1345147 099年11月26日按正替換頁 六、發明說明： 【發明所屬之技術領域】 [麵1]本發明涉及一種散熱裝置之製備方法。 【先前技術】 [0002] 近年來，電腦中央處理器即CPU運算速度不斷提高，發熱 量亦隨之增大，如果不將CPU產生之熱量及時散發出去， CPU溫度會急劇升高，過高的溫度不僅會降低CPU的使用 壽命，還可能使CPU崩潰，電腦中止運行。 [0003] 為解決散熱問題現有電腦中採用各種散熱裝置，其中具 有鰭片的散熱器是常用的散熱裝置'，談散熱器包括一與 mi貼合的散熱基座，及設的若干散熱 鰭片’在鰭片上可固設一當CPU工作 時，其産生的熱量通過散熱基座傳遞給散熱鰭片，然後 在散熱風扇的輔助作用下，鰭片將熱量散發至周圍空氣 中，從而達到散熱之目的。. , “丫〈tv'xiucii [0004] 此種散熱器製程上一般將基座{與丨散：藤輕/片分開製作，再 進行組裝。這造成基座與間介面處熱阻較大》 例如一種常用的製程係沖壓扣接，散熱器製作完成後， 用散熱鰭片與基座間有效接觸面積較小，熱阻大，面對 散熱量越來越大之CPU，其散熱能力不足。 【發明内容】 [0005] 有鑒於此，有必要提供一種基座與散熱鰭片接觸介面處 熱阻小的散熱裝置製備方法。 [0006] 一種散熱裝置之製備方法，其包括以下步驟：提供一基 094138809 表單編號A0101 第4頁/共12頁 0993425487-0 1345.147 〇99 年 11 月^ 座及複數散熱鰭片，該散熱鰭片包括一結合段，該結合 段包括一彎折段；於該基座上形成複數與該結合段相應 之凹槽，其尺寸較該彎折段小〇·2%-5%;於500-600度之 溫度下將該複數散熱鰭片之結合段壓入該複數凹槽中。 [0007] 相較於先前技術，所述散熱裝置具有如下優點：首先， 基座與散熱鰭片間以熱壓接方式緊密結合，兩者之間部 分原子形成金屬鍵，作為金屬傳熱介質之電子可自由穿 過基座與散熱鰭片間介面’因此介面處熱阻極小，傳熱 速度快；其次，散熱鰭片彎折段之存在，可增加基座與 散熱鰭片間有效接觸 遞。 【實施方式】 積’熱阻更小’更有利於熱量傳 · ， Τ '4,. :v —…， \ t .. : > ,( fc * r - - ‘ . * < "' 、 [0008] [0009] [0010] 以下結合圖示說明一種散熱裝置及其製備方法： 請參閱第一圖，本發明第一實施例之散熱裝置10包括— .基座12、複數散熱鰭片14 η : d 基座I2及散熱鰭片I4可由#矜系:數高的金屬組成，如鋼 或銘。散熱縛片14包括一蛣备4&Γ4Ό，結合段140上延伸 出一彎折段142，基座12上包括與結合段14〇相應之彎折 狀凹槽122，凹槽122從基座12表面向内延伸，結合段 140與凹柄122以熱壓接方式緊密結合。本實施例中，弯 折段142與散熱鰭片14主體垂直，請參閱第二圖，凹槽 122包括豎直部分124及水平部分126，水平部分126與彎 折段142緊密結合’豎直段124與結合段除彎折段142外 之部分緊密結合。從微觀上看，本實施例之散熱裝置1〇 094138809 中，凹槽122與散熱錯片14接觸介面處部分金屬原子間形 表單編號Α0101 第5頁/共12頁 0993425487-0 1345147 _— 099年11月26日修正替換頁 成金屬鍵，基底12與散熱鰭片14間近似為一體結構，從 而金屬中作為傳熱介質之電子可自由越過基底12與散熱 鰭片14間之介面，從而降低整個散熱裝置之熱阻。彎折 段142可進一步增加散熱鰭片14與基座12間有效接觸面積 ，熱阻更小。 [0011] 請參閱第三圖，上述散熱裝置10之製備方法包括以下步 驟： [0012] 提供一金屬基座12及複數散熱鰭片14。基座12與散熱鰭 片14由熱導率高的金屬組成即可，優選為銅或鋁。散熱 鰭片14包括一結合段140，結合段140上.廷仲出一彎折段 142 〇 [0013] 於基座12上形成複數與結合段140相應之凹槽122，請參 閱第二圖，凹槽122之形狀根據彎折段142之形狀確定， 以確保凹槽122與結合段140間充分之接觸，從加工技術 難度考量，結構越簡單越好，本實例之彎奋段142與散熱 鰭片14主體垂直，散熱鰭片~1「4舉面成“L”型，當然其可 還可為其他形狀，但尺寸車4：灣#段142要小0.2%-5%。凹 槽122可與基底平行，等間距設置。 [0014] 於高溫下利用高壓將複數散熱鰭片14之結合段140壓入凹 槽122中。此過程可於500-600°C下進行，高溫高壓下， 散熱鰭片14與基座12間形成超緊密連接，散熱鰭片14與 基座12幾近一體結構。將散熱鰭片14壓入凹槽122中時， 可採用生產效率高的沖壓製程將散熱鰭片14從基座12之 側面沖入，優選的，壓入散熱鰭片14時之壓力大於1200 094138809 表單編號A0101 第6頁/共12頁 0993425487-0 1345147 099年11月26日梭正替換頁 千牛頓（KN)，因此本實施例之散熱裝置之製備方法便於 實際生產。 [0015] 請參閱第四圖，本發明第二實施例之散熱裝置20包括一 基座22，複數散熱鰭片24。 [0016] 本實施例與第一實施例大致相同，不同之處在於本實施 例之散熱裝置20中，基座22進一步包括一腔體222，腔體 222中容納有工作流體224。於基座22強度足夠之情況下 ，腔體222之體積越大越好。腔體222形狀任意，本實施 例中，腔體222為長方體形。工作流體224可為氨、酒精 、丙酮或其他低沸點的液體，♦可以.奉純水等高沸點的 液體，當工作液體爲高沸點的液體時，可將腔體222内抽 成低壓區，壓強可為10_3〜10_2帕斯卡（Pa)，以降低工作 流體之沸點。 [0017] 請參閱第五圖，係本發明第二實施例之散熱裝置20與發 熱元件配合示意圖，散熱裝置20丨扣接於發爇元件26上。 散熱時散熱裝置20工作過程如下，|熱元件26產生之熱 量傳遞給基座22，使腔體222内溫度升高，當溫度升高到 工作流體224之沸點時，工作流體224大量氣化，形成的 工作流體蒸氣攜帶大量熱量向腔體222内壓力較小之區域 運動，當蒸氣遇到溫度較低之腔壁後，即冷凝成液體， 而熱量經由基座22傳遞給散鰭片24，最終散發出去。 [0018] 由於工作流體具有較高之比熱值，其可於短時間内迅速 吸收大量熱量，避免發熱元件2 6局部過熱，再經由蒸氣 之氣體擴散作用，將發熱元件26吸收的熱量快速均勻分 094138809 表單編號A0101 第7頁/共12頁 0993425487-0 1345147 099年11月26日按正替換頁 散於基座靠近散熱鰭片24之一側，經由散熱鰭片24散發 到空氣中去。 [0019] 相較於先前技術，所述散熱裝置具有如下優點：首先， 基座與散熱鰭月間以熱壓接方式緊密結合，兩者之間部 分原子形成金屬鍵，作為金屬傳熱介質之電子可自由穿 過基座與散熱鰭片間介面，因此介面處熱阻極小，傳熱 速度快；其次，散熱鰭片彎折段之存在，可增加基座與 散熱鰭片間有效接觸面積，熱阻更小，更有利於熱量傳 遞。 .1345147 November 26, 2010, according to the replacement page. 6. Description of the invention: [Technical field to which the invention pertains] [Face 1] The present invention relates to a method of preparing a heat dissipating device. [Prior Art] [0002] In recent years, the CPU speed of the computer central processing unit has been continuously increased, and the heat generation has also increased. If the heat generated by the CPU is not released in time, the CPU temperature will rise sharply, too high. Temperature not only reduces the life of the CPU, but also causes the CPU to crash and the computer to stop running. [0003] In order to solve the problem of heat dissipation, various heat sinks are used in the existing computer, and the heat sink with fins is a commonly used heat sink device. The heat sink includes a heat sink base that is attached to the mi, and a plurality of heat sink fins. 