TWM247918U - Heat sink structure specifically for expansion card - Google Patents

Description

M247918 V. Creative Instructions G) [Technical Field to which the New Type belongs]. This creation is about a special heat dissipation structure for expansion cards, which can effectively help the expansion cards in the computer such as graphics cards (VGA cards) to quickly dissipate heat. It is a special heat dissipation structure for expansion cards. [Prior art] The basic case for claiming domestic priority in this creation is a new type of application filed in the Republic of China on March 3, 1992. The application number is 922 0 3 958. This is the basis for the priority of this creation. Here Be stated beforehand. Pressing, with the advancement of technology, the computer's execution progress is getting faster and faster, and the temperature generated in the host is also getting higher and higher. In order to effectively distribute the internal temperature of the host outside the system, to maintain the various elements in the host. Operate below the allowable temperature, usually with a larger area of the radiator attached to the surface of each component that generates the temperature, and the effect is increased by the remote radiator. However, since the conventional heat sink structure is mostly used in central processing units (CPUs), and today's computers such as graphics cards (VGA cards), etc., there are other heat dissipation structures designed to cool them. However, current computers require multimedia. Use, coupled with the rise of game software, etc., all kinds of expansion cards will also generate heat, especially if it is not used to cool the graphics chip (ch ip), etc., lest overheating affect its operation and the computer shell The system is almost a closed space, and it is easy to produce a result similar to the greenhouse effect because the heat cannot be discharged. In view of this, the author feels that the above-mentioned shortcomings can be improved, and he is committed to studying and cooperating with the application of academic theories, and relying on many years of experience in the industry. 14 According to Dan, the produced parts have little support in adding heat dissipation. The envoy Jing Yu

Page 5 M247918 V. Creation Instructions (2) Experience, in the spirit of excellence, has finally come up with a rationally designed and effective improvement of the above-mentioned original creation. [New content] The main purpose of this creation is to provide a heat dissipation structure exclusively for expansion cards, which can effectively help the processing chips of expansion cards such as graphics cards (VGA cards) inside the computer to quickly dissipate heat, while also avoiding processing. The effect of the chip due to heat generation is similar to the greenhouse effect, which can prevent the expansion card from being damaged due to overheating, so as to ensure that it can operate normally at the allowed temperature. In order to achieve the above-mentioned purpose, “the creative system provides a heat dissipation structure exclusively for expansion cards” including a first heat sink, a second heat sink, a clip holder, and one or more heat pipes; wherein the first heat sink is It has a body and a plurality of heat radiation fins formed at the surface of the far body, and a heat fan is provided at the heat radiation fins, and the second heat sink includes a plurality of sheet heat radiation fins arranged in a continuous stack @ It is composed in such a way that one end of the heat pipe is connected to the first heat sink, the other end penetrates the second heat sink, and the inside of the holder is hollow to form a through hole penetrating the top and bottom of the holder for the second The heat sink is set inside; to form a special heat dissipation structure for the two expansion cards. [Embodiment] is to make the> review committee to further understand the characteristics and technical content of this creation, please refer to the following detailed description of this creation And drawings, however, the drawings are provided for reference and explanation only, and are not intended to limit the creation.

M247918 on page 6 V. Creative Instructions (3) Please refer to the first picture, the second picture, and the first one m ^ 4]} ^ ^ _. The second picture and the fourth picture are respectively the first embodiment of this creation. Stereo decomposition_ 一一 # a 丨 > branches, warm knife fresh pictures, three-dimensional combination diagrams, the first distracting crying Like eight aunts, and the three-dimensional knife solution and three-dimensional Combination chart. This creation is for the improvement of a heat dissipation structure, and it hurts and dies on c Λ. The remote and good tool is used for an internal expansion card 50 0 (such as a graphics card, the fifth circle% μ, ^ # 下 弟 五(Not shown in the figure) and other processing chips (chips), including a younger one and a radiator 10, _ 筮 — n. Younger one political heater 20, one clip holder 30, and one or more heat pipes 40; of which: The heat sink 10 is an extruded heat sink, which has a body, which is too many fins 101 on one surface of the body 100, and the other surface on the other side is used to communicate with the expansion card 50 ( For example, if the sixth dagger does not handle the wafers and lay flat; as shown in the third and fourth figures *, the younger brother Zheng heater 100 has opened an accommodating space i 〇2 4 on each of the heat sink fins 〇J. The combined space 1 〇2 is used to place a centrifugal cooling fan 丨 〇3 and fix it, and use the airflow blown by the cooling fan 103 to quickly remove heat; as for the internal structure of the cooling fan 1 〇3 As the general structure is the same as the conventional structure, and it is not in the scope of this application for a patent, it will not be described in detail. The far second radiator 20 is a package. Most of the sheet-shaped heat dissipation fins are stacked and arranged continuously, and each of the heat dissipation fins 2000 is provided with through-holes 201, and the number of the holes 201 is equal to the number of the heat pipe 40. The "equivalent" is connected through one end of the heat pipe 40, and the other end of the heat pipe 40 is connected to the body 100 of the first radiator 10. The interior of the clip seat 30 is hollow to form A through hole 301 penetrating through the top and bottom of the second heat sink 20 is provided inside, and a hole 302 corresponding to the through hole 201 of the second heat sink 20 is provided on the clip base 30.

