipates impression 2
Hot wind hole 7, chip substrate 8, constant velocity spiral electroplated layer 9, middle pin 10, left pin 11, right pin 12.
Specific embodiment
Fig. 1, shown in 2: a kind of power integrated circuit electroplating lead frame includes that cooling fin 1, chip substrate 8, centre are drawn
Foot 10, left pin 11, right pin 12.Cooling fin 1 is opened up along cooling fin in connection sheet 6 through 6 link chips substrate 8 of connection sheet
Towards the heat dissipation air holes 7 in chip substrate direction, the punching press of cooling fin front coats the impression 2 of thermal grease layer 3, the back side by impression shape
At the heat dissipation fin 3 of, the graphene coated heat-radiation coating bed of material 5, constant velocity spiral electroplated layer 9 is equipped in the middle part of chip substrate 8；Middle pin
10 link chips substrates 8, left and right pin 12,12 are equipped with welding section, and welding section is equipped with electroplated layer.
Claims (4)
1. a kind of power integrated circuit electroplating lead frame, including cooling fin, chip substrate, terminal pin, it is characterised in that: institute
Cooling fin is stated through connection sheet link chips substrate, the radiation air along cooling fin towards chip substrate direction is opened up in connection sheet
Hole, cooling fin front punching press impression, the back side form heat dissipation fin by impression, and the chip substrate is equipped with electroplated layer, electroplated layer
In constant velocity spiral shape.
2. a kind of power integrated circuit electroplating lead frame according to claim 1, it is characterized in that: the terminal pin
Middle pin link chips substrate, the left and right pin of terminal pin are equipped with welding section, and welding section is equipped with electroplated layer.
3. a kind of power integrated circuit electroplating lead frame according to claim 1, it is characterized in that: the cooling fin is just
Punching press impression in face coats thermal grease layer.
4. a kind of power integrated circuit electroplating lead frame according to claim 1, it is characterized in that: the cooling fin is carried on the back
Radiate the graphene coated heat-radiation coating bed of material of fin in face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920331306.3U CN209561394U (en) | 2019-03-15 | 2019-03-15 | Power integrated circuit electroplating lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920331306.3U CN209561394U (en) | 2019-03-15 | 2019-03-15 | Power integrated circuit electroplating lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209561394U true CN209561394U (en) | 2019-10-29 |
Family
ID=68313067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920331306.3U Expired - Fee Related CN209561394U (en) | 2019-03-15 | 2019-03-15 | Power integrated circuit electroplating lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209561394U (en) |
-
2019
- 2019-03-15 CN CN201920331306.3U patent/CN209561394U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191029 Termination date: 20200315 |