CN201156227Y - computer cooling device - Google Patents
computer cooling device Download PDFInfo
- Publication number
- CN201156227Y CN201156227Y CNU2008200430705U CN200820043070U CN201156227Y CN 201156227 Y CN201156227 Y CN 201156227Y CN U2008200430705 U CNU2008200430705 U CN U2008200430705U CN 200820043070 U CN200820043070 U CN 200820043070U CN 201156227 Y CN201156227 Y CN 201156227Y
- Authority
- CN
- China
- Prior art keywords
- utility
- heat dissipation
- composite material
- fin group
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002131 composite material Substances 0.000 claims abstract description 14
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract 5
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域: Technical field:
本实用新型涉及散热装置技术领域,特别涉及一种电脑散热装置。The utility model relates to the technical field of heat dissipation devices, in particular to a computer heat dissipation device.
背景技术: Background technique:
众所周知,电脑的芯片组或处理器在运作时会产生高热,而且运作速度快,驱动电力功率越高,其产生的温度也就越高,若芯片组或处理器温度太高时,就会影响到其正常运作,造成电脑死机;因此,散热问题若无法解决,就会限制芯片组或处理器的运作速度,造成电脑运行不稳定。As we all know, the chipset or processor of a computer will generate high heat during operation, and the operation speed is fast. The higher the driving power, the higher the temperature generated. If the temperature of the chipset or processor is too high, it will affect Therefore, if the heat dissipation problem cannot be solved, it will limit the operating speed of the chipset or processor, resulting in unstable operation of the computer.
现有的电脑散热装置主要是由铜或铝合金制造的基座、散热鳍片组及辅助吹散热量的风扇等组成,由于资源的紧缺,铜和铝的价格正在逐步上升,由纯铜或铝制成的电脑散热装置,其成本较高。而且,因为铜和铝的密度较大,所制成的电脑散热装置重量大,容易压坏芯片,不方便安装。Existing computer cooling devices are mainly composed of bases made of copper or aluminum alloys, heat dissipation fins, and fans for assisting heat dissipation. Due to the shortage of resources, the prices of copper and aluminum are gradually increasing. The computer cooling device made of aluminum has a relatively high cost. Moreover, because the density of copper and aluminum is relatively high, the computer cooling device made is heavy, easily crushes the chip, and is inconvenient to install.
实用新型内容:Utility model content:
本实用新型的目的是针对现有技术的不足而提供一种成本低、散热效率高、降温效果显著的电脑散热装置。The purpose of the utility model is to provide a computer cooling device with low cost, high heat dissipation efficiency and remarkable cooling effect aiming at the deficiencies of the prior art.
为实现上述目的,本实用新型采用如下技术方案:In order to achieve the above object, the utility model adopts the following technical solutions:
一种电脑散热装置,它包括石墨复合材料制成的散热鳍片组、风扇、支架,所述散热鳍片组底部成型有基座,支架设置在散热鳍片组底部,风扇设置在散热鳍片组顶部。A computer cooling device, which includes a heat dissipation fin group made of graphite composite material, a fan, and a bracket. group top.
所述散热鳍片组顶部设有用于将风扇罩住的风罩,风罩通过螺钉与支架固定连接。The top of the cooling fin group is provided with a windshield for covering the fan, and the windshield is fixedly connected with the bracket by screws.
所述基座穿过支架并与支架卡接。The base passes through the bracket and is engaged with the bracket.
所述支架上成型有定位孔,定位孔中穿设有定位柱。A positioning hole is formed on the support, and a positioning column is pierced in the positioning hole.
本实用新型有益效果为:本实用新型包括有石墨复合材料制成的散热鳍片组、风扇、支架,所述散热鳍片组底部成型有基座,支架设置在散热鳍片组底部,风扇设置在散热鳍片组顶部;本实用新型的散热鳍片组和基座由石墨复合材料制成,石墨复合材料要比铜和铝的价格低很多,本实用新型具有成本低的特点,而且由石墨复合材料制成的散热鳍片组导热快、散热效率高、重量轻,所以本实用新型的散热装置具有散热速度快、降温效果显著的特点。The beneficial effects of the utility model are as follows: the utility model includes a cooling fin group made of graphite composite material, a fan, and a bracket, the bottom of the cooling fin group is formed with a base, the bracket is arranged at the bottom of the cooling fin group, the fan is arranged At the top of the heat dissipation fin group; the heat dissipation fin group and the base of the utility model are made of graphite composite material, and the price of graphite composite material is much lower than that of copper and aluminum. The utility model has the characteristics of low cost, and is made of graphite The heat dissipation fin group made of composite material has fast heat conduction, high heat dissipation efficiency and light weight, so the heat dissipation device of the utility model has the characteristics of fast heat dissipation speed and remarkable cooling effect.
附图说明: Description of drawings:
图1是本实用新型的结构示意图;Fig. 1 is the structural representation of the utility model;
图2是本实用新型的分解示意图。Fig. 2 is an exploded schematic view of the utility model.
具体实施方式: Detailed ways:
下面结合附图对本实用新型作进一步的说明,见图1~2,一种电脑散热装置,它包括石墨复合材料制成的散热鳍片组2、风扇3、支架4,所述散热鳍片组2底部成型有基座1,基座1的底面与CPU紧密接触,由石墨复合材料制成的基座1可以快速地把CPU上的热量快速地传递给散热鳍片组2。支架4设置在散热鳍片组2底部,风扇3设置在散热鳍片组2顶部,可以快速地把散热鳍片所聚集的热量吹走,达到散热、降温的效果。散热鳍片组2顶部设有用于将风扇3罩住的风罩6,风罩6通过螺钉5与支架4固定连接,风罩6与支架4将散热鳍片组2夹在中间。基座1穿过支架4并与支架4卡接。The utility model will be further described below in conjunction with the accompanying drawings, see Fig. 1-2, a kind of computer cooling device, it comprises the
支架4上成型有定位孔7,定位孔7中穿设有定位柱8,电脑主板设置有对应定位柱的孔,其中定位柱8的一端穿过支架4的定位孔7并与电脑主板扣接固定,从而将散热鳍片组2固定在电脑主板上。Positioning holes 7 are formed on the bracket 4,
本实用新型的散热鳍片组和基座由石墨复合材料制成,石墨复合材料要比铜和铝的价格低很多,具有成本低的特点,而且由石墨复合材料制成的散热鳍片组导热快、散热效率高、重量轻,所以本实用新型的散热装置散热速度快、降温效果显著。The heat dissipation fin group and the base of the utility model are made of graphite composite material, which is much lower than copper and aluminum, and has the characteristics of low cost, and the heat dissipation fin group made of graphite composite material conducts heat Fast heat dissipation, high heat dissipation efficiency, and light weight, so the heat dissipation device of the utility model has fast heat dissipation speed and remarkable cooling effect.
以上所述仅是本实用新型的较佳实施例,故凡依本实用新型专利申请范围所述的构造、特征及原理所做的等效变化或修饰,均包括于本实用新型专利申请范围内。The above is only a preferred embodiment of the utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the utility model patent application scope are all included in the utility model patent application scope .
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200430705U CN201156227Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008200430705U CN201156227Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201156227Y true CN201156227Y (en) | 2008-11-26 |
Family
ID=40104007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU2008200430705U Expired - Fee Related CN201156227Y (en) | 2008-01-15 | 2008-01-15 | computer cooling device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201156227Y (en) |
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2008
- 2008-01-15 CN CNU2008200430705U patent/CN201156227Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 |