TWM354319U - Structural improvement of heat dissipation fin and its heat dissipation module - Google Patents

Structural improvement of heat dissipation fin and its heat dissipation module Download PDF

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Publication number
TWM354319U
TWM354319U TW097211592U TW97211592U TWM354319U TW M354319 U TWM354319 U TW M354319U TW 097211592 U TW097211592 U TW 097211592U TW 97211592 U TW97211592 U TW 97211592U TW M354319 U TWM354319 U TW M354319U
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TW
Taiwan
Prior art keywords
heat dissipation
heat
reinforcing portion
fin
item
Prior art date
Application number
TW097211592U
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Chinese (zh)
Inventor
zhi-peng Chen
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Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW097211592U priority Critical patent/TWM354319U/en
Priority to US12/288,525 priority patent/US20090321049A1/en
Publication of TWM354319U publication Critical patent/TWM354319U/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M354319 八、新型說明: 【新型所屬之技術領域】 本創作係關於一種散熱鰭片結構改良,尤其特別是一 種藉由至少一補強部進以大幅的提升整體結構強度與散熱 面積之散熱縛片結構者。 - 【先前技術】 按,隨著電子資訊科技的日新月異,使得各%產品 • (如:電腦、筆記型電腦...等)之使用日趨普及且應用更為 廣泛’但由於電子資訊產業為了促使3C產品的運算處理速 度提升、存取容量增加之趨勢發展,以導致前述3C產品中 之電子元件於高速運作時常伴隨產生的高溫。 其中,以電腦為例,當前述電腦被啟動時,其内的一 :央處理H _)在高賴算處理τ所產生的高溫,會使得 刖述中央處理H陷人不穩定的狀態,輕者當機,嚴重則會 籲 f毀或毁損中央處理器;另者,為了解決電磁波賴射之問 題,通常都以機殼來封閉電腦主機,因此,如何將中央處 理器及其它發熱的電子元件產生之熱能快速導出,成為一 ' 重要課題。 %而-般中央處理器最常見的散熱方式,係採取其上方 设置-散熱器(heat sink)’前述散熱n-锻有若干鰭 片’其另-側之表面則直接接觸中央處理器,以使熱能可 傳導至前述鯖片端,並藉由輻射散熱及配合增設一風扇強 制驅動氣流以使熱能快速散逸。 -M354319 明參閱第ΙΑ、1Β圖所示,習知散熱鰭片結構,該散熱 鰭片11係為—片體,且其兩側邊弯卿成-摺邊ln ;: 在實際實施時,由於觀散熱制11於進行_出摺邊 111時’但翻體強度不足經常㈣擠壓的力道受力不均 而造成散熱則n之結構強度受到破壞產生彎折、扭 , 其他之變形現象; 一 此外’前述每—散熱鰭片11可相互堆4形成-散熱籍 • ^卜並且各該散熱鰭片11彼此間具有-散熱空間^ 當前述散_>{組1進行散熱時,錄細版丨係利用 輻射散熱方式將熱源向外擴散,且該等散熱韓片^結構外 型係為-平整片體,在單位空間中僅有上下兩端之平面作 為散熱部,散熱面積狹小,故散熱效能有限;以上所述, S知政熱鰭片及其組成之散熱模組具有下列之缺點: 1. 結構強度易受到破壞。 2. 於擠壓摺邊時,容易導致散熱鰭片變形。 3. 散熱面積過小。 4. 散熱效果不佳。 是以,要如何解決上述習用之問題與缺失,即為本案 之創作人與從事此行業之相關廠商所亟欲研究改善之方向 所在者。 ° 【新型内容】 本創作之主要目的’係提供-種增加結構強度之散熱 鱗片結構。 本創作之次要目的’係提供-種增加散熱面積之散熱 6 -M354319 籍片結構。 為達上述目的,本創作之一目 片結構改良’其包含:—本體,該本體上_成至少」 ^ 並相對凸出前 ’藉由β亥補強部得以大幅提升結構強度與 ,係提供一種散熱鰭 強部’該觀部細設於前述本體的_面, 補 述本體的另一面 增加散熱面積。 【實施方式】M354319 VIII. New Description: [New Technology Field] This creation is about the improvement of a heat sink fin structure, especially a heat sink structure that greatly enhances the overall structural strength and heat dissipation area by at least one reinforcing portion. By. - [Prior Art] Press, with the rapid development of electronic information technology, the use of various products (such as: computers, notebook computers, etc.) is becoming more popular and widely used, but due to the electronic information industry The trend of increasing the processing speed and increasing the access capacity of the 3C products has led to the high temperatures that accompany the electronic components in the aforementioned 3C products at high speeds. Among them, taking the computer as an example, when the computer is started, one of the following: the central processing H _) is high in the high temperature generated by the processing τ, which will make the central processing H unstable state, light