CN206493657U - Nanometer fin - Google Patents
Nanometer fin Download PDFInfo
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- CN206493657U CN206493657U CN201720057588.3U CN201720057588U CN206493657U CN 206493657 U CN206493657 U CN 206493657U CN 201720057588 U CN201720057588 U CN 201720057588U CN 206493657 U CN206493657 U CN 206493657U
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- heat
- graphene
- metal
- conducting substrate
- dissipating layer
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Abstract
The utility model is related to radiating fin of heating element field, espespecially a kind of nanometer fin, heat-conducting glue band, metal heat-conducting substrate and the graphene heat dissipating layer of layer surface are encapsulated including being arranged on heater element, using metal heat-conducting substrate as support Rotating fields, described heat-conducting glue band pastes or is coated in metal heat-conducting substrate lower surface, and described graphene heat dissipating layer is with the laminating metal heat-conducting substrate upper surface of graphene sputtering way.Due to material character reason, metal heat-conducting two-sided tape is strong in longitudinal direction thermal conductivity, graphene heat dissipating layer is protruded in horizontal heat conduction, and heating element generating heat is a heating, and heat is longitudinally after conduction to metal heat-conducting substrate, metal heat-conducting substrate is longitudinally transmitted to heat graphene heat dissipating layer, heat point source is diffused as plane heat source by graphene heat dissipating layer rapidly, counter to squeeze into metal level, so as to be changed into body radiating, area of dissipation is increased, radiating efficiency is improved；Graphene heat dissipating layer can avoid traditional approach from being fit together using adhesive with the laminating metal heat-conducting substrate upper surface of graphene sputtering way, the high defect of thermal resistance occur, effectively improve radiating effect.
Description
Technical field
The utility model is related to radiating fin of heating element field, espespecially a kind of nanometer fin.
Background technology
Heater element is the core cell of electronic product, if its radiate it is bad will it is breakdown, burn.For stable heating
The operating efficiency radiating of element is as more and more important link.Existing way is to install radiator fan additional or use water cooling mostly
Cooling system.The radiating effect of radiator fan is poor, noise is big, accounts for volume.Water-cooling heat radiating system good heat dissipation effect but equally be knot
Structure is big, accounts for volume, once and it is complicated, there is seepy question and can damage heater element.Therefore someone designs semiconductor and dissipated
Hot device, after radiator for semiconductor is powered using semiconductor chilling plate, cold end is from around absorbing heat, the characteristics of available for refrigeration
Element heat is dissipated to heating.Semiconductor refrigeration system without mechanical rotation, so it is noiseless, without abrasion.But, semiconductor chilling plate is needed
Heat abstractor to be installed in its hot junction to distribute the heat of its hot junction face generation, otherwise semiconductor chilling plate heat is not distributed not go out
The refrigeration of its cold end can be influenceed, semiconductor chilling plate is burnt in setting.
Utility model content
To solve the above problems, the utility model provides one kind by the use of graphene as heat sink material, radiating is effectively improved
Effect, is also equipped with the nanometer fin of high temperature tolerance performance.
To achieve the above object, the utility model, which is adopted the following technical scheme that, is：A kind of nanometer fin, including set
Heat-conducting glue band, metal heat-conducting substrate and the graphene heat dissipating layer of layer surface are encapsulated in heater element, using metal heat-conducting substrate as branch
Rotating fields are supportted, described heat-conducting glue band pastes or be coated in metal heat-conducting substrate lower surface, and described graphene heat dissipating layer is with stone
Black alkene solution vacuum splashing and plating mode is laminating in metal heat-conducting substrate upper surface.Due to material character reason, metal heat-conducting double faced adhesive tape
Band is strong in longitudinal direction thermal conductivity, and graphene heat dissipating layer is protruded in horizontal heat conduction, i.e., heat-conducting glue band is in longitudinal direction heat conduction, metal
Substrate heat conduction No yield point, graphene heat dissipating layer is in horizontal direction heat conduction, and heating element generating heat is a heating, and heat passes through heat-conducting glue
After band longitudinal direction conduction to metal heat-conducting substrate, metal heat-conducting substrate is longitudinally transmitted to heat graphene heat dissipating layer, and graphene dissipates
Heat point source is diffused as plane heat source by thermosphere rapidly, counter to squeeze into metal level, so as to be changed into body radiating, is increased area of dissipation, is carried
High radiating efficiency；Graphene heat transfer is fast, and the metal heat-conducting substrate thermal capacity is big, and graphene heat dissipating layer is with graphene sputter side
The laminating metal heat-conducting substrate upper surface of formula can avoid traditional approach from being fit together using adhesive, occur thermal resistance it is high lack
Fall into, effectively improve radiating effect.