M247918 V. Creation instructions (4) The heating pipe 40 is penetrated, and the clip base 30 is fixed on the end face of the inside of the computer case 60 (as shown in the fifth figure), and passes through the through hole of the clip base 30. 301 communicates with the outside world. At the same time, the side of the clip seat 30 is provided with a plurality of heat exhaust holes 3 0 3, which can allow the heat accumulated in the computer case 60 to be discharged through these heat exhaust holes 30 3 ° Therefore, with the above-mentioned structure, a heat dissipation structure dedicated to the creative expansion card can be obtained. As shown in the fifth and sixth figures, when this creation is applied to the expansion card 50, the heat generated by the processing chip of the expansion card 50 can be quickly passed through the first radiator 10 and the cooling fan 103. At the same time, the heat can be introduced into the second radiator 20 through the heat pipe 40, and the effect of heat dissipation can be enhanced by the second radiator 20, and another cooling fan can be fixed on the clamp base 30 (not shown) In order to increase the heat dissipation effect of the second heat sink 20. In addition, as shown in the seventh and eighth figures, they are a three-dimensional exploded view and a three-dimensional combined view of the second embodiment of the creation; wherein the _ heat dissipation: shell 10 ′ may also be a heat sink containing a large number of sheets. The fins 101 are stacked heat sinks formed by continuous stacking, and each of the radiating fins 丨 〇 丨 has a corresponding hole slot 104 ′ at the bottom edge, and is disposed on the body 100, on one surface. The second surface of the second body 10 0 ′ is flush with the chip of the expansion card 50 (as shown in the ninth figure), and the number of the hole slots 104 is also equal to that of the heat pipe 40. One end of the heat pipe 40 penetrates the link. The first heat sink 10 ′ of Lixiang Temple is equipped with a fixed 105 ′ with a hollow portion, and the periphery of the fixed seat 105 ′ is adjacent to the first heat sink 10 ′. Hook 106, used to hook on the expansion card 5〇ρ

Page 8 M247918 V. Creation instructions (5) By hooking Yan Hook 106 and the expansion card 50, the first heat sink 10 is forced by the fixing base 105 'to connect with the expansion card. The processing chip of 50 is closely attached; in addition, the fixed seat 105 'is used for a cooling fan 103, and is carried thereon, and the cooling fan 1 03 is screwed with a plurality of screws 107. It is fixed on the top surface of the fixing base 105, so that the cooling fan 丨 〇3, the blown airflow passes through the hollow part of the fixing base 105, and the processing chip provided with the expansion card 50 can quickly dissipate heat to the heat pipe 40. The portion where one end is connected to the second radiator 20 and the clip holder 30, and the structure and connection relationship of the second radiator 20 and the clip holder 30 are the same as those in the first embodiment, so please refer to In the foregoing, ^ this is repeated. Because of the following 1 temperature and 2 items, the result of 3 makes it possible to reach the right of novelty law. Therefore, by taking advantage of many advantages, you can reduce the lifespan and avoid the above-mentioned expectations and progress. Please use the heat dissipation structure dedicated to this expansion card to be at least effective. The high heat generated is quickly discharged outside the computer case. σ The temperature I inside the computer case can increase the internal zero group of the computer. The near-closed computer case produces a similar temperature effect. ΪΓΠ is a rare new creative product, which: to: solve the lack of knowledge for the purpose, and because of the extreme In accordance with the requirements of the new patent application, the patent sentence "Ping Chaya grants the spear for this case to protect the creator's