'The fins can be fixed. When the CPU is working, the heat generated by the CPU is transmitted to the heat dissipation fins through the heat dissipation base. Then, with the aid of the heat dissipation fan, the fins dissipate heat to the surrounding air to achieve heat dissipation. purpose. . "丫<tv'xiucii [0004] This type of heat sink process generally consists of a pedestal {with 丨: 藤轻/片, and then assembled. This causes a large thermal resistance at the pedestal and the interface." For example, a common process is stamping and fastening. After the heat sink is completed, the effective contact area between the heat sink fin and the base is small, and the heat resistance is large, and the CPU with insufficient heat dissipation has insufficient heat dissipation capability. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a heat sink device with a small thermal resistance at the contact interface between the susceptor and the heat sink fin. [0006] A method for fabricating a heat sink includes the following steps: providing a base 094138809 Form No. A0101 Page 4 / Total 12 Page 0993425487-0 1345.147 〇 November 1999 ^ Block and a plurality of heat sink fins, the heat sink fins include a joint section, the joint section includes a bend section; Forming a plurality of grooves corresponding to the bonding section, the size of which is less than 2%-5% of the bending section; pressing the bonding section of the plurality of heat radiating fins into the plurality of concaves at a temperature of 500-600 degrees In the slot. [0007] Compared to the prior art, the The heat dissipating device has the following advantages: First, the susceptor and the heat dissipating fin are tightly combined by thermocompression bonding, and some atoms between the two form a metal bond, and electrons as a metal heat transfer medium can freely pass through the pedestal and the heat dissipating fin The interface is so that the thermal resistance at the interface is extremely small and the heat transfer speed is fast. Secondly, the existence of the bent portion of the heat dissipation fin can increase the effective contact between the susceptor and the heat dissipation fin. [Embodiment] The product has a smaller thermal resistance. It is more conducive to heat transfer, Τ '4,. :v —..., \ t .. : > , ( fc * r - - ' . * <" ' , [0008] [0009] [0010] Referring to the drawings, a heat dissipating device and a manufacturing method thereof are provided. Referring to the first drawing, the heat dissipating device 10 of the first embodiment of the present invention includes: a susceptor 12, a plurality of fins 14 η : d pedestal I 2 and heat sink fins I4 may be composed of a metal having a high number, such as steel or inscription. The heat dissipating tab 14 includes a device 4&4, and a bent portion 142 is extended on the joint portion 140, and the base 12 includes a joint portion 14 〇 corresponding to the curved recess 122, the recess 122 extends inwardly from the surface of the base 12, the joint section 140 and The handle 122 is tightly coupled by thermocompression. In this embodiment, the bent section 142 is perpendicular to the main body of the heat dissipation fin 14. Referring to the second figure, the recess 122 includes a vertical portion 124 and a horizontal portion 126, and the horizontal portion 126 is The bending section 142 is intimately coupled with the portion of the joining section except the bending section 142. The microscopically, in the heat dissipating device 1〇094138809 of the embodiment, the groove 122 is in contact with the heat dissipating chip 14. Part of the metal atomic