When the machine is down, it will be called to destroy or destroy the central processing unit. In addition, in order to solve the problem of electromagnetic wave reflection, the computer mainframe is usually closed by the casing. Therefore, how to use the central processing unit and other heat-generating electronic components The heat generated is quickly exported and becomes an important issue. The most common way to dissipate the central processor is to take the upper set - the heat sink 'the above heat sink n-forged with a few fins' and the other side of the surface directly contacts the central processor to The thermal energy can be transmitted to the end of the cymbal, and the heat is quickly dissipated by radiating heat and cooperating with the addition of a fan to force the airflow. -M354319 For details, refer to the structure of the heat-dissipating fins, which are formed as a sheet body, and the two sides of the heat-dissipating fins 11 are formed into a folded edge ln; Viewing the heat dissipation system 11 when the _ exit hem 111 is performed, but the swell strength is insufficient. (4) The force of the squeezing force is unevenly distributed to cause heat dissipation, and the structural strength of n is broken to cause bending, twisting, and other deformation phenomena; In addition, each of the aforementioned heat-dissipating fins 11 may be formed by stacking 4 with each other, and each of the heat-dissipating fins 11 has a heat-dissipating space therebetween. When the heat-dissipating _> The 丨 system uses the radiation heat dissipation method to spread the heat source outward, and the heat dissipation Korean film structure is a flat body. In the unit space, only the upper and lower ends are used as the heat dissipation portion, and the heat dissipation area is narrow, so the heat dissipation is performed. The performance is limited; as mentioned above, the S-Iron hot fin and its heat dissipation module have the following disadvantages: 1. The structural strength is easily damaged. 2. When squeezing the hem, it is easy to cause the fins to deform. 3. The heat dissipation area is too small. 4. The heat dissipation is not good. Therefore, how to solve the above problems and shortcomings, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement. ° [New content] The main purpose of this creation is to provide a heat-dissipating scale structure that increases the structural strength. The secondary purpose of this creation is to provide a heat dissipation area that increases the heat dissipation area of the 6-M354319 film structure. In order to achieve the above objectives, one of the creations of this creation has improved the structure of the film, which includes: - the ontology, the body is at least _ at the same time and is relatively convex, and the structure is enhanced by the β-reinforcement portion. The strong portion 'the viewing portion is finely arranged on the _ surface of the body, and the other surface of the main body is added to increase the heat dissipation area. [Embodiment]