Preferably, bamboo-carbon layer is additionally provided between described graphene heat dissipating layer and metal heat-conducting substrate, bamboo charcoal is to far infrared
Line absorption rate is high, and the coefficient of overall heat transmission is also high, is easy to quickly collecting heat into the heat conducting film radiating of importing graphene using bamboo-carbon layer, accelerates to dissipate
Hot speed.
Preferably, nanoscale graphite alkene particle, described metal heat-conducting substrate are included in described graphene heat dissipating layer
Provided with nanoscale far infrared particle, the adhesion of graphene particles and nanoscale far infrared grain enhancing graphene and metal heat-conducting substrate
Property.
Preferably, described heat conduction tape surface is provided with release film layer.Release film layer is used to protect nanometer fin, when need
Release film layer is torn when using and sticked to again on heater element.
Preferably, described metal heat-conducting substrate is aluminium base or copper base.
Preferably, described graphene radiating layer surface is provided with protective layer, and described protective layer is silicon systems adhesive tape.Silicon systems glue
Band is used to prevent graphene heat dissipating layer to be torn, to extend its service life.
The beneficial effects of the utility model are：The point radiating of heater element is changed into body radiating by the utility model, rapidly
Increase air contact area of dissipation, further, since graphene has high thermal conductivity and good mechanical performance, nanoscale is thick
The a large amount of thermal energy conductions produced when graphene and metal heat-conducting the substrate work of degree come out and dissipated, and are not so increasing scattered
In the case of the volume of backing, hence it is evident that the operating temperature of reduction heater element.
Brief description of the drawings
Fig. 1 is the utility model structure chart.
Mark explanation：1. release film layer；2. heat-conducting glue band；3. laminated polyester film；4. metal heat-conducting substrate；5. graphene dissipates
Thermosphere；6. silicon systems adhesive tape.
Embodiment
Refer to shown in Fig. 1, the utility model is on a kind of nanometer fin, including is arranged on heater element encapsulated layer table
Heat-conducting glue band 2, metal heat-conducting substrate 4 and the graphene heat dissipating layer 5 in face, are support Rotating fields with metal heat-conducting substrate 4, described
Heat-conducting glue band 2 is covered in the lower surface of metal heat-conducting substrate 4, and described graphene heat dissipating layer 5 is with the laminating gold of graphene sputtering way
Belong to the upper surface of conductive substrate 4.Due to material character reason, heat-conducting glue band 2 is in longitudinal direction heat conduction, and graphene heat dissipating layer 5 is in horizontal stroke
To direction heat conduction, heater element is a heating, and heat is longitudinally after conduction to metal heat-conducting substrate 4, and metal heat-conducting substrate 4 is heat
It is transmitted to graphene heat dissipating layer 5, heat point source is become plane heat source by graphene heat dissipating layer 5 rapidly, counter to squeeze into metal heat-conducting No yield point
Substrate 4, so as to be changed into body radiating, can realize high efficiency and heat radiation, so as to increase area of dissipation；Graphene heat dissipating layer 5 is with stone
The black laminating upper surface of metal heat-conducting substrate 4 of alkene sputtering way can avoid traditional approach from being fit together using adhesive, occur
The defect of high thermal resistance, effectively improves heat-conducting effect.