form form at the interface Α0101 Page 5 / Total 12 pages 0993425487-0 1345147 _ - On November 26, 999, the replacement page was replaced by a metal key, and the substrate 12 and the heat sink fin 14 were approximately integrated. The electrons in the metal as a heat transfer medium can freely pass over the interface between the substrate 12 and the heat sink fins 14, thereby reducing the thermal resistance of the entire heat sink. The bent section 142 can further increase the effective contact area between the heat dissipation fins 14 and the susceptor 12, and the thermal resistance is smaller. Referring to FIG. 3, the method for fabricating the heat sink 10 includes the following steps: [0012] A metal base 12 and a plurality of heat sink fins 14 are provided. The susceptor 12 and the heat dissipating fins 14 may be composed of a metal having a high thermal conductivity, and preferably copper or aluminum. The heat dissipating fins 14 include a joint portion 140. The joint portion 140 has a bent portion 142. [0013] A plurality of grooves 122 corresponding to the joint portion 140 are formed on the base 12, please refer to the second figure. The shape of the groove 122 is determined according to the shape of the bending section 142 to ensure sufficient contact between the groove 122 and the coupling section 140. The difficulty of the processing technique is as simple as possible, and the bending section 142 and the heat sink fin of the present example. The main body of the piece 14 is vertical, and the fins ~1 "4 lifting surface is "L" type, of course, it can also be other shapes, but the size of the car 4: bay # segment 142 is 0.2%-5% smaller. Parallel to the substrate, equidistantly disposed. [0014] The bonding section 140 of the plurality of heat dissipation fins 14 is pressed into the groove 122 by high pressure at a high temperature. This process can be performed at 500-600 ° C, and the heat is dissipated under high temperature and high pressure. The fins 14 form an ultra-tight connection with the susceptor 12, and the heat dissipation fins 14 are nearly integrated with the susceptor 12. When the heat dissipation fins 14 are pressed into the grooves 122, the heat-dissipating fins can be used in a high-efficiency stamping process. The sheet 14 is punched in from the side of the susceptor 12. Preferably, the pressure when the heat sink fin 14 is pressed is greater than 1200 09413. 8809 Form No. A0101 Page 6 / Total 12 Page 0993425487-0 1345147 On November 26, 2008, the shuttle is replacing the page KN (KN), so the preparation method of the heat sink of this embodiment is convenient for actual production. [0015] In the fourth embodiment, the heat dissipation device 20 of the second embodiment of the present invention includes a base 22 and a plurality of heat dissipation fins 24. [0016] This embodiment is substantially the same as the first embodiment, except that the heat dissipation device of the embodiment 20, the base 22 further includes a cavity 222, and the working fluid 224 is accommodated in the cavity 222. The larger the volume of the cavity 222 is, the better the strength of the cavity 22 is. The shape of the cavity 222 is arbitrary. In the example, the cavity 222 has a rectangular parallelepiped shape. The working fluid 224 can be ammonia, alcohol, acetone or other low-boiling liquid, ♦ can be a high-boiling liquid such as pure water, when the working liquid is a high-boiling liquid, The cavity 222 is drawn into a low pressure zone, and the pressure may be 10_3~10_2 Pascal (Pa) to reduce the boiling point of the working fluid. [0017] Referring to the fifth figure, the heat sink 20 of the second embodiment of the present invention is heated. Component coordination diagram, The