本創作之上述目的及其結構與功能上的紐,將依據 所附圖式之較佳實施例予以說明。 請參閱第2Α、3Α、3Β圖所示,本創作係一種散熱籍片 結構改良,在摘作之驗佳實關,該雜鰭片係包含 本體21,該本體21之一侧向下延伸設有一第一摺邊 214,其另侧向下延伸設有一第二摺邊215,且於該本體上 汉有至少一穿孔216,該穿孔216係被用以供一熱導管32 穿《又’並且該本體21形成至少一補強部211,該補強部211 凹设於前述本體21的一面,並相對凸出前述本體21的另 一面’因此’藉由該補強部211得以大幅的提升結構強度 與增加散熱面積;在本較佳實施例,惟在本創作實際實施 時’前述之本體21亦可不設置有第一摺邊214及第二摺邊 215,且該補強部211亦係可呈不規則性或規則性地排列設 於該本體21上,前述規則性係為各該補強部211彼此間以 水平或垂直的排列(如圖3Α),則前述不規則性係為各該補 強部211彼此縱橫交錯的排列(如圖3Β)。 續參閱第4圖所示,前述補強部211凹設該本體21的 M354319 一立面具有-凹部213,相對凸出該本體21的另—面具有一 凸部212 ’前述凸部212用以當擠壓出前述第一、二擅邊 214、215的過程,可使該本體21之整體結構不受破壞, ,且亦柄加散熱面積;其中上述補強部2ιι之截面形狀 選自一半圓形及矩形及V型其中任一態樣。The above objects of the present invention, as well as the structure and function thereof, will be explained in accordance with the preferred embodiments of the drawings. Please refer to the 2nd, 3rd, and 3rd drawings. This is a kind of improvement of the structure of the heat-dissipating film. In the inspection of the film, the fuse includes the body 21, and one side of the body 21 is extended downward. A first flange 214 has a second flange 215 extending from the other side, and at least one hole 216 is formed on the body. The hole 216 is used for a heat pipe 32 to pass through again. The body 21 is formed with at least one reinforcing portion 211. The reinforcing portion 211 is recessed on one surface of the body 21 and protrudes from the other surface of the body 21. Therefore, the reinforcing portion 211 can greatly enhance the structural strength and increase. The heat dissipation area; in the preferred embodiment, the body 21 may not be provided with the first flange 214 and the second flange 215, and the reinforcement portion 211 may also be irregular. Or regularly arranged on the main body 21, the regularity is that the reinforcing portions 211 are arranged horizontally or vertically with each other (as shown in FIG. 3A), and the irregularity is that each of the reinforcing portions 211 is horizontally and horizontally Interlaced arrangement (Figure 3Β). Continuing to refer to FIG. 4, the reinforcing portion 211 recesses the M354319 of the main body 21 with a concave portion 213, and the other portion of the main body 21 has a convex portion 212. The convex portion 212 is used for Extrusion of the first and second 214, 215 processes, the overall structure of the body 21 is not damaged, and the heat dissipation area is also added; wherein the cross-sectional shape of the reinforcing portion 2 ι is selected from a semi-circular shape and Any of the rectangular and V-shaped features.

閱圖2A、2B所示,前述本體21係可彼此兩兩相 *成—散熱鰭片組2,其中每一本體21之第一、二 摺邊214」215緊貼於另一本體21之第-、二擅邊214了 215 ’則前述兩者本體21相鄰間形成一通道217。 接著參閱第5、6Α ®所*,該散讎組3係包含一基 座3卜5亥熱導管32及該散熱鰭片、组2,前述基座31上具 有=部311 ’前述凸部311 一側面則開有至少一洞孔31^2 並貫穿該凸部311,並且該洞孔312朝該基座31周沿處延 伸設有一溝槽313,另外,該基座31之一下端面31〇則與 至少二發熱單元(圖中未示)相接觸以作熱源傳導。 ^述熱導管32具有至少一吸熱部32G及至少一導熱部 321刖述及熱部32〇係、穿設過該基座之洞孔把,且 其容置於該溝槽313中’前述導熱部321 -端恰可貫穿至 相對於及本體21之穿孔216,使得該本體a與熱導管 可作結合’當該發鮮元產生齡科,储由前述基座31 將熱源先料雜鱗管32之贿部32G,再經由前述吸 熱部娜職源傳遞給予串設其上之散熱鰭片組2,並透 過該散_片組2將熱源對外擴散散熱,且進而可藉由該 補強部211之凸部212增加散熱面積。 M354319 另者,請參閱第6B圖所示,W 6B係本較佳實施例之 另一散熱模組的態樣,前述另一散熱模組之補強部Μ〗係 以3個說明表示,但並不侷限於此,其亦可為1個、2個、 3個、4個…等,惟,在本創作實際實施時,凡可用該補強 部211使該本體21肖加結構強度及增加散熱面積者,均係 , 本創作在此所稱的補強部211,合先陳明。 續參閱第5、7圖所示,前述散熱模組3對接一風扇5 • 搭配組合成一散熱器4,該風扇5係設置在相對該散熱鰭 片組2之-侧,更詳言之該風扇5安|於鄰近前述第一、 一摺邊214、215之本體21細,當前述風扇5強制將散 熱氣流導入通道217中時,係透過各該本體21之補強部 211之凹部213增加散熱氣流的流暢,使前述散熱氣流亦 能規律性的在前述通道217中流動,且又能促使散熱氣流 集中,另方面前述補強部211之凸部212進而增加散熱面 積’以大幅提升該散熱器4之散熱效能。 _ 故藉由各該本體21之補強部211之凸部212不僅增大 . 散熱鰭片組2之散熱面積,且其該凹部213又可引導並集 • 中6玄風扇5所產生之散熱氣流進行散熱,俾該散熱器4整 體之散熱效能大幅提升。以上所述,本創作係一種散熱鰭 片結構改良及其散熱模組’其具有以下列之優點: 1·增加結構強度。 2. 增加散熱面積。 3. 散熱效果佳。 惟以上所述者,僅係本創作之較佳可行之實施例而 M354319 已,舉凡利用本創作上述之方法、形狀、構造、裝置所為 之變化,皆應包含於本案之權利範圍内。 【圖式簡單說明】 第1A圖係習知之散熱鰭片示意圖; 第1B圖係習知之散熱鰭片組分解示意圖; 第2A圖係本創作之散熱鰭片示意圖; ^ 第2B圖係本創作之散熱鰭片組分解示意圖; 第3A圖係本創作之另一散熱鰭片示意圖; 第3B圖係本創作之另一散熱鰭片示意圖; 第4圖係本創作之另一散熱鰭片示意圖; 第5圖係本創作之散熱模組分解示意圖; 第6A圖係本創作之散熱模組組合示意圖; 第6B圖係本較佳實施例之另一散熱模組的態樣示意圖; 第7圖係本創作之散熱器示意圖。 【主要元件符號說明】 散熱鰭片組 …2 基座 … 31 本體 -21 下端面 … 310 補強部 …211 凸部 … 311 凸部 …212 洞孔 … 312 凹部 …213 溝槽 … 313 第一摺邊 …214 熱導管 … 32 第二摺邊 …215 吸熱部 … 320 -M354319 穿孔 …216 導熱部 … 321 通道 …217 散熱器 … 4 散熱模組 -3 風扇 … 5 112A and 2B, the body 21 can be formed into two pairs of heat sink fins 2, wherein the first and second flanges 214"215 of each body 21 are in close contact with the other body 21. - The second body is 214 215', and the two bodies 21 form a channel 217 adjacent to each other. Referring to the fifth and sixth aspects, the dilation group 3 includes a pedestal 3 and 5 heat-conducting ducts 32 and the heat-dissipating fins and the group 2, and the base 31 has a portion 311 'the convex portion 311 A side surface is opened with at least one hole 31^2 and penetrates the convex portion 311, and the hole 312 defines a groove 313 extending toward the periphery of the base 31, and a lower end surface 31 of the base 31 Then, it is in contact with at least two heat generating units (not shown) for heat source conduction. The heat pipe 32 has at least one heat absorbing portion 32G and at least one heat conducting portion 321 and a hot portion 32, and a hole hole penetrating through the pedestal, and is received in the groove 313. The portion 321 - the end can be penetrated to the perforation 216 opposite to the body 21, so that the body a and the heat pipe can be combined. 'When the fresh element is produced, the base is used to store the heat source. 32B bribe 32G, and then pass through the heat sinking part of the heat source to give the heat sink fin set 2, and the heat source is diffused and dissipated through the bulk pack 2, and further, the reinforcement part 211 The convex portion 212 increases the heat dissipation area. M354319 In addition, as shown in FIG. 6B, W 6B is another aspect of the heat dissipation module of the preferred embodiment, and the reinforcing portion of the other heat dissipation module is represented by three instructions, but The present invention is not limited thereto, and may be one, two, three, four, etc., but in the actual implementation of the present invention, the reinforcing portion 211 can be used to increase the structural strength and increase the heat dissipation area of the body 21. All of them are referred to herein as the reinforcement unit 211, which is referred to as Chen Ming. Continuing to refer to the figures 5 and 7, the heat dissipation module 3 is connected to a fan 5 and is combined to form a heat sink 4, which is disposed on the side opposite to the heat dissipation fin group 2, more specifically, the fan. The body 21 adjacent to the first and first flanges 214 and 215 is thin. When the fan 5 forcibly introduces the heat dissipation air into the channel 217, the heat dissipation airflow is increased