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Page 10 M247918 Simple illustration of the drawing [Simple illustration of the drawing] The first figure is an exploded perspective view of the first embodiment of this creation. The second picture is a three-dimensional combination diagram of the first embodiment of this creation. The third figure is a three-dimensional exploded view of the first radiator of the first embodiment of the present invention. The fourth diagram is a three-dimensional assembly diagram of the first radiator of the first embodiment of the present invention. The fifth figure is a use state diagram of the first embodiment of this creation. The sixth figure is an enlarged detailed view of part A of the fifth figure. The seventh figure is an exploded perspective view of the second embodiment of this creation. The eighth figure is a three-dimensional combination diagram of the second embodiment of this creation. The ninth figure is a use state diagram of the second embodiment of this creation. The tenth figure is an enlarged detailed view of part B of the ninth figure. [Element Representative Symbol] < This Creation > First Radiator 10 > 10 'Body 100, 100, Radiating Fins 101, 101, Receiving Space 102 Radiating Fan 103 > 103, Hole 104' Fixing Base 105 'Clip hook 106' Screw 107 'Second heat sink 20 Radiating fin 200 Perforation 201

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Claims (1)

M247918 —Three types of heat dissipation structures dedicated to expansion cards, including: a plurality; a first heat sink having a body and formed on the surface of the body—the first, a fin, and a heat dissipation fan is provided at the fins A heat sink is formed, which includes a plurality of fin-shaped heat dissipation fins arranged in a continuous stack and the through-holes are lost. The interior of the heat sink is hollow to form a ridge that penetrates the top and bottom of the heat sink, and the second heat sink is provided in the clip. The inside of the base; and one or more heat pipes, one end of which is connected to the first heat sink, and the other end runs through the second heat sink. Structure 2. The heat dissipation space dedicated to the expansion card as described in item 1 of the scope of the patent application, wherein each of the heat sink fins of the first heat sink is provided with an accommodation means, and the heat dissipation fan is placed in the accommodation space. 3, as described in item 1 of the scope of the patent application, the heat dissipation for the expansion card is dedicated, wherein each of the heat sink fins of the second heat sink is provided with a through hole, and the other end of the heat pipe is penetrated into the perforation to communicate with The second radiator company 4, as described in item 1 of the scope of the patent application, a dedicated heat dissipation strategy for the expansion card, wherein a hole corresponding to the heat pipe is provided on the clip seat, and the heat & It is connected to the second heat sink through a hole. 5. The heat dissipation '" structure dedicated to the expansion card described in item 1 of the scope of patent application, wherein the side of the clip seat is provided with a plurality of heat exhaust holes.鈇 6, as described in the scope of the patent application for the expansion card dedicated heat dissipation, ° ° structure, where the holder is fixed with another cooling fan. 7. A heat dissipation structure dedicated to expansion cards, which is used in computers M247918 6. The expansion card of the patent application area includes: a first heat sink, including a plurality of sheet-like heat sink fins formed in a continuous stack arrangement, and the heat sink fins are arranged on a body; a fixed seat A hollow part is provided on the first heat sink, and the fixing base extends to a side adjacent to the first heat sink to hook on the expansion card; a cooling fan is provided on the first heat sink; On a fixed base; a second heat sink, also comprising a plurality of fin-shaped heat-dissipating fins formed in a continuous stack arrangement; a clip base, the inside of which is hollow to form a through hole penetrating its top and bottom, and the second The heat sink is disposed inside the clip base; and one or more heat pipes, one end of which is connected to the first heat sink, and the other end passes through the second heat sink. 8. The heat dissipation structure dedicated to the expansion card as described in item 7 of the scope of the patent application, wherein each of the heat dissipation fins of the first heat sink is respectively provided with a corresponding hole slot, and one end of the heat pipe penetrates into these The hole is connected to the first heat sink. 9. The heat dissipation structure dedicated to the expansion card as described in item 7 of the scope of patent application, wherein the cooling fan is screwed on the top surface of the fixed seat with a plurality of screws. 0 0, the expansion as described in item 7 of the scope of patent application A card-specific heat dissipation structure, wherein each of the heat sink fins of the second heat sink is provided with a through hole, and the other end of the heat pipe penetrates the hole and is connected to the second heat sink. Page 14 M247918 VI. Patent application scope 1 1 The heat dissipation structure dedicated to the expansion card as described in item 7 of the patent application scope, wherein the clip seat is provided with a hole corresponding to the heat pipe, and the heat pipe runs through the It is connected to the second heat sink through a hole. 1 2. The heat dissipation structure exclusively for expansion cards as described in item 7 of the scope of patent application, wherein the side of the clip seat is provided with a plurality of heat exhaust holes. 1 3. The heat dissipation structure dedicated to the expansion card as described in item 7 of the scope of the patent application, wherein another cooling fan is fixed on the clamp base. Page 15