Preferably, bamboo-carbon layer is additionally provided between described graphene heat dissipating layer and metal heat-conducting substrate, bamboo charcoal is to far infrared
Line absorption rate is high, and the coefficient of overall heat transmission is also high, is easy to quickly collecting heat into the heat conducting film radiating of importing graphene using bamboo-carbon layer, accelerates to dissipate
Hot speed.
Preferably, the effect of graphene heat dissipating layer 5 is radiating, for the thickness of the graphene heat dissipating layer 5, is preferably
10 μm~300 μm.
Preferably, the described surface of heat-conducting glue band 2 is provided with release film layer 1.
Preferably, nanoscale graphite alkene particle, described metal heat-conducting substrate are included in described graphene heat dissipating layer 5
4 are provided with the adhesiveness of nanoscale metal particles, graphene particles and metallic particles enhancing graphene and metal heat-conducting substrate 4.
Preferably, described metal heat-conducting substrate 4 is aluminium base or copper base or aluminum nitride ceramic substrate.
Preferably, the described surface of graphene heat dissipating layer 5 is silicon systems adhesive tape 6 provided with protective layer, prevents graphene heat dissipating layer 5
It is torn.
Preferably, laminated polyester film 3, laminated polyester film 3 are additionally provided between described heat-conducting glue band 2 and metal heat-conducting substrate 4
To control during high temperature the small molecule migration inside laminated polyester film 3, the fin good heat dissipation effect being made and possesses high temperature tolerance
Performance, prevents metal heat-conducting substrate 4 because temperature is too high and softens.
Embodiment of above is only that preferred embodiment of the present utility model is described, not to the utility model
Scope be defined, on the premise of the utility model design spirit is not departed from, this area ordinary skill technical staff to this
Various modifications and improvement that the technical scheme of utility model is made, all should fall into the guarantor that claims of the present utility model are determined
In the range of shield.
Claims (6)
1. a kind of nanometer fin, it is characterised in that：Heat-conducting glue band, metal including being arranged on heater element encapsulation layer surface are led
Hot radical piece and graphene heat dissipating layer, using metal heat-conducting substrate as support Rotating fields, described heat-conducting glue band pastes or is coated in gold
Belong to conductive substrate lower surface, described graphene heat dissipating layer is laminating in metal heat-conducting substrate upper surface with graphene sputtering way.
2. a kind of nanometer fin according to claim 1, it is characterised in that：Described graphene heat dissipating layer and metal are led
Bamboo-carbon layer is additionally provided between hot radical piece.
3. a kind of nanometer fin according to claim 1, it is characterised in that：Include in described graphene heat dissipating layer
Nanoscale graphite alkene particle.
4. a kind of nanometer fin according to claim 1, it is characterised in that：Described heat conduction tape surface is provided with release
Film layer.
5. a kind of nanometer fin according to claim 1, it is characterised in that：Described metal heat-conducting substrate is aluminium base
Or copper base.
6. a kind of nanometer fin according to claim 1, it is characterised in that：Described graphene radiating layer surface is provided with
Protective layer, described protective layer is silicon systems adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720057588.3U CN206493657U (en) | 2017-01-17 | 2017-01-17 | Nanometer fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720057588.3U CN206493657U (en) | 2017-01-17 | 2017-01-17 | Nanometer fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206493657U true CN206493657U (en) | 2017-09-15 |
Family
ID=59802347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720057588.3U Active CN206493657U (en) | 2017-01-17 | 2017-01-17 | Nanometer fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206493657U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966615A (en) * | 2018-09-12 | 2018-12-07 | 刘冬舒 | A kind of heat loss through radiation piece |
-
2017
- 2017-01-17 CN CN201720057588.3U patent/CN206493657U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108966615A (en) * | 2018-09-12 | 2018-12-07 | 刘冬舒 | A kind of heat loss through radiation piece |
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