heat sink 20 is fastened to the hairpin element 26. The heat sink 20 works as follows: the heat generated by the heat element 26 is transferred to the susceptor 22, causing the temperature in the cavity 222 to rise, and when the temperature rises to work At the boiling point of the fluid 224, the working fluid 224 is vaporized in a large amount, and the formed working fluid vapor carries a large amount of heat to move to a region of less pressure in the cavity 222. When the vapor encounters a cavity wall having a lower temperature, it condenses into a liquid. Heat is transferred to the fins 24 via the susceptor 22 and eventually dissipates. [0018] Since the working fluid has a high specific heat value, it can quickly absorb a large amount of heat in a short time, avoiding local overheating of the heating element 26, and then rapidly dispersing the heat absorbed by the heating element 26 by vapor diffusion of the vapor. 094138809 Form No. A0101 Page 7 / Total 12 Page 0993425487-0 1345147 On November 26, 099, the replacement page is scattered on one side of the susceptor near the heat dissipation fin 24, and is radiated to the air via the heat dissipation fin 24. [0019] Compared with the prior art, the heat dissipating device has the following advantages: First, the susceptor and the heat dissipating fin are tightly combined by thermocompression, and some atoms between the two form a metal bond, and the electron as a metal heat transfer medium It can freely pass through the interface between the pedestal and the heat sink fin, so the thermal resistance at the interface is extremely small and the heat transfer speed is fast. Secondly, the existence of the bent portion of the heat sink fin can increase the effective contact area between the pedestal and the heat sink fin. The resistance is smaller and it is more conducive to heat transfer. .
[0020] 综上所述，本發明確已符合發明專利之要:件，遂依法提 • * 出專利申請。惟，以上所述者僅—為本發明之較佳實施方 式，自不能以此限制本案之·申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 " [0021] 第一圖係本發明第一實施例之·.散熱裝置剖面示意圖。 .一 - ^ [0022] 第二圖係本發明第一實施例之散熱裝置之製備方法中形 成有凹槽之基座剖面示意圖。 [0023] 第三圖係本發明第一實施例之散熱裝置之製備方法流程 圖。 [0024] 第四圖係本發明第二實施例之散熱裝置剖面示意圖。 [0025] 第五圖係本發明第二實施例之散熱裝置與發熱元件結合 不意圖。 094138809 表單編號A0101 第8頁/共12頁 0993425487-0 1345147 【主要元件符號說明】 [0026] 基座：12，22 [0027] 凹槽：122 [0028] 散熱鰭片：14， [0029] 結合段：140 [0030] 彎折段：142 [0031] 腔體：222 [0032] 工作流體：224 [0033] 發熱元件：26 24 094138809 表單编號A0101 第9頁/共12頁 099年11月26日按正替换頁 0993425487-0[0020] In summary, the present invention has indeed met the requirements of the invention patent: a patent application. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0021] The first figure is a schematic cross-sectional view of a heat sink according to a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0022] The second drawing is a schematic cross-sectional view of a susceptor having a groove formed in a method of manufacturing a heat sink according to a first embodiment of the present invention. [0023] The third figure is a flow chart of a method of preparing a heat sink according to a first embodiment of the present invention. [0024] The fourth figure is a schematic cross-sectional view of a heat sink according to a second embodiment of the present invention. The fifth drawing is a combination of the heat dissipating device of the second embodiment of the present invention and the heat generating component. 094138809 Form No. A0101 Page 8 of 12 0993425487-0 1345147 [Description of main component symbols] [0026] Base: 12, 22 [0027] Groove: 122 [0028] Heat sink fins: 14, [0029] Segment: 140 [0030] Bending section: 142 [0031] Cavity: 222 [0032] Working fluid: 224 [0033] Heating element: 26 24 094138809 Form number A0101 Page 9 of 12 Page 1299 November 26 Daily press replacement page 0993425487-0