through the recess 213 of the reinforcing portion 211 of each of the bodies 21. The sleek flow allows the venting airflow to flow regularly in the channel 217, and to promote the concentration of the radiant airflow. In addition, the convex portion 212 of the reinforcing portion 211 further increases the heat dissipation area to substantially increase the heat sink 4. Cooling performance. Therefore, the convex portion 212 of the reinforcing portion 211 of each of the main bodies 21 not only increases the heat dissipating area of the heat dissipating fin group 2, but also the concave portion 213 can guide and collect the heat dissipating airflow generated by the middle fan 5 The heat dissipation of the heat sink 4 as a whole is greatly improved. As described above, the present invention is a heat sink fin structure improvement and a heat dissipation module thereof which has the following advantages: 1. Increase structural strength. 2. Increase the heat dissipation area. 3. Good heat dissipation. However, the above descriptions are only preferred embodiments of the present invention, and M354319 has been modified to include the methods, shapes, structures, and devices described above. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a schematic diagram of a conventional heat sink fin; Fig. 1B is a schematic view of a conventional heat sink fin group; Fig. 2A is a schematic diagram of a heat sink fin of the present invention; ^ 2B is a creation of the present Schematic diagram of the heat sink fin group; Fig. 3A is a schematic diagram of another heat sink fin of the present invention; Fig. 3B is a schematic diagram of another heat sink fin of the present invention; Fig. 4 is a schematic diagram of another heat sink fin of the present invention; 5 is a schematic diagram of the heat dissipation module of the present invention; FIG. 6A is a schematic diagram of the heat dissipation module of the present invention; FIG. 6B is a schematic diagram of another heat dissipation module of the preferred embodiment; A schematic diagram of the created radiator. [Description of main component symbols] Heat sink fin set... 2 Base... 31 Body-21 Lower end face... 310 Reinforcement part...211 Projection... 311 Projection...212 Hole... 312 Recess...213 Groove... 313 First Fold ...214 Heat pipe... 32 Second flange...215 Heat sink... 320 -M354319 Piercing...216 Heat transfer...321 Channel...217 Heatsink... 4 Thermal module-3 Fan... 5 11

Claims (1)

M354319 九、申請專利範圍: ^ 種散熱鰭片結構改良,其 丨—— 至少一補強部,該補強部係二本體形成 相對凸出前述本體的另—面。、迷本體的-面,並 2=T第1項所述之散咖結構改良,其中 林體之—侧向τ延伸設有—第 其中 伸設有一第二摺邊。 ,,、另侧向下延 3·如申請專利制第丨項所述之散熱則 該補強部凹設該本體的—面具有—凹部,2^中 體的另-面具有一凸部。 丨凸出δ亥本 4.如申請專利難第丨或3項所述 任一者。 &如申請專利制第丨項所述之散熱則 該本體上設有至少一穿孔。 再文良, 6. 如申請專利1贿1項所述之散_片結構改良,Α φ 該《部射呈規職地㈣設料本體上、中 7. 如申請專利侧第1項所述之散_片結構改良, 2補強部係可呈不規則性地排列設於該:體 8. —種散結構改良之散誠組,係包含: —基座; 其中該補強部之截面形狀選自半圓形及矩:二 其中 導熱部,該吸熱 熱導官,具有至少一吸熱部及至少一 部係連結上述基座;及 12 -M354319M354319 IX. Patent application scope: ^ The structure of the heat dissipation fin is improved, and the 丨 - at least one reinforcing portion, the body of the reinforcing portion is formed to protrude from the other surface of the body. The body-face of the body, and the modification of the coffee structure described in Item 1 of the second item, wherein the forest body has a lateral τ extension, and a second hem is formed therein. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,丨 丨 δ 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. 4. & If the heat dissipation is as described in the patent application, at least one perforation is provided on the body. Re-Wen Liang, 6. If the application for patent 1 bribe 1 item is improved, Α φ The part of the film is placed on the body (4) on the body of the material. 7. As described in item 1 of the patent application side The slab structure is improved, and the two reinforcing portions are arranged irregularly in the body: the body 8. The scatter structure of the scatter structure includes: a pedestal; wherein the cross-sectional shape of the reinforcing portion is selected from Semicircular and moment: two of the heat conducting portions, the endothermic heat guide having at least one heat absorbing portion and at least one portion connecting the pedestal; and 12 - M354319 一散熱鰭片組,係由複數散熱鰭片堆疊構成,並_•套龄 前述導熱部,其中前述散熱鰭片包含一本體,該本體形 成至少一補強部,該補強部係凹設於前述本體的一面, 並相對凸出前述本體的另一面。 9. 如申請專利範圍第8項所述之散熱鰭片結構改良之散熱 模組,其中該補強部之截面形狀選自半圓形及矩形及V 型其中任一者。 10. 如申請專利範圍第8項所述之散熱鰭片結構改良之散 熱模組,其中該補強部係可呈規則性或不規則性 地排列設於該本體上。 13A heat dissipating fin set is composed of a plurality of heat dissipating fins stacked, and the heat dissipating fin includes a body, and the body forms at least one reinforcing portion, and the reinforcing portion is recessed on the body One side, and relatively protrudes from the other side of the body. 9. The heat dissipation module of the heat dissipation fin structure according to claim 8, wherein the cross-sectional shape of the reinforcing portion is selected from the group consisting of a semicircle, a rectangle, and a V shape. 10. The heat dissipation fin structure improved heat dissipation module according to claim 8, wherein the reinforcement portion is arranged on the body in a regular or irregular manner. 13
TW097211592U 2008-06-30 2008-06-30 Structural improvement of heat dissipation fin and its heat dissipation module TWM354319U (en)

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TW097211592U TWM354319U (en) 2008-06-30 2008-06-30 Structural improvement of heat dissipation fin and its heat dissipation module
US12/288,525 US20090321049A1 (en) 2008-06-30 2008-10-21 Radiating fin

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US9476655B2 (en) * 2013-12-11 2016-10-25 Asia Vital Components Co., Ltd. Thermal module
US10542644B2 (en) 2016-12-14 2020-01-21 A.K. Stamping Company, Inc. Two-piece solderable shield
CN106852069B (en) * 2016-12-20 2019-06-07 奇鋐科技股份有限公司 Heat-sink unit and its heat radiation module
US10921066B2 (en) * 2018-06-25 2021-02-16 Getac Technology Corporation Enhanced heat dissipation module, cooling fin structure and stamping method thereof

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Publication number Priority date Publication date Assignee Title
US10114274B2 (en) 2014-12-22 2018-10-30 Coretronic Corporation Heat dissipating module having turbulent structures
US10281807B2 (en) 2017-01-12 2019-05-07 Coretronic Corporation Projector, heat dissipation module, and heat dissipation fin set

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